JP4858021B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to a technical field of an electro-optical device such as a liquid crystal device, and an electronic apparatus such as a liquid crystal projector including the electro-optical device.

  As this type of electro-optical device, at least one of an electro-optical panel such as a liquid crystal panel that performs an electro-optical operation such as a display operation in a pixel region (or “image display region”) and a control circuit for driving or controlling the electro-optical panel. There is a device of a type constituted by a flexible substrate device on which a driving integrated circuit that bears a part is mounted. According to this type of apparatus, by separating a part of the control circuit from the electro-optical panel, it is possible to reduce the size of the electro-optical panel, enlarge the pixel area with respect to the size of the electro-optical panel, or the like. For example, an integrated circuit for driving an electro-optical panel is provided on a flexible substrate connected to the electro-optical panel by a mounting technique such as COF (Chip On Film) (see Patent Document 1).

JP 2006-18134 A

  However, when a driving integrated circuit is provided on a flexible substrate, the flexible substrate is often made of a material that transmits light and has no thickness. Through the drive integrated circuit. The driving integrated circuit includes many semiconductor elements that are likely to leak (hereinafter referred to as “light leakage” as appropriate) due to the photoelectric effect. For this reason, even if the incident light is not a strong light incident on the electro-optical panel like the projection light, but it is a diffused weak light or the like, it may cause a malfunction. There is.

  On the other hand, a method of arranging the driving integrated circuit in a case where light does not enter is conceivable. However, in that case, it is difficult to reduce the size of the entire electro-optical device, and the cost also increases.

  The present invention has been made in view of the above-described problems, for example, and includes an electro-optical device that can reduce the light leakage in a driving integrated circuit and can operate with high reliability, and such an electro-optical device. It is an object to provide various electronic devices.

In order to solve the above problems, an electro-optical device of the present invention has an electro-optical panel, a flexible substrate having a connection terminal portion connected to the electro-optical panel, and the connection terminal portion on one surface of the flexible substrate. a driving integrated circuit for driving the electro-optical panel through the other surface of the flexible substrate, and a light shielding film disposed opposite to the driving integrated circuit, wherein the light shielding film, the substrate And a light-shielding layer formed on a surface opposite to the surface on which the print layer of the base material is formed, and between the light-shielding layer and the flexible substrate. It is characterized by being attached to the flexible substrate through an adhesive layer .
Further, the light shielding layer is made of metal, and is connected to a ground wiring formed on the flexible substrate through a through hole formed in the adhesive layer.

  According to the electro-optical device of the present invention, during operation, the electro-optical panel is driven by the driving integrated circuit provided on the flexible substrate or by another control circuit or driving circuit built in the electro-optical panel. It is driven and its electro-optic operation is performed. For example, an image display operation is performed in the pixel region of the electro-optical panel. Here, particularly when an electro-optical panel that performs such an electro-optical operation is used as a light valve, the light is diffused in the electro-optical device, and is also applied to a portion other than a predetermined region of the electro-optical panel that should be originally incident Light may enter. Therefore, if there is no light-shielding film as in the present invention, the flexible substrate is often made of a material that transmits light, and since there is no thickness, the terminals provided in the driving integrated circuit through the flexible substrate. Light enters the driving integrated circuit from the part or package body. Since the driving integrated circuit is a semiconductor device, an electromotive force is generated by the photoelectric effect when light enters, and as a result, a light leakage current flows. That is, light leakage occurs. If an unexpected current such as a light leakage current flows, the driving integrated circuit may malfunction.

  However, according to the present invention, the light shielding film is formed in at least a part of the region facing the driving integrated circuit on the other surface of the flexible substrate. For this reason, it is possible to make it difficult for light to be incident on the driving integrated circuit, thereby preventing malfunction of the driving integrated circuit and improving the reliability of the electro-optical device.

From the viewpoint of improving the light shielding performance, the light shielding film is preferably formed so as to include the entire region facing the driving integrated circuit, and more preferably including the peripheral region. However, as compared with the case where no such light shielding film is formed, if the light shielding film is formed elsewhere in the region facing the driving integrated circuit, a corresponding light shielding effect can be obtained.
Further, since the light shielding film is provided with a printing layer in addition to the light shielding layer for light shielding, various information can be printed using a printer or the like. The information to be printed is, for example, a product code, an abbreviation code, a bar code, and the like. The light shielding film has various effects depending on the information to be printed. For example, in a manufacturing process, an electro-optical device provided with a light shielding film can be managed with reference to a code, and work efficiency can be improved. Also, in the repair process, parts can be traced by referring to the code to analyze the cause of failure.
Furthermore, the printing layer not only allows printing, but also has a light shielding ability, so that it has the effect of supplementing the light shielding in the light shielding layer and increasing the light shielding rate of the entire light shielding film.

  In one aspect of the electro-optical device of the present invention, the light-shielding film is at least partially formed in a region facing the driving integrated circuit on the one surface in addition to the other surface.

  According to this aspect, when light enters the flexible substrate from the region where the light shielding film is not formed on the other surface or from one surface, the one surface of the flexible substrate (that is, the driving integrated circuit is mounted). The light-shielding film provided in the region facing the driving integrated circuit on the surface to be driven can prevent light from entering the driving circuit. Accordingly, the light shielding for the driving integrated circuit is doubled and the possibility of malfunction is reduced, so that the reliability of the electro-optical device is improved.

  In this case, the electrical connection is made so that the light shielding film formed on one surface does not hinder the electrical connection between the wiring and the terminal on the flexible substrate and the terminal of the driving integrated circuit. It is preferable to form a light shielding film while avoiding the area to be taken.

  In another aspect of the electro-optical device of the present invention, the light-shielding film is adhered to the other surface as a piece of an adhesive tape containing a light-shielding material.

  According to this aspect, since the light shielding layer can be arranged by a simple method only by pasting, the working time in the manufacturing process is shortened. Further, since it is not necessary to use mounting parts such as screws, the cost can be reduced and the space can be saved.

  In another aspect of the electro-optical device according to the aspect of the invention, the driving integrated circuit further includes another light shielding film formed on at least a part of a surface opposite to the side facing the one surface.

  According to this aspect, since the light shielding film is also provided on the surface of the driving integrated circuit, the light is transmitted from both the front and back sides to the driving integrated circuit together with the light shielding film provided on the other surface of the flexible substrate. Incident can be prevented.

  Since the terminal portion of the driving integrated circuit is provided on the back surface (that is, the surface facing the substrate), light incident mainly from the other surface of the flexible substrate is driven from the terminal portion via the flexible substrate. Trying to enter the integrated circuit. However, when the terminal portion is provided on the side surface or when there is a gap between the driving integrated circuit and the flexible substrate, even if the light is incident from the front side, the inside of the driving integrated circuit The possibility of being incident on the Furthermore, there is also light that penetrates the package main body made of, for example, a resin of a driving integrated circuit that is not supposed to be irradiated with light from the surface side (that is, the surface opposite to the side facing the substrate). In addition, there may be a structure in which the integrated circuit is exposed and arranged on one surface of the flexible substrate. In other words, when the light shielding measure is not taken, there is a possibility that the driving integrated circuit may malfunction even if the light is incident from the front side.

  Therefore, as in this embodiment, not only the other surface of the flexible substrate but also the light-shielding film is provided on the surface of the drive circuit to prevent light from entering from both the front and back surfaces, and the drive integrated circuit can malfunction. The reliability of the electro-optical device is improved by further reducing the performance.

  In another aspect of the electro-optical device of the present invention, the light shielding film includes a metal layer, and the metal layer is connected to a ground wiring included in the wiring.

  According to this aspect, since the conductive metal layer provided in the light shielding film is connected to the ground wiring, noise generated in the driving integrated circuit or the like can be reduced. The metal layer may be a metal layer provided as a light shielding layer, or may be newly provided as a separate layer. When the metal layer is not the lowermost layer (that is, the layer adjacent to the flexible substrate), a through hole is provided in a part of the lower layer than the metal layer and is connected to the ground wiring through the through hole.

  Noise is generated mainly from components such as integrated circuits, causing malfunctions of the components that make up the electro-optical device and possibly destroying them, ensuring the reliability of the electro-optical device. Therefore, noise countermeasures are very important. Since noise is due to temporal potential fluctuations, it can be reduced by connecting the metal layer of the light-shielding film and the ground wiring, lowering the impedance of the driving integrated circuit, and suppressing potential fluctuations. By reducing the generation of noise, the influence of noise on other components in the vicinity can be reduced. Therefore, the possibility that the electro-optical device is defective due to the influence of noise is reduced, and the reliability is improved.

  In another aspect of the electro-optical device according to the aspect of the invention, the light-shielding film is also at least partially formed in a region on the other surface that does not face the driving integrated circuit.

  According to this aspect, it is possible to prevent light incident on the flexible substrate from a region not facing the driving integrated circuit from being refracted or reflected by the wiring or the like in the flexible substrate and entering the driving integrated circuit. .

Furthermore, since the area of the light shielding film can be increased, the area of the metal layer included in the light shielding film can also be increased. When the metal layer and the ground wiring are connected, the larger the area of the metal layer, the lower the impedance, and the noise reduction effect becomes higher. In other words, by forming a light shielding film in a region that does not face the driving integrated circuit, the reliability of the electro-optical device can be improved in terms of both shielding light from the driving integrated circuit and reducing noise generation. In order to solve the above problems, the apparatus includes the above-described electro-optical device (including various aspects thereof) of the present invention.

  According to the electronic apparatus of the present invention, since the electro-optical device according to the present invention described above is provided, a projection display device, a television, Various electronic devices such as a cellular phone, an electronic notebook, a word processor, a viewfinder type or a monitor direct-view type video tape recorder, a workstation, a video phone, a POS terminal, and a touch panel can be realized. In addition, as an electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper, an electron emission device (Field Emission Display and Conduction Electron-Emitter Display), and a display device using these electrophoretic device and electron emission device are realized. Is also possible.

  The operation and other advantages of the present invention will become apparent from the best mode for carrying out the invention described below.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, a TFT active matrix driving type liquid crystal device which is an example of the electro-optical device of the present invention is taken as an example. In this electro-optical device, a part of a circuit for controlling active matrix driving is built in the electro-optical panel shown in FIGS. 1 and 2, and other parts of the circuit will be described in detail later. It is of the type mounted on a flexible substrate (see FIG. 3).

  First, the configuration of the electro-optical panel 100 according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the configuration of the electro-optical panel 100 according to this embodiment, and FIG. 2 is a cross-sectional view taken along the line HH ′ of FIG. 1 and 2 show the electro-optical panel 100 in a state where a flexible substrate provided with a light shielding film, which will be described in detail later, is not connected.

  1 and 2, in the electro-optical panel 100 according to the present embodiment, the TFT array substrate 10 and the counter substrate 20 are disposed to face each other. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 are provided with a sealing material 52 provided in a seal region positioned around the image display region 10a. Are bonded to each other.

  In FIG. 1, a light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. A data line driving circuit 101 and an external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 in a region located outside the sealing region in which the sealing material 52 is disposed in the peripheral region. The sampling circuit 7 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. Further, the scanning line driving circuit 104 is provided so as to be covered with the frame light-shielding film 53 inside the seal region along two sides adjacent to the one side. On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20.

  On the TFT array substrate 10, a lead wiring 90 is formed for electrically connecting the external circuit connection terminal 102 to the data line driving circuit 101, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like. .

  In FIG. 2, on the TFT array substrate 10, a laminated structure in which wiring such as a pixel switching TFT (Thin Film Transistor) as a driving element, a scanning line, and a data line is formed. In the image display area 10a, pixel electrodes 9a are provided in a matrix on the upper layer of wiring such as pixel switching TFTs, scanning lines, and data lines. An alignment film is formed on the pixel electrode 9a. On the other hand, a panel light shielding film 23 is formed on a surface of the counter substrate 20 facing the TFT array substrate 10. The panel light-shielding film 23 is formed of, for example, a light-shielding metal film or the like, and is patterned, for example, in a lattice shape in the image display region 10a on the counter substrate 20. A counter electrode 21 made of a transparent material such as ITO is formed on the panel light-shielding film 23 in a solid shape so as to face the plurality of pixel electrodes 9a. An alignment film is formed on the counter electrode 21. Further, the liquid crystal layer 50 is made of, for example, a liquid crystal in which one or several types of nematic liquid crystals are mixed, and takes a predetermined alignment state between the pair of alignment films.

  Although not shown here, on the TFT array substrate 10, in addition to the data line driving circuit 101, the scanning line driving circuit 104, etc., the quality, defects, etc. of the electro-optical panel 100 during manufacturing or at the time of shipment are inspected. An inspection circuit, an inspection pattern, and the like may be formed.

  Next, the overall structure of the electro-optical device according to the present embodiment will be described with reference to FIG. FIG. 3 is a perspective view showing the configuration of the electro-optical panel 100 and the flexible substrate 200 connected to each other.

  The electro-optical device according to this embodiment includes an electro-optical panel 100, a flexible substrate 200, and a driving integrated circuit 300. The electro-optical panel 100 and the flexible substrate 200 are connected to each other by an external circuit connection terminal 102 and a connection terminal portion 201 provided respectively. The driving integrated circuit 300 is provided on the flexible substrate 200 in a surface-mounted manner, for example, and is configured to drive the electro-optical panel 100, that is, control the pixel electrode 9a.

  Next, the light shielding film 400 of this embodiment will be described with reference to FIGS. First, the arrangement position of the light shielding film 400 will be described with reference to FIGS. 4 to 6.

  FIG. 4 shows a case where the flexible substrate 200 is viewed from one side (left half in FIG. 4) on which the driving integrated circuit 300 is provided and the other side (right half in FIG. 4) on the opposite side. FIG.

  In FIG. 4, the wiring 202 is arranged on or in the flexible substrate 200 so as to extend in the longitudinal direction of the flexible substrate 200 (that is, the vertical direction in FIG. 4). The wiring 202 is electrically connected to the connection terminal portion 201 provided at the tip of the flexible substrate 200 (that is, the upper end in FIG. 4) and the driving integrated circuit 300 provided on the flexible substrate 200. The driving integrated circuit 300 is surface-mounted on “one surface” according to the present invention.

  The light shielding film 400 is provided on the other surface of the flexible substrate 200, that is, on the surface opposite to the surface mounted with the driving integrated circuit 300, in a region facing the driving integrated circuit 300. 300 is formed so as to cover 300. However, the light-shielding film 400 is not necessarily formed in this way. If the light-shielding film 400 is at least partially formed in a region facing the driving integrated circuit 300, the light-shielding effect according to the present embodiment. Is obtained accordingly.

  The light shielding film 400 is fixed to the flexible substrate 200 using an adhesive or the like. The light shielding film 400 may be attached manually, but in order to effectively exhibit the light shielding ability of the light shielding film 400, it is better to attach it at a predetermined position with high accuracy. That is, it is desirable that the attachment is performed while performing precise position measurement using a dedicated machine such as a stepper device for attaching a seal, for example, rather than manually.

  The light shielding film 400 prevents light from entering the driving integrated circuit 300. When light enters the driving integrated circuit 300, an electromotive force is generated in the semiconductor element provided in the driving integrated circuit 300 due to the photoelectric effect, and a light leakage current flows through the driving integrated circuit 300. When the optical leak current flows, the driving integrated circuit 300 causes a malfunction. That is, the light shielding film 400 blocks light, thereby preventing malfunction of the driving integrated circuit 300 and improving the reliability of the electro-optical device.

  Next, another arrangement example of the light shielding film 400 in the present embodiment will be described with reference to FIGS. 5 and 6 are cross-sectional views showing examples of arrangement of the light shielding film 400, respectively.

  In the arrangement example in FIG. 5, in addition to the light shielding film 400 a formed in the region facing the driving integrated circuit on the other surface of the flexible substrate 200 described above, the driving integrated circuit 300 on one surface is provided. A light-shielding film 400b is formed in a region facing the. The range of the light-shielding film 400b is not limited to the range shown in FIG. 5 and may be formed on at least a part of the region facing the driving integrated circuit 300 on one surface.

  With this arrangement, in addition to the effect of the light shielding film 400a described above, light incident on the flexible substrate 200 from a region without the light shielding film 400a on the other surface is refracted in the flexible substrate 200 or wiring It is possible to prevent the light from being reflected by 202 or the like and entering the driving integrated circuit 300. Further, the same effect can be obtained with respect to light incident on the flexible substrate 200 from one surface. That is, compared with the case where the light shielding film is only 400a, a high light shielding ratio can be realized and the reliability of the electro-optical device can be improved. The light shielding film 400b may be formed of an insulating film so that the wirings 202 are not short-circuited. On the other hand, the light shielding film 400a may be made of an insulating film, or may be made of a conductive film or a semiconductor film.

  In the arrangement example in FIG. 6, in addition to the light shielding film 400 a formed in the region facing the driving integrated circuit 300 on the other surface of the flexible substrate 200 described above, one surface of the driving integrated circuit 300 is provided. A light shielding film 400c is formed on the surface opposite to the surface opposite to the surface. The range of the light shielding film 400 c is not limited to the range shown in FIG. 6, and may be formed on at least a part of the surface of the driving integrated circuit 300.

  If arranged in this way, in addition to the effect of the light shielding film 400a described above, light incident from the gap between the driving integrated circuit 300 and the flexible substrate 200 can be blocked. Further, since the terminal portion of the driving integrated circuit 300 may be provided not only on the back surface but also on the side surface of the driving integrated circuit 300, the light shielding film 400c is effective in such a case. That is, compared with the case where the light shielding film is only 400a, a high light shielding ratio can be realized and the reliability of the electro-optical device can be improved.

  Next, the layer structure of the light shielding film 400 of this embodiment will be described with reference to FIG. FIG. 7 is a cross-sectional view showing the layer structure of the light shielding film 400.

  The light shielding film 400 in the present embodiment is configured by, for example, FN white coat. The FN Shirocoat is composed of PET (polyethylene terephthalate), Al (aluminum), and white pigment. Specifically, Al is deposited as a light shielding layer 403 under the PET layer 402 as a base material. Since Al has a high light reflectivity, an appropriate thickness is very effective as a light shielding layer. However, the light shielding layer 403 according to the present invention is not limited to Al, and may be composed of a metal other than Al or may be composed of a material other than metal. A print layer 401 is provided above the PET layer 402. The print layer 401 is provided by coating the PET layer 402 with a white pigment. Note that the stacking order of the layers constituting the light-shielding film is not limited to that described above. An adhesive layer 404 is provided below the light shielding layer 403. Thereby, the light shielding film 400 can be fixed to a predetermined position of the flexible substrate 200 by being attached like a seal.

  By being made of the above materials, the light shielding film 400 realizes light shielding for the driving integrated circuit 300, and can be reduced in cost compared to the case where a light shielding case or the like is provided. The thickness of each layer in this embodiment is about 2 μm for the printing layer 401, 50 μm for the PET layer 402, 2 μm for the light shielding layer 403, and about 20 μm for the adhesive layer 404. Since the light-shielding film 400 is very thin, it is not necessary to provide a new space for arrangement, and the electro-optical device can be saved in space.

  Next, printing on the print layer 401 will be described with reference to FIG. FIG. 8 is a plan view showing the printed light shielding film 400.

  As shown in FIG. 8, a product code, a bar code, or the like is printed on the printing layer 401 of the light shielding film 400 by a printing device such as a printer. In addition, information that is considered to be used in the manufacturing process or the repair process may be appropriately selected and printed.

  For example, if a product code is printed, it is possible to visually recognize in which product the part is incorporated in the manufacturing process, and work efficiency can be improved. If a code such as a barcode is recognized by a reading machine, parts can be easily managed using a computer or the like. In addition, by printing the date of manufacture and the name of the manufacturing plant, etc., it has traceability, and if the product breaks down, you can know when and where it was manufactured. Speedup and failure cause analysis are possible.

  As described above, by providing the printing layer 401 on the light shielding film 400 and printing various information on the printing layer 401, a plurality of practically beneficial effects can be obtained.

  Next, an electro-optical device according to a second embodiment will be described with reference to FIGS. In the second embodiment, the structure other than the light shielding film 400 is the same as that of the first embodiment. Therefore, in the second embodiment, the light shielding film 400 will be mainly described, and other descriptions will be omitted as appropriate. FIG. 9 is a cross-sectional view showing the layer structure of the light shielding film connected to the ground wiring. FIG. 10 is a plan view of a flexible substrate in which the light shielding film 400 is provided on the entire surface excluding the connection terminal portion 201.

  As shown in FIGS. 9 and 10, in the light shielding film 400 in this embodiment, a light shielding layer 403 made of a conductive metal is connected to a ground wiring which is one of the wirings 202 by a connector 403c. . The light shielding layer 403 and the ground wiring may be connected at one place or a plurality of places beyond that. The connector 403 c is provided by opening a through hole in a part of the adhesive layer 404. The connector 403c may be integrated with the light shielding layer 403 or may be newly provided as a separate body.

  First, the effect of the light shielding film 400 in the present embodiment on noise will be described. Noise is due to temporal potential fluctuations, and is mainly generated in components such as integrated circuits. In order to reduce the generation of noise, the potential fluctuation in the driving integrated circuit 300 may be suppressed. On the other hand, in the present embodiment, by reducing the impedance of the driving integrated circuit 300, fluctuations in potential are suppressed and noise generation can be reduced.

  In this embodiment, since the light shielding layer 403 made of conductive metal provided in the light shielding film 400 is connected to the ground wiring of the wiring 202, the capacitance of the wiring 202 increases. Since the impedance is almost inversely proportional to the capacitance, the impedance of the driving integrated circuit 300 that is electrically connected to the wiring 202 is lowered. Thereby, generation of noise is reduced, and malfunction of each component such as the driving integrated circuit 300 is less likely to occur, so that the reliability of the electro-optical device is ensured.

  As shown in FIG. 10, the light shielding film 400 may be formed in a region of the other surface of the flexible substrate 200 that does not face the driving integrated circuit 300. In this case, since the area of the light shielding film 400 is increased, the area of the light shielding layer 403 is also increased. Since the capacity is approximately proportional to the area, the capacity increases and the effect of lowering the impedance is increased.

  Furthermore, since the light shielding film 400 has a large area covering the flexible substrate 200, the light shielding rate with respect to the driving integrated circuit 300 is also high. Therefore, it is effective in securing the reliability of the electro-optical device by shielding light.

  Next, a projector using the above-described liquid crystal device, which is an electro-optical device, as a light valve will be described. FIG. 11 is a plan view showing a configuration example of the projector.

  As shown in FIG. 11, a lamp unit 1102 including a white light source such as a halogen lamp is provided inside the projector 1100. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G are the same as those of the liquid crystal device described above, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit. The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In the dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Therefore, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display image by the liquid crystal panel 1110G needs to be horizontally reversed with respect to the display images by the liquid crystal panels 1110R and 1110B.

  In addition, since light corresponding to each primary color of R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  In addition to the electronic apparatus described with reference to FIG. 10, a liquid crystal television, a mobile phone, a viewfinder type, a monitor direct view type video tape recorder, a car navigation device, a pager, an electronic notebook, a calculator, a word processor, a work Examples include a station, a videophone, a POS terminal, and a device equipped with a touch panel. Needless to say, the present invention can be applied to these various electronic devices.

  In addition to the liquid crystal device described in the above embodiment, the present invention also includes a reflective liquid crystal device (LCOS) in which elements are formed on a silicon substrate, a plasma display (PDP), a field emission display (FED, SED), The present invention can also be applied to an organic EL display, a digital micromirror device (DMD), an electrophoresis apparatus, and the like.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification. An electronic apparatus including the electro-optical device is also included in the technical scope of the present invention.

1 is a plan view showing an overall configuration of an electro-optical panel according to a first embodiment. It is the HH 'sectional view taken on the line of FIG. It is a perspective view which shows the structure of the connected electro-optical panel and a flexible substrate. It is a top view at the time of seeing a flexible substrate from one side in which an integrated circuit for drive is provided, and the other side. It is sectional drawing which shows the example of arrangement | positioning of a light shielding film. It is sectional drawing which shows the example of arrangement | positioning of a light shielding film. It is sectional drawing which shows the layer structure of a light shielding film. It is a top view which shows the printed light shielding film. It is sectional drawing which shows the layer structure of the light shielding film connected with a ground wiring in 2nd Embodiment. It is a top view of the flexible substrate with which the light shielding film was provided in the whole surface except the connection terminal part. It is a top view which shows the structure of the projector which is an example of the electronic device to which the electro-optical apparatus is applied.

Explanation of symbols

  9a ... Pixel electrode, 2 ... Scan line, 3 ... Data line, 6 ... Image signal line, 10 ... TFT array substrate, 10a ... Image display area, 100 ... Electro-optical panel, 102 ... External circuit connection terminal, 200 ... Flexible substrate , 201 ... connection terminal section, 202 ... wiring, 300 ... driving integrated circuit, 400 ... light shielding film, 401 ... printing layer, 402 ... PET layer, 403 ... light shielding layer, 404 ... adhesive layer

Claims (6)

An electro-optic panel;
A flexible substrate having a connection terminal portion connected to the electro-optical panel ;
On one surface of the flexible substrate, a driving integrated circuit for driving the electro-optical panel via the connection terminal portion,
A light-shielding film disposed opposite to the driving integrated circuit on the other surface of the flexible substrate;
The light-shielding film has a printable print layer formed on a base material, and a light-shielding layer formed on a surface opposite to the surface on which the print layer of the base material is formed. An electro-optical device, which is attached to the flexible substrate through an adhesive layer between the flexible substrate . 2. The electro-optical device according to claim 1, wherein the light shielding layer is made of a metal and is connected to a ground wiring formed on the flexible substrate via a through hole formed in the adhesive layer.   2. The electricity according to claim 1, wherein the light shielding film is formed at least partially in a region facing the driving integrated circuit on the one surface in addition to the other surface. Optical device.   4. The light-emitting film according to claim 1, further comprising: another light-shielding film formed on at least a part of a surface opposite to the side facing the one surface in the driving integrated circuit. The electro-optical device according to Item. The light-shielding film, on the other surface, an electric according to any one of claims 1 to 4, characterized in that it also at least partially formed in a region not opposed to the driving integrated circuit Optical device. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 5.

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