JP4946740B2 - WIRING BOARD, ELECTRO-OPTICAL DEVICE HAVING THE WIRING BOARD, AND ELECTRONIC DEVICE - Google Patents

Description

  The present invention relates to a wiring board such as a flexible substrate used to connect an electro-optical panel and an external circuit in an electro-optical device such as a liquid crystal device, an electro-optical device including the wiring board, and the electric The present invention relates to a technical field of an electronic apparatus including an optical device such as a liquid crystal projector.

  With this type of wiring board, it is possible to prevent noise, deterioration in the quality of transmitted signals, and the like. For example, Patent Document 1 describes a technique in which a common mode filter is connected to at least one end of a balanced transmission line that is used in a display device and transmits a differential signal having a small amplitude. Patent Document 2 describes a technique in which a pair of transmission lines that transmit differential signals are arranged symmetrically on a substrate.

Japanese Patent Laid-Open No. 10-271048 Japanese Patent Laid-Open No. 11-186664

  However, according to the background art described above, there is a technical problem that it does not support a plurality of transmission schemes or is not suitable for at least a plurality of transmission schemes. Even if a wiring corresponding to one transmission method and a wiring corresponding to another transmission method are provided on the substrate, there are technical problems such as an increase in the width of the wiring substrate.

  The present invention has been made in view of the above-described problems, for example, and is capable of efficiently arranging wiring while maintaining transmission quality and the like, while supporting a plurality of transmission methods, and the wiring It is an object to provide an electro-optical device including a substrate and an electronic device.

  In order to solve the above problems, a wiring board of the present invention includes a substrate, a plurality of first wirings and a plurality of second wirings arranged on the substrate in a stripe shape when viewed in plan on the substrate. The plurality of first wirings form a pair of two adjacent lines corresponding to a first signal forming a pair to be transmitted at least partially when used in the first transmission method. When functioning as a signal wiring and being used in the second transmission method, the signal wiring is configured to function as a signal wiring independent from each other, corresponding to the second signal independent from each other to be transmitted, The plurality of second wirings are at least partially formed of an nth (where n is a natural number) pair and an (n + 1) th pair formed by the plurality of first wirings on the array of the plurality of first wirings. When used in the first transmission method, the ground wiring is commonly used And function, as used in the second transmission mode, in response to the second signal, is configured to function each as a separate signal lines from each other.

  According to the wiring board of the present invention, the wiring board includes, for example, a single-layer board, a plurality of first wirings and a plurality of first wirings arranged on the board in stripes as viewed in plan on the board. Second wiring.

  The plurality of first wirings are at least partially used, for example, in a first transmission scheme that is a scheme for transmitting a LVDS (Low Voltage Differential Signaling) signal. Corresponding to the (LVDS signal), it functions as a signal wiring (that is, a differential line) that makes a pair of two adjacent to each other. On the other hand, the plurality of first wirings are independent from each other when they are used in a second transmission method, for example, a method of transmitting a CMOS (Complementary Metal Oxide Semiconductor) signal or a TTL (Transistor Transistor Logic) signal. Corresponding to the second signal (for example, a CMOS signal or a TTL signal), they are configured to function as signal wirings independent of each other.

  The plurality of second wirings are at least partially disposed between the nth pair and the (n + 1) th pair formed by the plurality of first wirings on the arrangement of the plurality of first wirings. When used in the first transmission system, it functions as a ground wiring in common, and when used in the second transmission system, it functions as a signal wiring independent of each other corresponding to the second signal. It is configured as follows. Here, “configured” according to the present invention means that the specifications related to wiring such as impedance, resistance value, wiring width, wiring length, etc. function as ground wiring for the first transmission method. This means that it is set to function as a signal wiring for the two-transmission method and is formed on the substrate (for example, film formation and patterning).

  According to the research of the present inventor, in general, when forming a differential line for LVDS signals on a single layer substrate, between the nth differential line pair and the (n + 1) th differential line pair, In order to set the characteristic impedance of the differential line to a predetermined value (for example, 100Ω) and to prevent crosstalk, a ground wiring is formed. In other words, a pair of differential lines is formed between the ground wires. In order to set the characteristic impedance of the differential line to a predetermined value, the ground wiring needs to have a certain area.

  Further, a wiring board in which a ground wiring having a certain area is formed between the nth differential line pair and the (n + 1) th differential line pair is used for a system for transmitting a CMOS signal or a TTL signal. When the wiring is also used, it is extremely difficult to use the ground wiring as the signal wiring. In order to secure the number of wirings according to the number of bits of the CMOS signal or the TTL signal (for example, 12 bits), the number of wirings may be increased. It is necessary to increase the width of the wiring board. Further, it has been found that the width of the wiring board is limited, and the number of wirings that can be formed on the board is also limited.

  However, the inventor of the present application does not increase the width (that is, the area) of the ground wiring for setting the specific impedance of the differential line for LVDS signals to a predetermined value (for example, it is equivalent to the width of the differential line). If the distance between one of the pair of differential lines and the ground wiring adjacent to the one and the distance between the pair of differential lines is a predetermined distance, the characteristic impedance of the differential line is a predetermined value. In the present invention, the second wiring functioning as the ground wiring when used in the first transmission system functions as the signal wiring when used in the second transmission system. It is configured to do.

  In order to prevent the occurrence of crosstalk between the nth differential line pair and the (n + 1) th differential line pair by not increasing the width of the ground wiring, the nth differential line pair And a plurality of ground lines are arranged between the (n + 1) th differential line pair and the distance (ie, pitch) between the nth differential line pair and the (n + 1) th differential line pair is, for example, traditional. What is necessary is just to make it a pitch equivalent to the case where a wide ground wiring is arrange | positioned.

  As a result, since there are a plurality of ground lines, the influence on the differential lines forming a pair is not required to increase the width of each ground line (that is, the width is equal to that of the differential lines). Even) can function in the same way as traditional wide ground wiring. In other words, when viewed from a pair of differential lines, the wide ground wiring is simply divided into a plurality of ground wirings, and if the total width or gap of the plurality of ground wirings is slightly adjusted, the traditional wide wiring It can be regarded as one ground wiring.

  The distance between one of the pair of differential lines and the ground wiring adjacent to the one, and the distance between the pair of differential lines are the width of the wiring, the characteristic value of the material forming the wiring, the frequency of the signal, etc. For example, it may be obtained from an electromagnetic field simulation based on the above. For example, when the wiring width is 35 μm (micrometer) and the signal frequency is 1 GHz (gigahertz), in order to set the characteristic impedance of the differential line to 100Ω, one of the pair of differential lines and adjacent to the one The distance between the ground lines to be set may be 60 μm and the distance between the pair of differential lines may be 33 μm.

  As a result, according to the wiring board of the present invention, it is possible to efficiently arrange the wiring and maintain the transmission quality and the like while supporting a plurality of transmission methods. In addition, since the second wiring functions as a ground wiring or a signal wiring according to the transmission method, when the wiring substrate is used as a wiring for a method for transmitting a CMOS signal or a TTL signal, the wiring bias In addition, it is possible to avoid uneven pin arrangement. Furthermore, an increase in manufacturing cost can be suppressed by suppressing an increase in the width of the wiring board and / or the number of wirings.

  In one aspect of the wiring board of the present invention, the width of the second wiring is equal to the width of the first wiring.

  According to this aspect, when the wiring board is used as, for example, a wiring for a system for transmitting a CMOS signal or a TTL signal, the first and second wirings can be used as the signal wiring. Is advantageous.

  In another aspect of the wiring board of the present invention, the first transmission method is a method of transmitting an LVDS signal as the first signal, and the second transmission method is a CMOS signal or TTL as the second signal. This is a method for transmitting a signal.

  According to this aspect, the wiring board can be used as an LVDS signal wiring board capable of high-speed signal transmission, and can be used as a widely used wiring board for CMOS signals or TTL signals.

  In another aspect of the wiring board of the present invention, the wiring board is a flexible board.

  According to this aspect, since the wiring is formed on the flexible substrate, the degree of freedom of the relative position between the wiring and the external circuit can be increased, which is very advantageous in practice.

  In order to solve the above-described problems, an electro-optical device of the present invention is an electric circuit that is electrically connected to the above-described wiring board of the present invention (including various aspects thereof) and performs an electro-optical operation. And an optical panel.

  According to the electro-optical device of the present invention, the electro-optical device includes a wiring board that electrically connects the electro-optical panel such as a liquid crystal panel and the external circuit such as the image signal processing circuit and the electro-optical panel. With. During the operation, the electro-optical panel is driven by a drive circuit provided on the electro-optical panel for driving the electro-optical panel or by a drive circuit provided on the wiring board. Done. That is, during the operation, for example, an image display operation is performed in the pixel region of the electro-optical panel, for example, by transmitting a data signal such as image data using a signal wiring provided on the flexible substrate as a transmission path.

  Here, since the electro-optical device of the present invention includes the above-described wiring board of the present invention, it is possible to efficiently arrange wiring and maintain transmission quality and the like while supporting a plurality of transmission methods. it can. That is, the signal transmitted from the drive circuit to the electro-optical panel may be, for example, an LVDS signal, a CMOS signal, or a TTL signal. Whether the signal is an LVDS signal, a CMOS signal, or a TTL signal may be determined by a controller, for example. In other words, even if the controller is replaced, the same electro-optical panel can be used, which is very advantageous in practice.

  According to one aspect of the electro-optical device of the present invention, the electro-optical device further includes a drive circuit that is provided on the wiring substrate and is electrically connected to at least a part of the plurality of wirings and drives the electro-optical panel.

  According to this aspect, the wiring board may be an IC (Integrated Circuit) chip mounting type wiring board.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects thereof).

  According to the electronic apparatus of the present invention, since it includes the above-described electro-optical device of the present invention, it is possible to prevent crosstalk or the like and perform a high-quality display. Various electronic devices such as a notebook, a word processor, a viewfinder type or a monitor direct-view type video tape recorder, a workstation, a videophone, a POS terminal, and a touch panel can be realized.

  The operation and other advantages of the present invention will become apparent from the best mode for carrying out the invention described below.

  Hereinafter, embodiments of a wiring board, an electro-optical device, and an electronic apparatus according to the present invention will be described with reference to the drawings. In the present embodiment, as an example of an electro-optical device, a TFT (Thin Film Transistor) active matrix driving type liquid crystal device is taken as an example.

  First, the overall configuration of the liquid crystal device according to the present embodiment will be described with reference to FIG. FIG. 1 is a perspective view of the liquid crystal device of this embodiment.

  In FIG. 1, the liquid crystal device according to the present embodiment includes a liquid crystal panel 100 and a wiring board 200 case 400. The wiring board 200 is a type on which the driving IC chip 300 is mounted. Here, the “liquid crystal panel 100” and the “driving IC chip 300” according to the present embodiment are examples of the “electro-optical panel” and the “driving circuit” according to the present invention, respectively.

  The driving IC chip 300 includes, for example, a part of a data line driving circuit (not shown) and the like, and is electrically and mechanically fixed to the wiring board 200 using a TAB (Tape Automated Bonding) technique. Yes. The wiring board 200 is formed by patterning wiring on a base material such as polyimide, for example.

  Next, the liquid crystal panel 100 will be described with reference to FIGS. Here, FIG. 2 is a plan view of the TFT array substrate as viewed from the side of the counter substrate together with the components formed thereon, and FIG. 3 is a cross-sectional view taken along the line HH ′ of FIG.

  2 and 3, in the liquid crystal panel 100 of the present embodiment, the TFT array substrate 10 and the counter substrate 20 are disposed to face each other. The TFT array substrate 10 is made of a transparent substrate such as a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of a transparent substrate such as a quartz substrate or a glass substrate, for example. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 correspond to a region where a plurality of pixels are provided. They are bonded to each other by a sealing material 52 provided in a sealing area located around the image display area 10 a as an example of the “area”.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or an ultraviolet / heat combination type curable resin for bonding the two substrates, and is applied to the TFT array substrate 10 in the manufacturing process, and then irradiated with ultraviolet rays. And cured by heating or the like. In the sealing material 52, a gap material such as glass fiber or glass beads for dispersing the distance (ie, gap) between the TFT array substrate 10 and the counter substrate 20 to a predetermined value is dispersed. Note that the gap material may be arranged in the image display region 10a or a peripheral region located around the image display region 10a in addition to or instead of the material mixed in the seal material 52.

  In FIG. 2, a light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10 a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the seal material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  An external circuit connection terminal 102 is provided along one side of the TFT array substrate 10 in a region located outside the seal region where the seal material 52 is disposed in the peripheral region. The sampling circuit 7 is provided so as to be covered with the frame light shielding film 53 on the inner side of the seal region along the one side. The scanning line driving circuit 104 is provided so as to be covered with the frame light-shielding film 53 inside the seal region along two sides adjacent to the one side.

  On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20. Further, a lead wiring 90 for electrically connecting the external circuit connection terminal 102, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like is formed.

  In FIG. 3, on the TFT array substrate 10, a laminated structure in which pixel switching TFTs as drive elements, wiring lines such as scanning lines and data lines are formed is formed. Although the detailed structure of this laminated structure is not shown in FIG. 3, pixel electrodes 9a made of a transparent material such as ITO (Indium Tin Oxide) are provided on the laminated structure in a predetermined pattern for each pixel. It is formed in an island shape.

  The pixel electrode 9a is formed in the image display region 10a on the TFT array substrate 10 so as to face a counter electrode 21 described later. On the surface of the TFT array substrate 10 facing the liquid crystal layer 50, that is, on the pixel electrode 9a, an alignment film 16 is formed so as to cover the pixel electrode 9a.

  A light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. For example, the light shielding film 23 is formed in a lattice shape when viewed in plan on the facing surface of the facing substrate 20. In the counter substrate 20, a non-opening area is defined by the light shielding film 23, and an area partitioned by the light shielding film 23 is an opening area that transmits light emitted from, for example, a projector lamp or a direct viewing backlight. The light shielding film 23 may be formed in a stripe shape, and the non-opening region may be defined by the light shielding film 23 and various components such as data lines provided on the TFT array substrate 10 side.

  On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed so as to face the plurality of pixel electrodes 9a. In order to perform color display in the image display region 10a on the light shielding film 23, a color filter (not shown in FIG. 3) may be formed in a region including a part of the opening region and the non-opening region. An alignment film 22 is formed on the counter electrode 21 on the counter surface of the counter substrate 20.

  2 and 3, on the TFT array substrate 10, in addition to the scanning line driving circuit 104, the sampling circuit 7, etc., a precharge signal having a predetermined voltage level is applied to a plurality of data lines as an image signal. A precharge circuit to be supplied in advance, an inspection circuit for inspecting the quality, defects, and the like of the liquid crystal device during manufacture or at the time of shipment may be formed.

  Next, the wiring board 200 will be described with reference to FIGS. 4 is a plan view showing a part of the wiring pattern formed on the wiring board 200, and FIG. 5 is a cross-sectional view showing a part of the cross section along the line AA ′ of FIG.

  In FIG. 5, a wiring board 200 according to the present embodiment includes a substrate 201, a plurality of wirings a <b> 1 to a <b> 6, b <b> 1 to b <b> 8 formed in a stripe shape (that is, an island shape on a cross section) on the substrate 201, and The insulating film 202 is formed to cover g1 to g3 and the upper and side surfaces of the plurality of wirings. The width w2 of each of the wirings a1 to a6 and the width w3 of each of the wirings b1 to b8 are, for example, 35 μm, and the width w1 of each of the wirings g1 to g3 is, for example, 157 μm. The distance d1 between the wiring g1 and the wiring a1, the distance d2 between the wiring a1 and the wiring b1, the distance d3 between the wiring b1 and the wiring b2, and the distance d4 between the wiring a2 and the wiring a3 are respectively 87 μm, 60 μm, 33 μm, for example. And 87 μm.

  When the wiring board 200 is used as a wiring for a system for transmitting an LVDS signal as an example of the “first transmission system” according to the present invention, the wirings a1 to a6 and g1 to g3 are respectively ground wirings. The wirings b1 to b8 function as signal wirings (ie, differential lines) paired with two adjacent to each other, corresponding to the LVDS signal to be transmitted. On the other hand, when the wiring board 200 is used as a wiring for a method of transmitting a CMOS signal or a TTL signal as an example of the “second transmission method” according to the present invention, the wirings a1 to a6 and b1 to b8 are Corresponding to the CMOS signal or TTL signal to be transmitted, each functions as a signal wiring independent from each other, and each of the wirings g1 to g3 functions as a ground wiring. As shown in FIG. 5, the wirings a1 to a6 are at least partially arranged between the nth pair and the (n + 1) th pair formed by the wirings b1 to b8.

  Here, “wirings a1 to a6” and “wirings b1 to b8” according to the present embodiment are examples of “second wiring” and “first wiring” according to the present invention, respectively. Note that the layout of the wirings g3 and g4 in FIG. 4 is the same as the layout of the wirings g1 and g2 in FIG.

  In FIG. 4, when an LVDS signal is input to the wiring board 200, each pair of wirings p1 to p7 functions as a differential line. When a CMOS signal or a TTL signal is input to the wiring substrate 200, the wiring formed between the wiring g1 and the wiring g2 and the wiring formed between the wiring g3 and the wiring g4 function as signal wirings. To do.

  As shown in FIG. 4, in the vicinity of the line AA ′, the wirings are arranged substantially evenly between the wiring g1 and the wiring g2 and between the wiring g3 and the wiring g4. Thereby, when the wiring board 200 is used as a wiring for a method for transmitting a CMOS signal or a TTL signal, generation of EMI (Electromagnetic Interference) noise can be suppressed. In addition, by forming at least two ground lines between the nth differential line pair and the (n + 1) th differential line pair, the nth differential line pair and the (n + 1) th difference are formed. It is possible to prevent crosstalk between the flow line pairs.

  Further, since the width of the wirings (wirings a1 to a6 in FIG. 5) formed between the nth differential line pair and the (n + 1) th differential line pair is equal to the width of the differential line, it is relatively easy. Thus, the pin arrangement of the connector (lower part in FIG. 4) can be made equally spaced.

  Here, with reference to FIG. 6, the characteristic impedance of the differential line and the distance between the pair of differential lines (distance d3 in FIG. 5) when using the wiring board 200 as the wiring for the LVDS signal will be described. . FIG. 6 is a characteristic diagram showing the relationship between the characteristic impedance of the differential line and the frequency of the LVDS signal for each distance between the pair of differential lines. In FIG. 6, solid lines a to k indicate cases where the distance between the pair of differential lines is 25 μm, 26 μm, 27 μm, 28 μm, 29 μm, 30 μm, 31 μm, 32 μm, 33 μm, 34 μm, and 35 μm, respectively. The width of the differential line and the width of the ground wiring are 35 μm, and the distance between the differential line and the ground wiring (distance d2 in FIG. 5) is 60 μm.

  For example, when a 1 GHz LVDS signal is input to the wiring board 200 and the characteristic impedance of the differential line is 100Ω, it can be seen from FIG. 6 that the distance between the differential lines may be 33 μm. Thus, from the width of the differential line, the width of the ground line, the distance between the differential lines, the distance between the differential line and the ground line, the characteristic value of the material constituting the line, and the like, as shown in FIG. If the relationship between the characteristic impedance of the differential line and the frequency of the LVDS signal is obtained, a wiring board according to the design of the electro-optical device can be designed or manufactured.

  The inventors of the present invention have found that if the distance between the differential line and the ground wiring is increased to some extent, the characteristic impedance of the differential line is not greatly affected even if the distance is further increased. . Therefore, the distance between the differential line and the ground wiring may be set so that the necessary number of wirings can be formed within the allowable width of the wiring board.

  FIG. 7 shows the functions of the wirings a1 to a6, b1 to b6, g1 and g2 in the wiring substrate 200 configured as described above with respect to the LVDS signal, the CMOS signal and the TTL signal.

  In this embodiment, the number of bits of the CMOS signal and the TTL signal is 12 bits, but even if it is 14 bits or the like, it is between the wiring a2 and the wiring a3, and between the wiring a4 and the wiring a5. When the wiring substrate 200 is used as a wiring for an LVDS signal, a wiring that functions as a ground wiring is formed, and when used as a wiring for a CMOS signal and a TTL signal, the wiring board 200 functions as a signal wiring. Good. That is, according to the number of bits of the CMOS signal or the TTL signal, the wiring functioning as the ground wiring when the wiring board 200 is used as the wiring for the LVDS signal is connected to the nth differential line pair and the n + 1th differential line pair. Two or more may be formed between the differential line pairs.

<Comparative example>
Next, a comparative example of the electro-optical device of this embodiment will be described with reference to FIGS. 8 and 9. FIG. 8 is a plan view showing a part of the wiring pattern formed on the wiring board in the comparative example of the electro-optical device of the present embodiment having the same meaning as FIG. 4, and FIG. It is sectional drawing which shows a part of B 'line cross section.

  As shown in FIG. 9, the wiring board according to the comparative example includes a substrate 211, a plurality of signal wirings s and a plurality of ground wirings g formed on the substrate 211, and a plurality of signal wirings s and a plurality of ground wirings g. And an insulating film 212 formed so as to cover the upper surface and side surfaces thereof. In the wiring board according to the comparative example, when used as the LVDS signal wiring, the ground wiring g has a certain wide area in order to set the characteristic impedance of the differential line to a predetermined value and to prevent crosstalk. ing.

  When such a wiring board is used as a wiring for a CMOS signal or a TTL signal, it is extremely difficult to use the ground wiring g as a signal wiring. Separately, a signal wiring for a CMOS signal or a TTL signal is used. Need to form. That is, there are a relatively large number of wiring and connector pins that cannot be used in the two transmission systems, ie, a system that transmits LVDS signals and a system that transmits CMOS signals or TTL signals, which increases costs. . In addition, an increase in the number of wirings may increase the width of the wiring board.

  In FIG. 8, focusing only on the signal wiring s, the distance between the signal wirings s is biased. Therefore, when the wiring board 200 is used as a wiring for a method for transmitting a CMOS signal or a TTL signal. EMI noise may occur. Furthermore, since there are a large number of ground wirings g having a large area, the degree of freedom of the wiring pattern for making the connector pin arrangement (lower part of FIG. 8) equal is very small.

<Electronic equipment>
Next, a case where the above-described electro-optical device is applied to a projector which is an example of an electronic apparatus will be described with reference to FIG. The liquid crystal panel 100 in the electro-optical device 1 described above is used as a light valve of a projector. FIG. 10 is a plan view showing a configuration example of the projector.

  As shown in FIG. 10, a projector 1100 includes a lamp unit 1102 made of a white light source such as a halogen lamp. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G have the same configuration as that of the above-described liquid crystal device, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit, respectively. The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In this dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Accordingly, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display images by the liquid crystal panels 1110R and 1110B need to be horizontally reversed with respect to the display images by the liquid crystal panel 1110G.

  Since light corresponding to the primary colors R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  In addition to the electronic apparatus described with reference to FIG. 10, a mobile personal computer, a mobile phone, a liquid crystal television, a viewfinder type or a monitor direct view type video tape recorder, a car navigation device, a pager, and an electronic notebook , Calculators, word processors, workstations, videophones, POS terminals, devices with touch panels, and the like. Needless to say, the present invention can be applied to these various electronic devices.

  Note that the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and wiring accompanying such a change. A substrate, an electro-optical device provided with such a wiring substrate, and an electronic apparatus including such an electro-optical device are also included in the technical scope of the present invention.

1 is a perspective view of a liquid crystal device according to an embodiment of the present invention. It is a top view which shows the whole structure of the liquid crystal panel which concerns on embodiment of this invention. It is the HH 'sectional view taken on the line of FIG. It is a top view which shows a part of wiring pattern currently formed in the wiring board which concerns on embodiment of this invention. It is sectional drawing which shows a part of AA 'line cross section of FIG. It is a characteristic view which shows the relationship between the characteristic impedance of the differential line in the wiring board which concerns on embodiment of this invention, and the frequency of an LVDS signal. It is a table | surface which shows the function of the wiring in the wiring board which concerns on embodiment of this invention. It is a top view which shows a part of wiring pattern currently formed in the wiring board which concerns on the comparative example of embodiment of this invention. It is sectional drawing which shows a part of BB 'line cross section of FIG. It is a top view which shows the structure of the projector which is an example of the electronic device to which the liquid crystal device which concerns on embodiment of this invention is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 100 ... Liquid crystal panel, 200 ... Wiring board, 201 ... Board | substrate, 202 ... Insulating film, 300 ... IC chip for a drive, 400 ... Frame, a1-a6, b1-b8, g1-g4 ... Wiring

Claims (7)

A substrate,
A plurality of first wirings and a plurality of second wirings arranged on the substrate in a stripe shape when viewed in plan on the substrate;
The plurality of first wirings are at least partially used as signal wirings that are paired by two adjacent lines corresponding to the first signal that forms a pair to be transmitted when used in the first transmission method. When functioning and used in the second transmission method, the second signal independent from each other to be transmitted is configured to function as a signal wiring independent from each other,
The plurality of second wirings at least partially include an nth (where n is a natural number) pair and an (n + 1) th pair formed by the plurality of first wirings on the array of the plurality of first wirings. Are arranged between each other and function as a ground wiring in common when used in the first transmission method, and correspond to the second signal when used in the second transmission method. A wiring board configured to function as a signal wiring independent of each other.   The wiring board according to claim 1, wherein a width of the second wiring is equal to a width of the first wiring.   The first transmission method is a method of transmitting a LVDS (Low Voltage Differential Signaling) signal as the first signal, and the second transmission method is a CMOS (Complementary Metal Oxide Semiconductor) signal or the second signal. 3. The wiring board according to claim 1, wherein the wiring board is a system for transmitting a TTL (Transistor Transistor Logic) signal.   The wiring board according to claim 1, wherein the wiring board is a flexible board. The wiring board according to any one of 1 to 4, and
An electro-optical device comprising: an electro-optical panel that is electrically connected to the wiring board and performs an electro-optical operation.   6. The electro-optical device according to claim 5, further comprising a drive circuit provided on the wiring board and electrically connected to at least a part of the plurality of wirings, and driving the electro-optical panel. apparatus.   An electronic apparatus comprising the electro-optical device according to claim 5.

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