JP4846299B2 - Marking method for semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device and a marking method thereof, and more particularly to a technique effective when applied to a marking method for a small semiconductor device.

  In a resin-encapsulated package, a sealing resin that encapsulates an integrated circuit portion, a first marking portion formed on the surface of the resin, and a portion of the first marking portion are formed. In addition, there is a technique that includes a second marking unit having a display format different from that of the first marking unit (see, for example, Patent Document 1).

  The electronic component storage package is composed of an insulating base having a plurality of notches formed on the side surface from the upper surface to the lower surface, and a lid attached to the upper surface of the insulating base so as to cover the electronic component. A notch conductor to which the wiring conductor led out from the mounting part is electrically connected is formed on the surface of only the side surface on one side of the insulating base, and the notch conductor is oriented toward the insulating base. There is a technique used as a recognition mark for recognizing (see, for example, Patent Document 2).

In the semiconductor package identification method, a light source is disposed obliquely above the semiconductor package, and a CCD camera having a pattern recognition function is disposed above the semiconductor package. There is a technique for identifying product information by detecting light emitted from a light source and reflected by a cutout of a semiconductor package (see, for example, Patent Document 3).
JP-A-11-26649 (FIG. 1) Japanese Patent Laying-Open No. 2003-7893 (FIG. 1) Japanese Patent Laid-Open No. 11-45951 (FIG. 1)

  In the future, semiconductor devices mounted on mobile communication devices such as mobile phones will require further miniaturization and various types of products.

  A recognition mark indicating product information such as a product type and a production lot is attached to the surface of the sealing body of the semiconductor device.

  However, when the surface area of the sealing body is reduced by downsizing the semiconductor device, the number of marks (characters) that can be displayed is extremely reduced. In addition, when the number of semiconductor device types increases, there is a problem that characters to be displayed are insufficient.

  For example, in a small semiconductor device having a package size of 0805 (0.8 × 0.5 mm) or smaller, only about one character can be displayed on the surface of the sealing body, and the number of semiconductor devices increases. There is a problem that it is not possible to handle due to insufficient characters to be displayed.

  Note that Patent Document 1 (Japanese Patent Application Laid-Open No. 11-26649) discloses a method of overprinting marks by stamping. However, in the stamping, there is a problem that the mark is likely to be blurred or blurred, and the mark is likely to disappear.

  Further, Patent Document 2 (Japanese Patent Laid-Open No. 2003-7893) discloses that an identification index indicating the orientation of the package is formed in the notches at the four corners of the package. However, the notches at the four corners have a problem that it is difficult to discriminate in visual inspection.

  Further, Patent Document 3 (Japanese Patent Laid-Open No. 11-45951) discloses a technique for performing recognition by forming a plurality of cutouts whose bar code-like directions are changed on the surface of a package. However, there is a problem that the recognition apparatus becomes large and costs and labor are required, such as a CCD camera arranged in the recognition apparatus.

  An object of the present invention is to provide a technique capable of displaying product information in accordance with the increase in product information in a semiconductor device.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in this application, the outline of typical ones will be briefly described as follows.

  That is, the present invention includes a semiconductor chip, a sealing body that seals the semiconductor chip, and an external terminal exposed from the sealing body, and a cathode band that indicates product information on the surface of the sealing body and a one-character mark The cathode band is formed by a groove, and a part of the sealing body is disposed on both sides of the cathode band.

  Furthermore, the present invention includes a marking step of attaching a first mark and a second mark indicating product information to the surface of the sealing body of the semiconductor device, and at least one of the first and second marks The mark indicates the product information of each semiconductor device depending on the display direction, and the mark is attached in the direction corresponding to the product information.

  Of the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  The mark attached to the sealing body of the semiconductor device indicates product information of each semiconductor device depending on the display direction. By attaching the mark in the direction corresponding to the product information, one mark can be obtained even in a small semiconductor device. The display type can be increased by changing the direction of. As a result, even if product information such as product types increases in a small semiconductor device, it is possible to display product information accordingly.

  In the following embodiments, the description of the same or similar parts will not be repeated in principle unless particularly necessary.

  Further, in the following embodiment, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments, but they are not irrelevant to each other unless otherwise specified. The other part or all of the modifications, details, supplementary explanations, and the like are related.

  Also, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), particularly when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and it may be more or less than the specific number.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.

(Embodiment)
1 is a plan view showing an example of the structure of a semiconductor device according to an embodiment of the present invention, FIG. 2 is a cross-sectional view showing an example of a cross-sectional structure taken along line AA shown in FIG. 1, and FIG. FIG. 2 is a back view showing an example of the structure of the semiconductor device shown in FIG. 1. 4 is a plan view showing the structure of a semiconductor device according to a modification of the embodiment of the present invention. FIGS. 5, 6, and 7 are structures in which the mark direction is changed in the semiconductor device of the embodiment of the present invention. It is a top view which shows an example.

  In the present embodiment, marking of a small and resin-encapsulated semiconductor device will be described. The diode 6 will be described as an example of the semiconductor device. As shown in FIG. 1, the size of the diode 6 in the plane direction is small, for example, about 0.8 mm (L) × 0.5 mm (M), but the size is limited to the above size. It is not something.

  The configuration of the diode 6 shown in FIGS. 1 to 3 will be described. The semiconductor chip 1 on which the diode element is formed, the conductive wire 4 that electrically connects the semiconductor chip 1 and the external terminal 3, and the semiconductor chip 1. And a sealing body 5 for resin-sealing the wires 4, and external terminals 3 and chip mounting portions 2 exposed from the sealing body 5.

  Furthermore, in the diode 6, a cathode band (first mark) 5c indicating product information and a one-character mark (second mark) 5d are attached to the surface 5a of the sealing body 5, and further, the cathode band. As shown in FIG. 2, 5c and one-character mark 5d are formed by grooves 5f, respectively.

  That is, the cathode band 5c and the one-letter mark 5d are formed by cutting into a concave shape by laser processing or the like, and thus form a groove 5f.

  Further, as shown in FIG. 1, a part of the sealing body 5 is arranged as a wall portion 5g on both sides of the cathode band 5c on the surface 5a of the sealing body 5. That is, when the cathode band 5c is formed by laser processing, the edge of the sealing body 5 is formed on the outer surface of both ends of the cathode band 5c on the surface 5a of the sealing body 5. That is, both ends of the cathode band 5c remain before the edge of the surface 5a and do not extend to the side surface.

  The cathode band 5c indicates the polarity (direction) of the cathode.

  The single-character mark 5d is preferably a versatile mark that can be seen by anyone, for example, numerals or English letters. For example, the type of diode 6, the reference potential, the production location, Product information such as production time is shown.

  In the diode 6 of the present embodiment, the one-character mark 5d indicates product information of each semiconductor device (diode 6) depending on the display direction as shown in FIGS. A one-character mark 5d is attached in a direction corresponding to the information.

  That is, by changing the display direction of the single character mark 5d, the product information such as the production location and the production time is different. By recognizing the single character mark 5d and its display direction, the meaning of the product information can be understood. It has become.

  Further, by changing the direction of the single-character mark 5d in this way, the number of types of product information to be displayed can be increased.

  In the diode 6 shown in FIGS. 4 to 7, the cathode band 5 c is formed up to the end of the surface 5 a on the surface 5 a of the sealing body 5.

  Here, the chip mounting portion 2 and the external terminal 3 are made of conductive thin plates, and not only the external terminal 3 but also the chip mounting portion 2 has an external terminal function, as shown in FIG. The back surface 2 b of 2 is also exposed on the back surface 5 b of the sealing body 5.

  Therefore, the semiconductor chip 1 is fixed on the main surface 2a of the chip mounting portion 2 via a conductive adhesive or the like.

  Moreover, the sealing body 5 is formed by the thermosetting epoxy resin etc., for example. However, it may be formed of a resin other than an epoxy resin.

  Next, the marking method of the semiconductor device of this embodiment will be described.

  After the assembly of the diode 6 is completed, in the marking step, marking is performed by attaching a cathode band 5c to the surface 5a of the sealing body 5 of the diode 6 and a one-character mark 5d indicating product information beside the cathode band 5c.

  In the diode 6 of the present embodiment, the one-character mark 5d indicates the product information of each diode 6 depending on the display direction. For example, as shown in FIGS. A one-character mark 5d is attached in a predetermined direction corresponding to. At this time, it is preferable that the one-character mark 5d is represented by, for example, a general-purpose number or English character.

  The cathode band 5c and the single-character mark 5d are preferably formed as grooves 5f (concave portions) by laser processing, for example.

  FIG. 4 shows a diode 6 of a modified example, and a cathode band (first mark) 5c and a one-character mark (second mark) 5d are formed on the surface 5a of the sealing body 5. , A small mark (third mark) 5e smaller than the one-character mark 5d.

  The small mark 5e is, for example, a bar (-), a dot (.), Etc., and this space is effective when a small space smaller than the space for one character remains beside the one character mark 5d. In this way, in addition to the single-character mark 5d, a smaller mark 5e smaller than this can be added to further increase the type and number of product information to be displayed.

  According to the semiconductor device (diode 6) and the marking method of the present embodiment, on the surface 5a of the encapsulant 5 of the diode 6, the one-character mark 5d attached to the side of the cathode band 5c is individually changed depending on the display direction. The product information of the diode 6 is shown, and by attaching a one-character mark 5d in the direction corresponding to the product information, the type of display can be increased by changing the direction of the mark even in the small diode 6. it can.

  As a result, even if product information such as product type increases in the small diode 6, the product information can be displayed accordingly.

  For example, when there are a plurality of assembly steps, it is possible to easily determine information such as in which assembly step the assembly is performed using the same single character.

  Further, by changing the direction of the mark for each production period, the production period of the product (diode 6) can be easily determined.

  Furthermore, since the single-character mark 5d itself that changes the display direction does not become small, it can be discriminated visually without using a microscope, a recognition device, etc., and information can be easily obtained without increasing costs and labor. Can be recognized.

  In addition, by forming the cathode band 5c and the single-character mark 5d as the groove 5f by laser processing, it is possible to prevent the phenomenon of mark bleeding or blurring or mark disappearance that occurs during stamping or printing, and the display life of the mark. Can be extended.

  Further, in the diode 6, the cathode band 5 c is formed by the groove 5 f, and a part of the sealing body 5 is arranged as a wall portion 5 g on both sides of the cathode band 5 c, thereby adhering material such as dicing tape. Can be prevented from entering the groove 5 f from the side surface of the sealing body 5.

  As a result, it is possible to prevent the problem that the diode 6 is difficult to be separated from the dicing tape after dicing.

  Further, since the display type of the product information is increased by changing the direction of the one-character mark 5d, numerals and English characters can be used for the mark itself. In the case of numbers and English characters, since they are versatile, they are different from displaying with special symbols or the like, and therefore, discrimination can be easily and quickly performed by anyone.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiments of the invention. However, the present invention is not limited to the embodiments of the invention, and various modifications can be made without departing from the scope of the invention. It goes without saying that it is possible.

  For example, in the above-described embodiment, the case where the semiconductor device is the diode 6 has been described. However, the semiconductor device may be another electronic component such as a transistor as long as it is a small semiconductor package. In this case, the first mark may be the cathode band 5c or another mark other than the cathode band 5c, and either one of the first mark or the second mark is a character. The product information of the semiconductor device (electronic component) may be displayed by changing the display direction of the characters.

  In the above embodiment, the cathode band 5c and the one-character mark 5d are formed by laser processing. However, the cathode band 5c and the one-character mark 5d may be attached by, for example, printing. .

  The present invention is suitable for electronic part marking technology.

It is a top view which shows an example of the structure of the semiconductor device of embodiment of this invention. It is sectional drawing which shows an example of the structure of the cross section cut | disconnected along the AA line shown in FIG. FIG. 2 is a back view showing an example of the structure of the semiconductor device shown in FIG. 1. It is a top view which shows the structure of the semiconductor device of the modification of embodiment of this invention. It is a top view which shows an example of the structure which changed the mark direction in the semiconductor device of embodiment of this invention. It is a top view which shows an example of the structure which changed the mark direction in the semiconductor device of embodiment of this invention. It is a top view which shows an example of the structure which changed the mark direction in the semiconductor device of embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Chip mounting part 2a Main surface 2b Back surface 3 External terminal 4 Wire 5 Sealing body 5a Front surface 5b Back surface 5c Cathode band (1st mark)
5d 1-character mark (second mark)
5e Small mark (third mark)
5f Groove 5g Wall (part)
6 Diode (semiconductor device)

Claims (6)

A semiconductor device marking method for marking a semiconductor device,
A marking step of attaching a first mark and a second mark indicating product information on the surface of the sealing body of the semiconductor device;
At least one of the first and second marks indicates product information of each semiconductor device depending on a display direction thereof, and the mark is attached in a direction corresponding to the product information. A semiconductor device marking method. The semiconductor device includes a marking method of a semiconductor device according to claim 1, wherein the diodes. A semiconductor device marking method for marking a semiconductor device,
A marking step of attaching a cathode band indicating product information and a one-letter mark on the surface of the sealing body of the semiconductor device;
The marking method for a semiconductor device, wherein the one-character mark indicates product information of an individual semiconductor device depending on a display direction thereof, and the one-character mark is attached in a direction corresponding to the product information. A semiconductor device marking method for marking a semiconductor device,
A marking step of attaching a cathode band indicating product information and a one-letter mark on the surface of the sealing body of the semiconductor device;
The one-character mark indicates product information of an individual semiconductor device depending on a display direction thereof,
A marking method for a semiconductor device, wherein the cathode band and the one-character mark are formed by laser processing, and the one-character mark is formed in a direction corresponding to the product information. A semiconductor device marking method for marking a semiconductor device,
Marking which attaches the cathode band which is the 1st mark which shows product information on the surface of the sealing body of the semiconductor device, the 2nd mark which is a 1-character mark, and the 3rd mark smaller than the 2nd mark Having a process,
The second mark indicates product information of an individual semiconductor device depending on a display direction thereof,
A marking method for a semiconductor device, wherein the second mark is attached in a direction corresponding to the product information. 6. The marking method for a semiconductor device according to claim 5 , wherein the third mark includes a bar (-) or a dot (.).

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