JP4863430B2 - サージ保護用半導体装置 - Google Patents
サージ保護用半導体装置 Download PDFInfo
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- JP4863430B2 JP4863430B2 JP2005021406A JP2005021406A JP4863430B2 JP 4863430 B2 JP4863430 B2 JP 4863430B2 JP 2005021406 A JP2005021406 A JP 2005021406A JP 2005021406 A JP2005021406 A JP 2005021406A JP 4863430 B2 JP4863430 B2 JP 4863430B2
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- type semiconductor
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Description
2 低濃度第1導電型半導体層
3、4、5 P型半導体層
6、116 絶縁皮膜
7 アノード電極
8 カソード電極
114 カソード電極
115 アノード電極
110 高濃度N型半導体基板
111 低濃度N型半導体層
112 P型半導体層
113 高濃度N型半導体層
J1 低濃度N型半導体層2とP型半導体層3との界面
J2 低濃度N型半導体層2とP型半導体層4との界面
J3 低濃度N型半導体層2とP型半導体層5との界面
J11 P型半導体層112と低濃度N型半導体層111との界面
J12 高濃度N型半導体層113とP型半導体層112との界面
Claims (1)
- 第1導電型半導体基板の上層に形成され、PN接合部の底部の降伏電圧が側面部の降伏電圧より高くなる濃度と厚みを有する低濃度第1導電型半導体層と、
前記低濃度第1導電型半導体層表面から内部にかけて一定間隔でストライプの列状に複数個形成され、前記低濃度第1導電型半導体層とPN接合された第2導電型領域とで等価回路的に直列配線されるダイオードと、
前記低濃度第1導電型半導体層の表面に前記低濃度第1導電型半導体層の一部と、前記第2導電型半導体領域の列の端部と他端部とを露出した状態に形成される絶縁皮膜と、
前記第2導電型半導体領域の前記列の端部にアノード電極を、前記他端部にカソード電極を有することを特徴とするサージ保護用半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005021406A JP4863430B2 (ja) | 2005-01-28 | 2005-01-28 | サージ保護用半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2005021406A JP4863430B2 (ja) | 2005-01-28 | 2005-01-28 | サージ保護用半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006210690A JP2006210690A (ja) | 2006-08-10 |
JP4863430B2 true JP4863430B2 (ja) | 2012-01-25 |
Family
ID=36967180
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005021406A Expired - Fee Related JP4863430B2 (ja) | 2005-01-28 | 2005-01-28 | サージ保護用半導体装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4863430B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203242609U (zh) * | 2010-06-02 | 2013-10-16 | 株式会社村田制作所 | Esd保护装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57128960A (en) * | 1981-02-04 | 1982-08-10 | Nippon Denso Co Ltd | Semiconductor device |
JPS6136979A (ja) * | 1984-07-30 | 1986-02-21 | Nec Corp | 定電圧ダイオ−ド |
JPS61147570A (ja) * | 1984-12-20 | 1986-07-05 | Sanyo Electric Co Ltd | ショットキバリア半導体装置 |
JPH0715010A (ja) * | 1993-06-15 | 1995-01-17 | Nissan Motor Co Ltd | 半導体装置の保護回路 |
JP4746734B2 (ja) * | 2000-06-14 | 2011-08-10 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP2003060045A (ja) * | 2001-06-07 | 2003-02-28 | Sony Corp | 保護ダイオードを備えた半導体装置およびその製造方法 |
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2005
- 2005-01-28 JP JP2005021406A patent/JP4863430B2/ja not_active Expired - Fee Related
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JP2006210690A (ja) | 2006-08-10 |
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