JP4888768B2 - Substrate exposure apparatus and substrate exposure method - Google Patents

Description

  The present invention relates to a substrate exposure apparatus and a substrate exposure method that irradiate a substrate with irradiation light through an exposure mask, and more particularly to a substrate exposure apparatus and a substrate exposure method that can accurately grasp the position of a substrate.

  As shown in FIG. 8, a stage 10 of a conventional substrate exposure apparatus is provided on a base 3, a vertical movement mechanism 9 that is provided on the base 3 and is movable in the vertical direction, and on the vertical movement mechanism 9. And a chuck 2 on which the substrate 50 is disposed. The stage 10 is disposed on a horizontal movement mechanism (not shown) that is movable in the horizontal direction.

  Further, when the vertical movement mechanism moves the chuck 2 downward, the stage 10 passes through a hole (not shown) provided in the chuck 2 and a plurality of pins (not shown) that support the substrate 50. ) (See FIG. 8). Then, a substrate moving mechanism arranged in the vicinity of the stage 10 supports the lower surface of the exposed substrate 50 supported by a plurality of pins, and moves the substrate 50 from the stage 10 (see FIG. 8).

  Further, as shown in FIG. 8, the bar mirror 1 is provided on the side surface of the base 3 of the stage 10 through the fixing rod 8 so as to be at the height position of the chuck 2. A laser irradiation measurement unit 11 that receives the reflection of the laser beam LB from the bar mirror 1 and detects the horizontal position of the substrate 50 on the chuck 2 is provided on the side of the chuck 2.

  However, since the bar mirror 1 is provided on the side surface of the base 3 via the fixing rod 8, when the substrate 50 disposed on the chuck 2 is moved to the exposure position by the horizontal movement mechanism, As a result, the bar mirror 1 vibrates relatively, and the position of the chuck 2 cannot be accurately grasped. Further, when the bar mirror 1 vibrates in this manner, the fixing of the bar mirror 1 to the base 3 may be loosened, and the position of the bar mirror 1 with respect to the chuck 2 may be shifted.

  The present invention has been made in consideration of such points, and the position of the bar mirror with respect to the chuck is not displaced by the vibration of the bar mirror, and the position of the substrate disposed on the chuck can be accurately grasped. It is an object to provide an exposure apparatus and a substrate exposure method using the substrate exposure apparatus.

  The present invention includes a light source for irradiating irradiation light, an exposure mask disposed below the light source, and a pair of stages provided in parallel below the exposure mask and movable in the horizontal direction with respect to the exposure mask. Each stage has a base and a chuck provided on the base and on which the substrate is disposed, the chuck is configured substantially integrally with the base in the vertical direction, and a bar mirror is provided on the side surface of the chuck. The substrate exposure apparatus is characterized in that a laser irradiation measuring unit is provided on the side of the chuck to receive the laser beam reflected by the bar mirror and detect the horizontal position of the chuck.

  With such a configuration, the position of the bar mirror with respect to the chuck is not displaced, and the position of the substrate disposed on the chuck can be accurately grasped.

  The present invention is the substrate exposure apparatus characterized in that the chuck is connected to the base via a tilt for adjusting the size of the gap with respect to the base, and can be finely adjusted with respect to the base.

  With such a configuration, the gap with respect to the base of the chuck can be finely adjusted.

  The present invention is the substrate exposure apparatus, wherein the stage further includes a plurality of pins that protrude vertically through the chuck and lift the substrate disposed on the chuck.

  With such a configuration, the plurality of pins can lift the substrate disposed on the chuck of the stage upward, and the substrate can be easily removed from the stage.

  The present invention is a substrate exposure apparatus further comprising a substrate moving mechanism for moving a substrate lifted by a plurality of pins from a stage.

  With such a configuration, the substrate lifted by the plurality of pins can be automatically moved from the stage.

  The present invention is the substrate exposure apparatus, wherein the stage is disposed on a horizontal movement mechanism that is movable in the horizontal direction.

  With such a configuration, the substrate placed on the chuck of the stage can freely move in the horizontal direction.

  According to the present invention, the horizontal movement mechanism includes an X-direction movement mechanism that moves in one direction in the horizontal direction, and a Y-direction movement mechanism that moves in a direction orthogonal to the one direction in the horizontal direction. The substrate exposure apparatus is characterized.

  The present invention provides a substrate placement step of placing one substrate on the chuck of one stage, and a first movement for moving the one substrate placed on the chuck of one stage to an exposure position below the exposure mask. A first exposure step of exposing a substrate moved below the exposure mask with irradiation light irradiated from a light source and passing through the exposure mask, and a substrate exposed by moving a pair of stages horizontally Is moved from the exposure position below the exposure mask to the first standby position outside the exposure position, and another substrate previously placed on the chuck of the other stage at the second standby position outside the exposure position is exposed. A second moving step of moving to an exposure position below the mask, and a second exposure in which another substrate moved to the exposure position below the exposure mask is exposed by irradiation light irradiated from the light source and passing through the exposure mask. A substrate exposure method characterized by comprising: a degree, the.

  With such a configuration, the position of the bar mirror with respect to the chuck is not displaced, and the position of the substrate disposed on the chuck can be accurately grasped.

  According to the present invention, by using a chuck that is substantially integrally formed in the vertical direction with respect to the base and provided with a bar mirror on the side surface, the position of the bar mirror with respect to the chuck does not shift due to vibration of the bar mirror, and It is possible to accurately grasp the position of the substrate placed on the board.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a substrate exposure apparatus according to the present invention will be described below with reference to the drawings. Here, FIG. 1 to FIG. 7C are diagrams showing an embodiment of the present invention.

  As shown in FIGS. 1, 2, and 4, the substrate exposure apparatus includes a light source 20 for irradiating ultraviolet rays (irradiation light), an exposure mask 15 disposed below the light source 20, and a parallel below the exposure mask 15. And a pair of stages 10 a and 10 b that are movable in the horizontal direction with respect to the exposure mask 15. The exposure mask 15 is held by the mask holding unit 40 at the periphery thereof.

  As shown in FIGS. 1 to 4, each stage 10a, 10b has bases 3a, 3b and chucks 2a, 2b provided on the bases 3a, 3b on which the substrates 50a, 50b are arranged. . Among these, each chuck | zipper 2a, 2b is connected with corresponding base 3a, 3b via the tilt 5a, 5b which adjusts the magnitude | size of the clearance gap with respect to base 3a, 3b. The chucks 2a and 2b can only finely adjust the gap with respect to the bases 3a and 3b by the tilts 5a and 5b, and are substantially integrated in the vertical direction.

  Further, as shown in FIGS. 1 to 4, a bar mirror 1ya is provided on the side surface of the chuck 2a on the Y direction side. Further, a bar mirror 1yb is provided on the side surface on the Y direction side of the chuck 2b, and a bar mirror 1x is provided on the side surface on the X direction side.

  As shown in FIGS. 1 to 3, a laser irradiation measuring unit 11y is provided on the side of the chucks 2a and 2b on the Y direction side, and a laser irradiation measuring unit 11x is provided on the side of the chuck 2b on the X direction side. It has been.

  Further, as shown in FIG. 4, the stage 10b has a plurality of pins 7b that protrude vertically through the chuck 2b and lift the substrate 50b disposed on the chuck 2b.

  Further, as shown in FIG. 1, a substrate moving mechanism 60 for moving the substrate 50b thus lifted by the plurality of pins 7b from the stage 10b is disposed on the side of the stage 10b. As shown in FIGS. 5A and 5B, the substrate moving mechanism 60 has an insertion rod 61 that is inserted between a plurality of pins 7b that lift the substrate 50b and moves the substrate 50b from the stage 10b. ing.

  Although not shown, the stage 10a similarly has a plurality of pins that protrude vertically through the chuck 2a and lift the substrate 50a disposed on the chuck 2a. Then, after the pins of the stage 10a lift the substrate 50a, the substrate moving mechanism 60 can insert the insertion rod 61 between the plurality of pins lifting the substrate 50a to move the substrate 50a from the stage 10a. .

  Further, as shown in FIGS. 1, 2 and 4, the respective stages 10a and 10b are integrated and disposed on a horizontal movement mechanism 30 which is movable in the horizontal direction. The horizontal direction moving mechanism 30 includes an X direction moving mechanism 31 that moves in the X direction (one of the horizontal directions) and a Y direction that moves in the Y direction (the direction perpendicular to the one direction in the horizontal direction). And a moving mechanism 36.

  Further, as shown in FIG. 1, the laser irradiation measurement unit 11x and the laser irradiation measurement unit 11y are each connected to the control unit 11A.

  1, 2, and 4, the Y-direction moving mechanism 36 is disposed on the base 13 and extends in the Y direction, and slidably holds the rail 39. It consists of a gripping portion 38 and a Y base 37 disposed on the gripping portion 38. As shown in FIGS. 1, 2, and 4, the X-direction moving mechanism 31 is disposed on the Y base 37 and extends in the X direction, and slidably holds the rail 34. It consists of an X base 32 having a gripping recess 33.

  Further, as shown in FIG. 2, the light source 20 is provided with an ultrahigh pressure mercury lamp 20a, a parabolic mirror 21 that collects the light from the mercury lamp 20a, and reflects the light from the parabolic mirror 21. A cold mirror 22 and a spherical mirror 23 that reflects light from the cold mirror 22. A shutter 24 and an integrator lens 26 are provided between the cold mirror 22 and the spherical mirror 23.

  Incidentally, as shown in FIG. 8, the conventional chuck 2 is arranged on a vertical movement mechanism 9 that is movable in the vertical direction. For this reason, even if the bar mirror 1 is provided on the side surface of the chuck 2, the vertical position of the bar mirror 1 is shifted, so that the horizontal position of the substrate 50 on the chuck 2 cannot be accurately detected.

  On the other hand, according to the present invention, as described above, the chucks 2a and 2b are substantially integrally formed in the vertical direction with respect to the bases 3a and 3b without using the vertical movement mechanism 9. . Therefore, as shown in FIGS. 1 to 4, the bar mirror 1 can be directly provided on the side surfaces of the chucks 2a and 2b.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, after the substrate moving mechanism 60 supports the substrate (one substrate) 50a from below, it is placed on the chuck 2a of one stage 10a (first substrate placement step 81) (FIGS. 6 and 7A (a)). reference). At this time, the substrate 50a is located at the first standby position.

  Next, the pair of stages 10a and 10b is moved in the X direction (the direction of the arrow in FIG. 7A (b)) by the X direction moving mechanism 31. As a result, the substrate 50a disposed on the chuck 2a of one stage 10a moves to the exposure position below the exposure mask 15 (first movement step 82) (see FIGS. 6 and 7A (b)). At this time, since the stage 10a and the stage 10b are integrated, the substrate (other substrate) 50b1 that has been placed on the chuck 2b of the stage 10b and has already been exposed moves to the second standby position outside the exposure position. (See FIG. 7A (b)).

  Thus, when the pair of stages 10a and 10b move in the X direction by the X direction moving mechanism 31, the laser beam LBx irradiated from the laser irradiation measuring unit 11x provided on the side of the chuck 2 in the X direction is The light is reflected by the bar mirror 1x provided on the side surface in the X direction of the chuck 2 and returned to the laser irradiation measurement unit 11x (see FIGS. 1 and 7A (b)).

  Then, the control unit 11A measures the time from when the laser irradiation measurement unit 11x irradiates the laser beam LBx to when it is reflected by the bar mirror 1x and returns to the laser irradiation measurement unit 11x. Thus, the control unit 11A can calculate the distance from the laser irradiation measurement unit 11x to the bar mirror 1x, and the control unit 11A measures the positions of the substrate 50a and the substrate 50b in the X direction.

  Next, the substrate 50a moved to the lower side of the exposure mask 15 is exposed with ultraviolet rays irradiated from the light source 20 and passing through the exposure mask 15 (first exposure step 83) (FIGS. 2 and 6).

  At this time, the substrate 50a is moved in the X direction as desired by the X direction moving mechanism 31, and is moved in the Y direction as desired by the Y direction moving mechanism 36 (see FIG. 7A (c)).

  As described above, when the substrate 50a moves in the X direction and the Y direction, the control unit 11A is irradiated with the laser beam LBx by the laser irradiation measurement unit 11x, then is reflected by the bar mirror 1x, and returns to the laser irradiation measurement unit 11x. Measure the time to come. Thus, the control unit 11A calculates the distance from the laser irradiation measurement unit 11x to the bar mirror 1x, and measures the position of the substrate 50a in the X direction. Similarly, the control unit 11A measures the time from when the laser irradiation measurement unit 11y irradiates the laser beam LBy to when it is reflected by the bar mirror 1ya and returns to the laser irradiation measurement unit 11y. Thus, the control unit 11A calculates the distance from the laser irradiation measurement unit 11y to the bar mirror 1ya and measures the position of the substrate 50a in the Y direction (see FIGS. 1 and 7A (c)).

  Thus, since the control unit 11A measures the X-direction position and the Y-direction position of the substrate 50a, the control unit 11A can drive and control the X-direction moving mechanism 31 and the Y-direction moving mechanism 36.

  Next, the plurality of pins 7b lifts the substrate 50b1 disposed on the chuck 2b of the stage 10b upward. Thereafter, the substrate moving mechanism 60 inserts the insertion rod 61 between the plurality of pins 7b, supports the substrate 50b1 from below, and removes the substrate 50b1 from the stage 10b (completed second substrate removal step 84) ( FIG. 5 (a) (b), FIG. 6 and FIG. 7B (a)). Thus, the plurality of pins 7b lifts the substrate 50b disposed on the chuck 2b of the stage 10b upward, so that the substrate 50b can be easily removed from the stage 10 by the substrate moving mechanism 60.

  Next, the substrate moving mechanism 60 supports the new substrate (other substrate) 50b2 from the lower side and arranges it on the other stage 10b from which the substrate 50b1 has been removed (new second substrate arrangement step 85) (FIG. 6). And FIG. 7B (b)).

  Next, the pair of stages 10a and 10b are moved in the X direction (the direction of the arrow in FIG. 7C) by the X direction moving mechanism 31, and the exposed substrate 50a is exposed from the exposure position below the exposure mask 15. Move to the first standby position outside the position. Since the stage 10a and the stage 10b are integrated, the substrate 50b2 disposed on the other stage 10b at the second standby position outside the exposure position moves to the exposure position below the exposure mask 15 ( Second moving step 87) (see FIG. 6 and FIG. 7C (a)).

  As described above, when the pair of stages 10 is moved in the X direction by the X direction moving mechanism 31, the control unit 11A is irradiated with the laser beam LBx by the laser irradiation measuring unit 11x and then reflected by the bar mirror 1x to perform laser irradiation. The time until returning to the measurement unit 11x is measured. Thus, the control unit 11A calculates the distance from the laser irradiation measurement unit 11x to the bar mirror 1x, and measures the positions of the substrate 50a and the substrate 50b in the X direction (see FIGS. 1 and 7C (a)).

  Next, the substrate 50b2 moved to the exposure position below the exposure mask 15 is exposed with ultraviolet rays that are irradiated from the light source 20 and pass through the exposure mask 15 (second exposure step 88) (see FIGS. 2 and 6).

  At this time, the substrate 50b2 moves in the X direction as desired by the X direction moving mechanism 31, and moves in the Y direction as desired by the Y direction moving mechanism 36 (see FIG. 7C (b)).

  As described above, when the substrate 50b2 moves in the X direction and the Y direction, the control unit 11A is irradiated with the laser irradiation measurement unit 11x by the laser beam LBx, and then is reflected by the bar mirror 1x and returns to the laser irradiation measurement unit 11x. Measure the time to come. Thus, the control unit 11A calculates the distance from the laser irradiation measurement unit 11x to the bar mirror 1x, and measures the position of the laser substrate 50b2 in the X direction. Similarly, the control unit 11A measures the time from when the laser irradiation measurement unit 11y irradiates the laser beam LBy to when it is reflected by the bar mirror 1yb and returns to the laser irradiation measurement unit 11y. Thus, the control unit 11A calculates the distance from the laser irradiation measurement unit 11y to the bar mirror 1yb and measures the position of the substrate 50b2 in the Y direction (see FIGS. 1 and 7C (b)).

  Thus, since the control unit 11A measures the X-direction position and the Y-direction position of the substrate 50b2, the control unit 11A can drive and control the X-direction moving mechanism 31 and the Y-direction moving mechanism 36.

  Next, a plurality of pins (not shown) lifts the substrate 50a disposed on the chuck 2a of the stage 10a upward. Thereafter, the substrate moving mechanism 60 inserts the insertion rod 61 between the plurality of pins, supports the substrate 50a from below, and removes the substrate 50a from the stage 10a (completed first substrate removing step 89) (FIG. 5 (a) (b), FIG. 6 and FIG. 7C (c)).

  Thereafter, the respective steps are sequentially repeated from the first substrate placement step 81 (see FIG. 6).

  According to the present invention, since the bar mirrors 1x, 1ya, 1yb are provided on the side surfaces of the chucks 2a, 2b in the series of steps described above, the positions of the bar mirrors 1x, 1ya, 1yb with respect to the chucks 2a, 2b are not shifted. And the position of the board | substrates 50a and 50b arrange | positioned on chuck | zipper 2a, 2b can be grasped | ascertained correctly.

  Further, the substrate exposure apparatus of the present invention has a pair of stages 10a and 10b that are movable in the horizontal direction. Therefore, the substrates 50a and 50b can be sequentially arranged on the stage 10a and the stage 10b, and the substrates 50a and 50b to be exposed next can be prepared. As a result, the substrates 50a and 50b can be exposed quickly and efficiently.

The top view which shows embodiment of the board | substrate exposure apparatus by this invention. The side view which looked at the substrate exposure apparatus by embodiment of this invention from the arrow II direction of FIG. The side view of the stage of the substrate exposure apparatus by embodiment of this invention. The side view which looked at the substrate exposure apparatus by embodiment of this invention from the arrow IV direction of FIG. The top view which shows the aspect which moves a board | substrate by the substrate moving mechanism of the substrate exposure apparatus by embodiment of this invention. The flowchart which shows the board | substrate exposure method by embodiment of this invention. The top view which shows the aspect which arrange | positions a substrate, moves, and exposes with the substrate exposure apparatus by embodiment of this invention. The top view which shows the aspect which replaces | exchanges a board | substrate with the substrate exposure apparatus by embodiment of this invention. The top view which shows the aspect which moves, exposes, and removes a board | substrate with the substrate exposure apparatus by embodiment of this invention. The side view which shows the conventional board | substrate exposure apparatus.

Explanation of symbols

1x, 1ya, 1yb Bar mirror 2a, 2b Chuck 3a, 3b Base 5a, 5b Tilt 7b Pin 10a, 10b Stage 11x, 11y Laser irradiation measuring unit 15 Exposure mask 20 Light source 30 Horizontal direction moving mechanism 31 X direction moving mechanism 36 Y direction moving Mechanism 50a, 50b, 50b1, 50b2 Substrate 60 Substrate movement mechanism 81 Substrate placement step 82 First movement step 83 First exposure step 87 Second movement step 88 Second exposure step

Claims (7)

A light source that emits irradiation light;
An exposure mask disposed below the light source;
A pair of stages provided in parallel below the exposure mask and movable in a horizontal direction with respect to the exposure mask;
The pair of stages are movable in the horizontal direction with respect to the exposure mask as a unit,
Each stage has a base and a chuck provided on the base and on which a substrate is arranged,
The chuck is configured substantially integrally with the base in the vertical direction,
A bar mirror is provided on the side of the chuck,
A substrate exposure apparatus, wherein a laser irradiation measuring unit for detecting a horizontal position of a chuck is provided on a side of the chuck to receive a laser beam reflected by a bar mirror.   2. The substrate exposure apparatus according to claim 1, wherein the chuck is connected to the base via a tilt for adjusting a size of a gap with respect to the base, and can be finely adjusted with respect to the base.   The substrate exposure apparatus according to claim 1, wherein the stage further includes a plurality of pins that protrude vertically through the chuck and lift the substrate disposed on the chuck.   4. The substrate exposure apparatus according to claim 3, further comprising a substrate moving mechanism for moving the substrate lifted by the plurality of pins from the stage.   2. The substrate exposure apparatus according to claim 1, wherein the stage is disposed on a horizontal movement mechanism that is movable in the horizontal direction.   The horizontal movement mechanism includes an X-direction movement mechanism that moves in one direction in the horizontal direction, and a Y-direction movement mechanism that moves in a direction orthogonal to the one direction in the horizontal direction. Item 6. The substrate exposure apparatus according to Item 5. A substrate placement step of placing one substrate on the chuck of one stage;
A first moving step of moving one substrate disposed on the chuck of one stage to an exposure position below the exposure mask;
A first exposure step of exposing the one substrate moved below the exposure mask with irradiation light irradiated from a light source and passing through the exposure mask;
The pair of stages are moved horizontally to move the exposed one substrate from the exposure position below the exposure mask to the first standby position outside the exposure position, and the other one at the second standby position outside the exposure position. A second moving step of moving another substrate preliminarily arranged on the chuck of the stage to an exposure position below the exposure mask;
A second exposure step of exposing the other substrate moved to the exposure position below the exposure mask with irradiation light irradiated from a light source and passing through the exposure mask;
Equipped with a,
The pair of stages are movable in the horizontal direction with respect to the exposure mask as a unit,
In the first moving step and the second moving step, the horizontal position of the chuck is detected based on the laser beam reflected by the bar mirror provided on the chuck,
The substrate exposure method, wherein the bar mirror is provided on a side surface of the chuck .

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