JP2007005617A - Method, program, device for displaying progress, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily grasp progress of a partial process as well as the overall progress of a specified process, in the case a plurality of partial processes are executed for an overall process. <P>SOLUTION: A window WD1 is displayed on a terminal device provided to an exposure device, which displays progress of a specified process where a plurality of partial processes for the exposure device are executed for an overall process (for example, a resetting process for setting the state of the exposure device to an initial state). The window WD1 is provided with a display region R1 for displaying progress of a specified overall process, and a display region R2 for displaying progress of respective partial processes. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a progress status display method, a display program and a display device for displaying the progress status of a predetermined process in which a plurality of partial processes are executed and the whole process is performed, and a device is manufactured while performing display by the method or the like The present invention relates to a device manufacturing method.

  Semiconductor devices, liquid crystal display devices, imaging devices (CCD (Charge Coupled Device), etc.), thin film magnetic heads, and other devices are manufactured by performing various types of processing on substrates using substrate processing equipment. Is done. The processing performed on the substrate by the substrate processing apparatus includes, for example, thin film formation processing, photolithography processing, and impurity diffusion processing, and the circuit formed on the substrate that has undergone these processing is inspected, evaluated, and repaired. There is a process to (repair).

  In the photolithography process described above, an exposure apparatus, which is a kind of substrate processing apparatus, is used to form a plurality of (ten to several tens) shot regions on a substrate coated with a photosensitive agent through a projection optical system. The exposure process for transferring to is repeated. Generally, a device manufacturing line for manufacturing a device is provided with a plurality of substrate processing apparatuses such as an exposure apparatus, thereby improving the manufacturing efficiency of the device.

Patent Document 1 below collects information on substrates being processed from each of the substrate processing apparatuses provided in the device manufacturing line, and indicates the processing status of the substrates existing in the device manufacturing line based on the collected information. A technique is disclosed in which the processing status of a substrate is easily and accurately grasped by displaying schematically.
JP 9-326339 A

  By the way, most of the above-described substrate processing apparatuses perform predetermined overall processing by a plurality of parts (units) operating in cooperation. For example, the exposure apparatus includes a laser unit that emits laser light used as exposure light, a transport unit that transports a mask or a substrate, a stage unit that holds the mask or substrate movably, and a relative relationship between the mask and the wafer. It is composed of a plurality of units such as alignment units that perform alignment, and a series of exposure processing is performed by each unit performing predetermined processing.

  When grasping the processing status of the exposure apparatus, there are cases where it is desired to simultaneously grasp the processing status of each unit of the exposure apparatus and the processing status of the entire exposure process. For example, when the exposure apparatus is started up or during regular or irregular maintenance, a reset process for setting the apparatus state of the exposure apparatus to an initial state is performed. This reset process ends when all the individual reset processes performed in each unit are completed, but if there is a unit that does not complete the reset process, it takes a long time to complete the entire reset process. Cost. During the reset process, device manufacturing itself has been stopped. Therefore, in order to prevent a decrease in device manufacturing efficiency as much as possible, it is necessary to grasp the progress of the entire reset process and the progress of the reset process in each unit. .

  In general, exposure processing is performed in units of lots with a plurality of substrates (for example, several tens of substrates) as a unit. When manufacturing a device, how much exposure processing is completed for one lot. As well as the progress of substrate processing in each unit or the progress of various processes performed on one substrate.

  The present invention has been made in view of the above circumstances, and easily grasps both the overall progress status of a predetermined process in which a plurality of partial processes are executed and the entire process is performed, and the progress status of the partial process. It is an object of the present invention to provide a progress status display method, a display program, a display device, and a device manufacturing method for manufacturing a device while performing display using the method.

The present invention adopts the following configuration corresponding to each diagram shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.
In order to solve the above problems, a progress status display method of the present invention is a progress status display method for displaying the progress status of a predetermined process in which a plurality of partial processes are executed and the entire process is performed, and the overall process A display step of simultaneously displaying the overall process progress status indicating the progress status of the process and the partial process progress status indicating the progress status of at least one of the plurality of partial processes.
According to the present invention, while a predetermined process in which a plurality of partial processes are executed and the whole process is executed, the progress of the whole process and the progress of at least one of the partial processes. The status is displayed at the same time.
In order to solve the above problems, a progress status display program of the present invention is a progress status display program for displaying the progress status of a predetermined process in which a plurality of partial processes are executed and the entire process is performed. And a display process for simultaneously displaying an overall process progress status indicating the progress status of the process and a partial process progress status indicating the progress status of at least one of the plurality of partial processes.
In order to solve the above-described problem, the progress status display device of the present invention is a progress status display device (T) that displays a progress status of a predetermined process in which a plurality of partial processes are executed and an entire process is performed, A display device (54) for simultaneously displaying the overall process progress status indicating the progress status of the overall process and the partial process progress status indicating the progress status of at least one of the plurality of partial processes; It is a feature.
In order to solve the above-described problems, the device manufacturing method of the present invention displays the overall process progress and the partial process progress using the progress display method, or displays the whole on the progress display device. A device is manufactured while displaying the progress of processing and the progress of partial processing.

According to the present invention, since the overall progress status of a predetermined process in which a plurality of partial processes are executed and the overall process is performed and the progress status of the partial process are displayed at the same time, these progress statuses can be easily displayed together. There is an effect that it can be grasped.
In addition, since the overall progress status of a given process and the progress status of a partial process are displayed at the same time, if a problem occurs during the execution of a given process, the cause of the trouble can be quickly identified from those displays. It has the effect that it can also be discovered.

  Hereinafter, a progress display method, a display program, a display device, and a device manufacturing method according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a view showing the schematic arrangement of an exposure apparatus to which an embodiment of the present invention is applied. An exposure apparatus EX shown in FIG. 1 is an exposure apparatus for manufacturing a semiconductor element. The pattern formed on the reticle R is sequentially transferred to the wafer W while the reticle R as a mask and the wafer W as a substrate are moved synchronously. This is a reduction projection type exposure apparatus of a step-and-scan method for transferring the image on the top.

  In the following description, if necessary, an XYZ orthogonal coordinate system is set in the drawing, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. In this XYZ orthogonal coordinate system, the XY plane is set to a plane parallel to the horizontal plane, and the Z axis is set to the vertical upward direction. Further, it is assumed that the synchronous movement direction (scanning direction) of reticle R and wafer W during exposure is set in the Y direction.

  The exposure apparatus EX shown in FIG. 1 includes a main body chamber C1 installed in a clean room and a transfer chamber C2 installed adjacent to the −Y side of the main body chamber C1. The main chamber C1 and the transfer chamber C2 are connected to each other through the openings a1 and a2. Most of the exposure apparatus main body is accommodated in the main body chamber C1. The exposure apparatus main body includes an illumination optical system ILS that illuminates a slit-shaped (rectangular or arc-shaped) illumination area on the reticle R with exposure light EL having uniform illuminance, a reticle stage RST that holds the reticle R, and a reticle R A projection optical system PL that projects a pattern image onto the wafer W, a wafer stage WST that holds the wafer W, an alignment detection system AS, a main control system CT, and the like are configured. A part of the illumination optical system ILS and the main control system CT and the terminal device T connected to the main control system CT are arranged outside the main body chamber C1 and the transfer chamber C2.

The illumination optical system PL includes a light source unit disposed outside the main body chamber C1 and the transfer chamber C2, and an illuminance uniformizing optical system including an optical integrator, a beam splitter, a condensing lens system, a reticle blind, and an imaging lens. It includes a system and the like (both not shown). The configuration of the illumination optical system ILS is disclosed in, for example, JP-A-9-320956. Here, as the light source unit, a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), an F ₂ laser light source (wavelength 157 nm), a Kr ₂ laser light source (wavelength 146 nm), an Ar ₂ laser light source ( An ultraviolet laser light source having a wavelength of 126 nm), a copper vapor laser light source, a harmonic generation light source of a YAG laser, a harmonic generation device of a solid-state laser (semiconductor laser, etc.), or a mercury lamp (i-line, etc.) can also be used. .

  Reticle stage RST is a reticle scanning stage that can move with a predetermined stroke in the scanning direction (Y direction) on the upper surface of reticle support base (surface plate) 11 that is horizontally disposed below illumination optical system ILS (−Z direction). 12 and a reticle fine movement stage 13 mounted on the reticle scanning stage 12 and capable of being finely driven in the X direction, the Y direction, and the rotation direction around the Z axis (θZ direction) with respect to the reticle scanning stage 12, respectively. I have. The reticle R is held on the reticle fine movement stage 13 by vacuum suction or electrostatic suction.

  A movable mirror 14 is provided at one end of the reticle fine movement stage 13, and a laser interferometer (hereinafter referred to as a reticle interferometer) 15 is disposed on the reticle support 11. The laser light emitted from the reticle interferometer 15 is applied to the mirror surface of the movable mirror 14, and the reticle interferometer 15 receives the interference light between the reflected light and the reference light. And the position in the rotation direction (θX, θY, θZ directions) around the Z axis are detected.

  Position information (or velocity information) of reticle fine movement stage 13 detected by reticle interferometer 15 described above is supplied to main control system CT that controls the overall operation of the apparatus. The main control system CT controls operations of the reticle scanning stage 12 and the reticle fine movement stage 13 via a reticle driving device 16 including a linear motor for driving the reticle scanning stage 12, a voice coil motor for driving the reticle fine movement stage 13, and the like. .

  The projection optical system PL is configured to include a plurality of refractive optical elements (lens elements), and both the object plane (reticle R) side and the image plane (wafer W) side are telecentric and have a predetermined reduction magnification β (β is, for example, Refractive optical systems having 1/4, 1/5, etc.) are used. The direction of the optical axis AX of the projection optical system PL is a Z direction orthogonal to the XY plane. For example, quartz or fluorite is used as the glass material of the plurality of lens elements provided in the projection optical system PL according to the wavelength of the exposure light EL. In the present embodiment, the projection optical system PL that projects an inverted image of the pattern formed on the reticle R onto the wafer W will be described as an example. Of course, even if an upright image of the pattern is projected. good.

  Wafer stage WST is arranged below projection optical system PL (−Z direction), and includes wafer XY drive stage 18, fulcrums 19 a to 19 c, and wafer table 20. The wafer XY drive stage 18 is configured to be movable in the X direction and the Y direction on the upper surface (reference plane) of the wafer support base (surface plate) 17, and is extendable in the Z direction on the wafer XY drive stage 18. Three fulcrum points 19a to 19c are provided. These three fulcrums 19a to 19c are arranged so as to form an angle of 120 ° with respect to the center of the wafer wafer table 20, for example. The fulcrums 19a to 19c are configured by using, for example, a method using a rotary motor and a cam, a laminated piezoelectric element (piezo element), a voice coil motor (here, referred to as a voice coil motor), or the like.

  The wafer table 20 is placed on the fulcrums 19a to 19c, and fine movement in the Z direction (including rotation around the X axis and rotation around the Y axis) is possible by controlling the amount of expansion / contraction of the fulcrums 19a to 19c. It is. The wafer W is held by vacuum suction or electrostatic suction through a wafer holder (not shown) provided on the wafer table 20. The three fulcrums 19a to 19c are controlled by the main control system CT. The positions of the wafer table 20 in the Z direction can be adjusted by uniformly extending and contracting the fulcrums 19a to 19c, and the X of the wafer table 20 can be adjusted by individually adjusting the expansion and contraction amounts of the three fulcrums 19a to 19c. The tilt angle about the axis and the Y axis can be adjusted.

  A moving mirror 21 is provided at one end on the wafer table 20, and a laser interferometer (hereinafter referred to as a wafer interferometer) that irradiates the mirror surface (reflection surface) of the moving mirror 21 with laser light outside the wafer stage WST. 22 is provided. The wafer interferometer 22 receives the interference light between the reflected light and the reference light obtained by irradiating the mirror surface of the movable mirror 21 with the laser light, and thereby the position and orientation of the wafer table 20 in the X direction and the Y direction. (Rotations θX, θY, θZ around the X, Y, and Z axes) are detected.

  The main control system CT controls the position and orientation of the wafer table 20 via the wafer driving device 23 based on the detection result of the wafer interferometer 22. Due to the movement control of wafer stage WST by main controller CT, wafer stage WST has an exposure position (a pattern transfer position via projection optical system PL) directly below projection optical system PL, as shown in FIG. The wafer W can be moved between a delivery position, that is, a loading position, set near the opening a1 of C1.

  The alignment detection system AS is arranged on the side surface portion in the Y direction of the projection optical system PL (in FIG. 1, for convenience of illustration, it is shown on the + X direction side of the projection optical system PL). This alignment detection system AS images the alignment mark (wafer alignment mark) attached to the partition area (hereinafter referred to as a shot area or a shot) set on the wafer W, performs image processing, and performs the position of the wafer alignment mark. And the detection result is output to the main control system CT. The optical axis of the optical system of the alignment detection system AS is parallel to the optical axis AX of the projection optical system PL. The detailed configuration of the alignment detection system AS is disclosed in, for example, Japanese Patent Laid-Open No. 9-219354 and US Pat. No. 5,859,707 corresponding thereto.

  Further, on the side of the projection optical system PL, a light transmitting system 24a and a light receiving system 24b are formed, and the inside and the vicinity of the exposure slit area on the wafer W conjugate with the illumination area on the reticle R with respect to the projection optical system PL. A multi-point AF sensor 24 is provided for detecting the position in the Z direction (optical axis AX direction) of the surface of the wafer W at each of a plurality of detection points set to. The multipoint AF sensor 24 detects the surface position and orientation of the wafer W in the direction of the optical axis AX of the projection optical system PL (rotations θX and θY around the X and Y axes: leveling). The main control system CT controls the amount of expansion / contraction of the fulcrums 19a to 19c based on the detection result of the multipoint AF sensor 24, and adjusts the inclination angles of the wafer table 20 around the X axis and Y axis.

  In addition to the control described above, the main control system CT uses a reference member (not shown) formed on the wafer table 20 to detect the baseline amount (projection center of the projected image via the projection optical system PL and alignment detection). Control for obtaining a distance from the center of the measurement visual field of the system AS. In addition, the result of measuring several representative (about 3 to 9) wafer alignment marks formed on the wafer W by the alignment detection system AS and the pre-recorded design values of each shot area are obtained. EGA (enhanced global alignment) calculation is performed to obtain array coordinates of all shot areas on the wafer W.

  Then, the main control system CT compares the reticle stage RST and the wafer stage WST via the wafer driving device 23 based on the array coordinates obtained by correcting the array coordinates of the shot obtained by the EGA calculation with the baseline amount. Perform proper alignment. Thereafter, the synchronous movement of the reticle stage RST and the wafer stage WST is controlled, the exposure amount of the exposure light EL is controlled, and the position and orientation of the wafer W in the Z direction are controlled based on the detection result of the AF sensor 41. Then, the wafer W is exposed. The detailed configuration of the main control system CT will be described later.

  Exposure apparatus EX further includes a transport system for transporting wafer W to wafer stage WST, and a pre-alignment system for performing pre-alignment of wafer W transported by the transport system. The load slider 34 that forms a part of the transfer system can hold the wafer W by vacuum suction or electrostatic suction. The load slider 34 is configured to be movable in the Y direction through the openings a1 and a2 between the main body chamber C1 and the transfer chamber C2 by a transfer mechanism described later while holding the wafer W. . The load slider 34 that has received the wafer W in the transfer chamber C2 moves in the + Y direction and moves above the loading position of the wafer stage WST in the main body chamber C1. Then, loading of wafer W is realized from load slider 34 onto wafer stage WST located at the loading position.

  FIG. 2 is a top perspective view showing a schematic configuration of the transfer system for the wafer W including the pre-alignment system. As shown in FIG. 2, the transfer system for the wafer W includes a load robot 31 that takes out the wafer W from a front opening unified pod (hereinafter referred to as “FOUP”) 30, and a load robot 31 to a load slider 34. A pre-alignment stage 32 for performing pre-alignment on the wafer W during the relay, a turntable 33 mounted on the pre-alignment stage 32, the load slider 34, and a load A Y drive mechanism 35 for driving the slider 34 in the Y direction, an unload slider 36 for unloading the exposed wafer W from the wafer stage WST, and an unload robot 37 for receiving the wafer W from the unload slider 36 It is configured to include.

  The FOUP 30 is the same as the transport container disclosed in, for example, Japanese Patent Application Laid-Open No. 8-279546. The FOUP 30 is an opening / closing type having an opening on only one surface and a door (lid) that opens and closes the opening. A container (sealed wafer cassette). In the FOUP 30, a plurality of wafers W are stored at a predetermined interval in the vertical direction (Z direction). The FOUP 30 is set at the position shown in FIG. 2 by a FOUP transport device (not shown). By this setting, the opening a3 for the FOUP 30 disposed in the transfer chamber C2 is connected to the opening of the FOUP 30. When the door of the opening is opened, the wafer W inside the FOUP 30 can be loaded into the transfer chamber C2 through the opening and the opening a3.

  The load robot 31 is a horizontal articulated robot capable of attracting and holding the wafer W at the tip of the arm, and mainly transporting the wafer W from the FOUP 30 to the pre-alignment stage 32 and exposing from the unload robot 37. Collecting used wafers. The posture control of the road robot 31 is performed by driving a rotation motor (not shown) incorporated in a joint or the like of the road robot 31 under the instruction of the main control system CT.

  The pre-alignment stage 32 is a stage movable within the XY plane. The pre-alignment stage 32 is at least movable between the position where the wafer W can be delivered to the load slider 34 and the position where the load robot 31 can deliver the wafer W in the Y direction. It is configured. The pre-alignment stage 32 is controlled by driving a drive mechanism such as a linear motor shown in FIG. 1 under the instruction of the main control system CT. FIG. 2 illustrates a state in which the pre-alignment stage 32 is disposed at a position where the wafer W can be delivered to the load slider 34.

  The turntable 33 is disposed at a substantially central portion on the surface on the + Z side of the pre-alignment stage 32, can move up and down, and can rotate about a rotation axis parallel to the Z axis while holding the wafer W. It is a table. A disk-like wafer suction holding surface for holding the wafer W by vacuum suction or electrostatic suction or the like is provided on the end surface on the + Z side of the turntable 33. By rotating the turntable 33, It is possible to rotate the wafer W sucked and held on the suction holding surface. This rotation is performed by driving a drive mechanism (not shown) under the instruction of the main control system CT.

  Information on the XY position of the pre-alignment stage 32, the rotation position of the turntable 33, the height of the wafer suction holding surface (wafer), and the like drive the position detection sensor (not shown), the pre-alignment stage 32, and the turntable 33. It is detected by a sensor or the like that monitors the drive amount of the motor to be transmitted and sent to the main control system CT. Based on the information, the main control system CT controls the XY position of the pre-alignment stage 32 and the position (rotational position, Z position) of the turntable 33.

  As shown in FIG. 2, the load slider 34 is connected to a Y drive mechanism 35 that extends in the Y direction from the transfer chamber C2 side to the main body chamber C1 side through the opening a2 of the transfer chamber C2 and the opening a1 of the main body chamber C1. ing. The load slider 34 can move (slide) in the Y direction between the transfer chamber C2 and the main body chamber C1 by driving the Y drive mechanism 35 under the instruction of the main control system CT, and moves to the transfer chamber C2. The wafer W held on the turntable 33 is received, moved to the + Y side, and the wafer W is transferred above the loading position.

  The unload slider 36 is configured to be movable (slidable) in the Y direction below (−Z side) the load slider 34. The unload slider 36 receives the wafer W from the center table CT lifted by holding the wafer W by vacuum suction or the like when unloading the exposed wafer W from the wafer stage WST. To the transfer position of the wafer W. The unload slider 36 is also driven by driving a drive mechanism (not shown) under the instruction of the main control system CT.

  The unload robot 37 is a horizontal articulated robot that receives the wafer W from the unload slider 36 at the delivery position and delivers the wafer W to the load robot 31, for example. The posture control of the unload robot 37 is also performed by driving a rotation motor (not shown) incorporated in a joint or the like of the unload robot 37 under the instruction of the main control system CT.

  That is, in the present embodiment, the load system of the wafer W is constituted by the load robot 31, the load slider 34, the pre-alignment stage 32 (including the turntable 33), the Y drive mechanism 35, the unload slider 36, the unload robot 37, and the like. It is configured. When any of these apparatuses included in the wafer W transfer system delivers the wafer W to another apparatus included in the wafer W transfer system or the wafer stage WST, and any other apparatus included in the wafer W transfer system. When the wafer W is delivered from the apparatus or wafer stage WST, a signal indicating that is output to the main control system CT.

  Next, the configuration of the main control system CT will be described. FIG. 3 is a block diagram showing a schematic configuration of the main control system CT. As shown in FIG. 3, the main control system CT provided in the exposure apparatus of this embodiment includes a main processor 40 that performs overall control, and various types of exposure equipment EX that are provided under the control of the main processor 40. And a unit controller UC for controlling the device (control unit). The unit controller UC includes a stage controller 41, an alignment controller 42, a wafer loader controller 43, and the like.

  Stage controller 41 controls operations of reticle stage RST, wafer stage WST, and the like. More specifically, the positioning operation of the reticle stage RST is controlled with reference to the position information of the reticle stage RST detected by the laser interferometer 15 shown in FIG. Further, the positioning operation and the like of wafer stage WST are controlled while referring to the position information of wafer stage WST detected by laser interferometer 22.

  The alignment controller 42 controls the alignment detection system AS and a reticle alignment detection system RAS (not shown in FIG. 1) that detects the position of the reticle R. The control performed by the alignment controller 42 includes, for example, control for starting emission of a detection beam from the light transmission system 24a included in the alignment detection system AS, control for moving the reticle alignment detection system RAS to a predetermined measurement position, and detection thereof. For example, control for processing a signal detected by the system according to a predetermined algorithm.

  The wafer loader controller 43 includes a load robot 31, a pre-alignment stage 32, a turntable 33, a load slider 34, a Y drive mechanism 35, an unload slider 36, and an unload included in the wafer W transfer system shown in FIG. The operation of the robot 37 is controlled. These unit controllers UC control various processing devices in accordance with control commands output from the main processor 40.

  The representative units constituting the unit controller UC have been described above. The unit controller UC includes a body controller, a reticle loader controller, an I / O controller, a lens controller, an illumination unit controller, a beam self-adjusting controller, etc. in addition to the above. Consists of including. The body controller controls a column (not shown) that supports each apparatus constituting the exposure apparatus EX, and the reticle loader controller controls the reticle loader that transports the reticle R. The I / O controller controls input / output of various signals (various data) handled by the exposure apparatus EX, and the lens controller controls optical characteristics of the projection optical system PL. Furthermore, the illumination unit controller controls the illumination optical system ILS to control the illuminance of the exposure light, the size of the illumination area, etc., and the beam self-adjustment controller, the output power of the laser light (laser beam) emitted from the light source unit, etc. To control.

  In the above configuration, when the main processor 40 outputs a control signal to each of the unit controllers UC and controls the operation of each apparatus under control with respect to each of the unit controllers UC, the exposure apparatus EX performs the expected operation. An operation (such as an exposure operation) is performed. When the unit controller UC is controlling each device under control based on the control signal of the main processor 40, the unit controller UC outputs a status signal indicating their state to the main processor 40. Here, the status signal output from each of the unit controllers UC to the main processor 40 includes, for example, a signal indicating the progress status of the reset process shown below, a signal indicating the transfer status of the wafer W in the transfer system shown in FIG. There are a signal indicating a progress status when exposing W, an error signal, and other signals. The main processor 40 controls each unit controller UC while referring to these status signals.

  Here, the reset process is a process of setting the apparatus state of the exposure apparatus EX to the initial state when the exposure apparatus EX is started up or during regular or irregular maintenance. This reset process is completed when all the individual reset processes performed in each of the unit controllers UC are completed. During the reset process, the main processor 40 communicates with each of the unit controllers UC to grasp the progress of the reset process and the progress of the entire reset process in each of the unit controllers UC.

  It should be noted that individual reset processing of a plurality of controllers constituting the unit controller UC may be performed in parallel between the start and end of the reset processing (until the entire reset processing is completed). Only the reset process of one controller may be performed. In some cases, the reset process performed by one controller includes a plurality of processes. In addition, multiple controllers may be performed in conjunction with each other.

  Next, the terminal device T provided in each exposure apparatus EX will be described. FIG. 4 is an external view of the terminal device T. As shown in FIG. 4, the terminal device T includes a terminal main body 51, a keyboard 52 and a mouse 53, and a display 54 such as a liquid crystal display device or a CRT (Cathode Ray Tube). The terminal body 51 includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), a communication interface unit, a hard disk (these are not shown), and a CD-ROM drive or DVD (registered). (Trademark) -a drive device 55 such as a ROM drive.

  Various programs read through the drive device 55 are recorded in the hard disk provided in the terminal body 51, for example. When the operator operates the keyboard 52 or the mouse 53 to activate a program corresponding to the instruction to execute a predetermined process, the execution result is displayed on the display 54. In the present embodiment, a program for displaying the progress of various processes performed by the exposure apparatus EX on the terminal device T is installed. This program communicates with the main control system CT, acquires predetermined information according to an operator's instruction from the main control system CT, and displays the progress status of various processes performed in the exposure apparatus EX.

  As long as the data related to the process (data for which the progress can be calculated) is obtained from the main control system CT among the processes performed in the exposure process EX, the terminal device T displays the progress for any process. Can be displayed. Hereinafter, a display example of the progress status of (1) reset processing, (2) wafer transfer processing, and (3) exposure processing will be described.

(1) Reset processing In order to cause the exposure apparatus EX to perform reset processing, the operator must operate the keyboard 52 or the mouse 53 to give a predetermined instruction to the terminal device T to start the reset processing program. There is. When the reset processing program is started in accordance with an operator instruction, a display window WD1 shown in FIG. FIG. 5 is a diagram illustrating a display example of the display 54 of the terminal device T during the reset process. The display window WD1 shown in FIG. 5 includes a display area R11 indicating the progress status of the entire reset process (the overall process progress status), a display area R12 displaying the progress status of the reset process of each controller constituting the unit controller UC, and a reset. A “start” button B11 for starting the process and an “end” button B12 for ending the reset process are provided.

  In the example shown in FIG. 5, a progressive bar (also referred to as a progress bar) indicating the progress of the entire reset process is provided in the display area R11. In the display area R12, a plurality of names C1 of the controllers forming the unit controller UC are displayed, and a check box C2 corresponding to each of the controller names C1 and a display field for displaying the progress of the controller in characters. C3 is provided. For example, “Body Controller” is displayed as the body controller name C1 described above, one check box is provided on the left side of the display, and the character string “Not Execute” is displayed on the right side of the screen. One display column C3 is provided. Before starting the reset process, all the display columns C3 are displayed as “Not Execute”.

  A check box C2 provided in the display region R2 is used to select whether or not to perform a reset process on the corresponding controller and whether or not to display the progress status. When the operator operates the mouse 53 and moves the mouse cursor to a display position of a check box that is not checked and performs a click operation, the check box C2 can be checked. If the same operation is performed on the check box C2 with a check, the check can be cleared. In the example shown in FIG. 5, seven check boxes C2 are displayed, but the operator can select one or more of them.

  When the operator operates the mouse 53 to select one or more of the check buttons C2, and presses the “start” button B1, a reset processing start command signal is output from the terminal device T to the main control system CT. The reset process is started. Here, it is assumed that the check boxes corresponding to the wafer loader controller 43 and the reticle loader controller are checked. When the reset process is started, the main processor 40 provided in the main control system CT outputs a control signal for starting the reset process to each of the controllers included in the unit controller UC. When this control signal is received, each of the controllers (wafer loader controller 43 and reticle loader controller) included in the unit controller UC individually starts reset processing.

  While each of the controllers provided in the unit controller UC is performing the reset process, the main processor 40 outputs an inquiry signal to each of the controllers at regular time intervals. When receiving this inquiry signal, each of the controllers provided in the unit controller UC outputs a status signal to the main processor 40. The main processor 40 that has received the status signal calculates the progress of the reset process in each controller and calculates the progress of the entire reset process. The progress of the entire reset process is, for example, 100% of the time required for the reset process due to the design of the unit controller UC, or 100% of the time required when the reset process is actually executed when the exposure apparatus EX is started up. And the ratio of the elapsed time to this time may be calculated.

  The calculated progress status of the entire reset process is displayed as a progressive bar in the display area R11, and the individual progress status of each controller is displayed as a character string in each of the display columns C3. In the example shown in FIG. 5, when the entire reset process is completed, the display of the progressive bar displayed in the display area R11 becomes 100%. When the reset process of each controller is completed, the reset process display area corresponding to the controller is displayed. The display in the display column C3 provided in R12 becomes “Completed”. Here, the character string in the display column C3 during the reset process may be displayed as the reset process execution rate (percent display) in the controller, and a character string (for example, a wafer loader) that informs the operator of the state of the controller. In the case of the controller 43, a character string indicating which part is currently being initialized) may be displayed.

  As described above, in the present embodiment, when the operator selects a plurality of check boxes C2, the progress status of the reset process individually performed by the plurality of controllers is displayed separately in each of the display columns C3, The progress of the entire reset process is displayed. Thereby, the operator can easily grasp the progress of the reset process. Further, since these displays are displayed in one display window WD1, the operator can more easily grasp the progress of the reset process.

  Furthermore, since the time required for the entire reset process to be completed can be predicted from the progressive bar displayed in the display area R11, for example, it is determined whether or not to perform other work according to the remaining time. It can be carried out. Furthermore, from the display in the display area R12, for example, when an error occurs in the reset process, the controller (unit) that caused the error can be easily identified from the display in the display area R12.

  In the example shown in FIG. 5, the progress status of the entire reset process is displayed by a progressive bar, and the progress status of the reset process in each controller is displayed by a character string. However, these are a character display, a graph display, and an illustration. It may be done by display. For example, as shown in FIG. 6, reset processing in each controller (unit) may be displayed as a bar graph. FIG. 6 is a diagram showing another display example of the display region R12 provided in the display window WD1.

  In the example illustrated in FIG. 6, the progress status of each controller (unit) is displayed as a bar graph from a portion denoted by reference symbol A0 to a portion denoted by reference symbol A1. Further, when a reset process is performed by performing a plurality of processes in one controller, the progress status of each process may be displayed hierarchically. In the example illustrated in FIG. 6, hierarchical display is performed for the controller that is displayed as Unit 4. In this example, the progress status of the processing performed in the controller is displayed by the length of the arrow from the portion labeled B0 to the portion labeled B1. When the above display is performed, the operator can immediately and intuitively grasp the progress of the reset process in each controller.

(2) Wafer Transport Processing The wafer W transport processing by the transport system of the exposure apparatus EX is performed by the operator operating the terminal device T after the FOUP 30 that stores a predetermined number of wafers W is set at the position shown in FIG. This is started when an instruction to start the exposure processing of the wafer W or an instruction to start the transfer of the wafer W is issued. Here, it is assumed that one lot of wafers (25 sheets) are stored in the FOUP 30. When an instruction is given by the operator, a signal indicating that is output from the terminal device T to the main control system CT. As a result, a control signal is output from the main control system CT to the wafer loader controller 43, and the transfer process is started.

  When a control signal is output from the main control system CT to the wafer loader controller 43, the load robot 31 takes out one wafer W from the FOUP 30 and positions the wafer W above the pre-alignment stage 32. Next, when the turntable 33 rises and moves in the + Z direction, the bottom surface of the wafer W is held by the turntable 33. In this state, when the turntable 33 is further raised or the load robot 31 is lowered, the wafer W is transferred from the load robot 31 to the turntable 33. At this time, it is assumed that the load slider 34 and the unload slider 36 are located at predetermined standby positions. The load robot 31 transfers the wafer W to the turntable 33 and then retracts to the −Y side.

  When the wafer W is held on the turntable 33, the pre-alignment stage 32 rotates the turntable 33 and the held wafer W at a predetermined angular velocity, and a notch (or orientation) of the wafer W using a sensor such as a line sensor. ) Is detected. Based on the detection result, the main control system CT detects the rotation amount θ1 of the wafer W and the eccentric amount (ΔX1, ΔY1) of the center of the wafer W in the XY two-dimensional direction with respect to the center of the turntable 33. The method for obtaining the rotation amount θ1 of the wafer W and the eccentric amount (ΔX1, ΔY1) of the center position of the wafer W is disclosed in, for example, Japanese Patent Laid-Open No. 10-12709, and detailed description thereof is omitted. This process is also called a “pre-1 measurement process” in which the rotation and position of the wafer W are roughly adjusted.

  Next, the pre-alignment stage 32 adjusts the position of the wafer W so that the detected rotation amount θ1 of the wafer W and the eccentric amount (ΔX1, ΔY1) of the center position of the wafer W are cancelled. The amount of rotation θ1 is adjusted by rotating the turntable 33, and the amount of eccentricity (ΔX1, ΔY1) is adjusted by driving the pre-alignment stage 32 in the X and Y directions. As the order of the rotation adjustment and the eccentricity adjustment, it is desirable that the eccentricity adjustment is performed first, and the rotation adjustment is performed after the eccentricity adjustment. That is, it is desirable that the pre-alignment stage 32 temporarily stops after the XY movement of the pre-alignment stage 32 and thereafter the turntable 33 is rotated.

  Next, the main control system CT moves the pre-alignment stage 32 by a predetermined distance (a constant distance) in the + Y direction. Thereby, the wafer W comes to be positioned at a position where measurement by a pre-alignment apparatus (not shown) that adjusts the position of the wafer W with high accuracy. A pre-alignment apparatus (not shown) images at least three locations on the edge of the wafer W and outputs the imaging results to the main control system CT. The main control system CT obtains the rotation amount θ2 of the wafer W from the sent imaging result. Then, the turntable 33 is rotated so that the obtained rotation amount θ2 is canceled, and the direction of the wafer W is finely adjusted to a desired direction. The process is referred to as a “pre-2 measurement process”.

Next, the wafer W is transferred from the turntable 33 to the load slider 34. In this delivery, the load slider 34 in the retracted position advances in the −Y direction by driving of the Y drive mechanism 35 and passes without interfering with the wafer W held on the turntable 33, and the finger part thereof After entering the position where the wafer W can be held, the turntable 33 is lowered. Here, after the wafer W is held on the load slider 34, the position information in the wafer coordinate system of the wafer W held on the load slider 34 by the pre-alignment apparatus (not shown) used in the pre-2 measurement step described above. It is desirable to obtain (center position coordinates (X _C , Y _C ) and rotation amount θ _C ).

  Next, the main control system CT moves the load slider 34 holding the wafer W to the loading position by moving it in the + Y direction by a predetermined distance (fixed distance). The stop position of wafer stage WST at this time was calculated based on the position information of wafer W detected in the pre-2 measurement step (position information on wafer W held on load slider 34 is more desirable). The position is shifted from the designed loading position by the amount of displacement.

  Here, it is desirable to provide a “pre-3 measurement step” for detecting position information (position and rotation amount) of the load slider 34 using a mark detection system (not shown). Then, based on the position information of the wafer W detected in the pre-2 measurement process (and the detection result of the pre-3 measurement process), the load position of the wafer W estimated on the wafer stage WST is obtained. The positional deviation from the actual load position is calculated in advance. Then, the wafer W is delivered from the load slider 34 onto the wafer stage WST, and then the load slider 34 is retracted to a predetermined standby position. With the above operation, a new wafer W is held on wafer stage WST.

  When there is a wafer W (exposed wafer) on wafer stage WST, unloading of wafer W is performed in parallel with loading of wafer W by load slider 34 described above. That is, the main control system CT places the unload slider 36 at the loading position when the wafer stage WST is placed at the loading position, and before the new wafer W is loaded from the load slider 34 to the wafer stage WST. Then, control is performed to transfer the exposed wafer W from the wafer stage WST to the unload slider 36.

  When the exposed wafer W is delivered from the wafer stage WST to the unload slider 36, the unload slider 36 advances in the −Y direction by driving the Y drive mechanism 35, and delivers the wafer W to the unload robot 37. Move to the delivery position. When the movement is completed, the wafer W is transferred from the unload slider 36 to the unload robot 37. The wafer W transferred to the unload robot 37 is transferred from the unload robot 37 to the load robot 31 and returned to the FOUP 30 by the load robot 31 or transferred to a transfer system (not shown) and connected inline. To a coater / developer (not shown) (hereinafter abbreviated as “C / D”).

  If the transfer of the wafer W is performed in the transfer system of the wafer W while the transfer process described above is performed, a signal indicating that is output from the wafer loader controller 43 to the main control system CT. When there is a request from the terminal device T, this signal is output from the main control system CT to the terminal device T, and the terminal device T displays the progress of the transfer process on the display 54 based on this signal.

  FIG. 7 is a diagram illustrating a display example of the display 54 of the terminal device T during the conveyance process. The display window WD2 shown in FIG. 7 displays a display area R21 indicating the progress status of the entire transport process (overall process progress status) and the progress status of the transport process (partial process progress status) of each of the devices constituting the transport system. A display area R23 for displaying various messages (information indicating the state of the transfer system) output from the area R22 and the wafer loader controller 43 and the like is provided.

  In the example shown in FIG. 7, a progressive bar indicating the progress of the entire transport process is provided in the display area R21. This progressive bar is 100% when the transfer processing of one lot (25 wafers) of wafers W is completed. In the display area R22, each device constituting the transport system is schematically displayed. As shown in FIG. 7, the FOUP 30, the load robot 31, the pre-alignment stage 32, the load slider 34, the wafer stage WST, the unload slider 36, and the unload robot 37 are schematically displayed as blocks P0 to P6. Further, a table (not shown) for temporarily placing the wafer W to be transferred to the coater / developer (not shown) connected inline as described above, and a table (for temporarily placing the wafer W from the coater / developer) ( Are schematically shown as blocks P7 and P8, respectively.

  A block P0 representing the FOUP 30 displays the number of wafers W initially stored in the FOUP 30 (or the maximum number of wafers W that can be stored) and the remaining number of wafers W currently stored in the FOUP 30. Site d0 is provided. The other blocks P1 to P8 are provided with display parts d1 to d8 for displaying the wafer numbers of the wafers W that are being transferred among the wafers W stored in the POUP 30.

  In FIG. 7, a display “0/25” indicating that the remaining number of wafers W is 0 is displayed on the display part d0 of the block P0 indicating the FOUP 30, and the display part d2 of the block P2 representing the pre-alignment stage 32 is displayed. The wafer number “20” is displayed, the wafer number “19” is displayed on the display part d4 of the block P4 representing the wafer stage WST, and the wafer number “18” is displayed on the display part d6 of the block P6 representing the unload robot 37. The case where it is displayed is illustrated. From this display, at that time, all the wafers W are unloaded from the FOUP 30, the 18th wafer W is transferred to the unload robot 37, held on the wafer stage WST of the 19th wafer W, It can be intuitively understood that the 20th wafer W is arranged on the pre-alignment stage 30. The display of the display parts d0 to d8 provided in the blocks P0 to P9 changes according to the progress of the wafer W transfer process.

  As described above, in the present embodiment, the progress status of the transfer process for the entire lot is displayed in the display region R21, and the progress indicating which wafer W is transferred by each of the apparatuses constituting the transfer system. The situation is displayed in the display area R22. Thereby, the operator can easily grasp the progress of the conveyance process. In addition, since these displays are displayed in one display window WD2, the operator can more easily grasp the progress of the conveyance process.

  In the example shown in FIG. 5, the progress status of the entire transport process is displayed by a progressive bar, and each of the devices constituting the transport system is displayed by blocks P0 to P8. You may perform by a display, a graph display, and an illustration display. In the display area R22, each device constituting the transfer system is indicated by blocks P0 to P8, indicating which number of wafers W are transferred to which device, but the transfer status of each wafer W is displayed. May be.

  FIG. 8 is a diagram showing another display example of the display region R22 provided in the display window WD2. As shown in FIG. 8, the wafer numbers of the wafers W are sequentially displayed in the vertical direction of the screen, and the progress of the transfer for each wafer W is displayed on the right side by a progressive bar. The progress of the wafer W that has not been removed from the FOUP 30 (wafer numbers “11” to “25” in the example shown in FIG. 8) is 0%, and the wafer W that has been transferred (wafer number in the example shown in FIG. 8). For “1” to “6”), the progress is 100%. For the wafer W being transferred (wafer numbers “8” to “10” in the example shown in FIG. 8), a display corresponding to the progress is made. By performing the display shown in FIG. 8, the transfer status of each wafer W can be intuitively grasped.

(3) Exposure Process In the transfer process described in (2) above, when a new wafer W is held on wafer stage WST, the exposure process for wafer W is started. When the exposure process is started, main control system WST moves wafer stage WST holding wafer W below alignment detection system AS. When the movement is completed, first, a search mark formed on the wafer W is observed using the alignment detection system AS, and so-called search alignment is executed. For details of the search alignment, a method similar to the method disclosed in detail in, for example, Japanese Patent Laid-Open No. 2-272305 and US Pat. No. 5,151,750 corresponding thereto can be used. .

  When the search alignment is finished, representative several (about 3 to 9) wafer alignment marks formed on the wafer W are observed by the alignment detection system AS, and so-called fine alignment is executed. In this fine alignment, the main control system CT performs EGA (enhanced global alignment) calculation using the measurement results of several wafer alignment marks and the design values of each shot area recorded in advance, and the wafer W The array coordinates of all the upper shot areas are obtained.

  Then, the main control system CT compares the reticle stage RST and the wafer stage WST via the wafer driving device 23 based on the array coordinates obtained by correcting the array coordinates of the shot obtained by the above EGA calculation with the baseline amount measured in advance. Correct alignment. Thereafter, the synchronous movement of the reticle stage RST and the wafer stage WST is controlled, the exposure amount of the exposure light EL is controlled, and the position and orientation of the wafer W in the Z direction are controlled based on the detection result of the AF sensor 41. Then, the wafer W is exposed. A plurality of shot areas are set on the wafer W, and exposure is performed on all of these shot areas while synchronizing the reticle stage RST and the wafer stage WST.

  When the exposure for all the shot areas on the wafer W is completed, the exposed wafer W is unloaded by the unload slider 36 as described in (2) above, and a new wafer W is loaded by the load slider 34 along with the wafer stage. It is loaded onto WST. The exposure process is similarly performed on a new wafer W. Before the exposure process for one lot of wafers W is started, a predetermined reticle R is transferred from the reticle library (not shown) onto the reticle stage RST, and the relative alignment of the reticle R with respect to the wafer stage WST is performed. Is called. At the same time, the baseline amount is measured using the alignment detection system AS.

  FIG. 9 is a diagram showing a display example of the display 54 of the terminal device T during the exposure process. In the display window WD3 shown in FIG. 9, a display area R31 indicating the progress of the entire exposure process (overall process progress) and a display area for displaying the progress of each process included in the exposure process (partial process progress). R32 and a display area R33 for displaying various information such as position information of exposure areas and exposure conditions are provided. Here, the exposure process refers to a process of exposing the wafer W held on the wafer stage WST in a narrow sense, but in a broad sense, transport and alignment of the reticle R and the wafer W, a baseline check, and measurement of an alignment mark. Various processes (preliminary processes) performed before or after the exposure are included. The display window WD3 shown in FIG. 9 displays the progress of exposure processing (in a narrow sense) and preliminary processing.

  In the example shown in FIG. 9, a progressive bar indicating the progress of the entire exposure process including the exposure process and the preliminary process is provided in the display region R31. This progressive bar is 100% when the exposure process (including the preliminary process) for one wafer W is completed. In the display region R32, a display region E0 on which a wafer map schematically showing the outer diameter shape and shot region of the wafer W is displayed, and a display region on which the execution status of the preliminary process performed on the reticle R is displayed. E1 and a display part E2 for displaying the execution status of the preliminary processing and exposure processing or measurement processing performed on the wafer W are provided.

  The display region EO schematically shows shot areas set on the wafer W, and each shot area is given a shot number. Of the shot area displayed on the display part E0, the part corresponding to the shot area to which the exposure light EL is actually irradiated is turned on. In addition, the display portion E1 includes a lighting portion f1 that is lit while the reticle R is being transported, a lighting portion f2 that is lit while the alignment of the reticle R is being performed, and a baseline check. There is provided a lighting part f3 that is lit during the lighting. The display unit E3 includes a lighting unit f4 that is lit while the wafer W is being transferred, a lighting unit f5 that is lit while the wafer W is being aligned, and exposure or measurement (eg, illuminance). A lighting part f6 that is lit while measurement is being performed is provided.

  Therefore, when the exposure process for one lot is performed, as described above, the conveyance of the reticle R, the alignment, and the baseline check are sequentially performed. However, when these processes are actually performed, the display portion E1 is displayed. The lighting portions f1, f2, and f3 are sequentially turned on. When the wafer W is taken out from the FOUP 30 and transferred, the lighting part f4 of the display part E2 is turned on. When the alignment with respect to the wafer W transferred to the wafer stage WST is performed, the lighting part f5 of the display part E2 is turned on. To do. When the exposure process for the wafer W is started, the lighting part f6 of the display part E2 is turned on, and the shot areas irradiated with the exposure light EL are sequentially turned on. The lighting sections f1 to f6 are turned off when the processing is completed, but the exposed shot area among the shot areas displayed on the display part E1 continues to be lit until the wafer W is unloaded.

  As described above, in the present embodiment, the progress status of the entire exposure process including the preliminary process is displayed in the display area R31, and the progress status of the preliminary process and the exposure process (in a narrow sense) is displayed in the display area R32. Is done. Thereby, the operator can easily grasp the progress of the exposure process. Further, since these displays are displayed in one display window WD3, the operator can further easily grasp the progress of the exposure process.

  In the example shown in FIG. 9, the progress status of the transfer process of the entire exposure process including the preliminary process is displayed by a progressive bar, and the process statuses of the preliminary process and the exposure process (in a narrow sense) are displayed in the display area R32. However, the progress status of the exposure process in a narrow sense may be displayed with a progressive bar in the display area R31, and the exposure process status of each shot area may be displayed on the display part E0. When such a display is performed, the progressive bar of the display area R31 extends each time the shot area is exposed, and the progress status becomes 100% when the exposure of all the shot areas is completed. As a display of the exposure processing status of each shot area, for example, a display in which the brightness of the shot area is increased in accordance with the time during which the exposure light EL is irradiated (integrated exposure amount) can be considered.

  As mentioned above, although embodiment of this invention was described, this invention is not restrict | limited to the said embodiment, It can change freely within the scope of the present invention. For example, in the above-described embodiment, the case of displaying the progress status of the process performed by the exposure apparatus EX has been described as an example. However, the present invention shows the progress status of the process performed by the substrate processing apparatus other than the exposure apparatus. It can also be applied to display. Here, as the substrate processing apparatus other than the exposure apparatus, for example, an inspection apparatus that inspects a circuit formed on the substrate, an evaluation apparatus that evaluates a pattern formed on the substrate, and repair (repair) of the circuit formed on the substrate. A repair device that performs

  Moreover, each display mentioned above with respect to the display 54 provided in the terminal device T is not restrict | limited to said example, It can change freely within the scope of the present invention. For example, when the progress status of the reset process described above is displayed, the characters displayed in the display field C3 provided in the display area R12 in FIG. 5 may be displayed in different colors according to the status of the controller. Further, the display portions d0 to d8 of the blocks P1 to P8 displayed in the display region R22 shown in FIG. 7 are displayed in green, for example, when the wafer W is present, and are displayed in white when the wafer W is not present. A color-coded display such as Further, the display in the display region R32 shown in FIG.

  The exposure apparatus EX in the above embodiment may be an exposure apparatus using an immersion method as disclosed in International Publication No. 99/49504, and is an exposure apparatus that does not use an immersion method. Also good. An exposure apparatus using an immersion method is an immersion exposure apparatus that locally fills the space between the projection optical system PL and the wafer W with a liquid, such as a substrate to be exposed as disclosed in JP-A-6-124873. An immersion exposure apparatus for moving a held stage in a liquid tank, a liquid tank having a predetermined depth is formed on a stage as disclosed in JP-A-10-303114, and a substrate is held therein. Any of the immersion exposure apparatuses may be used.

  Also, the above exposure apparatus is used for manufacturing a display including a liquid crystal display element (LCD), etc., used for manufacturing a semiconductor element, and for transferring a device pattern onto a semiconductor wafer. Any of an exposure apparatus used for manufacturing a thin film magnetic head, an exposure apparatus used for transferring a device pattern onto a ceramic wafer, and an exposure apparatus used for manufacturing an image pickup device such as a CCD may be used. Furthermore, an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer to manufacture a reticle or mask used in an optical exposure apparatus, EUV exposure apparatus, X-ray exposure apparatus, electron beam exposure apparatus, or the like. There may be.

  Next, a method for manufacturing a micro device will be described. FIG. 10 is a flowchart showing an example of a manufacturing process of a microdevice (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, etc.). As shown in FIG. 10, first, in step S10 (design step), a function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and a pattern design for realizing the function is performed. Subsequently, in step S11 (mask manufacturing step), a mask (reticle) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S12 (wafer manufacturing step), a wafer is manufactured using a material such as silicon.

  Next, in step S13 (wafer processing step), as will be described later, an actual circuit or the like is formed on the wafer using lithography and the like using the mask and wafer prepared in steps S10 to S12. Next, in step S14 (device assembly step), device assembly is performed using the wafer processed in step S13. This step S14 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S15 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S14 are performed. After these steps, the microdevice is completed and shipped.

  FIG. 11 is a diagram showing an example of a detailed flow of step S13 of FIG. 10 in the case of a semiconductor device. In FIG. 11, in step S21 (oxidation step), the surface of the wafer is oxidized. In step S22 (CVD step), an insulating film is formed on the wafer surface. In step S23 (electrode formation step), an electrode is formed on the wafer by vapor deposition. In step S24 (ion implantation step), ions are implanted into the wafer. Each of the above steps S21 to S24 constitutes a pretreatment process at each stage of the wafer processing, and is selected and executed according to a necessary process at each stage.

  At each stage of the wafer process, when the above-described pre-processing step is completed, the post-processing step is executed as follows. In this post-processing step, first, in step S25 (resist formation step), a photosensitive agent is applied to the wafer. In step S26 (exposure step), the circuit pattern of the mask is transferred to the wafer by the lithography system (exposure apparatus) and the exposure method described above. Next, in step S27 (development step), the exposed wafer is developed, and in step S28 (etching step), the exposed members other than the portion where the resist remains are removed by etching. In step S29 (resist removal step), the resist that has become unnecessary after the etching is removed. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the wafer.

It is a figure which shows schematic structure of the exposure apparatus with which one Embodiment of this invention is applied. It is a top perspective view showing a schematic configuration of a transfer system for a wafer W including a pre-alignment system. It is a block diagram which shows schematic structure of main control system CT. 2 is an external view of a terminal device T. FIG. It is a figure which shows the example of a display of the display 54 of the terminal device T at the time of a reset process. It is a figure which shows the other example of a display of display area R12 provided in display window WD1. It is a figure which shows the example of a display of the display of the terminal device T at the time of a conveyance process. It is a figure which shows the other example of a display of display area R22 provided in display window WD2. It is a figure which shows the example of a display of the display 54 of the terminal device T at the time of an exposure process. It is a flowchart which shows an example of the manufacturing process of a microdevice. It is a figure which shows an example of the detailed flow of step S13 of FIG. 10 in the case of a semiconductor device.

Explanation of symbols

31 Road robot (conveyance unit)
32 Pre-alignment stage (conveyance unit)
34 Load slider (transport unit)
35 Y drive mechanism (conveyance unit)
36 Unload slider (transport unit)
37 Unloading robot (transport unit)
54 Display (display device)
EX exposure equipment (substrate processing equipment)
R reticle (mask)
T terminal device (status display device)
W wafer (substrate)

Claims (23)

A progress status display method for displaying a progress status of a predetermined process in which a plurality of partial processes are executed and an entire process is performed,
And a display step of simultaneously displaying an overall process progress status indicating the progress status of the overall process and a partial process progress status indicating a progress status of at least one partial process among the plurality of partial processes. Progress display method.   2. The progress according to claim 1, wherein the display of the partial process progress status is performed for each display area that displays the partial process progress status provided corresponding to each of the plurality of partial processes. Status display method.   3. The progress status display method according to claim 1, wherein, when the partial process includes a plurality of processes, the partial process progress status is hierarchically displayed for each of the plurality of processes.   2. The display step according to claim 1, wherein at least one of the overall process progress status and the partial process progress status is displayed by at least one display method of character display, graph display, and illustration display. 4. The progress status display method according to any one of 3.   5. The progress status display method according to claim 1, wherein the display step displays the overall process progress status and the partial process progress status in the same screen area. 6. .   6. The reset process according to claim 1, wherein the predetermined process is a reset process that sets an apparatus state of a substrate processing apparatus that includes a plurality of units and performs a process on a substrate to an initial state. The progress display method according to any one of the above. The overall process progress status is a progress status from the start to the completion of the reset process,
The progress status display method according to claim 6, wherein the partial processing progress status is a progress status from the start to the completion of processing related to reset processing for each unit provided in the substrate processing apparatus.   6. The predetermined process is a transfer process in the transfer unit of a substrate processing apparatus configured to include a transfer unit for transferring a substrate and performing a process on the substrate. The progress status display method according to claim 1. The overall processing progress status is a progress status until the transfer of all of the predetermined number of the substrates is completed by the transfer processing performed in the transfer unit,
The progress display method according to claim 8, wherein the partial processing progress is a transport progress of the substrate in the transport unit.   2. The predetermined processing is processing performed on the substrate and processing related to the processing of a substrate processing apparatus that performs processing on a partitioned area set on the substrate using a laser beam. The progress status display method according to any one of claims 1 to 5. The overall process progress status is a progress status until the processing to be performed on the partitioned area on the substrate is completed,
11. The progress status display method according to claim 10, wherein the partial process progress status is a progress status of a preliminary process as a process related to a process applied to the substrate. The substrate processing apparatus is an exposure apparatus that transfers a mask pattern to each of the partition regions on the substrate,
The process related to the process performed on the substrate includes at least one process of a transfer process of the mask and the substrate and an alignment process of performing relative alignment between the mask and the substrate. 11. A progress display method according to 11. A progress status display program for displaying the progress status of a predetermined process in which a plurality of partial processes are executed and the entire process is performed,
And a display process for simultaneously displaying an overall process progress status indicating the progress status of the overall process and a partial process progress status indicating a progress status of at least one of the plurality of partial processes. Progress display program.   14. The progress according to claim 13, wherein the display of the partial process progress status is performed for each display area that displays the partial process progress status provided corresponding to each of the plurality of partial processes. Status display program.   The progress display program according to claim 13 or 14, wherein, when the partial process includes a plurality of processes, the partial process progress is displayed hierarchically for each of the plurality of processes.   The display process is a process of displaying at least one of the overall process progress status and the partial process progress status by at least one display method of character display, graph display, and illustration display. The progress status display program according to claim 15.   The progress according to any one of claims 13 to 16, wherein the display process is a process of displaying the overall process progress status and the partial process progress status in the same screen area. Status display program. A progress status display device that displays the progress status of a predetermined process in which a plurality of partial processes are executed and the entire process is performed,
A display device that simultaneously displays the overall process progress status indicating the progress status of the overall process and the partial process progress status indicating the progress status of at least one of the plurality of partial processes is provided. Progress display device.   19. The progress according to claim 18, wherein the display of the partial process progress status is performed for each display area that displays the partial process progress status provided corresponding to each of the plurality of partial processes. Status display device.   20. The progress status display apparatus according to claim 18 or 19, wherein, when the partial process includes a plurality of processes, the partial process progress status is hierarchically displayed for each of the plurality of processes.   19. The display device according to claim 18, wherein at least one of the overall process progress status and the partial process progress status is displayed by at least one display method of character display, graph display, and illustration display. The progress status display device according to any one of 20.   The progress display device according to any one of claims 18 to 21, wherein the display device displays the overall processing progress status and the partial processing progress status in the same screen area. . The progress status display method according to any one of claims 1 to 12 is used to display the overall processing progress status and the partial processing progress status, or any one of claims 18 to 22. A device manufacturing method comprising manufacturing the device while displaying the overall processing progress status and the partial processing progress status on the progress status display device according to claim 1.

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