JP4855362B2 - Jig for evaluation test of electronic parts and electrode for evaluation test - Google Patents

Description

  The present invention relates to an electronic component evaluation test jig and an evaluation test electrode used for an evaluation test such as a reliability test of an electronic component such as a chip component.

  In recent years, electronic components have been used under severe conditions of use, including in-vehicle use. And among electronic parts, chip parts are used very often, and there are many kinds. Therefore, development of new products of chip parts is active.

  Under such circumstances, when a new chip component product is developed, it is necessary to efficiently perform a reliability test on these various chip components. The reliability test includes, for example, a high-temperature operation life test and a high-temperature and high-humidity life test. For example, tests such as applying a voltage and applying a current load to a chip component at a high temperature are performed.

  As a technique related to a reliability test in a conventional chip component, for example, there is one disclosed in Patent Document 1.

  In the printed circuit board for evaluation test of an electronic component and the test method using the same disclosed in Patent Document 1, a large number of electronic components 102 are mounted on the printed circuit board 101 as shown in FIG. Is mounted, each lead 103 of the electronic component 102 is inserted into the lead hole 104 and connected to the wiring 105.

  By the way, in recent years, chip parts have become very small with technological progress. For example, chip parts such as chip multilayer ceramic capacitors have become 0.3 to 5 mm in length. Further, there are no leads, and there are cases where both ends of the chip component are a plus side terminal and a minus side terminal.

  In the reliability test of such chip parts, for example, a jig shown in FIG. 15 has been conventionally used.

  In this chip capacitor jig 200, as shown in FIG. 15, for example, the chip capacitor 201 is sandwiched between one plus side terminal plate 202 and each contact probe 203, and the plus side terminal plate 202 and each contact are arranged. A voltage or the like is applied to the connection wires 204 and 205 respectively connected to the probe 203.

  As shown in FIG. 16, each contact probe 203 is provided so as to penetrate the probe mounting resin 206 so as to be movable forward and backward, and can press the chip capacitor 201 by a spring 207. Since the chip capacitor jig 200 is used for a long time in a high temperature environment, the connection between the connection wires 204 and 205, the plus terminal plate 202, and each contact probe 203 is soldered, for example.

  When the chip capacitor 201 is set on the chip capacitor jig 200, the gap between the plus terminal plate 202 and the contact probe 203 is adjusted according to the size of the chip capacitor 201. Since many samples are tested in a small space, the interval between the contact probes 203 is about 10 mm.

In the chip capacitor jig 200, the chip capacitor 201 is sandwiched between the plus-side terminal plate 202 and each contact probe 203. However, the present invention is not limited to this, and each contact is used instead of the plus-side terminal plate 202. In some cases, a probe is provided and the chip capacitor 201 is sandwiched between a pair of contact probes.
Japanese Patent Laid-Open No. 5-87876 (published April 6, 1993)

  However, the conventional electronic device evaluation test jig and the evaluation test electrode have the following problems.

  First, the chip capacitor 201 which is a small chip component is picked with tweezers, and then the operation of pulling the contact probe 203 with one hand and sandwiching the chip capacitor 201 between the plus side terminal plate 202 and the contact probe 203 is troublesome.

  In addition, the contact probe 203 is exposed to a severe environment such as high temperature, and the portion in contact with the chip capacitor 201 becomes dirty. Therefore, the contact probe 203 needs to be periodically replaced. However, in order to replace the contact probe 203, it is necessary to disassemble the entire chip capacitor jig 200, and the replacement cost is expensive and troublesome. In particular, when the soldered portion between the contact probe 203 and the wiring is cut, it is oxidized by an aging test, so that it cannot be soldered again. As a result, the evaluation test jig itself must be replaced with a new one.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide an electronic component evaluation test jig and an evaluation test electrode that can be easily set and maintained. There is.

  In order to solve the above-described problems, an electronic component evaluation test jig according to the present invention is inserted into a socket having a two-pole terminal connected to an evaluation test load, and an insertion port of the socket. For the evaluation test having a pair of insertion connecting members electrically connected to the two-pole terminals, and a pair of holding members electrically connected to each insertion connecting member and holding the electronic component to be evaluated And an electrode.

  In a conventional electronic component evaluation test jig, an electronic component is picked with tweezers, set between probes to which wiring is connected, and then sandwiched between probes. For this reason, for example, when an electronic component is a small chip component having a length of 1 mm or less, for example, a probe and tweezers, which are detailed operations, are used to set one electronic component on an evaluation test jig. Since it is necessary to perform the work twice with the work between the two, the setting work is troublesome.

  However, according to the above-described invention, the evaluation test electrode for sandwiching the electronic component to be tested can be separated from the socket to which the evaluation test load is connected. For this reason, in order to set the evaluation target electronic component in the evaluation test jig, after the electronic component is sandwiched between the pair of sandwiching members in the evaluation test electrode, the evaluation test electrode in which the electronic component is sandwiched What is necessary is just to insert a pair of insertion connection member in the insertion port of a socket. In this case, the socket having a two-pole terminal and the pair of insertion connecting members of the evaluation test electrode inserted into the insertion port of the socket can be configured with large parts that can be easily inserted, and The electrode for evaluation test can be attached to the socket with one touch.

  Therefore, since the fine work of pinching the electronic component is only once, setting is easy.

  In addition, when the evaluation test jig is used at a high temperature for a long period of time, the sandwiching member is oxidized and deteriorates, so that it is difficult to use it multiple times. However, in the present invention, it is sufficient to replace the evaluation test electrode itself having a pair of clamping members, and the socket can be reused. Therefore, the socket does not have to be disassembled in order to use the evaluation test jig again. For this reason, maintenance becomes easy.

  Therefore, it is possible to provide an electronic component evaluation test jig that is easy to set and easy to maintain.

  In the electronic component evaluation test jig of the present invention, it is preferable that the evaluation test electrode comprises a clip-like structure that elastically holds the electronic component to be evaluated.

  As a result, the evaluation test electrode itself has a function of a clip for elastically holding the electronic device to be evaluated, so that the electronic device to be evaluated is held in a state where a pressing force is applied. As a result, the clamped state of the electronic component to be evaluated can be stably held.

  In the electronic component evaluation test jig of the present invention, the evaluation test electrode includes a first support member that supports one first insertion connection member and one first clamping member, and the other second electrode. A second support member that supports the insertion connection member and the other second clamping member, a hinge member that rotatably connects the first support member and the second support member, and a first support member that are supported by the first support member. And an elastic member that imparts an elastic clamping force to the electronic component to be evaluated that is clamped between the tip of the first clamping member and the tip of the second clamping member supported by the second support member. Preferably it is.

  Thereby, the clip-like structure of the electrode for evaluation tests can be specifically configured.

  In the electronic component evaluation test jig of the present invention, the first insertion connecting member and the first clamping member are provided to overlap each other, and are screwed to the first support member at the overlapped portion. The second insertion connecting member and the second clamping member are preferably provided so as to overlap each other, and are screwed to the second support member at the overlapped portion.

  Accordingly, the first insertion connecting member and the first holding member can be easily electrically connected to each other, and the second insertion connecting member and the second holding member can be easily electrically connected to each other. .

  The first insertion connecting member and the first clamping member are overlapped with each other and screwed to the first support member, and the second insertion connecting member and the second clamping member are overlapped with each other and screwed to the second support member. Since it is only stopped, if the screw is removed, the first clamping member and the second clamping member can be easily detached from the first support member and the second support member. Therefore, when the first clamping member and the second clamping member are deteriorated, the first clamping member and the second clamping member can be easily replaced.

  In the electronic component evaluation test jig according to the present invention, it is preferable that the first clamping member and the second clamping member have a long hole longer than a screw diameter for screwing.

  Thereby, the 1st clamping member and the 2nd clamping member can be slid with respect to the 1st supporting member and the 2nd supporting member within the range of a long hole.

  Accordingly, since the distance between the tip of the first clamping member and the tip of the second clamping member can be adjusted, the size of the electronic device under test to be clamped can be widened. Moreover, the clamping pressure of the electronic component can be changed by adjusting the distance between the tip of the first clamping member and the tip of the second clamping member.

  In the electronic component evaluation test jig of the present invention, the first insertion connection member is screwed to the first support member, and the second insertion connection member is screwed to the second support member. It is preferable that

  Thereby, also about the 1st insertion connection member and the 2nd insertion connection member, when it deteriorates, it can exchange easily by removing a screw.

  In the electronic component evaluation test jig according to the present invention, it is preferable that the first support member and the second support member are each bent in a “<” shape.

  That is, for example, when the first support member and the second support member are made of members parallel to each other, if the first support member and the second support member are not bent, the electronic component to be evaluated is sandwiched. Since it cannot do, manufacture of a 1st supporting member and a 2nd supporting member becomes complicated.

  However, in the present invention, since the first support member and the second support member are each bent in a “<” shape, the first holding member and the second holding member are simply formed of a flat plate. Thus, the electronic device to be evaluated can be sandwiched.

  Therefore, the first clamping member and the second clamping member can be easily manufactured.

  In the electronic component evaluation test jig of the present invention, the front end surface of the first support member on the first sandwiching member side outer surface and the second support member on the second sandwiching member side outer end surface The surfaces are preferably formed so as to be parallel to each other.

  Accordingly, when the evaluation test electrode sandwiching the electronic component to be tested is inserted and attached to the socket, the front end surface of the first support member on the first sandwiching member side and the second support member second 2 If the tip of the outer surface on the side of the clamping member is held between fingers, the evaluation test is performed without dropping the electronic component to be evaluated sandwiched between the tip of the first clamping member and the tip of the second clamping member. The electrode can be inserted into the socket.

  In the electronic component evaluation test jig of the present invention, a first recess is formed on the outer surface of the first support member, and a second recess is formed on the outer surface of the second support member. Is preferably formed.

  Accordingly, when the evaluation test electrode sandwiching the electronic component to be tested is inserted and attached to the socket, the first recess formed on the outer surface of the first support member and the outer surface of the second support member If the finger is held between the second recess formed on the finger, the finger does not slide on the first support member and the second support member.

  As a result, when the evaluation test electrode is inserted into the socket, the fingers sandwiching the first support member and the second support member are displaced toward the socket, whereby the leading end of the first sandwiching member and the leading end of the second sandwiching member It is possible to insert the evaluation test electrode into the socket without dropping the electronic component to be tested sandwiched between them.

  In the electronic component evaluation test jig of the present invention, a first taper portion for bending the first insertion connection member is provided at an end of the first support member on the first insertion connection member side. In addition, it is preferable that a second taper portion for bending the second insertion connection member is provided at an end of the second support member on the second insertion connection member side.

  Thereby, when inserting the 1st insertion connection member and the 2nd insertion connection member of the electrode for evaluation tests into the insertion port of a socket, the 1st insertion connection member and the 2nd insertion connection member enter the insertion port of a socket. Even if it is difficult, the first insertion connection member and the second insertion connection member are bent at the first taper portion and the second taper portion, so that the first insertion connection member and the second insertion connection member of the evaluation test electrode are connected to the socket. It can be easily inserted into the slot.

  In the electronic component evaluation test jig of the present invention, the tip of the first clamping member supported by the first support member and the tip of the second clamping member supported by the second support member are respectively sharp. It is preferable.

  Thereby, when the electronic component to be tested is in a small chip shape, the sharp tip of the first holding member supported by the first support member and the sharpness of the second holding member supported by the second support member are provided. It is possible to easily hold the electronic component to be evaluated at the tip.

  In the electronic component evaluation test jig of the present invention, it is preferable that a plurality of combinations of the socket and the evaluation test electrode are provided.

  As a result, a plurality of evaluation target electronic components can be evaluated and tested at a time.

  In the electronic component evaluation test jig according to the present invention, a socket fixing base provided with the plurality of sockets is provided, and terminals of each of the two poles of each socket provided on the socket fixing base are It is preferable that each of the wires extending from the evaluation test load is soldered and connected in parallel.

  As a result, even when a plurality of sockets are provided, each two-pole terminal of each socket is soldered and connected in parallel to the wiring extending from the evaluation test load. Even if it performs, the connection of the terminal of a socket and wiring is strong, and it can hold | maintain electrical connection favorably.

  Moreover, in order to solve the said subject, the electrode for evaluation tests of this invention is used for the jig | tool for evaluation tests of the said electronic component, It is characterized by the above-mentioned.

  Accordingly, it is possible to provide an evaluation test electrode used for an electronic component evaluation test jig that is easy to set up and easy to maintain.

  As described above, the electronic component evaluation test jig of the present invention includes a socket having two-pole terminals connected to the evaluation test load, and the two-pole of the socket inserted into the socket insertion port. A pair of insertion connection members that are electrically connected to the terminals, and an evaluation test electrode that is electrically connected to each insertion connection member and has a pair of holding members that hold the electronic components to be evaluated. It is what it has.

  In addition, the evaluation test electrode of the present invention is used for the electronic component evaluation test jig as described above.

  Therefore, it is possible to provide an electronic component evaluation test jig and an evaluation test electrode that are easy to set and maintain easily.

  An embodiment of the present invention will be described with reference to FIGS. 1 to 13 as follows.

  As shown in FIG. 2, a chip capacitor 1 as an electronic component to be evaluated to which the evaluation test jig of the present embodiment is applied is made of, for example, a rectangular parallelepiped. This chip capacitor 1 has electrode terminals 1a and 1b at both ends, and does not have a conventional lead. There are various sizes of the chip capacitor 1, for example, a length of about 0.2 mm to 5 mm. The minimum size of the chip capacitor 1 is, for example, width 0.3 mm × length 0.6 mm × height 0.2 mm.

  As shown in FIG. 1, an evaluation test jig 10 of the present embodiment used for performing a reliability test of the chip capacitor 1 includes a socket 2 as a plurality of sockets in a chassis 2 as a socket fixing base. A plurality of 20 are attached. Each socket 20 is provided with a chip clip 30 as an evaluation test electrode that can be inserted.

  As shown in FIGS. 3C and 3D, the socket 20 has two-pole terminals 22 and 22, and insertion ports 21 and 21 formed by these two-pole terminals 22 and 22. As shown in FIGS. 3A and 3B, a pair of first insertion connecting member 31a and second insertion connecting member 31b protruding from the chip clip 30 can be inserted. That is, each terminal 22 and 22 is provided in the insertion port 21 and 21 of the socket 20 so that the 1st insertion connection member 31a and the 2nd insertion connection member 31b can be inserted.

  Then, the first insertion connection member 31a and the second insertion connection member 31b are respectively inserted into the insertion ports 21 and 21 of the socket 20, so that the first insertion connection member 31a and the second insertion connection member 31b have two poles. Terminals 22 and 22 are electrically connected to each other.

  As shown in FIG. 4, the two-pole terminals 22 and 22 in the plurality of sockets 20 are connected in parallel to the wirings 3 and 4, respectively, and are connected to a power source 5 as an evaluation test load. In this embodiment, the power source 5 is used as the evaluation test load. However, the power supply 5 is not necessarily limited to this, and any power supply may be used as long as it is generally used as the evaluation test load.

  As shown in FIGS. 3A and 3B, the chip clip 30 is connected to the first insertion connection member 31a and the second insertion connection member 31b, and the first insertion connection member 31a and the second insertion connection member 31b. It has a pair of first clamping members 32a and second clamping members 32b that are electrically connected and clamp the chip capacitor 1, and are made of a clip-like structure that elastically clamps the chip capacitor 1.

  Specifically, the chip clip 30 includes a first support member 33a that supports one first insertion connection member 31a and one first clamping member 32a, the other second insertion connection member 31b, and the other second insertion member 31a. A second support member 33b that supports the sandwiching member 32b, a hinge member 34 that rotatably couples the first support member 33a and the second support member 33b, and a first sandwiching member supported by the first support member 33a A spring 35 is provided as an elastic member for applying an elastic clamping force to the chip capacitor 1 held between the tip of 32a and the tip of the second holding member 32b supported by the second support member 33b. .

  The configuration of the tip clip 30 is an example, and is not necessarily limited thereto. For example, the position of the spring 35 may exist on the chip capacitor 1 side with respect to the hinge member 34. Further, not only the spring 35 but also other elastic members may be used. Further, the first support member 33a and the second support member 33b can be elastically rotated by making the hinge member 34 of a rubber plate or the like. That is, the chip clip 30 may be a clip-like structure that elastically holds the chip capacitor 1.

  The hinge member 34 is formed by pin-connecting a first connecting member 36a from the first support member 33a and a second connecting member 36b from the second support member 33b. Thereby, the 1st support member 33a and the 2nd support member 33b can rotate mutually.

  Further, the first support member 33a and the second support member 33b, the first connection member 36a and the second connection member 36b, and the hinge member 34 are made of, for example, a resin that can withstand 200 ° C.

  As shown in FIGS. 5 (a) and 5 (b), the first insertion connecting member 31a and the first clamping member 32a are provided so as to overlap each other, and at the overlapped portion, the first support member 33a is connected to the screw 37. Screwed. The first insertion connecting member 31a is screwed to the first support member 33a with screws 38.

  Similarly, the second insertion connecting member 31b and the second clamping member 32b are also provided so as to overlap each other, and are screwed to the second support member 33b with screws 37 at the overlapped portions. The second insertion connecting member 31b is screwed to the second support member 33b with screws 38.

  Accordingly, the first insertion connecting member 31a and the first holding member 32a can be easily electrically connected to each other, and the second insertion connecting member 31b and the second holding member 32b can be easily electrically connected to each other. can do.

  The first insertion connecting member 31a and the first holding member 32a are overlapped with each other and screwed to the first support member 33a, and the second insertion connecting member 31b and the second holding member 32b are overlapped with each other. Since the second support member 33b is merely screwed, the first clamping member 32a and the second clamping member 32b can be easily detached from the first support member 33a and the second support member 33b by removing the screw 37. it can. Therefore, when the 1st clamping member 32a and the 2nd clamping member 32b deteriorate, the 1st clamping member 32a and the 2nd clamping member 32b can be replaced | exchanged easily.

  Further, in the present embodiment, the first insertion connecting member 31a and the first clamping member 32a, and the second insertion connecting member 31b and the second clamping member 32b are not integral parts, so that the chip capacitor 1 is clamped. It is possible to easily replace only the first clamping member 32a and the second clamping member 32b.

  As shown in FIG. 5 (a), the first insertion connecting member 31a and the first holding member 32a are overlapped with each other when the first holding member 32a is present on the upper side of the first insertion connecting member 31a. As shown in FIG.5 (b), any may be with the case where the 1st clamping member 32a exists in the lower side of the 1st insertion connection member 31a.

  The first insertion connection member 31a and the second insertion connection member 31b, and the first clamping member 32a and the second clamping member 32b are made of, for example, a SUS spring material plated with gold (Au). Accordingly, the chip capacitor 1 can be elastically clamped by the spring pressure between the first clamping member 32a and the second clamping member 32b, and the first insertion connection member 31a and the second insertion terminal 31a are connected to the chip capacitor 1 from the electrode terminals 1a and 1b. The insertion connection member 31b is electrically connected. In the present invention, the first insertion connection member 31a and the second insertion connection member 31b, and the first clamping member 32a and the second clamping member 32b do not necessarily have to be plated with gold (Au).

  Here, in the present embodiment, as shown in FIGS. 5A and 5B and FIG. 6, the first clamping member 32 a and the second clamping member 32 b have a screw diameter larger than that of the screw 37 for screwing. A long slot 39 is formed.

  As a result, the first clamping member 32a and the second clamping member 32b can be slid by the length of the long hole 39. As a result, as shown in FIG. The clamping width D of the chip capacitor 1 between the tip of the second clamping member 32b can be changed. Thereby, even if the chip capacitor 1 has a different size, the chip capacitor 1 can be held between the tip of the first holding member 32a and the tip of the second holding member 32b, and a reliability test can be performed. It has become.

  As the tip shapes of the first clamping member 32a and the second clamping member 32b, various shapes can be adopted as shown in FIGS. Thereby, the tip shape of the 1st clamping member 32a and the 2nd clamping member 32b can be selected according to the size of the chip capacitor 1.

  Here, it is preferable that each front-end | tip of the 1st clamping member 32a and the 2nd clamping member 32b is each sharp. Thereby, when the chip capacitor 1 has a small chip shape, the chip capacitor 1 can be easily clamped at the respective sharp tips of the first clamping member 32a and the second clamping member 32b.

  In the present embodiment, the first support member 33a and the second support member 33b are formed to be bent in a “<” shape. As a result, as shown in FIGS. 5 (a) and 5 (b), the first insertion connecting member 31a and the second insertion connecting member 31b are formed in a “<” shape of the first support member 33a and the second support member 33b. The first and second clamping members 32a and 32b can be formed of a flat plate while being bent in a “<” shape.

  Thereby, the 1st clamping member 32a and the 2nd clamping member 32b which need replacement | exchange can be manufactured easily.

  A method of performing a reliability test of the chip capacitor 1 using the evaluation test jig 10 having the above configuration will be described. Here, as the reliability test, for example, a high temperature operation life test, a high temperature high humidity life test, and the like are performed. Specifically, for example, a durability test such as several hundred hours is performed by applying a voltage of, for example, 500 V or a current load to the chip capacitor 1 at a high temperature of 200 ° C. At this time, pressure may be applied in some cases. Then, determine what the failure rate is.

  First, as shown in FIG. 9A, the spring 35 provided on the first insertion connection member 31 a and the second insertion connection member 31 b side in the first support member 33 a and the second support member 33 b of the chip clip 30. As shown in FIG. 9 (b), the first support member 33a and the second support member 33b are rotated by pressing the extension line with fingers, and the leading end of the first sandwiching member 32a and the second sandwiching member are rotated. The space | interval with the front-end | tip of 32b is opened.

  Next, as shown in FIG. 10, the chip capacitor 1 is sandwiched between the tip of the first sandwiching member 32 a and the tip of the second sandwiching member 32 b, and the chip clip 30 is sandwiched in the chip clip 30. The first insertion connection member 31 a and the second insertion connection member 31 b are inserted into the insertion ports 21 and 21 of the socket 20.

  Similarly, chip clips 30 sandwiching the chip capacitor 1 are sequentially inserted into the plurality of sockets 20 in the evaluation test jig 10 shown in FIG.

  As a result, as shown in FIG. 4, since the sockets 20 are connected in parallel, the sockets 20 are connected to a power source, and a constant voltage, for example, is applied to each chip capacitor 1.

  And this evaluation test jig | tool 10 is accommodated in a 200 degreeC thermostat for a fixed time, for example. Then, after an elapse of a certain time, the evaluation test jig 10 is taken out of the thermostatic bath, and the state of each chip capacitor 1 is evaluated.

  Here, with respect to the evaluation test jig 10, for example, when the first clamping member 32a and the second clamping member 32b are exposed to a long-term high temperature and the conductivity is deteriorated, maintenance is performed. There is a need to do. In this case, by removing the screw 37, the first clamping member 32a and the second clamping member 32b can be easily replaced.

  At this time, the connection between the terminals 22 and 22 of the socket 20 and the wires 3 and 4 is performed by soldering, but when the first clamping member 32a and the second clamping member 32b of the chip clip 30 are replaced, There is no need to disassemble the terminals 22 and 22 of the socket 20 and the wires 3 and 4. Therefore, maintenance is easy.

  Similarly, the first insertion connection member 31a and the second insertion connection member 31b are also simply fixed to the first support member 33a and the second support member 33b with screws 38 and 38. When the member 31a and the second insertion connection member 31b deteriorate, they can be easily replaced by removing the screws 38.

  In addition, this invention is not limited to said embodiment, A various change is possible within the scope of the present invention.

  For example, as shown in FIG. 11, the first recesses 41 and 41 as the second recesses are formed at positions on the extended line of the hinge member 34 outside the first support member 33a and the second support member 33b. Is possible.

  Accordingly, when the first insertion connection member 31a and the second insertion connection member 31b of the chip clip 30 are inserted into the insertion ports 21 and 21 of the socket 20, the recesses 41 and the first support member 33a and the second support member 33b are formed. If 41 is pinched with a finger | toe, it can prevent a finger | toe slipping at the time of insertion.

  Therefore, when the finger slides at the time of insertion and the finger presses the lower side of the first support member 33a and the second support member 33b, the tip of the first sandwiching member 32a and the tip of the second sandwiching member 32b The interval is increased, and the chip capacitor 1 can be prevented from falling.

  As a structure for obtaining the same effect, for example, as shown in FIG. 12, the front end surface of the first support member 33a on the first sandwiching member 32a side and the second sandwiching member 32b of the second support member 33b are provided. It is possible to form the parallel portions 42 and 42 so that the front end surface of the side outer side is parallel to each other.

  Thereby, if the parallel parts 42 and 42 in the 1st support member 33a and the 2nd support member 33b are picked with a finger | toe, the clamped chip capacitor 1 will not be dropped.

  As a modification of the chip clip 30, as shown in FIG. 13, a first taper portion 51a for bending the first insertion connection member 31a is provided at the end of the first support member 33a on the first insertion connection member 31a side. It is preferable to form the 2nd taper part 51b which bends the 2nd insertion connection member 31b in the edge part by the side of the 2nd insertion connection member 31b in the 2nd support member 33b while forming. The first tapered portion 51a and the second tapered portion 51b are formed not only on the inside of the first insertion connecting member 31a and the second insertion connecting member 31b in the first support member 33a and the second support member 33b but on the outside. May be.

  Accordingly, when the chip clip 30 is inserted into the insertion ports 21 and 21 of the socket 20, the first insertion connection member 31a and the second insertion connection member 31b are bent at the first taper portion 51a and the second taper portion 51b. Therefore, the first insertion connection member 31a and the second insertion connection member 31b can be easily inserted into the insertion ports 21 and 21 of the socket 20.

  As described above, the electronic component evaluation test jig 10 of the present embodiment includes the socket 20 having the two-pole terminals 22 and 22 connected to the power supply 5 and the insertion ports 21 and 21 of the socket 20. A pair of first insertion connection member 31a and second insertion connection member 31b that are inserted and electrically connected to the two-pole terminals 22 and 22, respectively, and first insertion connection member 31a and second insertion connection member 31b. A chip clip 30 having a pair of first and second clamping members 32a and 32b that are electrically connected and sandwich the chip capacitor 1 is provided.

  As a result, the chip clip 30 that holds the chip capacitor 1 can be separated from the socket 20 to which the power supply 5 is connected. For this reason, in order to set the chip capacitor 1 in the evaluation test jig 10, the chip capacitor 1 is sandwiched between the pair of first and second clamping members 32 a and 32 b in the chip clip 30, and then the chip capacitor 1. What is necessary is just to insert a pair of 1st insertion connection member 31a and 2nd insertion connection member 31b in the chip clip 30 which pinched | interposed in the insertion port 21 * 21 of the socket 20. FIG. That is, the work itself of holding the chip capacitor 1 with the chip clip 30 is the work of bringing the first holding member 32 a and the second holding member 32 b into contact with the electrode terminals 1 a and 1 b of the chip capacitor 1.

  The socket 20 having the two-pole terminals 22 and 22 and the pair of first insertion connection members 31a and second insertion connection members 31b of the chip clip 30 inserted into the insertion ports 21 and 21 of the socket 20 are: The chip clip 30 can be attached to the socket 20 with a single touch.

  Therefore, since the fine work of pinching the chip capacitor 1 is only required once, setting is easy. Therefore, the set time can be shortened.

  In addition, when the evaluation test jig 10 is used at a high temperature for a long period of time, the first clamping member 32a and the second clamping member 32b are oxidized and deteriorated, making it difficult to use multiple times. However, in the present embodiment, it is sufficient to replace the chip clip 30 itself having the pair of first clamping member 32a and second clamping member 32b, and the socket 20 can be reused. Therefore, the socket 20 does not have to be disassembled in order to use the evaluation test jig 10 again. For this reason, maintenance becomes easy and maintenance costs can be reduced.

  Therefore, it is possible to provide the evaluation test jig 10 for the chip capacitor 1 in which the chip capacitor 1 can be easily set and maintained easily.

  In the conventional chip capacitor jig 200 shown in FIG. 15, the distance between the contact probe 203 and the plus-side terminal plate 202 when the contact probe 203 is pulled is substantially the same in the plurality of contact probes 203. Therefore, when performing a reliability test of the chip capacitor 201 that is larger than the distance between the contact probe 203 and the plus side terminal plate 202 when the contact probe 203 is pulled, the distance between the contact probe 203 and the plus side terminal plate 202 is larger. Another wide chip capacitor jig 200 must be used.

  On the other hand, in the present embodiment, it is only necessary to prepare a chip clip 30 having a larger distance between the tip of the first clamping member 32a and the tip of the second clamping member 32b, and the evaluation test jig 10 as a whole. There is no need to replace it. Therefore, it is possible to easily cope with a chip capacitor 1 having a larger size.

  Further, in the conventional chip capacitor jig 200 shown in FIG. 15, in order to set the chip capacitor 201 on the chip capacitor jig 200, the entire chip capacitor jig 200 must be pulled out from a constant temperature bath (not shown). .

  However, in the present embodiment, the work of holding the chip capacitor 1 between the first holding member 32a and the second holding member 32b of the chip clip 30 is performed outside the thermostat, and the chip clip 30 is inserted into the socket 20 and attached. Only work can be performed in a thermostat. Further, the operation of inserting and attaching the chip clip 30 to the socket 20 can be easily performed individually for each chip clip 30.

  Therefore, the evaluation test jig 10 that can be easily handled can be provided. Further, since each chip clip 30 can be taken out individually, it is possible to easily take out defective products.

  Further, in the evaluation test jig 10 of the present embodiment, the first clamping member 32a and the second clamping member 32b are provided with a long hole 39 longer than the screw diameter for screwing.

  Thereby, within the range of the long hole 39, the 1st clamping member 32a and the 2nd clamping member 32b can be slid with respect to the 1st support member 33a and the 2nd support member 33b.

  Accordingly, since the distance between the tip of the first clamping member 32a and the tip of the second clamping member 32b can be adjusted, the size of the chip capacitor 1 that can be clamped can be widened. Moreover, the pressure which clamps the chip capacitor 1 can be changed by adjusting the space | interval of the front-end | tip of the 1st clamping member 32a and the front-end | tip of the 2nd clamping member 32b.

  Moreover, in the evaluation test jig 10 of the present embodiment, a plurality of combinations of the socket 20 and the chip clip 30 are provided. Thereby, a plurality of chip capacitors 1 can be evaluated and tested at a time. In the present embodiment, for example, 25 sets or 50 sets can be prepared. In this case, since the chip clip 30 can be attached to the socket 20 in a three-dimensional upward direction, the planar area can be made smaller than that of the conventional chip capacitor jig 200 shown in FIG. For this reason, it becomes possible to accommodate many evaluation test jigs 10 in the high temperature layer.

  Further, in the evaluation test jig 10 of the present embodiment, the chassis 2 provided with a plurality of sockets 20 is provided, and the two-pole terminals 22 and 22 of each socket 20 provided in the chassis 2 are provided. Are connected to the wirings 3 and 4 extending from the power source 5 by soldering in parallel.

  As a result, even when a plurality of sockets 20 are provided, the two-pole terminals 22 and 22 of each socket 20 are soldered and connected in parallel to the wires 3 and 4 extending from the power source 5, respectively. For example, even when an evaluation test is performed at a high temperature, the connection between the terminals 22 and 22 of the socket 20 and the wirings 3 and 4 is strong, and the electrical connection can be maintained well.

  Further, the chip clip 30 of the present embodiment is used for the evaluation test jig 10. Thereby, it is possible to provide the chip clip 30 used for the evaluation test jig 10 in which the chip capacitor 1 can be easily set and maintained easily.

  The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the claims, and the technical means disclosed in different embodiments can be appropriately combined. Embodiments to be made are also included in the technical scope of the present invention.

  The present invention can be applied, for example, to an electronic component evaluation test jig and an evaluation test electrode used for an evaluation test such as a reliability test of an electronic component such as a chip component. The electronic component can be applied to a chip component such as a chip capacitor, for example.

It is a perspective view which shows one Embodiment of the jig for evaluation tests in this invention. It is a perspective view which shows the structure of the chip capacitor by which an evaluation test is performed using the said jig for evaluation tests. (A) is front sectional drawing which shows the chip clip of the said jig for evaluation test, (b) is a right view which shows the chip clip of the said jig for evaluation test, (c) is for the said evaluation test It is front sectional drawing which shows the socket of a jig | tool, (d) is a right view which shows the socket of the said jig | tool for an evaluation test. It is a circuit diagram which shows the connection state of the terminal of the socket in the inside of the chassis of the said jig | tool for evaluation test, and wiring. (A) is a front view which shows the state in which the 1st clamping member of the chip clip in the said jig | tool for evaluation test is piled up and connected to the upper side of the 1st insertion connection member, (b) is for the said evaluation test It is a front view which shows the state in which the 1st clamping member of the chip clip in a jig | tool is piled up and connected under the 1st insertion connection member. It is a perspective view which shows the chip clip and socket in the said jig for evaluation tests. It is front sectional drawing which shows the state which slid the 1st clamping member and the 2nd clamping member of the chip clip in the said jig | tool for evaluation test, and attached to the 1st support member and the 2nd support member. (A)-(d) is a front view of the principal part which shows the various examples of the front-end | tip shape of a 1st clamping member and a 2nd clamping member. (A) is front sectional drawing which shows the chip clip which closed the 1st clamping member and the 2nd clamping member, (b) is front sectional drawing which shows the chip clip which opened the 1st clamping member and the 2nd clamping member. is there. It is front sectional drawing which shows the chip clip which clamped the chip capacitor with the 1st clamping member and the 2nd clamping member, and inserted the 1st insertion connection member and the 2nd insertion connection member in the insertion port of the socket. It is a perspective view which shows the modification of the said jig | tool for evaluation tests, and shows a chip clip. The other modification of the said jig | tool for evaluation tests is shown, and it is front sectional drawing which shows a chip clip. It is a front sectional view showing a chip clip, showing still another modified example of the evaluation test jig. It is a perspective view of the principal part which shows the jig | tool for the evaluation test of the conventional electronic component. It is a top view which shows the conventional jig | tool for the evaluation test of other electronic components. It is sectional drawing which shows the structure of the contact probe in the jig | tool for evaluation tests of the said other electronic component.

Explanation of symbols

1 Chip capacitors (electronic components to be evaluated)
1a, 1b Electrode terminal 2 Chassis (Socket fixing base)
3.4 Wiring 5 Power supply (Evaluation test load)
10 Evaluation Test Jig 20 Socket 21 Insert 22 Terminal 30 Chip Clip (Evaluation Test Electrode)
31a 1st insertion connection member 31b 2nd insertion connection member 32a 1st clamping member 32b 2nd clamping member 33a 1st support member 33b 2nd support member 34 Hinge member 35 Spring (elastic member)
36a First connecting member 36b Second connecting member 37 Screw 38 Screw 39 Slot 41 Recess 42 Parallel portion 51a First taper portion 51b Second taper portion

Claims (11)

A socket having a two-pole terminal connected to the evaluation test load;
A pair of insertion connection members that are inserted into the socket sockets and electrically connected to the two-pole terminals of the socket, respectively, and are electrically connected to the respective insertion connection members; An evaluation test electrode having a pair of clamping members for clamping the component ,
The evaluation test electrode is composed of a clip-like structure that elastically clamps the electronic component to be evaluated, and
A first support member for supporting one first insertion connecting member and one first clamping member;
A second support member that supports the other second insertion connecting member and the other second clamping member;
A hinge member rotatably connecting the first support member and the second support member;
An elastic clamping force is applied to the electronic component to be tested that is clamped between the tip of the first clamping member supported by the first support member and the tip of the second clamping member supported by the second support member. An elastic member to be applied,
The first insertion connection member and the first clamping member are provided to overlap each other, and are screwed to the first support member at the overlapped portion,
The electronic component evaluation test jig, wherein the second insertion connecting member and the second clamping member are provided to overlap each other and are screwed to the second support member at the overlapped portion . 2. The electronic component evaluation test jig according to claim 1 , wherein the first clamping member and the second clamping member are provided with elongated holes longer than a screw diameter for screwing. The first insertion connection member is screwed to the first support member,
It said second insert connecting member, a jig for evaluation testing of an electronic component according to claim 1 or 2, characterized in that it is screwed to the second support member. Said first support member and the second support member, respectively, "V" shape to the jig for evaluation testing of an electronic component according to claim 1, 2 or 3, characterized in that it is formed by bending the Ingredients. The distal end surface of the first holding member on the outer side surface on the first clamping member side and the distal end surface of the second supporting member on the outer side surface on the second clamping member side are formed so as to be parallel to each other. The electronic component evaluation test jig according to claim 4 . A first recess is formed on the outer surface of the first support member, and
The electronic component evaluation test jig according to any one of claims 1 to 5 , wherein a second recess is formed on an outer surface of the second support member. A first taper portion for bending the first insertion connection member is provided at an end of the first support member on the first insertion connection member side, and
Wherein the second end of the of the support member second insert connecting member, any one of the preceding claims, characterized in that the second tapered portion to bend the second insert connection members are provided 2. An electronic component evaluation test jig according to item 1. The distal end of the first clamping member supported by the first support member, and the tip of the second holding member supported by the second support member may be any of claims 1 to 7, characterized in that a pointed, respectively 2. An electronic component evaluation test jig according to item 1. The electronic component evaluation test jig according to claim 1 , wherein a plurality of combinations of the socket and the evaluation test electrode are provided. A socket fixing base provided with the plurality of sockets is provided,
10. The electronic component evaluation test according to claim 9 , wherein each of the two pole terminals of each socket provided on the socket fixing base is soldered and connected in parallel to a wiring extending from the evaluation test load. jig. Any one in the evaluation test electrode, characterized in that used in the evaluation test fixture of the electronic component according to claim 1-10.

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