JPH08204238A - Light emission device - Google Patents
Light emission deviceInfo
- Publication number
- JPH08204238A JPH08204238A JP7013463A JP1346395A JPH08204238A JP H08204238 A JPH08204238 A JP H08204238A JP 7013463 A JP7013463 A JP 7013463A JP 1346395 A JP1346395 A JP 1346395A JP H08204238 A JPH08204238 A JP H08204238A
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting device
- lead
- light emission
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、発光装置に関し、詳し
くは発光装置のリードの形状に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, and more particularly to the shape of leads of a light emitting device.
【０００２】[0002]
【従来の技術】従来の発光装置は、図３（ａ）の側面図
に示すように、発光素子１１が一方のリード１２の一端
に実装されており、且つ発光素子１１の電極（図示せ
ず）と他方のリード１３の一端がボンディングワイヤ１
４により電気的に接続されている。そして、樹脂封止部
１５が発光素子１１とボンディングワイヤ１４を覆うよ
うに透光性の樹脂により形成され、発光装置が構成され
ている。2. Description of the Related Art In a conventional light emitting device, as shown in a side view of FIG. 3A, a light emitting element 11 is mounted on one end of one lead 12 and an electrode (not shown) of the light emitting element 11 is provided. ) And one end of the other lead 13 is the bonding wire 1
4 electrically connected. Then, the resin sealing portion 15 is formed of a translucent resin so as to cover the light emitting element 11 and the bonding wire 14, and the light emitting device is configured.
【０００３】ところで近年、発光装置が用いられるディ
スプレイ装置はフルカラー化が急速に進み、発光装置に
も多色化が要求されている。それにともない図３（ｂ）
の側面図に示すように、赤色を発光する発光素子１１ａ
と、緑色を発光する発光素子１１ｂが一方のリード１２
の一端に実装されており、それぞれの発光素子１１ａ及
び１１ｂの電極（図示せず）と他方のリード１３ａ及び
１３ｂのそれぞれの一端がボンディングワイヤ１４によ
り電気的に接続されている。そして、樹脂封止部１５が
それぞれの発光素子１１ａ、１１ｂとボンディングワイ
ヤ１４を覆うように透光性の樹脂により形成され、多色
発光可能な発光装置が構成されている。By the way, in recent years, full-color display devices using light emitting devices have been rapidly developed, and light emitting devices are also required to have multiple colors. Accordingly, Fig. 3 (b)
As shown in the side view of FIG.
And the light emitting element 11b that emits green light is connected to one of the leads 12
Of the light emitting elements 11a and 11b and the respective ends of the leads 13a and 13b on the other side are electrically connected by a bonding wire 14. The resin sealing portion 15 is formed of a translucent resin so as to cover the respective light emitting elements 11a and 11b and the bonding wire 14, and a light emitting device capable of multicolor light emission is configured.
【０００４】[0004]
【発明が解決しようとする課題】一般に前述した発光装
置は、図４の一部平面図に示されるような金属板を打ち
抜いて、複数を一連に製造可能なリードフレームが用い
られて製造されている。この発光装置はリードフレーム
上で樹脂封止部を形成し、リード間のダムバーを切除し
た後に電気測定され、それぞれの発光装置のリードの極
性を識別し、良品となった発光装置がリードフレームか
ら分離され種々の形態で包装されている。Generally, the above-described light emitting device is manufactured by using a lead frame capable of manufacturing a plurality of metal plates by punching out a metal plate as shown in a partial plan view of FIG. There is. In this light emitting device, a resin sealing part is formed on the lead frame, the dam bar between the leads is cut off, and then electrical measurement is performed to identify the polarities of the leads of each light emitting device. Separated and packaged in various forms.
【０００５】しかし、発光装置のリードの形状が略スト
レート状のため、発光装置のリードの極性の判別後に複
数の発光装置を一括状に袋詰めするバルク包装等の発光
装置を固定しない包装形態の場合、発光装置を電子機器
等の基板に実装する前に再度、発光装置のリードの極性
を判別をしなければならず、発光装置の実装工程の簡略
化を図ることが難しいという問題点があった。However, since the leads of the light emitting device have a substantially straight shape, a packaging form in which the light emitting device is not fixed, such as bulk packaging in which a plurality of light emitting devices are collectively packaged after the polarities of the leads of the light emitting device are determined. In this case, it is necessary to determine the polarity of the leads of the light emitting device again before mounting the light emitting device on a substrate of an electronic device or the like, which makes it difficult to simplify the mounting process of the light emitting device. It was
【０００６】更に、前述の図３（ｂ）に示すような多色
発光可能な発光装置の場合、リードの極性を判別しても
図５に示すように回路が左右対称となっており、発光装
置の実装方向の間違いを起こし易いという問題点があっ
た。本発明は、実装前の極性の識別及び、方向の識別の
容易な発光装置の構造を提供することを目的とする。Further, in the case of the light emitting device capable of emitting multicolored light as shown in FIG. 3B, even if the polarities of the leads are discriminated, the circuit becomes symmetrical as shown in FIG. There is a problem that the mounting direction of the device is likely to be wrong. An object of the present invention is to provide a structure of a light emitting device in which it is easy to identify the polarity before mounting and the direction.
【０００７】[0007]
【課題を解決するための手段】前述の問題点を解決する
ために、本願の請求項１に記載した発明は、発光素子が
実装された一方のリードと、前記発光素子と電気的に接
続された他方のリードと、前記発光素子を覆うように透
光性樹脂にて形成された樹脂封止部と、からなる発光装
置において、前記樹脂封止部より導出される前記一方若
しくは他方のリードの先端部に凸部が形成されているこ
とを特徴としている。In order to solve the above-mentioned problems, the invention described in claim 1 of the present application is such that one lead on which a light emitting element is mounted is electrically connected to the lead. In the light emitting device including the other lead and a resin sealing portion formed of a translucent resin so as to cover the light emitting element, the one or the other lead led out from the resin sealing portion It is characterized in that a convex portion is formed at the tip.
【０００８】[0008]
【発明の作用及び効果】発光装置において、樹脂封止部
より導出される前記一方若しくは他方のリードの先端部
に凸部が形成されていることにより、発光装置のリード
の極性の判定が容易になり、発光装置の包装形態に関係
なく実装工程の簡略化が可能になるという効果を有す
る。In the light emitting device, since the projection is formed at the tip of the one or the other lead led out from the resin sealing portion, the polarity of the lead of the light emitting device can be easily determined. Therefore, there is an effect that the mounting process can be simplified regardless of the packaging form of the light emitting device.
【０００９】そして、発光装置のリードの先端部に凸部
が形成されていることにより、発光装置が対称状に形成
されている場合であっても、その回路や外観に関係なく
発光装置の方向性の識別が容易になり、発光装置の実装
の方向間違いを防止できるという効果を有する。Since the leads of the light emitting device are formed with the protrusions at the tips thereof, even if the light emitting device is formed symmetrically, the direction of the light emitting device is irrelevant regardless of its circuit or appearance. This has the effect of facilitating the identification of the sex and preventing an error in the mounting direction of the light emitting device.
【００１０】[0010]
【実施例】以下本発明の発光装置の実施例を図面を用い
て説明する。図１は本発明の一実施例である発光装置を
示す側面図で、発光素子１がＦｅよりなる一方のリード
２の一端にダイボンディングにより実装されている。
尚、発光素子１の裏面側のカソード電極（図示せず）が
リード２と電気的に接続されている。このリード２の他
端の先端部には、発光装置の極性（カソード電極）を示
す略矩形状の凸部２ａが形成されている。Embodiments of the light emitting device of the present invention will be described below with reference to the drawings. FIG. 1 is a side view showing a light emitting device according to an embodiment of the present invention, in which a light emitting element 1 is mounted on one end of one lead 2 made of Fe by die bonding.
A cathode electrode (not shown) on the back surface side of the light emitting element 1 is electrically connected to the lead 2. At the tip of the other end of the lead 2, a substantially rectangular convex portion 2a indicating the polarity (cathode electrode) of the light emitting device is formed.
【００１１】そして、発光素子１の上面側のアノード電
極（図示せず）とＦｅよりなる他方のリード３の一端が
Ａｕよりなるボンディングワイヤ４により電気的に接続
されている。このボンディングワイヤ４と発光素子１を
覆うように、樹脂封止部５が透光性を有するエポキシ樹
脂により形成され、発光装置が構成されている。この実
施例において、発光装置のリード２の先端部に形成され
ている凸部２ａは、発光装置を製造するリードフレーム
に予め形成されていても良く、またリードフレームから
個別の発光装置を分離する際にリードフレームの一部を
加工して形成しても良い。凸部２ａの形状は実装の際に
ＣＣＤカメラ等の認識装置で認識可能であれば特に矩形
に限定されるものではない。Then, an anode electrode (not shown) on the upper surface side of the light emitting element 1 and one end of the other lead 3 made of Fe are electrically connected by a bonding wire 4 made of Au. A resin sealing portion 5 is formed of a translucent epoxy resin so as to cover the bonding wire 4 and the light emitting element 1, and a light emitting device is configured. In this embodiment, the convex portion 2a formed at the tip of the lead 2 of the light emitting device may be formed in advance on the lead frame for manufacturing the light emitting device, or separate the light emitting device from the lead frame. At this time, a part of the lead frame may be processed and formed. The shape of the convex portion 2a is not particularly limited to a rectangle as long as it can be recognized by a recognition device such as a CCD camera during mounting.
【００１２】尚、発光装置のリードの先端部に形成され
た凸部は、電子機器等の基板に実装される際に、切断等
にて除去され従来の発光装置と同様のストレート状とす
ればよいので、発光装置の実装に制限を加えることなく
リードの極性の識別が容易になる。次に、図２は本発明
の他の実施例である発光装置を示す側面図で、赤色を発
光する発光素子１ａと、緑色を発光する発光素子１ｂが
Ｆｅよりなる一方のリード２の一端にダイボンディング
により並列状に実装されている。尚、発光素子１ａ及び
１ｂの裏面側のカソード電極（図示せず）がリード２に
電気的に接続されている。The convex portion formed on the tip of the lead of the light emitting device is removed by cutting or the like when it is mounted on a substrate of an electronic device or the like so that it has a straight shape similar to that of a conventional light emitting device. Since it is good, the polarity of the lead can be easily identified without limiting the mounting of the light emitting device. Next, FIG. 2 is a side view showing a light emitting device according to another embodiment of the present invention. A light emitting element 1a emitting red light and a light emitting element 1b emitting green light are attached to one end of one lead 2 made of Fe. They are mounted in parallel by die bonding. The cathode electrodes (not shown) on the back surface side of the light emitting elements 1a and 1b are electrically connected to the leads 2.
【００１３】この発光素子１ａ及び１ｂの上面側のアノ
ード電極（図示せず）とＦｅよりなる他方のリード３ａ
及び３ｂのそれぞれの一端がＡｕよりなるボンディング
ワイヤ４により電気的に接続されている。赤色を発光す
る発光素子１ａと電気的に接続されているリード３ａの
先端部には発光装置の赤色のアノード電極のリードであ
ることを示す略矩形状の凸部３ａ’が形成されている。Anode electrodes (not shown) on the upper surface side of the light emitting elements 1a and 1b and the other lead 3a made of Fe.
And 3b are electrically connected to each other by a bonding wire 4 made of Au. At the tip of the lead 3a that is electrically connected to the light emitting element 1a that emits red light, a substantially rectangular convex portion 3a 'indicating that it is a lead of the red anode electrode of the light emitting device is formed.
【００１４】そして、樹脂封止部５がそれぞれの発光素
子１ａ、１ｂとボンディングワイヤ４を覆うように透光
性を有するエポキシ樹脂により形成され、３色発光可能
な発光装置が構成されている。この実施例において、発
光装置のリードの極性と方向を示す凸部は赤色の発光素
子が実装されているリード側に形成したが、緑色側のリ
ードに形成してもよく、又、リードの凸部は発光装置に
実装される発光素子の極性に合わせて形成すればよく特
にアノード側に限定されるものではない。The resin encapsulation portion 5 is formed of a translucent epoxy resin so as to cover the light emitting elements 1a and 1b and the bonding wires 4, thus forming a light emitting device capable of emitting three colors of light. In this embodiment, the convex portion indicating the polarity and direction of the lead of the light emitting device is formed on the lead side on which the red light emitting element is mounted, but it may be formed on the green side lead, or the convex portion of the lead may be formed. The portion may be formed according to the polarity of the light emitting element mounted in the light emitting device, and is not particularly limited to the anode side.
【００１５】更に、発光素子の組み合わせについても、
発光装置に要求される色によって組み合わせを決定すれ
ばよく、特に赤と緑の組み合わせに限定されるものでは
ない。前述のような複数色発光可能な発光装置におい
て、その回路が図５のように左右対称となっており、且
つ外形形状も対称になっている場合、従来ではリードの
極性を電気測定で識別しても、各発光素子の発光する色
を確認しなければならなかったが、リードの先端部に凸
部が形成されていることで、左右対称な発光装置でも容
易にリードの極性及び発光装置の方向を識別することが
できる。Furthermore, regarding the combination of light emitting elements,
The combination may be determined according to the color required for the light emitting device, and is not particularly limited to the combination of red and green. In a light emitting device capable of emitting light of multiple colors as described above, if the circuit is bilaterally symmetric as shown in FIG. 5 and the external shape is also symmetric, conventionally, the polarities of the leads are identified by electrical measurement. However, it was necessary to confirm the color of light emitted from each light emitting element. However, since the protrusion is formed at the tip of the lead, the polarity of the lead and the light emitting device can be easily adjusted even in a symmetrical light emitting device. The direction can be identified.
【００１６】尚、本発明は上述の実施例に記載の形成方
法、形状及び材料等の構成に特に限定されるものではな
い。The present invention is not particularly limited to the formation method, the shape, the material and the like described in the above embodiments.
【図１】本発明の発光装置の一実施例を示す側面図FIG. 1 is a side view showing an embodiment of a light emitting device of the present invention.
【図２】本発明の発光装置の他の実施例を示す側面図FIG. 2 is a side view showing another embodiment of the light emitting device of the present invention.
【図３】従来の発光装置を示す側面図FIG. 3 is a side view showing a conventional light emitting device.
【図４】発光装置の製造に用いられるリードフレームを
示す一部平面図FIG. 4 is a partial plan view showing a lead frame used for manufacturing a light emitting device.
【図５】複数色発光可能な発光装置の一回路を示す回路
図FIG. 5 is a circuit diagram showing a circuit of a light emitting device capable of emitting light of a plurality of colors.
１・・・・発光素子 ２・・・・一方のリード ３・・・・他方のリード ４・・・・ボンディングワイヤ ５・・・・樹脂封止部 １１・・・発光素子 １２・・・一方のリード １３・・・他方のリード １４・・・ボンディングワイヤ １５・・・樹脂封止部 1 ... Light emitting element 2 ... One lead 3 ... Other lead 4 ... Bonding wire 5 ... Resin sealing part 11 ... Light emitting element 12 ... One side Lead 13 ... other lead 14 ... bonding wire 15 ... resin encapsulation portion
Claims (1)
前記発光素子と電気的に接続された他方のリードと、前
記発光素子を覆うように透光性樹脂にて形成された樹脂
封止部と、からなる発光装置において、 前記樹脂封止部より導出される前記一方若しくは他方の
リードの先端部に凸部が形成されていることを特徴とす
る発光装置。1. A lead in which a light emitting element is mounted,
A light emitting device comprising the other lead electrically connected to the light emitting element, and a resin sealing portion formed of a translucent resin so as to cover the light emitting element, wherein the light emitting device is derived from the resin sealing portion. A light emitting device, characterized in that a convex portion is formed at a tip portion of the one or the other of the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7013463A JPH08204238A (en) | 1995-01-31 | 1995-01-31 | Light emission device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7013463A JPH08204238A (en) | 1995-01-31 | 1995-01-31 | Light emission device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08204238A true JPH08204238A (en) | 1996-08-09 |
Family
ID=11833847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7013463A Pending JPH08204238A (en) | 1995-01-31 | 1995-01-31 | Light emission device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08204238A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100766445B1 (en) * | 2006-06-30 | 2007-10-11 | 서울반도체 주식회사 | Light emitting diode |
| US7781792B2 (en) | 2007-12-11 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Solid state illumination device |
-
1995
- 1995-01-31 JP JP7013463A patent/JPH08204238A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100766445B1 (en) * | 2006-06-30 | 2007-10-11 | 서울반도체 주식회사 | Light emitting diode |
| US7781792B2 (en) | 2007-12-11 | 2010-08-24 | Foxsemicon Integrated Technology, Inc. | Solid state illumination device |
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