JP4831819B2 - Circuit board terminal group manufacturing method - Google Patents

Description

  The present invention relates to a method of manufacturing a terminal group consisting of a plurality of terminals for component mounting provided on a circuit board, and in particular, uniformizing the thickness of a solder precoat layer formed on the surface of the terminal group, The present invention relates to a terminal group manufacturing method in which the amount of solder to be precoated is made constant by equalizing the area of each terminal.

  In order to improve the soldering workability when placing the connection part of the electronic component on the component mounting terminal provided on the circuit board and soldering, a solder precoat layer is previously formed on the terminal group composed of a plurality of terminals. Is known to form. The solder precoat layer is formed by printing paste solder on the surface of the terminal group using a printing metal mask and heating and melting the paste solder (hereinafter referred to as fusing), or by solder plating or the like. It is formed by forming a solder layer, fusing the solder layer and then fusing.

  In a method of forming a solder precoat layer by printing paste solder, in the case of a terminal group with a narrow pitch, adjacent terminals may be connected due to bleeding or sagging of the paste solder. When fusing is performed in this state, when the solder is melted, the adjacent terminals are not uniformly separated, and the thickness of the solder precoat layer tends to vary. Further, the thickness of the solder precoat layer may become non-uniform due to the positional deviation of the cover lay covering the periphery of the terminal.

  18-21 is explanatory drawing which shows the process until it prints and pastes a paste-form solder. 18 shows a terminal group in which a plurality of sets of terminals 2a and 2b facing each other on the circuit board 1 are arranged in parallel, and the cover lay 3 is shifted in the terminal length direction (left-right direction in the figure). ing. The terminals 2a and 2b shown in the figure are bonded together with a terminal length of 0.3 mm and a cover lay 3 shifted by 0.1 mm. Therefore, the length of the left terminal 2a exposed from the opening 3a of the cover lay 3 is 0.2 mm, the length of the right terminal 2b is 0.4 mm, and the difference between the left and right terminal areas is doubled.

  In this state, as shown in FIG. 19, since the left opening 4a of the printing metal mask 4 extends over the cover lay 3, when the paste-like solder 5 is printed, the cover lay 3 as shown in FIG. The paste-like solder 5 is printed on the upper surface of the sheet. Since the amount of the paste solder 5 to be printed is determined by the size of the openings 4a and 4b, the same amount is printed regardless of the displacement of the cover lay 3. Therefore, when fusing is performed as shown in FIG. 21, the thickness of the solder precoat layer 6a is increased in the terminal 2a having a small area, and conversely, the thickness of the solder precoat layer 6b is decreased in the terminal 2b having a large area. As a result, the thicknesses of the solder precoat layers 6a and 6b are not uniform.

  Here, the cover lay is a type that forms a terminal portion by printing and exposing and developing a photosensitive ink, a type that exposes and develops by bonding a photosensitive dry film, and an insulating film. There are some which are punched and bonded together. Among these, the photosensitive ink or dry film type has the advantage of being less likely to be misaligned because it can be aligned with the circuit as a reference, but has the disadvantage of being easily cracked against bending stress. On the other hand, the insulating film type is difficult to break against bending, but has a drawback of being easily displaced when bonded. The above-described shift of the coverlay is particularly noticeable when an insulating film type is used.

  When mounting a component such as an IC or a connector, as shown in FIG. 22A, if the thickness of the solder precoat layer 6 is uniform, the component is pressed from above as shown in FIG. When the solder is melted, the solder precoat layer 6 has an equal thickness at each terminal 2 and a good connection is obtained.

  On the other hand, as shown in FIG. 23A, when the thickness of the solder precoat layer 6 varies, the terminal 2c in which the solder precoat layer 6 is connected to the upper component terminal and the terminal that is not connected 2d occurs. Therefore, as shown in FIG. 5B, when the solder is melted while pressing the component from above, it is necessary to push the component further in order to connect the terminals having a wide upper and lower gap, and the solder precoat layer In the thick terminal 2c, the solder may protrude and short-circuit with an adjacent terminal. For this reason, there was a problem that a stable connection could not be established.

  In general, a flexible circuit board often uses a film of polyimide or the like as a base material. In this case, shrinkage of dimensions occurs due to temperature and humidity. For this reason, a positional shift is likely to occur when the coverlay is bonded, and as a result, the area where the terminals are exposed changes greatly. If the terminal area is small, this effect becomes very large. In addition, since the shrinkage occurs due to the influence of temperature and humidity during fusing, the alignment with the formed circuit is unstable. Therefore, it is a factor that it is difficult to form a uniform thickness of the solder precoat layer. Here, in general, in order to form a cover lay, a method by printing an insulating ink on a necessary portion, a method of bonding an insulating film in which an opening is formed in advance, a coating or film of photosensitive insulating ink A method by exposure, development, heat treatment, etc. following the lamination of the photosensitive insulating resin in the form of a tape is employed.

  On the other hand, even when the solder layer is formed by solder plating and the solder layer is fused to form the solder precoat layer, the thickness of the solder layer may be uneven in the workpiece due to the variation in the current density distribution. There is a factor that makes it difficult to form a uniform thickness of the solder precoat layer, similar to the method of printing paste solder described above.

  As a method to prevent short-circuiting due to protrusion of solder when parts have to be pushed in, a slit-like area that does not fuse with solder is formed in a part of the terminal, a wide terminal part, and a slit-like area It is known that excessive molten solder flows into a slit-like region by dividing the terminal portion into narrow terminal portions divided by (see, for example, Patent Document 1).

In addition, a photosensitive resin mask having solder heat resistance is provided on the circuit board, and an opening is formed by exposing the mask, and paste solder is embedded in the opening and reflowing is performed. There is also known a method of dissolving and removing the photosensitive resin mask after a solder precoat layer is formed (see, for example, Patent Document 2).
Japanese Patent No. 3496308 JP-A-10-322007

  If the thickness of the solder precoat layer is not uniform due to misalignment of the coverlay, etc., as shown in FIG. 23, the component will be pushed more than necessary, and there is a risk that the solder will protrude and short to the adjacent terminal, etc. Conventionally, there has been a problem that a stable connection cannot be established.

  In the invention described in Patent Document 1, excess molten solder flows into the slit-shaped region, but the thickness of the solder precoat layer is not uniform, and conversely, the slit-shaped region is formed. As a result, a narrow portion is formed in the terminal, and the solder of the narrow portion becomes thin, which causes a variation in thickness.

  In the invention described in Patent Document 2, an opening is provided in a photosensitive resin mask, and after the solder precoat layer is formed by embedding paste solder therein, the photosensitive resin mask is removed. Cost. In addition, the thickness of the solder precoat layer cannot be equalized more easily. Conventionally, the thickness is confirmed by visual inspection, and if the difference is large, the thickness is reworked. For this reason, quality and work efficiency were not good.

  Furthermore, if the area where the terminals are exposed is changed due to the positional deviation of the coverlay bonding, even if the thickness of the solder precoat layer can be made uniform, the solder precoat layer formed on the terminals The amount of solder itself changes. This factor also prevents a stable connection with the component.

  Accordingly, the present invention provides a method for forming a solder precoat layer on the surface of a terminal group consisting of a plurality of terminals for mounting components provided on a circuit board, and each of the terminals in the terminal group is also applied to a narrow pitch terminal. Provide a method for manufacturing a terminal group in which the thickness of the solder precoat layer formed on the terminal surface is made uniform and the area of each terminal is made uniform, so that the amount of solder precoated on each terminal is constant. The purpose is to do.

The present invention has been proposed in order to achieve the above object, and the invention according to claim 1 is characterized in that a solder pre-coating is applied to the surface of a terminal group comprising a plurality of opposed terminals for mounting components provided on a circuit board. In the method of forming a layer,
The terminal group is formed in advance with a first connecting portion made of the same material as the terminals for connecting the terminals facing each other, or a second connecting portion for further longitudinally connecting the first connecting portions. Has been
A cover lay having an opening provided to expose the location of the terminal group and a positioning target in the vicinity of the opening is bonded to the circuit board surface,
A solder layer is provided on the surface of the terminal group including the first connection part and the second connection part exposed from the opening, and the solder layer is heated and melted to form a solder precoat layer.
Thereafter, an unnecessary portion including the first connecting portion and the second connecting portion between the terminals is cut and removed by a cutting method having an alignment mechanism based on the positioning target. Provided is a method for manufacturing a terminal group of a substrate.

  According to this configuration, the mutually facing terminals of the terminal group provided on the circuit board are connected to each other by the connecting portions made of the same material as the terminals, and both the terminals and the connecting portions form an integral plane. Yes. If paste-like solder printing or solder plating is performed on the surface of the terminal and the connecting portion, the surface of the terminal and the connecting portion is an integral flat surface without a step, and therefore a solder layer having substantially the same thickness is formed on this flat surface. The When this solder layer is fused, the solder flows into the entire flat portion of each terminal and connecting portion, and a solder precoat layer having a uniform thickness is formed over the entire flat portion. Then, by cutting and removing unnecessary portions between the mutually facing terminals of the terminal group, the vicinity of the connecting portion is eliminated, and terminals having a solder precoat layer having a uniform thickness are separated from each other to form a terminal group. .

  Since this unnecessary part is cut based on the positioning target provided on the cover lay, even if a positional deviation occurs due to the bonding of the cover lay, the cut location also moves by the amount of the deviation, The area where the terminals are exposed is kept constant. As a result, the amount of solder precoated on each terminal can be made constant. It is preferable that at least two positioning targets be provided in the vicinity of the cutting location. However, when a plurality of cutting locations are adjacent and are cut at a time, a part of the positioning target can be omitted.

  Here, the cutting means is not particularly limited as long as it has a positioning mechanism based on the positioning target, and examples thereof include punch punching, router processing, and ablation by a carbon dioxide laser.

According to a second aspect of the invention, the positioning target provides a terminal group method of manufacturing a circuit board according to claim 1, wherein that you have been formed as an opening punched the coverlay.

  According to this configuration, since the circuit board is exposed at the positioning target portion, which is an opening formed by punching the cover lay, the image is recognized because the color tone is different from that of the cover lay. If a material of the same material as the terminal is provided in the positioning target part, if the solder layer is also formed in this part and fusing, the difference in color tone from the coverlay becomes clearer, so it becomes easier to recognize the image. preferable.

The invention according to claim 3 is a method of forming a solder precoat layer on the surface of a terminal group consisting of a plurality of opposing terminals for component mounting provided on a circuit board.
The terminal group is preliminarily formed with a first connecting portion made of the same material as the terminals for connecting the terminals facing each other, and a second connecting portion for further longitudinally connecting the first connecting portions. Has been
A cover lay having an opening provided so that the location of the terminal group is exposed is bonded to the circuit board surface,
A solder layer is provided on the surface of the terminal group, the solder layer is heated and melted to form a solder precoat layer,
Thereafter, an unnecessary portion including the first connecting portion and the second connecting portion between the terminals is positioned to recognize an image of the opening of the connecting portion and the edge of the terminal and the coverlay. Provided is a circuit board terminal group manufacturing method characterized by cutting and removing with a cutting means having an alignment mechanism.

  This configuration is an effective means when the positioning target provided on the coverlay cannot be installed due to factors such as circuit design restrictions.

  According to this configuration, the mutually opposed terminals of the terminal group provided on the circuit board are connected to each other by the first connecting portion made of the same material as the terminal, and further cross the first connecting portion. Thus, the second connecting portion is also formed of the same material as the terminal, and each terminal and the connecting portion form an integral plane. Furthermore, an opening is provided in the vicinity of the connecting portion between the first connecting portion and the second connecting portion.

  If the surface of the terminal and the first connecting portion and the second connecting portion is printed with solder paste or solder plating, the surface of the terminal and each connecting portion has no step and is an integral plane. A solder layer having substantially the same thickness is formed on the plane. When this solder layer is fused, the solder flows into the entire flat portion of each terminal and each connecting portion, and a solder precoat layer having a uniform thickness is formed over the entire flat portion. Then, unnecessary portions including the respective connecting portions connecting the terminal groups are cut and removed, whereby the terminals having the uniform thickness solder precoat layers are separated from each other to form the terminal groups.

  Furthermore, with this configuration alone, the thickness of the solder precoat layer tends to increase at the connecting portion between the first connecting portion and the second connecting portion. Is to control. When cutting unnecessary portions by punching, it is preferable that the solder precoat layer does not hit the punching die. The area of the opening is suitably 10% to 80% of the area of the entire intersection. The shape of the opening may be a polygon such as a circle or a square.

  Then, image recognition is performed on the opening portion of the connection portion between the first connecting portion and the second connecting portion, and the edge portion of the terminal and the cover lay, and the central portion having both ends of the boundary position of the cover lay is cut and removed. To do. This unnecessary portion is cut based on a mechanism that recognizes the edge of the terminal and the coverlay, so even if there is a position shift due to the coverlay bonding, the cut location is the same as the shift amount. The area where the terminals are exposed is kept constant. As a result, the amount of solder precoated on each terminal can be made constant.

  According to the present invention, it is possible to form the solder precoat layer with a more uniform thickness without being affected even if a positional deviation occurs in the bonding of the coverlay to the circuit board, and the terminals are exposed. Since the surface area is kept constant, the amount of pre-coated solder can be made constant, and the mounting parts can be connected easily and reliably, greatly improving the quality and production efficiency in circuit board manufacturing. Can be improved.

  Hereinafter, a method for producing a terminal group of a circuit board according to the present invention will be described with reference to preferred embodiments. In a method of forming a solder precoat layer on the surface of a terminal group consisting of a plurality of terminals for mounting components provided on a circuit board, a narrow pitch terminal is formed on each terminal surface in the terminal group. In order to achieve the object of making the thickness of the solder precoat layer uniform, the present invention includes a connecting portion for connecting the terminals facing each other in advance in the terminal group, and including the connecting portion. This was realized by providing a solder layer on the surface of the terminal group, heating and melting the solder layer to form a solder precoat layer, and then cutting and removing unnecessary portions between the terminals.

  In the first embodiment, the first connecting portion that connects the terminals facing each other is formed of the same material as the terminal, and after forming a solder precoat layer on the terminal, an unnecessary portion including the first connecting portion is punched out. It is.

  FIG. 1 shows a state in which a first connecting portion 11 that connects mutually opposing terminals 2a and 2b is formed of the same material as the terminals 2a and 2b, and shows a broken line from the end of the opening 3a of the cover lay 3 The above shows the original terminal length. Moreover, the positioning target 12 is formed as an opening above and below the cover lay opening 3a in FIG.

  FIG. 2 shows a state after printing the paste solder 5, and FIG. 3 shows an opening state of the paste solder printing metal mask 4 used at this time. Since the paste-like solder 5 is printed on the entire terminals 2a and 2b and the first connecting portion 11, the displacement of the cover lay 3 can be ignored. Therefore, the paste is applied regardless of the position of the cover lay opening 3a. The solder 5 can be printed.

  Even when the paste-like solder 5 is printed, even if the printing metal mask opening 4c protrudes to the top of the cover lay 3 and is printed on the upper surface of the cover lay 3, fusing causes the terminals 2a, Since solder flows into 2b and the 1st connection part 11 whole, it becomes possible to produce the solder precoat layer 6 with fixed solder thickness.

  FIG. 4 shows a state after fusing. By connecting the opposing terminals 2a and 2b with the first connecting portion 11, the terminal area does not change due to the positional deviation of the cover lay 3, and a solder with a constant thickness is obtained. The precoat layer 6 can be formed.

  FIG. 5 shows a state in which an unnecessary portion including the first connecting portion 11 between the terminals is cut and removed after fusing, and the cutting and removing portion 13 includes a cutting unit (not shown) including an alignment mechanism based on the positioning target 12. Is removed by cutting. Here, the cutting means is not particularly limited as long as it has a positioning mechanism based on the positioning target, and examples thereof include punch punching, router processing, and ablation by a carbon dioxide laser.

  FIG. 6 shows a misaligned state. Even if the cover lay 3 is deviated from a desired bonding position indicated by a two-dot chain line and bonded to a position indicated by a solid line, the positioning target applied to the cover lay 3 is shown. 12 also moves with the same shift amount. By determining the coordinates of the cut / removed portion 13 based on the positioning target 12, even when a positional shift occurs due to the coverlay 3 being bonded, the cut portion is also moved by the shift amount.

  FIG. 7 shows a state where unnecessary portions including the first connecting portion 11 after fusing shown in FIG. 6 are cut and removed, and even if there is a positional deviation due to the bonding of the cover lay 3, it is cut by the deviation amount. Since the location also moves, the area where the terminals are exposed is kept constant, and there is no problem that the thickness of the solder precoat layer 6 is different as in the conventional circuit board shown in FIG. It is possible to make the amount of the solder pre-coated constant, and to form the solder pre-coating layer 6 uniformly.

  The positioning target 12 applied to the cover lay 3 may be an opening formed by punching the cover lay 3. In this case, since the circuit board under the opening is exposed, the image is recognized by the color tone different from that of the coverlay 3. If a material of the same material as the terminal is provided in the positioning target part, if the solder layer is also formed in this part and fusing, the difference in color tone from the coverlay becomes clearer, so it becomes easier to recognize the image. preferable.

  In the second embodiment, not only the terminals facing each other, but also the second coupling portion that connects adjacent terminals to each other is formed of the same material as the terminals. After the solder precoat layer is formed on the terminals, the first coupling is performed. Unnecessary parts including the part and the second connecting part are punched out.

  In FIG. 8, the first connecting portion 11 and the second connecting portion 15 are formed of the same material as the terminals between the terminals, and the paste solder 5 is printed on the terminals and the connecting portions to perform fusing. Indicates the state.

  As shown in the figure, the first connecting portion 11 that connects the terminals 2a and 2b facing each other is formed of the same material as the terminals 2a and 2b, and further, the second connecting portion that connects adjacent terminals to each other. 15 is formed of the same material as the terminals 2a and 2b and the first connecting portion 11, and the solder melted during fusing moves between the terminals facing or adjacent to each other, thereby forming a more uniform solder precoat layer thickness. It becomes possible to do.

  FIG. 9 shows a state where unnecessary portions including the first connecting portion 11 and the second connecting portion 15 between the terminals 2 a and 2 b are cut and removed after fusing, and the cut and removed portion 13 is aligned based on the positioning target 12. It is cut and removed by a cutting means (not shown) including a mechanism. In this case as well, as in the first embodiment, the area where the terminals are exposed is kept constant, and the amount of solder 6 precoated on the terminals 2a and 2b can be made constant.

  The width of the second connecting portion 15 is set so that, when there is a positional deviation due to the bonding of the cover lay 3, even if the cutting part moves by the deviation amount, it does not remain at the time of cutting. The If this requirement is satisfied, 30% to 150% of the width of the terminals 2a and 2b is appropriate.

  FIG. 10 shows the printing metal mask 4 according to the second embodiment, and it is not necessary to separately provide the opening 4c according to the terminal shape as shown in FIG. 3, and the whole is collectively corresponding to the opening 3a of the coverlay. It is good also as the opening part 4d opened. Also in this case, since the solder flows through a circuit connected at the time of fusing, the solder precoat layer 6 can be formed with a constant solder thickness.

  When the first connecting portion 11 and the second connecting portion 15 are formed of the same material as the terminals 2a and 2b as shown in FIG. 8 of the second embodiment, paste solder is printed on the terminals and the connecting portions. When fusing is performed, the area of the intersection portion of the connecting portion increases, and therefore the thickness of the solder precoat layer 6 at the intersection portion tends to increase. In that case, the thick part of the precoat layer 6 locally hits the punching die. Example 3 removes a part of material of the intersection part of a connection part, and forms a removal location in an intersection part so that the area of this intersection part may not become large.

In FIG. 11, a circular removal portion 17 is formed at the intersection of the first connecting portion 11 and the second connecting portion 15 shown in FIG. 8, and the end portions 2 a and 2 b and the first connecting portion 11 A state where paste-like solder is printed on the second connecting portion 15 and fusing is shown.

  In this way, when the removal portion 17 is formed by punching at the intersection portion, the area of the intersection portion does not increase, so that the increase in the solder thickness can be suppressed, and the solder precoat layer 6 locally hits the punching die. Can be prevented. The area of the removal part 17 is suitably 10% to 80% of the area of the entire intersection, and the shape of the removal part 17 may be a polygon such as a circle or a square.

  In Example 4, as shown in FIG. 11 of Example 3 described above, the removal portion 17 is formed at the intersection portion so that the area of the intersection portion of the first coupling portion 11 and the second coupling portion 15 does not increase. In this case, the image including the removed portion 17 is recognized, and the coordinates of the positioning target 12 applied to the cover lay 3 are compared with each other so that the shift amount of the bonding of the cover lay 3 can be obtained. is there.

  FIG. 12 shows a state in which the cover lay 3 is shifted and adhered to the left side in the drawing, and connects a line 19 connecting the positioning target 12 applied to the cover lay 3 and a removal point 17 provided at the intersection of the connecting portion. The amount of opening with the line 20 is the amount of shift ΔX in the horizontal direction in the figure.

  If this deviation amount ΔX exceeds the threshold value, it is preferable to stop the operation of cutting and removing the unnecessary portion between the terminals 2a and 2b, since a defect can be easily determined by visual inspection or electrical inspection at the time of shipment. Similarly, the positioning target 12 applied to the cover lay 3 is compared with the location where the material at the intersection of a specific connecting portion is removed, and the amount of deviation in the vertical direction and the turning direction is detected in addition to the horizontal direction in the figure. Is possible.

  In the fifth embodiment, when a plurality of cut and removed portions 13 are adjacent to each other, they are cut simultaneously.

  FIG. 13 shows an example in which three terminal groups shown in FIG. 8 are arranged adjacent to each other, and unnecessary portions of these three terminal groups are cut and removed simultaneously. In this case, the coverlay 3 may be provided with the positioning target 12 for all the terminal groups. However, as shown in the figure, the positioning target in the central terminal group is omitted, and based on the positioning targets 12 on the left and right. Then, unnecessary portions may be cut.

  In Example 6, as shown in FIG. 11, when the removal target 17 is formed at the intersection of the first connecting part 11 and the second connecting part 15, the positioning target 12 cannot be provided on the coverlay 3. Then, the misalignment of the cover lay 3 is determined and unnecessary portions are cut and removed.

  FIG. 14 shows a state in which the cover lay 3 not provided with the positioning target 12 is displaced, and the cover lay 3 is displaced from a desired bonding position indicated by a two-dot chain line and bonded to a position indicated by a solid line. Even if the distances L1 and L2 between the left and right edges of the opening 3a of the cover lay and the removal portion 17 provided at the intersection of the first connecting portion 11 and the second connecting portion 15 are shown in the image, Find by recognition.

  Then, based on the distances L1 and L2, as shown in FIG. 15, between the left and right side edges in the drawing of the cover lay opening 3a and the left and right side edges of the cut and removed portion 13 indicated by a two-dot chain line. The distances L3 and L4 are obtained, and the cut and removed portion 13 is positioned and removed at positions where the left and right distances L3 and L4 are equal.

  As a result, the area where the terminals are exposed is kept constant, and the amount of solder precoated on each terminal can be made constant.

  Similarly, as shown in FIG. 16, when the cover lay 3 is stuck to the circuit board 1 in the turning direction, the left and right edges of the cover lay opening 3a and the first edge The distances L5 and L6 between the connecting portion 11 and the removal point 17 provided at the intersection of the second connecting portion 15 are obtained by image recognition at the upper and lower portions in the figure.

  Based on the distances L5 and L6, as shown in FIG. 17, the left and right sides of the opening 3a of the coverlay in the drawing and the left and right sides of the cut and removed portion 13 indicated by the two-dot chain line are centered on the turning angle θ The distances L7 and L8 between the edge portions are obtained, and the cut and removed portion 13 is positioned in a state where the left and right distances L7 and L8 are equal to each other at an angle θ and cut and removed.

  When the amount of deviation exceeds a threshold value, it is preferable to stop the operation of cutting and removing the cut and removed portion 13 between the terminals because a defect can be easily determined by visual inspection or electrical inspection at the time of shipment.

  As described above, according to the present invention, even if a positional deviation occurs in the bonding of the coverlay to the circuit board, the solder precoat layer is formed to have a uniform thickness and unnecessary portions are aligned by the alignment based on the positioning target. Since it is cut and removed, the mounting components can be connected easily and reliably, so that the quality and production efficiency in circuit board manufacture can be greatly improved.

  It should be noted that the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified ones.

Explanatory drawing which shows the manufacture process of Example 1 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 1 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 1 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 1 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 1 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 1 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 1 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 2 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 2 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 2 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 3 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 4 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 5 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 6 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 6 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 6 which concerns on this invention. Explanatory drawing which shows the manufacture process of Example 6 which concerns on this invention. Explanatory drawing which shows the malfunction in the conventional manufacturing process. Explanatory drawing which shows the malfunction in the conventional manufacturing process. Explanatory drawing which shows the malfunction in the conventional manufacturing process. Explanatory drawing which shows the malfunction in the conventional manufacturing process. Explanatory drawing which shows a state with a favorable connection with mounting components in the conventional manufacturing process. Explanatory drawing which shows a state with a bad connection with mounting components in the conventional manufacturing process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Circuit board 2, 2a, 2b Terminal 3 Coverlay 3a, Opening 4 Printing metal mask 4a, 4b, 4c, 4d Opening 5 Paste-like solder 6, 6a, 6b Solder precoat layer 11 1st connection part 12 Positioning Target 13 Cutting / removal point (unnecessary part)
15 2nd connection part 17 Circular removal part (unnecessary part)

Claims (3)

In a method of forming a solder precoat layer on the surface of a terminal group consisting of a plurality of opposing terminals for component mounting provided on a circuit board,
The terminal group is formed in advance with a first connecting portion made of the same material as the terminals for connecting the terminals facing each other, or a second connecting portion for further longitudinally connecting the first connecting portions. Has been
A cover lay having an opening provided to expose the location of the terminal group and a positioning target in the vicinity of the opening is bonded to the circuit board surface,
A solder layer is provided on the surface of the terminal group including the first connection part and the second connection part exposed from the opening, and the solder layer is heated and melted to form a solder precoat layer.
Thereafter, an unnecessary portion including the first connecting portion and the second connecting portion between the terminals is cut and removed by a cutting method having an alignment mechanism based on the positioning target. A method for manufacturing a terminal group of a substrate.   The method for manufacturing a terminal group of a circuit board according to claim 1, wherein the positioning target is formed as an opening formed by punching the coverlay. In a method of forming a solder precoat layer on the surface of a terminal group consisting of a plurality of opposing terminals for component mounting provided on a circuit board,
The terminal group is preliminarily formed with a first connecting portion made of the same material as the terminals for connecting the terminals facing each other, and a second connecting portion for further longitudinally connecting the first connecting portions. Has been
A cover lay having an opening provided so that the location of the terminal group is exposed is bonded to the circuit board surface,
A solder layer is provided on the surface of the terminal group, the solder layer is heated and melted to form a solder precoat layer,
Thereafter, an unnecessary portion including the first connecting portion and the second connecting portion between the terminals is positioned to recognize an image of the opening of the connecting portion and the edge of the terminal and the coverlay. A method of manufacturing a terminal group of circuit boards, comprising cutting and removing with a cutting means having an alignment mechanism.