JP4841460B2 - Backup pin arrangement position determining apparatus, backup unit forming apparatus, and substrate processing apparatus - Google Patents

Description

  The present invention relates to a backup pin arrangement position determining apparatus, a backup unit forming apparatus, and a substrate processing apparatus in a backup unit for supporting a substrate.

Conventionally, in a substrate processing apparatus (for example, a printing machine or a surface mounting machine), the substrate is supported by preventing the substrate from being bent when a solder paste is printed on the substrate surface or when a component is mounted on the substrate. A backup unit is used. This backup unit has a configuration in which a plurality of backup pins are detachably set on a support plate. Although the backup pin supports the board from the back side of the board, parts may be mounted on the back side of the board, so if the backup pin is set at a position where it interferes with the part, the part may be damaged or the board may be leveled. I can't keep it. For this reason, there is considered a backup pin arrangement position determining device that determines the arrangement position of the backup pin so that the backup pin does not interfere with the component by displaying the position information of the component mounted on the board by the display means. (Patent Document 1 below).
Republished WO2004 / 103054

  However, in this backup pin arrangement position determining device, although the arrangement position of the backup pin can be determined, an image indicating the determined arrangement position of the backup pin is not displayed on the display means. The finished state cannot be confirmed, and the arrangement balance of the backup pins in the entire backup unit cannot be grasped. As a result, there is a problem that the backup pins for supporting the substrate are locally insufficient and the substrate is locally bent during processing by the substrate processing machine.

  The present invention has been completed based on the above situation, and an object of the present invention is to make it possible to arrange the backup pins in a well-balanced manner by displaying an image showing the arrangement positions of the backup pins.

The present invention is to determine a position of a backup pin in a backup unit for supporting a substrate having a plurality of backup pins detachably disposed on a support plate and having a protrusion on the back surface side by the backup pin. A backup pin arrangement position determining device, wherein pin arrangement possible position information acquisition means for obtaining pin arrangement possible position information indicating a position where a backup pin can be arranged on the support plate, and the position of the protrusion on the substrate Protrusion position information acquisition means for acquiring information, and arrangement of the backup pin so that the tip of the backup pin hits the position on the back side of the substrate avoiding the protrusion based on the position information on the pin arrangement and the protrusion position information Pin arrangement position determining means for determining the position, and backup pin arrangement position determined by the pin arrangement position determining means An image synthesizing means for synthesizing the image based on the position information of the image and the projection section shown, and a display means for displaying the synthesized image synthesized by the image synthesizing means, the backup pins are drilled on the support plate There are two types of pins: an insertion type backup pin that is inserted and fixed in the support hole and a magnet type backup pin that is fixed to a flat surface other than the support hole on the support plate by a magnetic force. If the position determining means determines that the insertion type backup pin is disposed and then determines that the strength of the backup unit is insufficient, the position determining means determines the location of the magnet type backup pin. characterized in was configured to specify a set position. According to such a configuration, the pin placement position information acquisition means acquires the pin placement position information, the protrusion position information acquisition means acquires the protrusion position information, and the pin placement position information and the protrusion position. Based on the information, the pin arrangement position determining means determines the arrangement position of the backup pin. Then, the image synthesizing unit can synthesize the image indicating the arrangement position of the backup pin and the image based on the position information of the protruding portion, and the synthesized image synthesized by the image synthesizing unit can be displayed on the display unit. As a result, the arrangement position of the backup pin can be confirmed by the display means, so that the backup pin can be arranged in a balanced manner. In addition, it is confirmed whether the insertion type backup pins are arranged in a well-balanced manner, and if it is determined that there is a portion where the strength of the backup pin unit is insufficient in consideration of the overall balance, the pin arrangement is In order to reinforce by adding a magnet-type backup pin to a location where the strength is determined to be insufficient by the installation position determining means, the location can be designated as the location of the magnet pin.

The following configuration is preferable as an embodiment of the present invention.
The pin arrangement position determining means includes an input means for an operator to indicate the position in the composite image displayed by the display means, and the position instructed by the input means is determined as the arrangement position of the backup pin. It is good. According to such a configuration, the operator can determine the position of the backup pin by instructing the position with the input means in the composite image displayed by the display means.

  The image synthesizing means may be configured to also synthesize an image based on the pin disposition position information on the support plate. According to such a configuration, the position where the backup pin can be arranged can be displayed in the composite image displayed by the display means, so that the arrangement position of the backup pin can be easily determined.

  The protrusion position information acquisition means may include an image pickup means for picking up an image of the protrusion on the back surface of the substrate, and may acquire a captured image of the protrusion taken by the image pickup means as protrusion position information. According to such a configuration, a captured image of the protruding portion on the back surface of the substrate imaged by the imaging unit can be acquired as protruding portion position information.

  The protruding portion position information acquisition means may acquire, as the protruding portion position information, the coordinates of the central position of the protruding portion, information on the shape and size of the protruding portion, and position information in the circumferential direction with the center position as the rotation center. Good. According to such a configuration, it is possible to acquire, as the protrusion position information, the coordinates of the center position of the protrusion, information on the shape and size of the protrusion, and position information in the circumferential direction with the center position as the rotation center.

  The image synthesizing means may be configured to synthesize an image based on position information of components mounted on the surface opposite to the back surface of the substrate. According to such a configuration, the backup pin can be arranged on the back surface side of the position where the component is mounted on the substrate surface.

  The present invention is configured to include a backup unit for carrying out a backup unit forming operation, comprising pin transport means for transporting a backup pin toward the backup pin placement position determined by the backup pin placement position determining device. It is good also as an apparatus.

  Further, the present invention may be a substrate processing apparatus that sequentially executes predetermined processing for each type of substrate on different types of substrate groups, and may be a substrate processing apparatus provided with the backup pin arrangement position determining device.

  According to the present invention, it is possible to display the image showing the arrangement position of the backup pin and check the arrangement state, so that the backup pin can be arranged in a balanced manner.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS.
<Overall configuration>
FIG. 1 shows a part of a component mounting line to which a backup pin arrangement position determining apparatus of the present invention is applied. This component mounting line is for manufacturing an electronic circuit board, and includes a loader (not shown), a backup unit forming apparatus 100, a printing machine 10, a mounting machine (not shown), a reflow furnace (not shown), and an unloader (not shown). (Omitted) are provided in a row and are connected to each other by a conveyor 50. Then, while carrying a printed circuit board (hereinafter referred to as “substrate”) P by the conveyor 50, each process of solder paste printing, component mounting, and reflow is sequentially performed, so that finally a required mounted component (main board) is obtained. An example of the “protrusion” of the invention: An electronic circuit board on which M is mounted is manufactured. Each of these devices is connected to a backup pin arrangement position determination device (hereinafter referred to as “arrangement position determination device”) 70 through an electric communication line such as a LAN (Local Area Network) and transmits / receives data to / from each other. It is possible.

<Configuration of backup unit forming apparatus and backup unit>
The backup unit forming apparatus 100 is an apparatus that forms a backup unit B that is a support member for supporting the support surface side (corresponding to the “back surface side” of the present invention) of the substrate P. In this component mounting line, Is installed between the loader and the printing press 10. As shown in FIG. 2, the backup unit B avoids these mounting components M when a plurality of mounting components M are mounted on the support surface side of the double-sided substrate that mounts components on both sides of the substrate P. Used to support P. For this reason, the backup unit B includes a metal support plate 21 and a plurality of backup pins 22 that are detachably set on the support plate 21. The backup pin 22 is fixed to a flat surface other than the support hole 23 on the support plate 21 and an insertion-type backup pin 22A that is inserted and fixed in a support hole 23 formed on the support plate 21 by a magnetic force. Two types of magnetic backup pins 22B are set.

  The backup unit forming apparatus 100 is installed below the transport path of the substrate P transported by the conveyor 50. In FIG. 1, the conveyor 50 located above the backup unit forming apparatus 100 is cut out for convenience of explanation of the structure.

  The backup unit forming apparatus 100 includes a base 120, and a pair of Y-direction guide rails 101 extending in the Y direction are provided at predetermined intervals on an upper portion of a frame (not shown) integrated with the base 120. ing. A pin station 110 in which a plurality of backup pins 22 are stored is provided between the two Y-direction guide rails 101 on the base 120, and when the backup pins 22 are set on the front side of the pin stations 110. A set stand 121 for holding the support plate 21 is installed.

  On the Y-direction guide rail 101, a pin transport unit support member 102 extending in the X direction is provided so as to be movable in the Y direction. The pin transport unit support member 102 is provided with a pin transport unit 103 that holds and transports the backup pin 22 between the support plate 21 held on the set base 121 and the pin station 110 so as to be movable in the X direction. Yes. The pin transport unit 103 corresponds to the “pin transport unit” of the present invention.

  A Y-direction ball screw shaft 104 is disposed on the side of the Y-direction guide rail 101 so as to be rotatable, and is screwed into a ball nut (not shown) fixed to the pin transport unit support member 102. A servo motor 105 is fixed to the upper part of the frame integrated with the base 120, and the Y-direction ball screw shaft 104 is driven by the servo motor 105 to move the pin conveying unit 103 to a desired position in the Y direction. it can.

  As shown in FIG. 3, an X direction ball screw shaft 106 extending in the X direction is provided on the pin transport unit support member 102 so as to be rotatable. The X direction ball screw shaft 106 is screwed into a ball nut (not shown) fixed to the pin transport unit 103. A servo motor 107 is fixed to the pin transport unit support member 102 at one end of the X direction ball screw shaft 106. Accordingly, the X-direction ball screw shaft 106 can be driven by the servo motor 107 to move the pin conveyance unit 103 to a desired position in the X direction.

  The pin transport unit 103 includes a lateral drive unit 108 provided to be movable in the X direction with respect to the pin transport unit support member 102, and a vertical drive unit 109 provided to be movable in the vertical direction with respect to the lateral drive unit 108. It consists of and. A hollow motor (not shown) is fixed inside the lateral drive unit 108, and a ball nut (not shown) is connected to the hollow armature shaft of the hollow motor. On the other hand, a Z-direction ball screw shaft 111 that is screwed into the ball nut is fixed on a fixed plate 112 that protrudes in the horizontal direction at the lower end of the vertical drive unit 109. Thereby, the motive power of a hollow motor can be obtained and the vertical drive part 109 can be moved to the desired position of a Z direction. The hollow motor is a servo type motor.

  The vertical drive unit 109 is provided with a gripping mechanism unit 114 including a pair of clamping units 113 that clamp the backup pin 22 from both sides. Although a detailed description of the gripping mechanism portion 114 is omitted, the back-up pins 22 of the backup pin 22 are moved closer to and away from each other by the power of a servo motor (not shown) provided inside the gripping mechanism portion 114. Gripping / releasing operation is possible.

<Configuration of printing press>
The printing machine 10 includes a base 11, and a pair of Y-direction guide rails 16 extending in the Y direction are provided at predetermined intervals on the upper part of a frame (not shown) integrated with the base 11. . A squeegee unit support member 18 extending in the X direction is provided on both Y direction guide rails 16 so as to be movable in the Y direction. The squeegee unit support member 18 supports the squeegee unit 17 so as to be movable in the X direction, and the squeegee 14 is held by the squeegee unit 17 so as to be movable up and down.

  A Y-direction ball screw shaft 19 is disposed on the side of the Y-direction guide rail 16 so as to be rotatable. The Y-direction ball screw shaft 19 is attached to a ball nut (not shown) fixed to the squeegee unit support member 18. It is screwed. A servo motor 20 is fixed to the upper part of the frame integrated with the base 11, and the Y direction ball screw shaft 19 is driven by the servo motor 20 to move the squeegee unit support member 18 to a desired position in the Y direction. Can do.

  An X direction ball screw shaft (not shown) is rotatably disposed on the squeegee unit support member 18, and is screwed into a ball nut (not shown) fixed to the squeegee unit 17. Further, a servo motor (not shown) is fixed to the squeegee unit support member 18, and the squeegee unit 17 can be moved to a desired position in the X direction by driving the X direction ball screw shaft by the servo motor. .

  Between the two Y-direction guide rails 16 on the base 11, a mask support frame 13 for holding a mask 12 in which an opening of a predetermined mask pattern is formed is disposed. The mask support frame 13 is fixed to the upper part of a frame (not shown) integrated with the base 11, and the mask 12 is positioned above the transport path of the substrate P transported by the conveyor 50.

  A substrate moving table 15 is provided on the base 11 below the substrate P transport path, and the backup unit B is fixed on the substrate moving table 15. The backup unit B can be detached from the front side of the printing press 10. The substrate moving table 15 includes an upper member and a lower member, and the backup unit B is fixed to the upper surface of the upper member. The upper member is provided so as to be movable within a predetermined range in the Z direction relative to the lower member, and the substrate P whose support surface side is supported by the backup unit B is separated from the lower surface of the mask 12 by driving the upper member in the Z direction. It is movable between a contact position where the contact is made and a separation position which is separated from the lower surface of the mask 12. Thus, when the substrate P is in the contact position, the solder paste is supplied onto the mask 12 from a nozzle (not shown), and the supplied solder paste is scraped with the squeegee 14 and embedded in the opening of the mask 12. Thus, the solder paste can be printed at a predetermined position on the substrate P.

  On the outer surface of the squeegee unit 17, a pair of board recognition cameras 60 are integrally attached to both sides sandwiching the squeegee unit 17. Both board recognition cameras 60 are arranged at a predetermined interval in the X-axis direction and are moved together with the squeegee unit 17 in the X-axis direction and the Y-axis direction. Moreover, the movable region on the mounting surface of the board P is selected by selecting one of the board recognition cameras 14 according to the mounting position of the mounting component M on the mounting surface (the surface opposite to the support surface) of the board P. Can be imaged. The substrate recognition camera 60 includes a photoelectric conversion element, and converts a captured image into an analog image signal.

<Electrical configuration in component mounting line>
Next, an electrical configuration centering on the CPU 71 of the arrangement position determining device 70 will be described with reference to FIG. The CPU 71 is connected to the printing machine 10, the mounting machine 30, and the backup unit forming apparatus 100. The CPU 71 sends the set position data of the backup pins 22 arranged on the support plate 21 to the backup unit forming apparatus 100. The CPU 71 corresponds to the “pin arrangement possible position information acquisition unit” and the “pin arrangement position determination unit” of the present invention.

  The arrangement position determining device 70 includes a liquid crystal monitor (an example of the “display unit” of the present invention) 40, an image processing unit (an example of the “image synthesis unit” of the present invention) 72, an input unit 90 such as a mouse, Storage means 80 for storing image data, set position data, and the like. The liquid crystal monitor 40, the image processing unit 72, the input means 90, and the storage means 80 are all controlled by the CPU 71. The analog image signal obtained by the board recognition camera 60 is output to the image processing unit 72 and converted into a digital image signal by an A / D conversion unit (not shown) in the image processing unit 72.

<Creation of set position data by arrangement position determination device>
Next, a procedure for creating the set position data of the backup pin 22 by the arrangement position determining apparatus 70 in the present embodiment will be described with reference to FIGS.
First, a procedure for acquiring a support surface image of the substrate P (an example of “position information of the protruding portion” of the present invention) by the substrate recognition camera 60 will be described with reference to the flowchart of FIG. When the substrate P is set on the substrate moving table 15 of the printing press 10 with the support surface facing upward (S101), a fiducial mark (not shown) of the substrate P is recognized by the substrate recognition camera 60. Thus, the position of the substrate P in the X-axis direction and the Y-axis direction is recognized, and the outer dimension X1 in the X-axis direction and the outer dimension Y1 in the Y-axis direction of the substrate P are acquired. At the same time, the dimension A in the X-axis direction and the dimension B in the Y-axis direction of the camera field of view by the substrate recognition camera 60 are acquired (S102).

  Next, assuming that the lower left coordinates of the substrate P are (0, 0) and the coordinates of the center point of the imaging point are (X1, Y1), X1 = A / 2, Y1 = B / 2. Set (S103). When the imaging center of the substrate recognition camera 60 is moved to the imaging point coordinates (A / 2, B / 2) (S104), the support surface of the substrate P is imaged by the substrate recognition camera 60. The captured image data of the support surface acquired by the board recognition camera 60 is stored in the storage unit 80 in association with the imaging point coordinates (A / 2, B / 2) (S105).

  Subsequently, X1 = X1 + A and Y1 = Y1 are set to move the imaging center of the board recognition camera 60 by a distance A in the X-axis direction (S106). The board recognition camera 60 moves by a distance A from the left end of the board P in the X-axis direction and performs imaging each time until X1 becomes X + A / 2 (that is, the camera field of the board recognition camera 60 is outside the right side of the board P). To move) and repeat imaging. When the imaging center of the board recognition camera 60 reaches (X + A / 2, Y1) (Yes in S107), all imaging along the X-axis direction at Y1 = Y1 is completed. Next, X1 = A / 2 and Y1 = Y1 + B are set to perform imaging along the X-axis direction at Y1 = Y1 + B (S108).

  When the imaging center of the board recognition camera 60 reaches (A / 2, Y1 + B), imaging is performed along the X-axis direction as shown in steps S104 to S107. In this way, movement and imaging are repeated until Y1 reaches Y + B / 2 (that is, until the camera field of view of the substrate recognition camera 60 reaches the upper and outer sides of the substrate P). When the imaging center of the board recognition camera 60 reaches (A / 2, Y + B / 2) (Yes in S109), the coordinates X1 of all the captured image data stored in the storage unit 80 are expressed as X1 = X−X1. By changing the above, the image data reversed left and right is acquired (S110).

  Thereafter, the center of the captured image obtained by the board recognition camera 60 is arranged at the coordinate position stored in association with the captured image data, so that one image is formed as a whole, and thus configured. The support surface image of the substrate P is displayed on the liquid crystal monitor 40 (S111).

  Next, an array image of the support holes 23 in the support plate 21 of the backup unit B (hereinafter referred to as “hole array image”) is created. The hole array image is performed in the same manner as the acquisition of the support surface image of the substrate P by the substrate recognition camera 60 (however, step S105 and step S110, which are processes for converting left and right) are not performed. That is, the support plate 21 is placed on the substrate moving table 15 of the printing machine 10, a positioning mark (not shown) on the support plate 21 is recognized by the substrate recognition camera 60, and the support plate 21 is on the XY plane. Get position, X dimension, and Y dimension. Then, imaging is performed sequentially from the lower left end of the support plate 21 along the X-axis direction and the Y-axis direction, and these images are arranged at the coordinate positions where the imaging is performed to constitute one image as a whole. Create a hole array image. Note that the hole array image corresponds to an example of “pin placementable position information” of the present invention.

Next, a specific method for synthesizing the support surface image of the substrate P and the hole array image by the image processing unit 72 will be described with reference to FIGS.
FIG. 7 is an enlarged pixel display of a part of the hole array image a1, the support surface image b1, and the composite image c shown in FIG. In the hole array image a1 and the thinned-out image b1 in FIG. 7, the collection of points displayed by the monochrome pixel P1 represents the support hole 23, and the two support holes 23 shown in the figure are displayed in both the images a1 and b1. . A collection of dots displayed by the white pixel P2 represents a region without the support hole 23. On the other hand, in the support surface image a2 and the thinned-out image b2 in FIG. 7, the collection of dots displayed by the shaded pixel P3 represents the mounting component M, and the collection of dots displayed by the white pixel P4 has no mounting component M. Represents an area. By deleting every other pixel in the vertical and horizontal directions in both images a1 and a2, thinned-out images b1 and b2 are formed, and both images b1 and b2 are displayed on the liquid crystal monitor 40 (S201, S202). .

  Next, as shown in FIG. 9, the images b1 and b2 are displayed so that the lower end center of the support plate 21 displayed in the thinned image b1 on the liquid crystal monitor 40 coincides with the lower end center of the substrate P of the thinned image b2. Overlapping. Then, the pixel of the thinned-out image b2 is positioned at the position where the pixel is deleted in the thinned-out image b1, thereby forming the composite image c (S203).

Next, a procedure for designating the arrangement position of the backup pin 22 based on the composite image c will be described with reference to FIGS.
In the display screen of the composite image c displayed on the liquid crystal monitor 40 of FIG. 8, the white hole c1 represents a position where the insertion type backup pin 22A can be disposed, and the blue hole (displayed as a black and white checkered pattern on the drawing). C2 represents the position of the backup pin 21 provisionally determined by the operator. Further, the shaded portion c3 represents the placement position of the mounting component M, and the white background black dot region c4 represents a region in which the magnet type backup pin 22B can be disposed.

  Since the white hole c <b> 1 is image-recognized by the CPU 71, the operator can select it using the mouse 90. Therefore, the operator selects the white hole c1 for setting the insertion type backup pin 22A while viewing the composite image c displayed on the liquid crystal monitor 40, and uses the mouse 90 to move the tip of the cursor c5 over the white hole c1. By clicking on the white hole c1, the clicked white hole c1 is displayed as a blue hole c2 (S301). In this way, the designation operation of the arrangement position of the insertion type backup pin 22A is repeatedly performed (S301 to S303). When all the designation operations are completed (Yes in S303), all the designated blue holes c2 are set as red holes. While displaying, the center coordinates of the red hole are stored in the storage means 80 (S304).

  Here, the operator confirms whether or not the insertion type backup pins 22A are arranged in a well-balanced manner while confirming the composite image in which the red holes are displayed. If it is determined that there is a location where the strength of the backup pin unit B is insufficient in consideration of the overall balance, a magnetic backup pin 22B is added to the location where the strength is determined to be insufficient to reinforce. Therefore, the location is designated as the arrangement position of the magnet pin 22B (Yes in S305). Further, when there are holes and irregularities provided on the substrate P as well as the mounting component M, the arrangement position can be corrected so as to avoid these holes and irregularities.

  The location of the magnet type backup pin 22B is specified by determining the location where the magnet type backup pin 22B is arranged within the shaded portion c3 and positioning the tip of the cursor at the location. This is done by clicking. Then, the clicked arrangement position is displayed as a green hole (S306). In this manner, the designation operation of the arrangement position of the magnet type backup pin 22B is repeatedly performed (S306 to S308). When all the designation operations are completed (Yes in S308), all the designated green holes are changed to yellow. While displaying as a circular hole, the center coordinate of the yellow circular hole is stored in the storage means 80 (S309).

  Thereafter, when the set position data of the backup pin 22 is formed based on the center coordinates of the red hole and the yellow hole stored in the storage unit 80, the set position data is sent to the backup unit forming apparatus 100. Then, the backup unit forming apparatus 100 arranges the insertion type backup pin 22A and the magnet type backup pin 22B based on the set position data, and performs the forming operation of the backup unit B.

  As described above, in the present embodiment, the arrangement position of the backup pin 22 determined by the operator can be confirmed on the liquid crystal monitor 40, so that the backup pin 22 can be arranged in a balanced manner. At that time, when the operator clicks with the mouse 90 in the composite image c displayed on the liquid crystal monitor 40, the arrangement position of the backup pin 22 can be determined. In addition, since the white hole c1 can be displayed as a position where the backup pin 22 can be disposed in the composite image c, an operation for specifying the position where the backup pin 22 is disposed is easy. In addition, the support surface image a2 of the substrate P acquired by the substrate recognition camera 60 as an image based on the position information of the mounted component M can be used as it is to synthesize the image with the hole array image a1. Furthermore, it is possible not only to avoid the mounted component M mounted, but also to arrange the backup pin 22 while avoiding the holes and irregularities provided on the substrate P.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS.
The backup pin arrangement position determining device (hereinafter referred to as “arrangement position determining device”) 130 according to the second embodiment is completely the same in configuration as the arrangement position determining device 70 according to the first embodiment. Omitted. The arrangement position determining device 130 of the present embodiment creates position information of the mounting component M mounted on the support surface of the substrate P from the Gerber data used for making the mask 12, and from the image based on the position information. The arrangement position of the backup pin 22 is automatically extracted. Hereinafter, a procedure for creating set position data of the backup pin 22 using the arrangement position determining device 130 will be described.

<Creation of set position data by arrangement position determination device>
First, a procedure for creating board information data that is position information of the mounting component M mounted on the support surface of the board P will be described with reference to FIGS. 10 and 11.
The Gerber data is data relating to the position, size, shape, etc. of the solder paste printed at a predetermined position on the substrate P. When this Gerber data is displayed on the liquid crystal monitor 4, it is shown in the upper diagram of FIG. It becomes image d. In this image d, a rectangular area is an opening d1 in which solder paste is embedded in the mask 12. Since the opening d1 is arranged corresponding to the positions of the both-side electrodes of the mounting component M, the position information of the opening d1 includes the coordinates of the center position of the mounting component M, and information on the shape and size of the mounting component M. The position information of the mounting component M including the position information in the circumferential direction with the center position of the mounting component M as the rotation center can be used.

  The Gerber data is obtained (S401), and the XY dimensions of the outer shape of the substrate P are input and set using the input means 90 (S402). Next, the X dimension of the Gerber data is reversed horizontally and converted into horizontally reversed data (S403). Then, by increasing the size of the opening d1 by 2 mm on one side (S404), the opening e1 enlarged by 4 mm as a whole is formed. In this way, as shown in the lower diagram of FIG. 11, the pair of openings e1 corresponding to the both-side electrodes of the mounting component M are in contact with each other, and the opening e1 is integrated, so that the mounting component M exists. An image (image based on the substrate information data) e showing a pseudo position is formed.

Next, a procedure for automatically extracting the set position of the backup pin 22 using the image e based on the board information data will be described with reference to FIGS.
First, the coordinate data of the hole position f1 indicating the support holes 23 in the hole array image data f is converted into coordinate data with the lower left of the substrate P as the origin (S501), and the hole position f1 positioned outside the outer shape of the substrate P. Is deleted from the coordinate data (S502). The numerical aperture N1, which is the number of apertures in the Gerber data, is input and set by the input means 90 (S503). Then, the lower end center of the substrate P in the image e based on the substrate information data is matched with the lower end center of the support plate 21 in the image f based on the hole array image data (middle stage in FIG. 13), and an opening corresponding to N = 0. The coordinate data of the hole position f1 inside e1 is deleted (S506). The coordinate data deletion of the hole position f1 is repeatedly performed (S505 to S507), and when the data deletion is completed for all the openings e1 (Yes in S507), as illustrated in the lower image g in FIG. The coordinates of the position f1 are displayed on the liquid crystal monitor 40 as the black hole g1 and the coordinates of the deleted hole position f1 as the white hole g2. Then, the black hole g1 and the white hole g2 are associated with the coordinate data and stored in the storage unit 80 as temporary set position data (S508).

  It should be noted that the backup unit B can be formed by the backup pin forming apparatus 100 based on the temporary set position data. However, when the size of the mounting component M in the image e based on the board information data is smaller than the mounting component M that is actually mounted, the backup pin 22 and the mounting component M may interfere with each other. Therefore, it is necessary to perform a final check by comparing the image e based on the temporary set position data with the support surface image h of the substrate P.

  The image processing unit 72 combines the image g based on the temporary set position data and the support surface image h of the substrate P, and displays the combined image on the liquid crystal monitor 40. The operator determines whether or not the mounting component M interferes with the black hole g1 by checking the composite image displayed on the liquid crystal monitor 40. If there is an interfering black hole g1, the coordinate data of the hole position f1 is deleted by positioning the tip of the cursor on the black hole g1 and clicking. In this way, the temporary set position data is corrected, and when all corrections are completed, the temporary set position data is stored in the storage unit 80 as the final set position data.

  Thereafter, the final set position data stored in the storage unit 80 is sent to the backup unit forming apparatus 100. The backup unit forming apparatus 100 arranges the backup pins 22 based on the final set position data, and the backup unit B Perform formation work.

  As described above, in the present embodiment, the position information of the mounted component M can be acquired using the print mask Gerber data. If the position information of the mounting component M is used, the coordinates of the position where the mounting component M exists, the information about the size and shape, and the position information in the circumferential direction can be grasped. Can be automatically extracted. Therefore, it is not necessary for the operator to determine the position where the backup pins 22 are arranged one by one, and the work efficiency can be improved.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) In the present embodiment, the captured image of the support plate 21 is used as pin disposition possible position information indicating the position where the backup pin can be disposed. According to the present invention, the coordinates of the center position of the support hole 23 are used. Further, the shape and size of the support hole 23 and the position information in the circumferential direction with the center position of the support hole 23 as the center of rotation may be acquired as pin disposition-possible position information.

  (2) In the first embodiment, the captured image of the support surface of the substrate P is displayed on the liquid crystal monitor 40 as the pin placement possible position information. However, according to the present invention, the captured image of the support surface of the substrate P is not necessarily the liquid crystal. It is not necessary to display on the monitor 40, and it may be determined whether or not the clicked position is the support hole 23 when the mouse 90 is clicked on the screen.

  (3) In this embodiment, a mouse is illustrated as the input unit 90. However, according to the present invention, the input unit may be configured by directly touching the touch panel type liquid crystal monitor 40.

  (4) In the second embodiment, the Gerber data is exemplified as the position information of the mounting component M. However, according to the present invention, if the center position of the mounting component M or the coordinates of both side electrodes are present, the Gerber data is necessarily used. There is no.

  (5) In the present embodiment, the mounting component M is illustrated as the protruding portion. However, according to the present invention, the mounting component M is not necessarily required. For example, the reinforcing plate having a step attached to the back surface of the substrate P is provided. It may be.

  (6) In the present embodiment, an example is shown in which an image based on position information of the mounting component M mounted on the mounting surface (surface opposite to the support surface) of the substrate P is not displayed. An image based on the position information of the mounting component M mounted on the mounting surface of the substrate P may be displayed together with the composite image c. Specifically, a captured image of the mounting surface of the substrate P is acquired by the substrate recognition camera 60, and in FIGS. 8 and 14, the lower end center of the substrate P in the captured image of the mounting surface is the lower end of the substrate P on the support surface. Combine the image with the center. If it does in this way, the backup pin 22 can be mainly arrange | positioned on the back side of the position where the mounting component M is mounted in a mounting surface. Therefore, it is possible to efficiently prevent the substrate P from being bent.

  (7) In the present embodiment, the component mounting process is described as an example. However, according to the present invention, the present invention is not limited to the component mounting process, and may be a board manufacturing process for manufacturing a printed circuit board, for example.

  (8) In the present embodiment, a component mounting line including a printing process, a mounting process, and a reflow process has been described as an example. However, according to the present invention, any other process may be used as long as it includes any one processing step. It may be an embodiment.

  (9) In this embodiment, the backup pin arrangement position determining device 70 is provided independently of the printing machine 10, the mounting machine 30, and the backup unit forming device 100. However, according to the present invention, the backup pin arrangement position determining device 70 is provided. The installation position determining device 70 may be applied to any of the printing machine 10, the mounting machine 30, and the backup unit 100.

  (10) In this embodiment, the backup unit forming apparatus 100 is provided independently of the printing machine 10 and the mounting machine 30, but according to the present invention, the backup unit forming apparatus 100 is integrated with the printing machine 10. (For example, one integrated into the board carry-in part of the printing machine 10 or one integrated into the board carry-out part), or one integrated into the mounting machine 30 (For example, one integrated into the board carry-in part of the mounting machine 30 or one integrated into the board carry-out part).

  (11) In the present embodiment, the backup unit forming apparatus 100 is used to perform the forming operation of the backup unit B. However, according to the present invention, the forming operation is always performed using the backup unit forming apparatus 100. It is not necessary, and it is also possible for the operator to visually recognize the arrangement position displayed on the liquid crystal monitor 40 and arrange the backup pin 22.

1 is a partially cutaway plan view showing a backup unit forming apparatus and a printing press according to Embodiment 1. A perspective view schematically showing the configuration of the backup unit Front view showing the backup unit forming apparatus Block diagram showing the electrical configuration centered on the CPU Flow chart showing the procedure for obtaining the substrate image of the support surface A flowchart showing the image composition procedure The figure which showed the state where a part of the image composition screen was expanded and displayed in pixels Figure showing how to determine the placement position while looking at the composite image Flow chart showing the procedure for arranging the backup pin The flowchart which showed the procedure which acquires board | substrate information based on the Gerber data for printing masks in Embodiment 2. Diagram showing how to create board information from the Gerber data Flow chart showing the procedure for automatically extracting the backup pin set position The figure which showed the concrete mode which automatically extracts the set position of the backup pin on image processing Diagram showing how the set position is corrected by superimposing the automatically extracted backup pin set position on the support surface image

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Substrate processing apparatus 21 ... Support plate 22 ... Backup pin 40 ... Liquid crystal monitor (display means)
60 .. substrate recognition camera (imaging means)
70, 130 ... backup pin arrangement position determining device 71 ... CPU (pin arrangement possible position information acquiring means, pin arrangement position determining means)
72. Image processing unit (image composition means)
90 ... Input means 100 ... Backup unit forming apparatus B ... Backup unit M ... Mounted component (protrusion)
P ... Printed circuit board

Claims (8)

A backup pin for determining the location of the backup pin in a backup unit for supporting a substrate having a plurality of backup pins detachably disposed on a support plate and having a protrusion on the back side by the backup pin. An arrangement position determining device,
Pin disposition-possible position information acquisition means for acquiring pin disposition-possible position information indicating a position where the backup pin can be disposed on the support plate;
Protrusion part position information acquisition means for acquiring position information of the protrusion part on the substrate;
Based on the pin disposition possible position information and the protrusion position information, a pin disposition for determining the disposition position of the backup pin so that the tip of the backup pin hits a position on the back surface of the substrate avoiding the protrusion. Installation position determining means;
Image combining means for combining an image indicating the arrangement position of the backup pin determined by the pin arrangement position determining means and an image based on the position information of the protrusion;
Display means for displaying the synthesized image synthesized by the image synthesizing means,
The backup pin includes an insertion type backup pin that is inserted into and fixed to a support hole formed on the support plate, and a magnet type that is fixed to a flat surface other than the support hole on the support plate by a magnetic force. When the pin arrangement position determining means determines that the insertion position of the backup pin is determined and then determines that the strength of the backup unit is insufficient. , the backup pins arranged position-determining device that specifies the location where the strength is insufficient as the arrangement position of the backup pins of said magnet type.   The pin placement position determining means includes an input means for an operator to instruct a position in the composite image displayed by the display means, and the position designated by the input means is determined as the backup pin placement position. The back-up pin arrangement position determining apparatus according to claim 1.   The backup pin arrangement position determination device according to claim 1, wherein the image synthesis unit also synthesizes an image based on the pin arrangement possible position information on the support plate.   The projection part position information acquisition unit includes an imaging unit that images the projection part on the back surface of the substrate, and acquires a captured image of the projection part captured by the imaging unit as the projection part position information. Item 4. The backup pin arrangement position determining device according to any one of items 3 to 4.   The protrusion position information acquisition means uses the coordinates of the center position of the protrusion, information on the shape and size of the protrusion, and position information in the circumferential direction with the center position as the rotation center as the protrusion position information. The backup pin arrangement position determining device according to any one of claims 1 to 3, which is obtained.   6. The backup pin arrangement according to claim 1, wherein the image synthesizing unit also synthesizes an image based on position information of components mounted on a surface opposite to the back surface of the substrate. Positioning device.   7. A configuration comprising pin conveying means for conveying the backup pin toward the backup pin arrangement position determined by the backup pin arrangement position determining device according to claim 1. And a backup unit forming apparatus for forming a backup unit.   7. A substrate processing apparatus that sequentially executes a predetermined process for each type of substrate on different types of substrate groups, comprising the backup pin arrangement position determining device according to claim 1. Substrate processing equipment.

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