JP4853726B2 - 半導体テスタ用テストヘッド - Google Patents
半導体テスタ用テストヘッド Download PDFInfo
- Publication number
- JP4853726B2 JP4853726B2 JP2007211659A JP2007211659A JP4853726B2 JP 4853726 B2 JP4853726 B2 JP 4853726B2 JP 2007211659 A JP2007211659 A JP 2007211659A JP 2007211659 A JP2007211659 A JP 2007211659A JP 4853726 B2 JP4853726 B2 JP 4853726B2
- Authority
- JP
- Japan
- Prior art keywords
- coaxial cable
- test head
- connection portion
- performance board
- heat insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012360 testing method Methods 0.000 title claims description 37
- 239000004065 semiconductor Substances 0.000 title claims description 21
- 239000000463 material Substances 0.000 claims description 11
- 238000013459 approach Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000008646 thermal stress Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Description
テストヘッド内部に収納されているピンエレクトロニクスカードとテストヘッドの上部に設けられているパフォーマンスボードが複数本の同軸ケーブルを介して接続された半導体テスタ用テストヘッドにおいて、
前記パフォーマンスボードに接続される前記同軸ケーブルの接続部近傍の直線部分は、
剛性を有し少なくとも片方が熱伝導率が低い2枚の板材よりなり、これら2枚の板材には前記同軸ケーブルの接続部が貫通できる大きさの複数の貫通穴が形成され、前記板材を重ね合わせて前記貫通穴に前記同軸ケーブルの接続部近傍の直線部分を通した後に前記2枚の板材を相互に近づくように摺動させることにより、前記同軸ケーブルの接続部近傍の直線部分を前記2枚の板材で挟んで固定するように構成された断熱部材を介してテストヘッド内部に固定支持されていることを特徴とする。
2 ピンエレクトロニクスカード(ピンカード)
3、5、7、10、11 コネクタ
4 フラットケーブル
6 マザーボード
8 パフォーマンスボード
9 同軸ケーブル
12、13、14 断熱部材
Claims (1)
- テストヘッド内部に収納されているピンエレクトロニクスカードとテストヘッドの上部に設けられているパフォーマンスボードが複数本の同軸ケーブルを介して接続された半導体テスタ用テストヘッドにおいて、
前記パフォーマンスボードに接続される前記同軸ケーブルの接続部近傍の直線部分は、
剛性を有し少なくとも片方が熱伝導率が低い2枚の板材よりなり、これら2枚の板材には前記同軸ケーブルの接続部が貫通できる大きさの複数の貫通穴が形成され、前記板材を重ね合わせて前記貫通穴に前記同軸ケーブルの接続部近傍の直線部分を通した後に前記2枚の板材を相互に近づくように摺動させることにより、前記同軸ケーブルの接続部近傍の直線部分を前記2枚の板材で挟んで固定するように構成された断熱部材を介してテストヘッド内部に固定支持されていることを特徴とする半導体テスタ用テストヘッド。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007211659A JP4853726B2 (ja) | 2007-08-15 | 2007-08-15 | 半導体テスタ用テストヘッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007211659A JP4853726B2 (ja) | 2007-08-15 | 2007-08-15 | 半導体テスタ用テストヘッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009047464A JP2009047464A (ja) | 2009-03-05 |
JP4853726B2 true JP4853726B2 (ja) | 2012-01-11 |
Family
ID=40499832
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007211659A Active JP4853726B2 (ja) | 2007-08-15 | 2007-08-15 | 半導体テスタ用テストヘッド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4853726B2 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6454365A (en) * | 1987-08-26 | 1989-03-01 | Matsushita Electric Ind Co Ltd | Prober |
JPH0370437U (ja) * | 1989-11-08 | 1991-07-15 | ||
JPH0651021A (ja) * | 1992-07-31 | 1994-02-25 | Nec Corp | 低温ハンドラ用テストボード |
JP3025113B2 (ja) * | 1992-10-07 | 2000-03-27 | 三菱電機株式会社 | 低温ハンドラ |
JP2004233057A (ja) * | 2003-01-28 | 2004-08-19 | Ibiden Engineering Kk | プリント配線板検査用ピン治具およびその製造方法 |
-
2007
- 2007-08-15 JP JP2007211659A patent/JP4853726B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2009047464A (ja) | 2009-03-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4972418B2 (ja) | 試験装置およびプローブカード | |
US8007289B2 (en) | Connector apparatus | |
US9591781B2 (en) | Floating daughter card system | |
KR20150088262A (ko) | 안내공 내에서의 원치않은 이동을 저지하는 스프링 기구를 구비한 프로브 | |
US20060221559A1 (en) | Two-dimensional adjustable edge connector adaptor | |
JPH11344510A (ja) | プローブカード、プローブ及び半導体試験装置 | |
US9500675B2 (en) | Probe module supporting loopback test | |
CN112119315B (zh) | 高频高性能探针卡 | |
US7816932B2 (en) | Test system with high frequency interposer | |
US8062071B2 (en) | Electrical connector for electrical connection between neighboring connectors | |
US6137508A (en) | Printhead de-multiplexing and interconnect on carriage mounted flex circuit | |
JP5681423B2 (ja) | 多心ケーブルをピングリッドアレイコネクタに接続する装置 | |
US20080100323A1 (en) | Low cost, high pin count, wafer sort automated test equipment (ate) device under test (dut) interface for testing electronic devices in high parallelism | |
JP4853726B2 (ja) | 半導体テスタ用テストヘッド | |
KR101602023B1 (ko) | 전기 상호접속을 위한 전자 배열기 | |
KR101384399B1 (ko) | 프로브 카드 | |
KR101241804B1 (ko) | 프로브블록 | |
KR101479956B1 (ko) | 자동 테스트 장비 인터페이스용 직각 연결 시스템 | |
KR20140110443A (ko) | 프로브 카드 | |
KR102075484B1 (ko) | 반도체 테스트용 소켓 | |
KR101913274B1 (ko) | 프로브 카드의 전기적 특성 측정장치 | |
RU2319263C1 (ru) | Контактирующее устройство для электрического соединения жестких печатных плат | |
CN113514780B (zh) | 一种用于卫星整星低频电缆的测试系统以及测试方法 | |
KR20180104253A (ko) | 탄소 섬유를 이용한 양방향 도전성 핀 및 양방향 도전성 패턴 모듈 | |
KR100589759B1 (ko) | 반도체 및 전기회로 검사 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100512 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110530 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110603 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110620 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110728 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110822 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20110906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110912 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110929 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20111012 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20141104 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4853726 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20171104 Year of fee payment: 6 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20171104 Year of fee payment: 6 |
|
S201 | Request for registration of exclusive licence |
Free format text: JAPANESE INTERMEDIATE CODE: R314201 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20171104 Year of fee payment: 6 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |