JP4831483B2 - Exposure apparatus and exposure method - Google Patents

Description

  The present invention relates to an exposure apparatus capable of shortening the exposure time of a substrate, and an exposure method using the exposure apparatus.

  As shown in FIGS. 8A to 8C, the exposure apparatus includes a light source (not shown) for irradiating ultraviolet rays (irradiation light), an exposure mask 15 disposed below the light source, and an exposure mask 15 The stage 10 is provided below and is movable in the horizontal direction from one operating position to another operating position. Among these, the stage 10 is disposed on a vertical movement mechanism 45 that is movable in the vertical direction, and the vertical movement mechanism 45 is disposed on a horizontal movement mechanism 30 that is movable in the horizontal direction.

  Then, the stage 10 is moved from one operation position to another operation position, and from the state where one region of the substrate 50 exists at the exposure position below the exposure mask 15, another region of the substrate 50 (the next exposure target and In a state where there is a certain region, first, the substrate 50 is moved downward by the vertical movement mechanism 45, and a sufficient gap is provided between the substrate 50 and the exposure mask 15 (see FIG. 8A). In this way, the substrate 50 and the exposure mask 15 are prevented from contacting when the substrate 50 moves in the horizontal direction as will be described later. Next, the substrate 50 is moved in the horizontal direction by the horizontal movement mechanism 30 (see FIG. 8B). In this manner, the other area of the substrate 50 (area to be exposed next) is moved below the exposure mask 15. Thereafter, the substrate 50 is moved upward by the vertical movement mechanism 45, and the gap between the substrate 50 and the exposure mask 15 is restored to the original size (see FIG. 8C).

  However, in the conventional exposure apparatus as described above, when the substrate 50 is moved in the vertical direction by the vertical movement mechanism 45, the substrate 50 is slowly moved so that air pressure (wind) against the exposure mask 15 by the substrate 50 is not generated. It is necessary to move up and down. For this reason, the exposure time which exposes the board | substrate 50 becomes long.

  The present invention has been made in consideration of such points, and an exposure apparatus that can rapidly move the substrate in the vertical direction and can shorten the exposure time of the substrate, and the exposure apparatus are used. It is an object of the present invention to provide an exposure method.

  The present invention includes a light source for irradiating irradiation light, an exposure mask disposed below the light source, and a stage provided below the exposure mask and movable in a horizontal direction from one operating position to another operating position. The stage is movable in the vertical direction, and while moving horizontally from one operating position to another operating position, it descends downward and then rises to the same height position at one operating position. An exposure apparatus that returns to a height position.

  With such a configuration, the substrate placed on the stage can be quickly moved in the vertical direction, and the exposure time of the substrate can be shortened.

  The present invention is the substrate exposure apparatus, wherein the stage is disposed on a horizontal movement mechanism that is movable in the horizontal direction.

  According to the present invention, the horizontal movement mechanism includes an X-direction movement mechanism that moves in one direction in the horizontal direction, and a Y-direction movement mechanism that moves in a direction orthogonal to the one direction in the horizontal direction. The substrate exposure apparatus is characterized.

  The present invention is the substrate exposure apparatus, wherein the stage is disposed on a vertical movement mechanism that is movable in the vertical direction.

  The present invention is a horizontal movement mechanism, a bar mirror is provided on the side of the stage, the laser beam is irradiated to the side of the bar mirror, and the laser beam reflected from the bar mirror is received and disposed on the stage. A substrate exposure apparatus comprising a laser irradiation measuring unit for detecting a horizontal position of the substrate.

  With such a configuration, the horizontal position of the stage can be accurately grasped.

  The present invention is the substrate exposure apparatus, wherein the stage has a base and a chuck disposed on the base.

  The present invention is the substrate exposure apparatus, wherein the stage has a plurality of freely projecting pins that extend vertically through the chuck.

  With such a configuration, the substrate placed on the stage can be supported from below and easily removed from the stage.

  The present invention is a substrate exposure apparatus including a substrate moving mechanism that supports and moves a substrate lifted by a plurality of pins from below in the vicinity of a stage.

  With such a configuration, the substrate placed on the stage can be supported from below and can be easily and automatically removed from the stage.

  The present invention includes a substrate placement step of placing a substrate on a stage, an exposure position moving step of moving the stage to one operating position, and placing a region of the substrate on the stage at an exposure position below the exposure mask; , A first exposure process in which one area of the substrate under the exposure mask is exposed by irradiation light irradiated from the light source and passing through the exposure mask, and the stage is moved from one operation position to another operation position, and on the chuck An exposure region changing step of arranging another region of the substrate at an exposure position below the exposure mask, and a second exposure step of exposing the other region of the substrate below the exposure mask with irradiation light irradiated from the light source and passing through the exposure mask. And moving the stage horizontally from one operating position to another operating position, the stage descends downward and then rises to the same height as the height position in one operating position. A substrate exposure method characterized by returning to position.

  With such a configuration, the substrate placed on the stage can be quickly moved in the vertical direction, and the exposure time of the substrate can be shortened.

  According to the present invention, while the stage moves horizontally from one operating position to another operating position, the stage descends downward and then rises to the same height position as the one operating position. Since it returns, a board | substrate can be moved to an up-down direction rapidly, and the exposure time of a board | substrate can be shortened.

Embodiment Hereinafter, an embodiment of an exposure apparatus according to the present invention will be described with reference to the drawings. Here, FIG. 1 thru | or FIG. 7 is a figure which shows embodiment of this invention.

  As shown in FIGS. 1 and 2, the exposure apparatus is provided with a light source 20 for irradiating ultraviolet rays (irradiation light), an exposure mask 15 disposed below the light source 20, and a lower portion of the exposure mask 15. And a stage 10 that can move in the horizontal direction from an operating position 10A to another operating position 10B. The stage 10 includes a base 3 and a chuck 2 disposed on the base 3. The exposure mask 15 is held by the mask holding unit 40 at the periphery.

  As shown in FIG. 1, the stage 10 is disposed on a vertical movement mechanism 45 that is movable in the vertical direction. As shown in FIGS. 1 and 2, the vertical movement mechanism 45 is disposed on a horizontal movement mechanism 30 that is movable in the horizontal direction. The horizontal direction moving mechanism 30 includes an X direction moving mechanism 31 that moves in the X direction (one of the horizontal directions) and a Y direction that moves in the Y direction (the direction perpendicular to the one direction in the horizontal direction). And a moving mechanism 36.

  The vertical movement mechanism 45 is moved up and down after the stage 10 is moved downward while the stage 10 is moved horizontally from one operation position 10A to another operation position 10B by the horizontal movement mechanism 30. It can be returned to the same height position as the height position in the operating position (see FIGS. 3A and 3B and FIG. 4). In the present application, the “height position that is the same as the height position at one operation position” means a height position that is substantially the same as the height position at one operation position.

  As shown in FIGS. 1 and 2, bar mirrors 1x and 1y are provided on the horizontal movement mechanism 30 and on the side of the stage 10. More specifically, as shown in FIGS. 1 and 2, a bar mirror 1x is provided on the horizontal movement mechanism 30 on the side of the stage 10 in the X direction. A bar mirror 1y is provided on the side of the stage 10 in the Y direction.

  As shown in FIGS. 1 and 2, the laser beam LBx is irradiated to the side of the bar mirror 1x in the X direction and the laser beam LBx reflected from the bar mirror 1x is received, and the horizontal position of the stage 10 is detected. A laser irradiation measuring unit 11x is provided. Further, a laser irradiation measuring unit 11y that irradiates the laser beam LBy and receives the laser beam LBy reflected from the bar mirror 1y and detects the horizontal position of the stage 10 is provided on the Y direction side of the bar mirror 1y. .

  Further, as shown in FIGS. 1 and 5A and 5B, the stage 10 has a plurality of freely projecting pins 7 that penetrate the chuck 2 and extend in the vertical direction. Further, as shown in FIGS. 5A and 5B, a substrate moving mechanism 60 is disposed in the vicinity of the stage 10 for supporting and moving the substrate 50 lifted by the plurality of pins 7 from below. 5A and 5B, the substrate moving mechanism 60 is inserted between a plurality of pins 7 lifting the substrate 50, and an insertion rod 61 that moves the substrate 50 from the stage 10 is provided. Have

  Further, as shown in FIG. 2, the laser irradiation measurement unit 11 x and the laser irradiation measurement unit 11 y are each connected to the control unit 19.

  As shown in FIGS. 1 and 2, the Y-direction moving mechanism 36 is disposed on the base 13 and extends in the Y direction, and a grip portion 38 that grips the rail 39 slidably. And a Y base 37 disposed on the grip portion 38. As shown in FIGS. 1 and 2, the X-direction moving mechanism 31 is disposed on the Y base 37 and extends in the X direction, and a holding recess 33 that holds the rail 34 slidably. X base 32 having

  As shown in FIG. 1, the light source 20 includes an ultrahigh pressure mercury lamp 20a, a parabolic mirror 21 provided on the back of the mercury lamp 20a, and condensing the light from the mercury lamp 20a, and reflecting the light from the parabolic mirror 21. A cold mirror 22 and a spherical mirror 23 that reflects light from the cold mirror 22. A shutter 24 and an integrator lens 26 are provided between the cold mirror 22 and the spherical mirror 23.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, the substrate 50 is supported and moved from below by the substrate moving mechanism 60, and is placed on the chuck 2 of the stage 10 (substrate placement step 81) (see FIGS. 2, 5, and 6). At this time, the gap between the substrate 50 disposed on the chuck 2 of the stage 10 and the exposure mask 15 is 150 μm.

  Next, the stage 10 is moved to one operating position 10A by the horizontal movement mechanism 30, and one region 50A of the substrate 50 on the chuck 2 is arranged at the exposure position below the exposure mask 15 (exposure position movement). Step 82) (See FIGS. 2, 3A and 6).

  Next, one region 50A of the substrate 50 below the exposure mask 15 is exposed to ultraviolet rays that are irradiated from the light source 20 and pass through the exposure mask 15 (first exposure step 83) (see FIGS. 3A and 6). ).

  Next, the stage 10 is moved from one operation position 10A to another operation position 10B by the horizontal movement mechanism 30, and another region (region to be the next exposure target) 50B on the chuck 2 is formed. Then, it is arranged at the exposure position below the exposure mask 15 (exposure region changing step 85) (see FIG. 3B and FIG. 6).

  In this way, while the substrate 50 arranged on the chuck 2 of the stage 10 moves in the horizontal direction from one operation position 10A to another operation position 10B, the stage 10 descends downward and then rises. It returns to the same height position as the height position in one operation position 10A (see FIGS. 3A and 3B and FIG. 4). That is, as shown in FIG. 4, the substrate 50 arranged on the chuck 2 of the stage 10 moves obliquely downward and then moves obliquely upward, and has the same height as the height position at the one operating position 10A. Return to the position.

  More specifically, first, based on a signal from the control unit 19, the stage 10 starts to move in the horizontal direction (XY direction) from one operating position 10 </ b> A by the horizontal movement mechanism 30 (horizontal movement step 91). (See FIGS. 4, 6 and 7).

  Next, on the basis of the signal from the control unit 19, the stage 10 starts to move downward while moving in the horizontal direction by the vertical movement mechanism 45 (lowering step 92) (FIGS. 4, 6, and 7). reference).

  Thereafter, when the gap between the substrate 50 arranged on the chuck 2 of the stage 10 and the exposure mask 15 is opened by a predetermined distance (400 μm in the present embodiment), the vertical movement mechanism 45 moves the distance. While maintaining the above, the stage 10 continues to move in the horizontal direction (see FIGS. 4 and 7).

  Next, on the basis of a signal from the control unit 19, the stage 10 is raised by the vertical movement mechanism 45, and the gap between the substrate 50 and the exposure mask 15 disposed on the chuck 2 of the stage 10 is based on. Return (in this embodiment, it becomes 150 μm) (ascending step 93) (see FIGS. 4, 6 and 7).

  Thereafter, the tilt of the stage 10 is corrected as necessary (tilt correction step 94) (see FIGS. 4, 6, and 7).

  As described above, when another region 50B (region to be exposed next) 50B is arranged at the exposure position below the exposure mask 15, the horizontal movement mechanism 30 is based on the signal from the control unit 19. The horizontal movement of the stage 10 is stopped (horizontal direction stopping step 95) (see FIGS. 4, 6 and 7). At this time, the stage 10 is disposed at another operating position 10B.

  As described above, according to the present embodiment, the substrate 50 arranged on the chuck 2 of the stage 10 moves obliquely downward while the stage 10 moves from one operating position 10A to another operating position 10B. After that, it moves obliquely upward and returns to the same height position as the height position in the one operating position 10A. For this reason, the exposure mask 15 disposed above the substrate 50 is not easily affected by air pressure (wind) generated as the substrate 50 moves in the vertical direction. Further, when the substrate 50 is moved in the horizontal direction, it can be moved in the vertical direction at the same time.

  For this reason, the board | substrate 50 can be rapidly moved to an up-down direction, and the time which moves the board | substrate 50 for exposure can be shortened. Further, since the substrate 50 moves obliquely downward and moves in the horizontal direction while maintaining a sufficient gap with the exposure mask 15, it is possible to prevent the substrate 50 and the exposure mask 15 from contacting each other.

  As described above, when the substrate 50 on the stage 10 is moved in the horizontal direction by the horizontal movement mechanism 30, the substrate 50 is moved in the X direction as desired by the X direction movement mechanism 31, and the Y direction. The moving mechanism 36 moves in the Y direction as desired (see FIGS. 1 and 2).

  Hereinafter, a method of driving and controlling the stage 10 on which the substrate 50 is arranged in the horizontal direction by the X direction moving mechanism 31 and the Y direction moving mechanism 36 of the horizontal direction moving mechanism 30 will be described.

  When the stage 10 moves in the X direction and the Y direction by the X direction moving mechanism 31 and the Y direction moving mechanism 36, the control unit 19 irradiates the laser beam LBx by the laser irradiation measuring unit 11x and then uses the bar mirror 1x. The time until the light returns to the laser irradiation measurement unit 11x is measured. Accordingly, the control unit 19 calculates the distance from the laser irradiation measurement unit 11x to the bar mirror 1x, and measures the position of the substrate 50 on the stage 10 in the X direction. Similarly, the control unit 19 measures the time from when the laser irradiation measurement unit 11y irradiates the laser beam LBy to when it is reflected by the bar mirror 1y and returns to the laser irradiation measurement unit 11y. Accordingly, the control unit 19 calculates the distance from the laser irradiation measurement unit 11y to the bar mirror 1y, and measures the position of the substrate 50 on the stage 10 in the Y direction (see FIGS. 1 and 2).

  Thus, since the control unit 19 measures the X-direction position and the Y-direction position of the substrate 50, the control unit 19 can drive and control the X-direction moving mechanism 31 and the Y-direction moving mechanism 36. In addition, the horizontal position of the substrate 50 disposed on the stage 10 can be accurately grasped.

  After the exposure region changing step 85 described above, another region (the next region to be exposed) 50B under the exposure mask 15 is exposed with ultraviolet rays that are irradiated from the light source 20 and pass through the exposure mask 15 ( Second exposure step 86) (see FIGS. 3B and 6).

  Thereafter, the exposure region changing step 85 and the second exposure step 86 are sequentially repeated until the exposure of the entire region of the substrate 50 (for example, eight regions in the case of eight surfaces) is completed. When the exposure of the entire region of the substrate 50 is completed, the horizontal direction moving mechanism 30 moves the substrate 50 to a position shifted from below the exposure mask 15 (removal position moving step 87) (see FIGS. 2 and 6).

  Next, the plurality of pins 7 lift the substrate 50 disposed on the chuck 2 of the stage 10 upward. Thereafter, the substrate moving mechanism 60 inserts the insertion rod 61 between the plurality of pins 7, supports the substrate 50 from below, and removes the substrate 50 from the stage 10 (completed substrate removal step 89) (FIG. 5). (See (a), (b) and FIG. 6)

  Thus, after the substrate 50 disposed on the chuck 2 of the stage 10 is lifted upward by the plurality of pins 7, the substrate 50 is supported from below by the substrate moving mechanism 60. Can be easily and automatically removed from the chuck 2 of the stage 10.

1 is a side sectional view showing an exposure apparatus according to an embodiment of the present invention. The top view which shows the exposure apparatus by embodiment of this invention. The side view which shows the positional relationship of the horizontal direction of the exposure apparatus by embodiment of this invention. The side view which shows the moving mechanism of the horizontal direction of the exposure apparatus by embodiment of this invention. The top view which shows the mechanism in which a board | substrate is moved from a stage by the board | substrate movement mechanism of the exposure apparatus by embodiment of this invention. The flowchart which shows the exposure method by embodiment of this invention. The graph which shows the relationship between the magnitude | size of the space | interval of a board | substrate and an exposure mask, and time in the exposure method by embodiment of this invention. The side view which shows the moving mechanism of the horizontal direction in the conventional exposure apparatus.

Explanation of symbols

1x, 1y Bar mirror 2 Chuck 3 Base 7 Pin 10 Stage 10A One operation position 10B Other operation positions 11x, 11y Laser irradiation measuring unit 15 Exposure mask 20 Light source 30 Horizontal direction moving mechanism 31 X direction moving mechanism 36 Y direction moving mechanism 45 Vertical movement mechanism 50 Substrate 50A One area 50B Other area 60 Substrate movement mechanism 81 Substrate placement process 82 Exposure position movement process 83 First exposure process 85 Exposure area change process 86 Second exposure process 87 Removal position movement process 89 Completed substrate Removal step 91 Horizontal direction moving step 92 Lowering step 93 Ascending step 94 Tilt correcting step 95 Horizontal direction stopping step LBx, LBy Laser light

Claims (9)

A light source that emits irradiation light;
An exposure mask disposed below the light source;
A stage provided below the exposure mask and movable in a horizontal direction from one operation position to another operation position;
The stage is movable in the vertical direction. While moving from one operating position to another operating position, the stage moves diagonally downward, then moves diagonally upward, and has the same height as the height position at one operating position. An exposure apparatus characterized by returning to the vertical position.   2. The substrate exposure apparatus according to claim 1, wherein the stage is disposed on a horizontal movement mechanism that is movable in the horizontal direction.   The horizontal movement mechanism includes an X-direction movement mechanism that moves in one direction in the horizontal direction, and a Y-direction movement mechanism that moves in a direction orthogonal to the one direction in the horizontal direction. Item 3. The substrate exposure apparatus according to Item 2.   2. The substrate exposure apparatus according to claim 1, wherein the stage is disposed on a vertical movement mechanism that is movable in the vertical direction. On the horizontal movement mechanism, a bar mirror is provided on the side of the stage,
The laser irradiation measurement unit for irradiating the laser beam to the side of the bar mirror and receiving the laser beam reflected from the bar mirror and detecting the horizontal position of the substrate disposed on the stage is provided. 3. The substrate exposure apparatus according to 2.   The substrate exposure apparatus according to claim 1, wherein the stage has a base and a chuck disposed on the base.   7. The substrate exposure apparatus according to claim 6, wherein the stage has a plurality of freely projecting pins that extend vertically through the chuck.   8. The substrate exposure apparatus according to claim 7, further comprising a substrate moving mechanism for supporting and moving a substrate lifted by a plurality of pins from below in the vicinity of the stage. A substrate placement step of placing the substrate on the stage;
An exposure position moving step in which the stage is moved to one operating position, and one region of the substrate on the stage is disposed at an exposure position below the exposure mask;
A first exposure step of exposing a region of the substrate below the exposure mask with irradiation light irradiated from a light source and passing through the exposure mask;
An exposure area changing step in which the stage is moved from one operation position to another operation position, and another area of the substrate on the chuck is disposed at an exposure position below the exposure mask;
A second exposure step of exposing other regions of the substrate below the exposure mask with irradiation light irradiated from a light source and passing through the exposure mask;
While moving the stage from one operating position to another operating position , the stage moves diagonally downward and then moves diagonally upward to return to the same height position as the one operating position. A substrate exposure method.

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