JP2017219864A - Scanning exposure device and scanning exposure method - Google Patents

Scanning exposure device and scanning exposure method Download PDF

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JP2017219864A
JP2017219864A JP2017167435A JP2017167435A JP2017219864A JP 2017219864 A JP2017219864 A JP 2017219864A JP 2017167435 A JP2017167435 A JP 2017167435A JP 2017167435 A JP2017167435 A JP 2017167435A JP 2017219864 A JP2017219864 A JP 2017219864A
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substrate
scanning
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illuminance sensor
light irradiation
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和重 橋本
Kazushige Hashimoto
和重 橋本
敏成 新井
Toshinari Arai
敏成 新井
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V Technology Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To carry out a check of light irradiation energy on a substrate surface without affecting tact time.SOLUTION: A scanning exposure device 1 comprises: a substrate stage 2; a light irradiation device 3; an illuminance sensor stage 4 that supports an illuminance sensor 4S at the same height as that of a surface of a substrate W; and scanning control means 6 for controlling movement of the substrate stage 2 and the illuminance sensor stage 4 in a scanning direction. While the substrate stage 2 is scanned and the substrate W is subjected t a scanning exposure by the light irradiation device 3, the scanning control means 6 causes the illuminance sensor stage 4 to stand by at a position where the illuminance sensor stage 4 does not interfere with movement of the substrate stage 2, and after the scanning exposure is ended, the scanning control means 6 causes the substrate stage 2 to stand by outside a light irradiation range of the light irradiation device 3, the illuminance sensor stage 4 is scanned and the illuminance sensor 4S is subjected to the scanning exposure by the light irradiation device 3.SELECTED DRAWING: Figure 2

Description

本発明は、光配向処理などに用いられる走査露光装置及び走査露光方法に関するものである。   The present invention relates to a scanning exposure apparatus and a scanning exposure method used for photo-alignment processing and the like.

液晶素子の配向膜や紫外線硬化型液晶を用いた光学フィルムの配向層など、液晶分子を配向させる機能を有する膜や層(以下、総称して配向膜という)の形成に、近年、光配向処理が採用されている。光配向処理を行うには、配向膜となる感光性樹脂膜に選択された波長(例えば紫外光)の光を偏光軸が特定した偏光状態(例えば直線偏光状態)で照射する。   In recent years, photo-alignment treatment has been used to form films and layers having the function of aligning liquid crystal molecules (hereinafter collectively referred to as alignment films), such as alignment films for liquid crystal elements and alignment layers for optical films using ultraviolet curable liquid crystals. Is adopted. In order to perform the photo-alignment treatment, light having a selected wavelength (for example, ultraviolet light) is irradiated on the photosensitive resin film serving as the alignment film in a polarization state (for example, a linearly polarized state) specified by the polarization axis.

光配向処理用の走査露光装置は、所定の幅を有する配向膜を連続的に形成するために、配向膜の幅方向に沿って棒状の光源(ロングアークランプ)を配置し、この光源と偏光子を組み合わせて、選択波長の偏光光を配向膜の幅方向に沿って照射し、これを配向膜の幅方向と交差する方向に走査するものが知られている(下記特許文献1参照)。   In order to continuously form an alignment film having a predetermined width, a scanning exposure apparatus for photo-alignment processing arranges a rod-shaped light source (long arc lamp) along the width direction of the alignment film. There is known a technique in which polarized light having a selected wavelength is irradiated along a width direction of an alignment film and scanned in a direction crossing the width direction of the alignment film (see Patent Document 1 below).

特開2006−133498号公報JP 2006-133498 A

前述した光配向処理に限らず、基板上に形成された膜や層を走査露光する場合には、基板表面において所望の光照射エネルギーが照射されていることの確認が求められる。このような光照射エネルギーの確認は、被露光面となる基板表面と同じ高さに照度センサを設置し、実際に行われる走査露光と同じ条件(発光量及び走査速度)で照度センサを露光することが必要になる。   When scanning exposure is not limited to the above-described photo-alignment treatment, a film or a layer formed on the substrate is required to be confirmed that a desired light irradiation energy is irradiated on the substrate surface. To confirm such light irradiation energy, an illuminance sensor is installed at the same height as the substrate surface to be exposed, and the illuminance sensor is exposed under the same conditions (light emission amount and scanning speed) as the actual scanning exposure. It will be necessary.

この際、基板が支持されるステージ上に照度センサを設置すると、走査露光の範囲内に照度センサを設ける必要があるので、基板の設置位置に対して走査方向前方又は後方のいずれかに照度センサを設置せざるを得なくなる。これによると、照度センサを露光するために走査露光の範囲が実質的に拡大されることになり、走査露光のタクトタイムが延長される問題が生じる。特に、高い光照射エネルギーが求められる場合には走査速度を遅くして積算露光量を高めることがなされるので、走査範囲の拡大によるタクトタイムの影響が更に大きくなる問題があった。   At this time, if the illuminance sensor is installed on the stage on which the substrate is supported, it is necessary to provide the illuminance sensor within the scanning exposure range. Will be forced to install. According to this, the range of scanning exposure is substantially expanded in order to expose the illuminance sensor, and there is a problem that the tact time of scanning exposure is extended. In particular, when high light irradiation energy is required, the scanning speed is slowed down to increase the integrated exposure amount, so that there is a problem that the influence of the tact time due to the expansion of the scanning range is further increased.

本発明は、このような問題に対処することを課題の一例とするものである。すなわち、走査露光装置において、基板表面における光照射エネルギーの確認をタクトタイムに影響なく行うこと、等が本発明の目的である。   This invention makes it an example of a subject to cope with such a problem. That is, an object of the present invention is to confirm the light irradiation energy on the substrate surface without affecting the tact time in the scanning exposure apparatus.

このような目的を達成するために、本発明による走査露光装置は、以下の構成を少なくとも具備するものである。   In order to achieve such an object, a scanning exposure apparatus according to the present invention has at least the following configuration.

基板を支持すると共に支持された基板の幅方向と交差する走査方向に沿って移動自在な基板ステージと、前記基板ステージに支持された基板の幅方向全体に光を照射する光照射装置と、前記基板ステージに支持された基板の表面と同一高さに照度センサを支持すると共に前記照度センサが前記光照射装置の光照射範囲を移動するように前記走査方向に沿って移動自在な照度センサステージと、前記基板ステージと前記照度センサステージの前記走査方向に沿った移動を制御する走査制御手段とを備え、前記走査制御手段は、前記基板ステージを走査して該基板ステージに支持された基板を前記光照射装置によって一定の走査速度で走査露光する間、前記照度センサステージを前記基板ステージとの距離が一定になるように移動させ、前記走査露光終了後に前記基板ステージを前記基板を排出するために前記走査速度より速い速度で移動させると共に、前記照度センサステージを前記走査速度で走査して前記光照射装置によって前記照度センサを走査露光することを特徴とする走査露光装置。   A substrate stage that supports the substrate and is movable along a scanning direction that intersects the width direction of the supported substrate; a light irradiation device that irradiates light to the entire width direction of the substrate supported by the substrate stage; and An illuminance sensor stage that supports the illuminance sensor at the same height as the surface of the substrate supported by the substrate stage and is movable along the scanning direction so that the illuminance sensor moves in a light irradiation range of the light irradiation device; Scanning control means for controlling movement of the substrate stage and the illuminance sensor stage along the scanning direction, and the scanning control means scans the substrate stage and moves the substrate supported by the substrate stage to the substrate stage. While scanning exposure is performed at a constant scanning speed by a light irradiation device, the illuminance sensor stage is moved so that the distance from the substrate stage is constant, and the scanning is performed. After the light is finished, the substrate stage is moved at a speed faster than the scanning speed to eject the substrate, and the illuminance sensor stage is scanned at the scanning speed and the illuminance sensor is scanned and exposed by the light irradiation device. A scanning exposure apparatus characterized by the above.

このような特徴を有する走査露光装置によると、基板の走査露光と照度センサの走査露光を独立して行うことができるので、基板の走査露光終了後における基板排出時間を利用して、照度センサの走査露光を行うことができる。これによって、基板表面における光照射エネルギーの確認を走査露光のタクトタイムに影響なく行うことができる。   According to the scanning exposure apparatus having such characteristics, the scanning exposure of the substrate and the scanning exposure of the illuminance sensor can be performed independently. Therefore, the substrate discharge time after the completion of the scanning exposure of the substrate is used to Scanning exposure can be performed. This makes it possible to check the light irradiation energy on the substrate surface without affecting the tact time of scanning exposure.

本発明の一実施形態に係る走査露光装置の全体構成を示した説明図である。It is explanatory drawing which showed the whole structure of the scanning exposure apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態における走査制御手段による制御の一例を示した説明図である。It is explanatory drawing which showed an example of the control by the scanning control means in one Embodiment of this invention.

以下、図面を参照しながら本発明の実施形態を説明する。図1は本発明の一実施形態に係る走査露光装置の全体構成を示した説明図である。走査露光装置1は、基板ステージ2、光照射装置3、照度センサステージ4、照度センサ4S、走査手段5、走査制御手段6を備えている。図1に示した例では、走査手段5によって基板ステージ2及び照度センサステージ4を図示Y方向に走査する例を示しているが、基板ステージ2及び照度センサステージ4の位置を固定して光照射装置3を同様の走査手段によって図示Y軸方向に沿って走査するものであってもよい。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory diagram showing the overall configuration of a scanning exposure apparatus according to an embodiment of the present invention. The scanning exposure apparatus 1 includes a substrate stage 2, a light irradiation device 3, an illuminance sensor stage 4, an illuminance sensor 4 </ b> S, a scanning unit 5, and a scanning control unit 6. In the example shown in FIG. 1, the scanning unit 5 scans the substrate stage 2 and the illuminance sensor stage 4 in the Y direction in the drawing, but the positions of the substrate stage 2 and the illuminance sensor stage 4 are fixed and light irradiation is performed. The apparatus 3 may be scanned along the Y-axis direction in the figure by the same scanning means.

基板ステージ2は、走査露光の対象となる基板Wを支持すると共に、支持された基板Wの幅方向(図示X方向)と交差する走査方向(図示Y方向)に沿って、走査手段5による移動が自在な構成になっている。これに対して、光照射装置3は、光源3Aなどを備えており、基板ステージ2に支持された基板Wの幅方向(X方向)全体に光を照射するものである。   The substrate stage 2 supports the substrate W to be subjected to scanning exposure, and is moved by the scanning unit 5 along a scanning direction (Y direction shown in the drawing) that intersects the width direction (X direction shown in the drawing) of the supported substrate W. Is a free configuration. In contrast, the light irradiation device 3 includes a light source 3A and the like, and irradiates light to the entire width direction (X direction) of the substrate W supported by the substrate stage 2.

照度センサステージ4は、基板ステージ2に支持された基板Wの表面と同一高さに照度センサ4Sを支持すると共に、照度センサ4Sが光照射装置3の光照射範囲を移動するように、走査手段5による走査方向(Y方向)に沿って移動自在な構成になっている。   The illuminance sensor stage 4 supports the illuminance sensor 4S at the same height as the surface of the substrate W supported on the substrate stage 2, and the scanning means so that the illuminance sensor 4S moves in the light irradiation range of the light irradiation device 3. 5 is configured to be movable along the scanning direction (Y direction).

基板ステージ2と照度センサステージ4の走査手段5による走査方向に沿った移動は、走査制御手段6によって制御される。本発明の実施形態においては、走査制御手段6によって基板ステージ2の走査と照度センサステージ4の走査を独立して制御することができる。   The scanning control means 6 controls the movement of the substrate stage 2 and the illuminance sensor stage 4 along the scanning direction by the scanning means 5. In the embodiment of the present invention, scanning of the substrate stage 2 and scanning of the illuminance sensor stage 4 can be controlled independently by the scanning control means 6.

照度センサステージ4の走査は、光照射装置3によって基板Wが設定された単位面積当たりの光照射エネルギーを受けているか否かを照度センサ4Sの走査露光で確認するためになされるものであるから、照度センサステージ4の走査速度は基板ステージ2の走査速度と同一の速度に設定される。しかしながら、照度センサ4Sによる計測時間を短縮する必要がある場合には、照度センサステージ4の走査速度を基板ステージ2の走査速度の2倍〜数倍にして、照度センサ4Sの計測結果を2倍〜数倍にすることで基板Wに照射される光照射エネルギーの値を確認することも可能である。   Scanning of the illuminance sensor stage 4 is performed in order to confirm whether or not the light irradiation device 3 receives light irradiation energy per unit area set by the light irradiation device 3 by scanning exposure of the illuminance sensor 4S. The scanning speed of the illuminance sensor stage 4 is set to the same speed as the scanning speed of the substrate stage 2. However, when it is necessary to shorten the measurement time by the illuminance sensor 4S, the scanning speed of the illuminance sensor stage 4 is set to twice to several times the scanning speed of the substrate stage 2, and the measurement result of the illuminance sensor 4S is doubled. It is also possible to confirm the value of the light irradiation energy with which the substrate W is irradiated by increasing it to several times.

図2は、走査制御手段6による制御の一例を示した説明図である。走査制御手段6は、先ず、図2(a),(b)に示すように、基板露光工程を実行する。基板露光工程では、基板ステージ2に支持された基板W上に基板Wの幅方向全体に光を照射する光照射装置3を配置して基板Wを走査露光する。   FIG. 2 is an explanatory diagram showing an example of control by the scanning control means 6. First, the scanning control means 6 executes a substrate exposure process as shown in FIGS. 2 (a) and 2 (b). In the substrate exposure step, a light irradiation device 3 that irradiates light over the entire width direction of the substrate W is disposed on the substrate W supported by the substrate stage 2 to scan and expose the substrate W.

このように基板Wに対する走査露光を行う基板露光工程では、走査制御手段6は、基板Wを走査露光する間、照度センサステージ4を基板ステージ2の移動に干渉しない位置に待機させる。図2(a),(b)に示した例では、基板露光工程の間、照度センサステージ4を基板ステージ2からの距離が一定になるように移動させているが、これに限らず、その間照度センサステージ4を基板ステージ2から離れた定位置に静止させていてもよい。照度センサステージ4を基板ステージ2からの距離が一定になるように移動させることで、次工程での照度センサステージ4の移動距離を短縮することができる。   Thus, in the substrate exposure process in which the scanning exposure is performed on the substrate W, the scanning control unit 6 stands by at a position where the illuminance sensor stage 4 does not interfere with the movement of the substrate stage 2 while the substrate W is scanned and exposed. In the example shown in FIGS. 2A and 2B, the illuminance sensor stage 4 is moved so that the distance from the substrate stage 2 is constant during the substrate exposure process. The illuminance sensor stage 4 may be stationary at a fixed position away from the substrate stage 2. By moving the illuminance sensor stage 4 so that the distance from the substrate stage 2 is constant, the moving distance of the illuminance sensor stage 4 in the next process can be shortened.

基板露光工程終了後に、図2(c),(d)に示すように、走査制御手段6は基板ステージ2上の露光済み基板Wを排出する基板排出工程を実行する。基板排出工程では、図2(c)に示すように、走査露光終了後に基板ステージ2を光照射装置3の光照射範囲外に待機させる。その際の移動は走査露光時の走査速度に対して十分に速い移動速度が設定される。   After completion of the substrate exposure process, the scanning control means 6 executes a substrate discharge process for discharging the exposed substrate W on the substrate stage 2 as shown in FIGS. In the substrate discharge step, as shown in FIG. 2C, the substrate stage 2 is placed outside the light irradiation range of the light irradiation device 3 after the scanning exposure is completed. The movement speed at that time is set to a sufficiently high movement speed with respect to the scanning speed at the time of scanning exposure.

基板ステージ2が光照射装置3の光照射範囲外に待機すると、図2(d)に示すように、露光済み基板Wの排出が行われるが、この排出に要する時間を利用して、照度センサステージ4を走査して光照射装置3によって照度センサ4Sを走査露光する。すなわち、基板排出工程の期間中に、照度センサ4S上に光照射装置3を配置して照度センサ4Sを走査露光する照度センサ露光工程を実行する。   When the substrate stage 2 stands by outside the light irradiation range of the light irradiation device 3, the exposed substrate W is discharged as shown in FIG. 2 (d). The stage 4 is scanned, and the illuminance sensor 4S is scanned and exposed by the light irradiation device 3. That is, during the substrate discharge process, the illuminance sensor exposure process is performed in which the light irradiation device 3 is arranged on the illuminance sensor 4S and the illuminance sensor 4S is scanned and exposed.

ここまでの説明では、光照射装置3を固定して、走査手段5で基板ステージ2と照度センサステージ4を走査する例を説明したが、前述したように、基板ステージ2と照度センサステージ4を固定して、光照射装置3を走査することでも同様の工程を実行することができる。   In the description so far, the example in which the light irradiation device 3 is fixed and the scanning unit 5 scans the substrate stage 2 and the illuminance sensor stage 4 has been described. However, as described above, the substrate stage 2 and the illuminance sensor stage 4 are The same process can be executed by scanning the light irradiation device 3 while fixing.

この場合は、光照射装置3が、基板ステージ2に支持された基板Wの幅方向全体に光を照射すると共に基板Wの幅方向と交差する走査方向に沿って移動自在になっている。そして、走査制御手段6は、光照射装置3を走査して基板ステージ2に支持された基板Wを走査露光する基板露光工程を実行した後に、光照射装置3を走査して照度センサ4Sを走査露光する照度センサ露光工程を実行する。この際、前述した説明と同様に、基板露光工程を実行した後に基板ステージ2上の露光済み基板Wを排出する基板排出工程を実行し、この基板排出工程の期間中に光照射装置3を走査して照度センサ4Sを走査露光する照度センサ露光工程を実行する。   In this case, the light irradiation device 3 irradiates light to the entire width direction of the substrate W supported by the substrate stage 2 and is movable along the scanning direction intersecting the width direction of the substrate W. Then, the scanning control unit 6 scans the light irradiation device 3 and scans the illuminance sensor 4S by scanning the light irradiation device 3 after performing the substrate exposure process of scanning and exposing the substrate W supported by the substrate stage 2. An illuminance sensor exposure process is performed. At this time, in the same manner as described above, after the substrate exposure process is executed, a substrate discharge process for discharging the exposed substrate W on the substrate stage 2 is executed, and the light irradiation device 3 is scanned during the substrate discharge process. Then, an illuminance sensor exposure process for scanning and exposing the illuminance sensor 4S is executed.

このような本発明の実施形態によると、基板露光工程では、基板ステージ2上の基板Wに対して基板Wの先端上に光照射装置3を配置して、基板WのY方向長さだけ走査露光を行うことができるので、走査露光のタクトタイムが延長されることはない。そして、基板露光工程終了後は次の基板Wを処理するための基板排出工程が実行されることになるが、その基板排出工程の期間を利用して照度センサ露光工程を実行することができるので、次の基板Wに対して基板露光工程を行う際には既に照度センサ露光工程は終了している。このように、本発明の実施形態によると、基板Wを走査露光するタクトタイムに影響を与えること無く、光照射装置3の光照射エネルギーを確認することができる。   According to such an embodiment of the present invention, in the substrate exposure step, the light irradiation device 3 is arranged on the tip of the substrate W with respect to the substrate W on the substrate stage 2, and the substrate W is scanned by the length in the Y direction. Since exposure can be performed, the tact time of scanning exposure is not extended. And after completion | finish of a substrate exposure process, the board | substrate discharge process for processing the next board | substrate W will be performed, but since an illumination sensor exposure process can be performed using the period of the board | substrate discharge process, When the substrate exposure process is performed on the next substrate W, the illuminance sensor exposure process has already been completed. Thus, according to the embodiment of the present invention, the light irradiation energy of the light irradiation device 3 can be confirmed without affecting the tact time for scanning and exposing the substrate W.

なお、図示においては、照度センサ4Sを照度センサステージ4に一つ設けた例を示しているが、照度センサ4Sは走査方向と交差する方向に沿って複数設けてもよい。また、照度センサステージ4には、照度と共に偏光方向を測定するセンサを設けてもよい。   In the drawing, an example is shown in which one illuminance sensor 4S is provided on the illuminance sensor stage 4, but a plurality of illuminance sensors 4S may be provided along a direction intersecting the scanning direction. The illuminance sensor stage 4 may be provided with a sensor that measures the polarization direction together with the illuminance.

1:走査露光装置,2:基板ステージ,3:光照射装置,
4:照度センサステージ,4S:照度センサ,5:走査手段,
6:走査制御手段,W:基板
1: scanning exposure apparatus, 2: substrate stage, 3: light irradiation apparatus,
4: Illuminance sensor stage, 4S: Illuminance sensor, 5: Scanning means,
6: scanning control means, W: substrate

Claims (2)

基板を支持すると共に支持された基板の幅方向と交差する走査方向に沿って移動自在な基板ステージと、
前記基板ステージに支持された基板の幅方向全体に光を照射する光照射装置と、
前記基板ステージに支持された基板の表面と同一高さに照度センサを支持すると共に前記照度センサが前記光照射装置の光照射範囲を移動するように前記走査方向に沿って移動自在な照度センサステージと、
前記基板ステージと前記照度センサステージの前記走査方向に沿った移動を制御する走査制御手段とを備え、
前記走査制御手段は、前記基板ステージを走査して該基板ステージに支持された基板を前記光照射装置によって一定の走査速度で走査露光する間、前記照度センサステージを前記基板ステージとの距離が一定になるように移動させ、前記走査露光終了後に前記基板ステージを前記基板を排出するために前記走査速度より速い速度で移動させると共に、前記照度センサステージを前記走査速度で走査して前記光照射装置によって前記照度センサを走査露光することを特徴とする走査露光装置。
A substrate stage that supports the substrate and is movable along a scanning direction that intersects the width direction of the supported substrate;
A light irradiation device for irradiating light across the entire width direction of the substrate supported by the substrate stage;
An illuminance sensor stage that supports the illuminance sensor at the same height as the surface of the substrate supported by the substrate stage and is movable along the scanning direction so that the illuminance sensor moves in the light irradiation range of the light irradiation device. When,
Scanning control means for controlling movement of the substrate stage and the illuminance sensor stage along the scanning direction;
The scanning control means scans the substrate stage and scans and exposes the substrate supported by the substrate stage at a constant scanning speed by the light irradiation device, and the distance between the illuminance sensor stage and the substrate stage is constant. And the substrate stage is moved at a speed higher than the scanning speed for discharging the substrate after the scanning exposure is completed, and the illuminance sensor stage is scanned at the scanning speed to thereby emit the light irradiation device. A scanning exposure apparatus characterized by scanning exposure of the illuminance sensor.
基板ステージに支持された基板上に当該基板の幅方向全体に光を照射する光照射装置を配置して当該基板を一定の走査速度で走査露光する基板露光工程と、
前記基板露光工程終了後に前記基板ステージを前記走査速度より速い速度で移動させて前記基板ステージ上の露光済み基板を排出する基板排出工程と、
前記基板排出工程の期間中に、前記基板ステージに支持された基板の表面と同一高さに支持された照度センサ上に前記光照射装置を配置して当該照度センサを前記走査速度で走査露光する照度センサ露光工程とを有することを特徴とする走査露光方法。
A substrate exposure step in which a light irradiation device for irradiating light across the width direction of the substrate is disposed on the substrate supported by the substrate stage, and the substrate is scanned and exposed at a constant scanning speed;
A substrate discharge step of discharging the exposed substrate on the substrate stage by moving the substrate stage at a speed faster than the scanning speed after the substrate exposure step is completed;
During the substrate discharging step, the light irradiation device is arranged on an illuminance sensor supported at the same height as the surface of the substrate supported by the substrate stage, and the illuminance sensor is scanned and exposed at the scanning speed. A scanning exposure method comprising: an illuminance sensor exposure step.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020184023A1 (en) * 2019-03-12 2020-09-17 株式会社ブイ・テクノロジー Lighting angle measurement method, photoalignment exposure method and photoalignment exposure device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020184023A1 (en) * 2019-03-12 2020-09-17 株式会社ブイ・テクノロジー Lighting angle measurement method, photoalignment exposure method and photoalignment exposure device

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