JP2010175818A - Electro-optical apparatus and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent increase of electric resistance at an OLB part of a flexible wiring board connected electrically with an electro-optical apparatus. <P>SOLUTION: The electro-optical apparatus (1) comprises a pair of substrates (10, 20) disposed facing with each other, a pixel region (10a) with a plurality of pixels of one of the pair of the substrates arranged, a peripheral region disposed in the periphery of the pixel region, a semiconductor element (310) disposed along a first side of one of the substrates in the peripheral region for driving the plurality of pixels, and a plurality of connecting terminals (102) arranged adjacently to the first side along a second side shorter than the first side in the peripheral region. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a technical field of an electro-optical device such as a liquid crystal device and an electronic apparatus including the electro-optical device such as a liquid crystal projector.

  As this type of device, for example, Patent Document 1 describes an electro-optical device having an IC (Integrated Circuit) mounted on a substrate and a flexible substrate connected to an end of the substrate. . In particular, it is described that a part of a plurality of substrate-side terminals for mounting the IC and the flexible substrate on the substrate is surrounded by a shield layer.

  Note that when a liquid crystal panel, which is an example of this type of electro-optical device, is used as a light valve in a liquid crystal projector, if dust or dust (hereinafter referred to as “dust” as appropriate) adheres to the surface of the light valve, the projection screen Since the dust image is also projected on the image, the image quality may be deteriorated. For this reason, a dust-proof glass plate is often provided on the outer surface of the substrate constituting the liquid crystal panel.

JP 2006-98450 A

  However, according to Patent Document 1, the side of the substrate along which the long side of the IC extends is the same as the side of the substrate to which the flexible substrate is connected. Then, for example, when a flexible substrate is connected to the short side of the substrate in order to reduce the size of an electronic apparatus including the electro-optical device, an OLB (Outer Lead Bonding) portion of the flexible substrate is formed. The accuracy is limited, and the electrode in the OLB portion of the flexible substrate and the electrode formed on the substrate may be shifted. As a result, there is a technical problem that the electrical contact area is reduced and the electrical resistance may increase.

  SUMMARY An advantage of some aspects of the invention is that it provides an electro-optical device and an electronic apparatus that can prevent an increase in electric resistance in an OLB portion.

  In order to solve the above problems, an electro-optical device of the present invention includes a pair of substrates disposed to face each other, a pixel region in which a plurality of pixels on one of the pair of substrates are arranged, A peripheral region located around a pixel region; a semiconductor element disposed along the first side of the one substrate in the peripheral region and driving the plurality of pixels; and the first side in the peripheral region And a plurality of connection terminals arranged along a second side shorter than the first side.

  According to the electro-optical device of the present invention, the semiconductor element as a driving driver for driving each of the plurality of pixels has one substrate in a peripheral region located around the pixel region of one substrate. Are arranged along the first side. Here, the “pixel area” does not mean an area of individual pixels, but means an entire area in which a plurality of pixels are arranged in a plane, and is typically an “image display area” or “display area”. Is equivalent to. Further, “arranged along the first side” means that the long side of the semiconductor element is arranged along the first side.

  The plurality of connection terminals are arranged along a second side that is adjacent to the first side and shorter than the first side in a peripheral region of one substrate. Each of the plurality of connection terminals is a terminal for electrically connecting the electro-optical device and an external circuit. Typically, various signals are input to the semiconductor element via the plurality of connection terminals. Is done.

  According to the study of the present inventor, the side along which the semiconductor element and the side along which the plurality of connection terminals lie on the same substrate are the same, and the semiconductor element is disposed along the short side of the one substrate. In this case, depending on the number of pins of the semiconductor element, there is a possibility that the distance between adjacent pins (that is, the pitch) is narrower. Then, although the distance between the connection terminals adjacent to each other becomes narrower, the electrodes in the OLB part are electrically connected to a plurality of connection terminals, for example, due to the formation accuracy of the OLB part of the flexible wiring board, It has been found that there is a possibility that the connection terminal of the circuit board is displaced.

  However, in the present invention, the semiconductor element is disposed along the first side of one substrate, and the plurality of connection terminals are disposed along the second side that is adjacent to the first side and shorter than the first side. Has been. For this reason, a plurality of connection terminals can be formed regardless of the pin pitch of the semiconductor element. As a result, a plurality of connection terminals can be formed, for example, according to the formation accuracy of the OLB portion of the flexible wiring board, and thus it is possible to prevent the electrodes and connection terminals in the OLB portion from being displaced. Therefore, an increase in electrical resistance in the OLB portion can be prevented.

  Particularly in the present invention, the second side on which the plurality of connection terminals are arranged is shorter than the first side on which the semiconductor element is arranged. Then, for example, since the flexible wiring board can be connected to the short side of the electro-optical device, for example, when the electro-optical device is mounted on an electronic device, the degree of freedom in arrangement can be improved.

  Further, since the semiconductor element is arranged on one substrate, it is less affected by noise than when a driving driver is provided as an external circuit, for example, and the electro-optical device can be driven stably. It is very advantageous for practical use.

  In one aspect of the electro-optical device of the present invention, the electro-optical device further includes a dust-proof substrate bonded to the other of the pair of substrates, and when viewed in plan on the pair of substrates, the dust-proof substrate includes: The semiconductor element is at least partially covered.

  According to this aspect, the dustproof substrate bonded to the other of the pair of substrates covers the semiconductor element at least partially when viewed in plan on the pair of substrates. The dust-proof substrate and the semiconductor element may be filled with an adhesive or the like, for example, or may not be filled with anything (that is, the dust-proof substrate and the semiconductor element are in contact with each other). May be).

  According to this aspect, the heat of the semiconductor element can be dissipated through the dust-proof substrate (that is, the dust-proof substrate can function as a heat dissipation member). Can be suppressed.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device of the present invention (including various aspects thereof).

  According to the electronic apparatus of the present invention, since the electro-optical device of the present invention described above is included, the electronic apparatus can be miniaturized and can perform high-quality display. Various electronic devices such as a device, a mobile phone, an electronic notebook, a word processor, a viewfinder type or a monitor direct-view type video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized.

  In addition, as an electronic apparatus of the present invention, for example, an electrophoretic device such as electronic paper, an electron emission device (Field Emission Display and Conduction Electron-Emitter Display), a display device using these electrophoretic devices and an electron emission device are realized. Is also possible.

  The effect | action and other gain of this invention are clarified from the form for implementing demonstrated below.

It is a top view which shows the whole structure of the liquid crystal device which concerns on embodiment of this invention. It is the sectional view on the AA 'line of FIG. It is the top view which looked at the TFT array substrate of the liquid crystal panel which concerns on embodiment of this invention from the counter substrate side with each component formed on it. It is the HH 'sectional view taken on the line of FIG. It is a top view which shows the structure of the projector as an example of the electronic device to which the liquid crystal device which concerns on embodiment of this invention is applied.

  Hereinafter, embodiments of an electro-optical device and an electronic apparatus according to the invention will be described with reference to the drawings. In the following drawings, the scales are different for each layer and each member so that each layer and each member can be recognized on the drawing. In the following embodiments, as an example of an electro-optical device, a TFT (Thin Film Transistor) active matrix driving type liquid crystal device with a built-in driving circuit is cited.

<Liquid crystal device>
First, the overall configuration of the liquid crystal device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the overall configuration of the liquid crystal device according to this embodiment, and FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG.

  1 and 2, the liquid crystal device 1 includes a liquid crystal panel 100, dust-proof glasses 210 and 220, a driver IC 310 for driving, and a flexible wiring board 320. Here, the “dust-proof glass 210” and the “driver IC 310 for driving” according to the present embodiment are examples of the “dust-proof substrate” and the “semiconductor element” according to the present invention, respectively.

  Here, the configuration of the liquid crystal panel 100 will be described in detail with reference to FIGS. 3 and 4. FIG. 3 is a plan view of the TFT array substrate of the liquid crystal panel according to the present embodiment, as viewed from the side of the counter substrate together with the components formed thereon, and FIG. 4 is a plan view of FIG. It is a HH 'line sectional view.

  3 and 4, in the liquid crystal panel 100, the TFT array substrate 10 and the counter substrate 20 are arranged to face each other. The TFT array substrate 10 is made of a substrate such as a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of a substrate such as a quartz substrate or a glass substrate. Here, the “TFT array substrate 10” and the “counter substrate 20” according to the present embodiment are examples of “one substrate” and “the other substrate” according to the present invention, respectively.

  A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 are surrounded by an image display region 10a as an example of the “pixel region” according to the present invention. They are bonded to each other by a sealing material 52 provided in a sealing region located in the area.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or an ultraviolet / heat combination type curable resin for bonding the two substrates, and is applied to the TFT array substrate 10 in the manufacturing process, and then irradiated with ultraviolet rays. And cured by heating or the like. In the sealing material 52, a gap material such as glass fiber or glass bead is sprayed for setting the interval (that is, the gap) between the TFT array substrate 10 and the counter substrate 20 to a predetermined value. Note that the gap material may be arranged in the image display region 10a or a peripheral region located around the image display region 10a in addition to or instead of the material mixed in the seal material 52.

  In FIG. 3, a light-shielding frame light-shielding film 53 that defines the image display region 10 a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  A data line driving circuit 101 is provided along one side of the TFT array substrate 10 in a region located outside the sealing region where the sealing material 52 is disposed in the peripheral region. The sampling circuit 7 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. On the other hand, along this one side, outside the data line driving circuit 101 (that is, the overhanging portion where the TFT array substrate 10 in FIG. 3 protrudes from the counter substrate 20 and below the data line driving circuit 101). A driver IC 310 for driving is mounted.

  The scanning line driving circuit 104 is provided so as to be covered with the frame light shielding film 53 in the frame area inside the seal area 52a along two sides adjacent to the one side. Further, the external circuit connection terminal 102 is provided along the edge of the side along which one side of the scanning line driving circuit 104 extends (that is, the left side of the TFT array substrate 10 in FIG. 3).

  The “external circuit connection terminal 102” according to the present embodiment is an example of the “plurality of connection terminals” according to the present invention, and the “lower side” and the “left side” of the TFT array substrate 10 in FIG. It is an example of the “first side” and the “second side” according to the present invention.

  On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20. Further, a lead wiring 90 for electrically connecting the driver IC 310 for driving, the data line driving circuit 101, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like is formed.

  Note that the external circuit connection terminal 102 and the driver IC 310 for driving are electrically connected to each other via a wiring not shown here.

  In FIG. 4, on the TFT array substrate 10, a laminated structure in which pixel switching TFTs as drive elements, wiring lines such as scanning lines and data lines are formed is formed. Although the detailed structure of this laminated structure is not shown in FIG. 4, pixel electrodes 9a made of a transparent material such as ITO (Indium Tin Oxide) are provided on the laminated structure in a predetermined pattern for each pixel. It is formed in an island shape.

  The pixel electrode 9a is formed in the image display region 10a on the TFT array substrate 10 so as to face a counter electrode 21 described later. On the surface of the TFT array substrate 10 facing the liquid crystal layer 50, that is, on the pixel electrode 9a, an alignment film 16 is formed so as to cover the pixel electrode 9a.

  A light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. For example, the light shielding film 23 is formed in a lattice shape when viewed in plan on the facing surface of the facing substrate 20. In the counter substrate 20, a non-opening area is defined by the light shielding film 23, and an area partitioned by the light shielding film 23 is an opening area through which light emitted from, for example, a projector lamp or a direct viewing backlight is transmitted. The light shielding film 23 may be formed in a stripe shape, and the non-opening region may be defined by the light shielding film 23 and various components such as data lines provided on the TFT array substrate 10 side.

  On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed so as to face the plurality of pixel electrodes 9a. In order to perform color display in the image display region 10a on the light shielding film 23, a color filter (not shown in FIG. 4) may be formed in a region including a part of the opening region and the non-opening region. An alignment film 22 is formed on the counter electrode 21 on the counter surface of the counter substrate 20.

  In addition to the data line driving circuit 101, the scanning line driving circuit 104, the sampling circuit 7 and the like on the TFT array substrate 10 shown in FIGS. A precharge circuit that supplies the charge signal prior to the image signal, an inspection circuit for inspecting the quality, defects, etc. of the liquid crystal device 1 during manufacture or at the time of shipment may be formed.

  The driver IC 310 for driving may have a part or all of the functions of the data line driving circuit 101.

  1 and 2 again, the dust-proof glass 210 at least partially covers the driver IC 310 for driving when viewed in plan on the TFT array substrate 10. As shown in FIG. 2, since the dustproof glass 210 is in contact with the driving driver IC 310, the heat of the driving driver IC 310 can be efficiently dissipated through the dustproof glass 210.

  Note that a space between the dustproof glass 210 and the driver IC 310 for driving may be filled with, for example, a heat conductive adhesive having a relatively high heat conductivity.

  The flexible wiring board 320 is electrically connected to the external circuit connection terminal 102. On the flexible wiring board 320, for example, a plurality of wirings are formed in stripes. When a power supply voltage is applied to a part of the plurality of wirings or various signals such as image signals are supplied to other parts of the plurality of wirings, a liquid crystal panel is provided via a driver IC 310 for driving. 100 is driven.

  In the present embodiment, in particular, the side along which the driver IC 310 for driving is located (that is, the lower side of the TFT array substrate 10 in FIG. 1) and the side along which the external circuit connection terminal 102 is located (ie, the TFT array substrate 10 in FIG. 1). The left side of is different. For this reason, the external circuit connection terminal 102 can be formed regardless of the pin pitch of the driver IC 310 for driving. As a result, the external circuit connection terminal 102 can be formed in accordance with the formation accuracy of the OLB portion of the flexible wiring board 320, thereby preventing the electrode in the OLB portion and the external circuit connection terminal 102 from shifting. be able to. Therefore, an increase in electrical resistance in the OLB portion can be prevented.

<Electronic equipment>
Next, a case where the above-described liquid crystal device is applied to a projector which is an example of an electronic device will be described with reference to FIG. The liquid crystal device 1 described above is used as a light valve of a projector. FIG. 5 is a plan view showing a configuration example of the projector.

  As shown in FIG. 5, a lamp unit 1102 including a white light source such as a halogen lamp is provided inside the projector 1100. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G have the same configuration as that of the liquid crystal device 1 described above, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit, respectively. . The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In this dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Accordingly, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display images by the liquid crystal panels 1110R and 1110B need to be horizontally reversed with respect to the display images by the liquid crystal panel 1110G.

  Since light corresponding to the primary colors R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  In addition to the electronic device described with reference to FIG. 5, a mobile personal computer, a mobile phone, an LCD TV, a viewfinder type or a monitor direct-view type video tape recorder, a car navigation device, a pager, and an electronic notebook , Calculators, word processors, workstations, videophones, POS terminals, devices with touch panels, and the like. Needless to say, the present invention can be applied to these various electronic devices.

  In addition to the liquid crystal device described in the above embodiment, the present invention can also be applied to a reflective liquid crystal device (Liquid Crystal On Silicon: LCOS) that forms elements on a silicon substrate.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change. In addition, an electronic apparatus including the electro-optical device is also included in the technical scope of the present invention.

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 10 ... TFT array substrate, 10a ... Image display area, 20 ... Opposite substrate, 100 ... Liquid crystal panel, 102 ... External circuit connection terminal, 310 ... Driver IC for driving, 320 ... Flexible wiring board

Claims (3)

A pair of substrates disposed opposite each other;
A pixel region in which a plurality of pixels of one of the pair of substrates are arranged;
A peripheral region located around the pixel region;
A semiconductor element that is disposed along the first side of the one substrate and drives the plurality of pixels in the peripheral region;
An electro-optical device comprising: a plurality of connection terminals that are adjacent to the first side and arranged along a second side that is shorter than the first side in the peripheral region. A dustproof substrate bonded to the other of the pair of substrates;
The electro-optical device according to claim 1, wherein the dust-proof substrate at least partially covers the semiconductor element when viewed in plan on the pair of substrates.   An electronic apparatus comprising the electro-optical device according to claim 1.

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