JP4836466B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

Info

Publication number
JP4836466B2
JP4836466B2 JP2005027205A JP2005027205A JP4836466B2 JP 4836466 B2 JP4836466 B2 JP 4836466B2 JP 2005027205 A JP2005027205 A JP 2005027205A JP 2005027205 A JP2005027205 A JP 2005027205A JP 4836466 B2 JP4836466 B2 JP 4836466B2
Authority
JP
Japan
Prior art keywords
circuit
memory
chip
switch
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005027205A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005251183A (ja
JP2005251183A5 (enExample
Inventor
潤 小山
馨太郎 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005027205A priority Critical patent/JP4836466B2/ja
Publication of JP2005251183A publication Critical patent/JP2005251183A/ja
Publication of JP2005251183A5 publication Critical patent/JP2005251183A5/ja
Application granted granted Critical
Publication of JP4836466B2 publication Critical patent/JP4836466B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

JP2005027205A 2004-02-06 2005-02-03 半導体装置 Expired - Fee Related JP4836466B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005027205A JP4836466B2 (ja) 2004-02-06 2005-02-03 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004030681 2004-02-06
JP2004030681 2004-02-06
JP2005027205A JP4836466B2 (ja) 2004-02-06 2005-02-03 半導体装置

Publications (3)

Publication Number Publication Date
JP2005251183A JP2005251183A (ja) 2005-09-15
JP2005251183A5 JP2005251183A5 (enExample) 2008-01-24
JP4836466B2 true JP4836466B2 (ja) 2011-12-14

Family

ID=35031552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005027205A Expired - Fee Related JP4836466B2 (ja) 2004-02-06 2005-02-03 半導体装置

Country Status (1)

Country Link
JP (1) JP4836466B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201437A (ja) * 2005-12-27 2007-08-09 Semiconductor Energy Lab Co Ltd 半導体装置
US7605410B2 (en) * 2006-02-23 2009-10-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US7759765B2 (en) 2006-07-07 2010-07-20 Semiconductor Energy Laboratory Co., Ltd Semiconductor device mounted with fuse memory
CN101523611B (zh) * 2006-10-04 2012-07-04 株式会社半导体能源研究所 半导体器件及其制造方法
US7994607B2 (en) 2007-02-02 2011-08-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP5525694B2 (ja) 2007-03-14 2014-06-18 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の作製方法
WO2010038596A1 (en) 2008-10-03 2010-04-08 Semiconductor Energy Laboratory Co., Ltd. Modulation circuit and semiconductor device including the same
JP5762723B2 (ja) 2009-11-20 2015-08-12 株式会社半導体エネルギー研究所 変調回路及びそれを備えた半導体装置
CN103366213B (zh) * 2012-03-31 2016-08-03 华矽半导体股份有限公司 主动式电子标签及其信号调变方法
CN104508705B (zh) * 2012-06-22 2018-05-25 日本电气株式会社 验证方法、验证系统、设备、验证设备和程序
US10666905B2 (en) 2012-06-22 2020-05-26 Nec Corporation Verification method, verification system, verification apparatus, and program therefor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172739A (ja) * 1986-01-24 1987-07-29 Nec Corp 半導体集積回路
JPH04307757A (ja) * 1991-04-04 1992-10-29 Nec Corp 半導体装置およびその製造方法
JP3170101B2 (ja) * 1993-04-15 2001-05-28 株式会社東芝 半導体装置及びその製造方法
JP4042182B2 (ja) * 1997-07-03 2008-02-06 セイコーエプソン株式会社 Ｉｃカードの製造方法及び薄膜集積回路装置の製造方法
JP2000020665A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 半導体装置
JP2000293996A (ja) * 1999-02-03 2000-10-20 Seiko Instruments Inc メモリ回路
JP3967487B2 (ja) * 1999-02-23 2007-08-29 株式会社東芝 Ｉｃカード
JP3696477B2 (ja) * 2000-04-06 2005-09-21 松下電器産業株式会社 アクセスシステム

Also Published As

Publication number Publication date
JP2005251183A (ja) 2005-09-15

Similar Documents

Publication Publication Date Title
US8430326B2 (en) Semiconductor device
US7909260B2 (en) Semiconductor device
JP4652087B2 (ja) 半導体装置
KR101146599B1 (ko) 반도체 장치 및 그를 갖는 제품
JP4776941B2 (ja) 半導体装置の製造方法、ｉｃカード、ｉｃタグ、ｒｆｉｄ、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ及び衣類
JP4718850B2 (ja) 半導体装置、ｉｃカード、ｉｃタグ、ｒｆｉｄ、トランスポンダ、紙幣、有価証券、パスポート、電子機器、バッグ及び衣類
JP4836466B2 (ja) 半導体装置
JP2005252232A (ja) 有価証券並びにチップ搭載物、及びそれらの作製方法
JP4836523B2 (ja) 半導体装置、ｉｃカード、ｉｃタグ、ｒｆｉｄ、トランスポンダ、紙幣、有価証券類、パスポート、電子機器、バッグ及び衣類

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071204

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071204

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20110126

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20110201

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20110920

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20110927

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141007

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20141007

Year of fee payment: 3

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees