JP2009204958A - Electro-optic device and method for manufacturing the same, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the number of components of an electro-optic device and to reduce the number of steps in manufacturing an electro-optic device. <P>SOLUTION: The electro-optic device (1) includes an electro-optic panel (100) carrying out an electro-optic operation in a pixel region (10a) and a housing case (210) made of a resin in contact with the outer face of the electro-optic panel and at least partially covering the outer face. Since the housing case is in contact with the outer face of the electro-optic panel in the electro-optic device, it is unnecessary to adhere and fix the housing case and the electro-optic panel to each other with, for example, an adhesive. This reduces the number of components of the electro-optic device and the number of steps in manufacturing the electro-optic device. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a technical field of an electro-optical device such as a liquid crystal device, a method for manufacturing the electro-optical device, and an electronic apparatus such as a liquid crystal projector including the electro-optical device.

  As this type of electro-optical device, for example, an electro-optical panel is housed in a case in which an opening corresponding to the effective display area is formed, and the electro-optical panel and the case are bonded and fixed to each other with an adhesive. An optical device has been proposed (see Patent Document 1).

JP 2002-366046 A

  However, according to Patent Document 1, after the electro-optical panel is housed in the case, the electro-optical panel and the case are bonded and fixed to each other with an adhesive, so that the number of components constituting the electro-optical device increases. However, there is a technical problem that the number of manufacturing steps of the electro-optical device increases.

  The present invention has been made in view of the above problems, for example, and provides an electro-optical device, a manufacturing method thereof, and an electronic apparatus that can reduce the number of components and the number of manufacturing steps. To do.

  In order to solve the above problems, an electro-optical device according to an aspect of the invention is an electro-optical panel that performs an electro-optical operation in a pixel region, and is made of a resin that contacts an outer surface of the electro-optical panel and at least partially covers the outer surface. A storage case.

  According to the electro-optical device of the present invention, for example, an electro-optical panel such as a liquid crystal panel performs an electro-optical operation such as a display operation in a pixel region on the electro-optical panel when driven. Here, the “pixel area” does not mean an area of individual pixels, but means an entire area in which a plurality of pixels are arranged in a plane, and is typically an “image display area” or “display area”. Is equivalent to.

  The housing case is made of a resin such as a transparent resin or a high thermal conductive resin, and is in contact with the outer surface of the electro-optical panel and at least partially covers the outer surface. Here, the “outer surface” means an outer surface such as an upper surface, a lower surface, or a side surface of the electro-optical panel. Further, “contacting the outer surface” typically means that the electro-optic panel and the housing are accommodated without anything between the electro-optic panel and the housing case (that is, the electro-optic panel and the housing case are in contact with each other). It means that the case is arranged.

  For example, the housing case may be in contact with only the side surface of the electro-optical panel, or may be in contact with all other portions while exposing a portion corresponding to the pixel region of the electro-optical panel. Alternatively, it may be in contact with the entire outer surface of the electro-optical panel (that is, the electro-optical panel may be included).

  Thus, since the storage case is in contact with the outer surface of the electro-optical panel, it is not necessary to bond and fix the storage case and the electro-optical panel to each other with an adhesive, for example. For this reason, the manufacturing cost can be reduced and the manufacturing process of the electro-optical device can be simplified.

  In addition, since the electro-optical panel and the housing case are in contact with each other, heat transfer efficiency between the electro-optical panel and the housing case is improved, and heat dissipation efficiency of the electro-optical panel can be improved. Furthermore, since the relative position between the electro-optical panel and the housing case is difficult to shift, the placement accuracy can be improved when the electro-optical device is mounted inside a housing of, for example, an electronic device.

  The housing case may be formed, for example, by placing an electro-optical panel in a mold that defines the outer shape of the housing case with a predetermined gap and filling the gap with resin (that is, insert molding). do it).

  If the electro-optical panel is bonded and fixed to the housing case with an adhesive or the like, at least a step of filling the adhesive between the electro-optical panel and the housing case must be provided. In addition, when the adhesive is filled, an air layer may be generated between the electro-optical panel and the housing case. Then, the heat transfer efficiency between the electro-optical panel and the housing case is reduced, and the heat dissipation efficiency of the electro-optical panel may be reduced. Further, depending on how the adhesive is filled between the electro-optical panel and the housing case, the electro-optical panel may be displaced from a predetermined position.

  However, in the present invention, as described above, since the housing case is at least partially in contact with the outer surface of the electro-optic panel, it is possible to improve the heat dissipation efficiency while reducing the number of parts and the number of manufacturing steps. This is very advantageous in practice.

  In one aspect of the electro-optical device of the present invention, the housing case includes the electro-optical panel.

  According to this aspect, since the storage case can be provided with functions such as a dust-proof member, the number of parts constituting the electro-optical device can be further reduced, which is very advantageous in practice. is there.

  In another aspect of the electro-optical device according to the aspect of the invention, the storage case includes a transparent resin.

  According to this aspect, even if the housing case is in contact with, for example, the pixel region of the electro-optical panel, it does not block light incident on the electro-optical device or light emitted from the electro-optical device. Very advantageous.

  In this aspect, the outer surface of the housing case may be subjected to antireflection processing.

  If comprised in this way, the fall of the brightness | luminance by a storage case can be suppressed, and it is very advantageous practically.

  In another aspect of the electro-optical device according to the aspect of the invention, the electro-optical panel is provided on a side of the pair of substrates that sandwich the electro-optical material and at least one of the pair of substrates that does not face the electro-optical material. A dustproof substrate.

According to this aspect, the pair of substrates sandwich the electro-optical material such as liquid crystal. Note that the pair of substrates has, for example, an inorganic alignment film made of an inorganic material such as SiO or SiO ₂ on the side facing the electro-optical material on at least one substrate. Similarly, an inorganic alignment film may be provided on the side facing the electro-optical material on the other substrate. The dust-proof substrate is disposed on the side of at least one of the pair of substrates that does not face the electro-optical material.

  If the storage case is arranged so that one surface of the dustproof substrate is exposed (for example, if it is in contact with only the side surface of the electro-optical panel), heat can be dissipated from the surface of the electro-optical panel. Dissipation efficiency can be improved.

  In an aspect in which the electro-optical panel includes a dustproof substrate, at least a portion corresponding to the pixel region on the surface of the dustproof substrate that does not face the pair of substrates may be exposed from the housing case.

  If comprised in this way, a storage case can be formed with the high thermal conductive resin which is resin containing a metal particle, carbon, etc., for example, and the heat dissipation efficiency of an electro-optical panel can be improved more. Alternatively, since the housing case can be formed of an opaque resin, the range of material selection can be increased, which is very advantageous in practice.

  In an aspect in which the electro-optical panel includes a dustproof substrate, the housing case may include a high thermal conductive resin.

  If comprised in this way, since a storage case contains highly heat conductive resin, it can be made comparatively easy and the heat dissipation efficiency of an electro-optical panel can be improved more, and it is very advantageous practically.

  In another aspect of the electro-optical device of the present invention, the electro-optical panel and the housing case are integrally formed by an insert molding method.

  According to this aspect, it is possible to form the housing case that is relatively easy and at least partially in contact with the outer surface of the electro-optical panel.

  In order to solve the above-described problems, an electro-optical device manufacturing method according to the present invention includes an electro-optical panel that performs an electro-optical operation in a pixel region, an outer surface of the electro-optical panel, and at least partially covering the outer surface. An electro-optical device manufacturing method comprising a resin-made storage case, wherein the electro-optical panel is disposed in a mold that defines an outer shape of the storage case with a gap of a predetermined width; and And a filling step of filling the gap with resin.

  According to the method for manufacturing an electro-optical device of the present invention, an electro-optical device that can reduce the number of parts and the number of manufacturing steps can be manufactured.

  First, in the arranging step, the electro-optical panel is arranged with a gap of a predetermined width inside a mold that defines the outer shape of the housing case. Here, the “predetermined width” according to the present invention is typically set as a width capable of supporting and fixing the electro-optical panel. Next, in the filling step, resin is filled in the gap between the electro-optical panel and the mold. A storage case is formed by solidifying the filled resin.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects thereof).

  According to the electronic apparatus of the present invention, since the above-described electro-optical device of the present invention is provided, for example, the manufacturing cost of the electro-optical device can be reduced. Various electronic devices such as electronic notebooks, word processors, viewfinder type or monitor direct-view type video tape recorders, workstations, videophones, POS terminals and touch panels can be realized.

  The operation and other advantages of the present invention will become apparent from the best mode for carrying out the invention described below.

  Hereinafter, embodiments of an electro-optical device, a manufacturing method thereof, and an electronic apparatus according to the present invention will be described with reference to the drawings. In the following drawings, the scales are different for each layer and each member so that each layer and each member can be recognized on the drawing. In the following embodiments, as an example of an electro-optical device, a TFT (Thin Film Transistor) active matrix driving type liquid crystal device with a built-in driving circuit is cited.

<First Embodiment>
A first embodiment of the electro-optical device according to the invention will be described with reference to FIGS.

(Configuration of liquid crystal device)
First, the overall configuration of the liquid crystal device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view showing the overall configuration of the liquid crystal device according to this embodiment, and FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG.

  1 and 2, the liquid crystal device 1 according to this embodiment includes a liquid crystal panel 100, a housing case 210, and a wiring board 220. Here, the “liquid crystal panel 100” according to the present embodiment is an example of the “electro-optical panel” according to the present invention.

  The liquid crystal panel 100 includes a TFT array substrate 10 and a counter substrate 20. The wiring board 220 is electrically connected to an external circuit connection terminal of the liquid crystal panel 100 described later. For example, a power supply voltage is applied to a part of a plurality of wirings formed in a stripe shape on the wiring substrate 220, or various signals such as image signals are supplied to other parts of the plurality of wirings. The liquid crystal panel 100 is driven.

  As shown in FIG. 2, the housing case 210 including the transparent resin encloses the liquid crystal panel 100 while being in contact with the outer surface of the liquid crystal panel 100 (in other words, the housing case 210 covers the entire liquid crystal panel 100. Formed to wrap up). The housing case 210 is provided with a plurality of mounting holes 210h for mounting the liquid crystal device 1 in a housing of an electronic device such as a liquid crystal projector. It is desirable that the outer surface 210a of the housing case 210 is subjected to antireflection processing.

  Since the storage case 210 is in contact with the outer surface of the liquid crystal panel 100, it is not necessary to bond and fix the storage case 210 and the liquid crystal panel 100 to each other with an adhesive, for example. In addition, heat transfer efficiency between the liquid crystal panel 100 and the housing case 210 is improved, and heat dissipation efficiency of the liquid crystal panel 100 can be improved. In addition, since the storage case 210 has a function of dust-proof glass that suppresses deterioration of image quality due to dust, dust, and the like attached to the liquid crystal device 1, it is not necessary to provide a separate dust-proof glass.

  Next, a specific configuration of the liquid crystal panel 100 will be described with reference to FIGS. FIG. 3 is a plan view of the TFT array substrate as viewed from the side of the counter substrate together with the components formed thereon, and FIG. 4 is a cross-sectional view taken along the line HH ′ of FIG.

  3 and 4, in the liquid crystal panel 100, the TFT array substrate 10 and the counter substrate 20 are arranged to face each other. The TFT array substrate 10 is made of a substrate such as a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of a substrate such as a quartz substrate or a glass substrate. Between the TFT array substrate 10 and the counter substrate 20, a liquid crystal layer 50 including liquid crystal as an example of the “electro-optical material” according to the present invention is sealed. The TFT array substrate 10 and the counter substrate 20 are These are bonded to each other by a sealing material 52 provided in a sealing area located around the image display area 10a as an example of the “pixel area” according to the present invention.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or an ultraviolet / heat combination type curable resin for bonding the two substrates, and is applied to the TFT array substrate 10 in the manufacturing process, and then irradiated with ultraviolet rays. And cured by heating or the like. In the sealing material 52, a gap material such as glass fiber or glass beads for dispersing the distance (ie, gap) between the TFT array substrate 10 and the counter substrate 20 to a predetermined value is dispersed. Note that the gap material may be arranged in the image display region 10a or a peripheral region located around the image display region 10a in addition to or instead of the material mixed in the seal material 52.

  In FIG. 3, a light-shielding frame light-shielding film 53 that defines the image display region 10 a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  A data line driving circuit 101 and an external circuit connection terminal 102 are provided along one side of the TFT array substrate 10 in a region located outside the sealing region in which the sealing material 52 is disposed in the peripheral region. The sampling circuit 7 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. The scanning line driving circuit 104 is provided so as to be covered with the frame light shielding film 53 in the frame area inside the seal area 52a along two sides adjacent to the one side.

  On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20. Further, a lead wiring 90 for electrically connecting the external circuit connection terminal 102 to the data line driving circuit 101, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like is formed.

  In FIG. 4, on the TFT array substrate 10, a laminated structure in which pixel switching TFTs as drive elements, wiring lines such as scanning lines and data lines are formed is formed. Although the detailed structure of this laminated structure is not shown in FIG. 4, pixel electrodes 9a made of a transparent material such as ITO (Indium Tin Oxide) are provided on the laminated structure in a predetermined pattern for each pixel. It is formed in an island shape.

  The pixel electrode 9a is formed in the image display region 10a on the TFT array substrate 10 so as to face a counter electrode 21 described later. On the surface of the TFT array substrate 10 facing the liquid crystal layer 50, that is, on the pixel electrode 9a, an alignment film 16 is formed so as to cover the pixel electrode 9a.

  A light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. For example, the light shielding film 23 is formed in a lattice shape when viewed in plan on the facing surface of the facing substrate 20. In the counter substrate 20, a non-opening area is defined by the light shielding film 23, and an area partitioned by the light shielding film 23 is an opening area that transmits light emitted from, for example, a projector lamp or a direct viewing backlight. The light shielding film 23 may be formed in a stripe shape, and the non-opening region may be defined by the light shielding film 23 and various components such as data lines provided on the TFT array substrate 10 side.

  On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed so as to face the plurality of pixel electrodes 9a. In order to perform color display in the image display region 10a on the light shielding film 23, a color filter (not shown in FIG. 4) may be formed in a region including a part of the opening region and the non-opening region. An alignment film 22 is formed on the counter electrode 21 on the counter surface of the counter substrate 20.

  In addition to the data line driving circuit 101, the scanning line driving circuit 104, the sampling circuit 7 and the like on the TFT array substrate 10 shown in FIGS. A precharge circuit that supplies the charge signal prior to the image signal, an inspection circuit for inspecting the quality, defects, etc. of the liquid crystal device 1 during manufacture or at the time of shipment may be formed.

(Manufacturing method of liquid crystal device)
Next, a method for manufacturing the liquid crystal device according to the present embodiment will be described with reference to FIGS. FIG. 5 is a process cross-sectional view showing a part of the process of the manufacturing method of the liquid crystal device according to the present embodiment, and FIG. 6 is a process cross-sectional view showing a process following the process of FIG. 7 is a process cross-sectional view showing a process that follows the process of FIG. 6. 5 to 7 are cross-sectional views taken along the line BB 'in FIG. In the following drawings, detailed members of the liquid crystal panel 100 shown in FIGS. 3 and 4 are omitted as appropriate, and only directly related members are shown.

  First, after the liquid crystal panel 100 is manufactured by a predetermined manufacturing method, as shown in FIG. 5, the liquid crystal panel 100 is arranged in a mold 310 that defines the outer shape of the housing case 210 with a predetermined gap. . In the present embodiment, a support member 311 for providing a gap between the lower surface of the liquid crystal panel 100 and the mold 310 is provided inside the mold 310. Before the liquid crystal panel 100 is disposed in the mold 310, the wiring board 220 is electrically connected to the external circuit connection terminal 102 (see FIG. 3) of the liquid crystal panel 100.

  Next, as shown in FIG. 6, the mold 320 is disposed on the mold 310, and the resin 340 stored in the cylinder 330 is filled into the gap through the hole provided in the mold 320. . After the filled resin 340 is hardened, the molded product is taken out from the molds 310 and 320, whereby the liquid crystal device 1 is manufactured as shown in FIG. Thus, according to the manufacturing method of the liquid crystal device according to the present embodiment, the liquid crystal panel 100 and the housing case 210 constituting the liquid crystal device 1 are integrally formed by an insert molding method. Therefore, the number of parts and the number of manufacturing steps can be reduced.

Second Embodiment
Next, a second embodiment according to the electro-optical device of the invention will be described with reference to FIGS. The second embodiment is the same as the first embodiment except that the configuration of the liquid crystal panel is different. Therefore, in the second embodiment, the description overlapping with that of the first embodiment is omitted, and the common portions on the drawings are denoted by the same reference numerals, and only FIGS. 8 and 9 are basically different only. The description will be given with reference. FIG. 8 is a plan view showing the entire configuration of the liquid crystal device according to the present embodiment having the same concept as in FIG. 1, and FIG. 9 is a CC ′ line in FIG. It is sectional drawing.

  As shown in FIG. 9, the liquid crystal panel 110 of the liquid crystal device 2 according to this embodiment includes a TFT array substrate 10 and a counter substrate 20 that sandwich a liquid crystal layer 50 (see FIG. 4), and a TFT array substrate 10 and a counter substrate. 20 includes dust-proof glasses 401 and 402 as examples of the “dust-proof substrate” according to the present invention, which are arranged on the side not facing each liquid crystal layer 50. Here, the “liquid crystal panel 110” according to the present embodiment is another example of the “electro-optical panel” according to the present invention.

  As shown in FIGS. 8 and 9, in the liquid crystal device 2, the housing case 210 is formed so that the upper surface and the lower surface of the liquid crystal panel 110 are exposed. In addition, it is desirable that the housing case 210 is formed including a high thermal conductive resin.

(Modification)
Next, a modification of the liquid crystal device according to the present embodiment will be described with reference to FIGS. FIG. 10 is a plan view showing the entire configuration of the liquid crystal device according to the present embodiment having the same concept as FIG. 1, and FIG. 11 is a DD ′ line in FIG. 10 having the same concept as FIG. It is sectional drawing.

  As shown in FIGS. 10 and 11, the liquid crystal device 3 according to this modification accommodates the liquid crystal panel 110 so that the area corresponding to the image display area 10 a (see FIG. 3) is exposed among the upper and lower surfaces of the liquid crystal panel 110. A case 210 is formed. In other words, the housing case 210 is provided with an opening 211 corresponding to the image display area 10a. If the storage case 210 is formed in this way, the storage case 210 can have a function as a parting. In this case, the storage case 210 is typically formed including an opaque resin.

  When cooling air is supplied to the liquid crystal device 3, the windward shape of the housing case 210 may be a wedge shape, or fins may be formed on the outer surface of the housing case 210.

<Electronic equipment>
Next, a case where the above-described liquid crystal device is applied to a projector that is an example of an electronic device will be described with reference to FIG. The liquid crystal panel 100 in the above-described liquid crystal device is used as a light valve of a projector. FIG. 12 is a plan view showing a configuration example of the projector.

  As shown in FIG. 12, a projector 1100 has a lamp unit 1102 made of a white light source such as a halogen lamp. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G have the same configuration as that of the above-described liquid crystal device, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit, respectively. The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In this dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Accordingly, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display images by the liquid crystal panels 1110R and 1110B need to be horizontally reversed with respect to the display images by the liquid crystal panel 1110G.

  Since light corresponding to the primary colors R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  In addition to the electronic device described with reference to FIG. 12, a mobile personal computer, a mobile phone, a liquid crystal television, a viewfinder type or a monitor direct view type video tape recorder, a car navigation device, a pager, and an electronic notebook , Calculators, word processors, workstations, videophones, POS terminals, devices with touch panels, and the like. Needless to say, the present invention can be applied to these various electronic devices.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. The manufacturing method and the electronic apparatus provided with the electro-optical device are also included in the technical scope of the present invention.

It is a top view which shows the whole structure of the liquid crystal device which concerns on 1st Embodiment. It is the sectional view on the AA 'line of FIG. It is a top view which shows the whole structure of the liquid crystal panel which concerns on 1st Embodiment. It is the HH 'sectional view taken on the line of FIG. It is process sectional drawing which shows a part of process of the manufacturing method of the liquid crystal device which concerns on 1st Embodiment. FIG. 6 is a process cross-sectional view illustrating a process that follows the process of FIG. 5. FIG. 7 is a process cross-sectional view illustrating a process that follows the process in FIG. 6. It is a top view which shows the whole structure of the liquid crystal device which concerns on 2nd Embodiment. It is CC 'sectional view taken on the line of FIG. It is a top view which shows the whole structure of the liquid crystal device which concerns on the modification of 2nd Embodiment. It is the DD 'sectional view taken on the line of FIG. It is a top view which shows the structure of the projector which is an example of the electronic device to which the electro-optical apparatus is applied.

Explanation of symbols

  1, 2, 3 ... Liquid crystal device, 10 ... TFT array substrate, 10a ... Image display area, 20 ... Counter substrate, 100, 110 ... Liquid crystal panel, 210 ... Housing case, 220 ... Wiring substrate, 310, 320 ... Mold, 401, 402 ... dustproof glass

Claims (10)

An electro-optic panel that performs an electro-optic operation in the pixel region;
An electro-optical device comprising: a resin housing case that is in contact with an outer surface of the electro-optical panel and at least partially covers the outer surface.   The electro-optical device according to claim 1, wherein the housing case includes the electro-optical panel.   The electro-optical device according to claim 1, wherein the housing case includes a transparent resin.   The electro-optical device according to claim 3, wherein the outer surface of the housing case is subjected to antireflection processing. The electro-optical panel is
A pair of substrates holding the electro-optic material;
The electro-optical device according to claim 1, further comprising: a dust-proof substrate provided on a side of the pair of substrates that is not opposed to the electro-optical material.   6. The electro-optical device according to claim 5, wherein at least a portion corresponding to the pixel region on a surface of the dust-proof substrate that does not face the pair of substrates is exposed from the housing case.   The electro-optical device according to claim 5, wherein the housing case includes a high thermal conductive resin.   The electro-optical device according to claim 1, wherein the electro-optical panel and the housing case are integrally formed by an insert molding method. An electro-optical device manufacturing method comprising: an electro-optical panel that performs an electro-optical operation in a pixel region; and a resin containing case that is in contact with an outer surface of the electro-optical panel and at least partially covers the outer surface,
An arrangement step of arranging the electro-optic panel with a gap of a predetermined width inside a mold that defines the outer shape of the housing case;
And a filling step of filling the gap with a resin.   An electronic apparatus comprising the electro-optical device according to any one of 1 to 8.

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