JP4830668B2 - Thermoelectric conversion device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a thermoelectric conversion device that can absorb heat and dissipate heat by passing a direct current through a series circuit composed of an N-type thermoelectric element and a P-type thermoelectric element, and a manufacturing method thereof.

  Conventionally, as this type of thermoelectric conversion device, for example, the one shown in Patent Document 1 is known. In this thermoelectric conversion device, a plurality of radiating electrode members protrude from one end face of the N-type thermoelectric elements and P-type thermoelectric elements alternately arranged on the insulating substrate, protruding from the other end face. In this way, a plurality of endothermic electrode members are joined. Each of these heat-dissipating and heat-absorbing electrode members is composed of a U-shaped metal plate and joined to adjacent N-type and P-type thermoelectric elements at the bottom of the U-shape. The electrode part which electrically connects between, the thermal radiation part which protrudes from this electrode part, and the heat absorption part are provided.

Thus, the thermoelectric conversion device excellent in heat exchange efficiency can be provided by providing the heat radiating portion and the heat absorbing portion while being joined to the electrode portion without using an insulating layer.
JP 2006-93437 A

  However, in the above-described thermoelectric conversion device, moisture contained in the air flowing around the heat radiating part and the heat absorbing part, water droplets attached to the heat absorbing part due to condensation, etc., from the heat radiating part and the heat absorbing part side to the thermoelectric element side As a result, there is a problem that a short circuit or migration occurs in the series circuit on the thermoelectric element side.

  In view of the above problems, an object of the present invention is to provide a thermoelectric conversion device in which occurrence of a short circuit and migration is prevented, and a manufacturing method thereof.

  In order to achieve the above object, the present invention employs the following technical means.

  In the invention described in claim 1, a plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35). A series circuit (50), a holding plate (21, 31) formed with a plurality of through holes (43), and a first surface (21a, 31a) of the holding plate (21, 31) In a thermoelectric conversion device comprising a plurality of heat exchange elements (26, 36) held in a plurality of through holes (43) and directly connected to a plurality of electrode portions (25, 35), a plurality of heat exchange elements (26, 36) are fitted into the plurality of through holes (43) by fitting portions (45) formed on the connection side to the plurality of electrode portions (25, 35), respectively, and the holding plate (21 , 31) has a plurality of through holes (43) formed on the first surface (21a, 31a). A weir portion (21c, 31c) having a predetermined height provided so as to surround a predetermined region including the region being formed, and a seal layer (27, 37) formed in the predetermined region. It is a feature.

  Thus, by providing the weir portion (21c, 31c) on the first surface (21a, 31a) on the side where the heat exchange element (26, 36) protrudes from the holding plate (21, 31), the first surface (21a , 31a), when the sealing layer (27, 37) is formed, the weir portion (21c, 31c) can prevent the sealing agent from flowing beyond the region where the sealing layer (27, 37) is formed. It becomes possible to use the sealing agent. Thereby, the gap is filled along the complicated shape of the meshing portion between the through hole (43) of the holding plate (21, 31) and the fitting portion (45) of the heat exchange element (26, 36). It becomes possible to easily form the sealing layers (27, 37) having excellent airtightness. By forming such a sealing layer (27, 37), water droplets adhering to the heat exchange element (26, 36) due to dew condensation or the like form a gap between the through hole (43) and the fitting portion (45). It is possible to reliably prevent the penetration into the thermoelectric element (12, 13) side and prevent the occurrence of short circuit and migration on the thermoelectric element (12, 13) side due to the intrusion of water droplets. Can do. In addition, it is possible to prevent the occurrence of migration caused by ionization of the heat exchange elements (26, 36) on the first surface (21a, 31a) side of the holding plates (21, 31) and the occurrence of a short circuit due to the migration.

  The dam portions (21c, 31c) are formed on the outer peripheral portion of the holding plate (21, 31) so as to surround almost the entire area of the first surface (21a, 31a), for example, as in the invention described in claim 2. Can be provided.

  Further, as in the invention described in claim 3, the fitting portion (45) of the heat exchange element (26, 36) is a flat portion (25, 35) having substantially the same shape as the cross-sectional shape of the through hole (43). ) And side surface portions (22a, 22b, 32a, 32b) that protrude from the outer peripheral portion of the flat surface portions (25, 35) and are fitted over the entire peripheral surface of the through hole (43). If comprised, the clearance gap between a through-hole (43) and a fitting part (45) will become small, and a sealing layer (27, 37) will be provided in the 1st surface (21a, 31a) of a holding plate (21, 31). When forming, the sealing agent is less likely to leak from the gap between the through hole (43) and the fitting portion (45) to the thermoelectric element (12, 13) side. Thereby, formation of the sealing layer (27, 37) using a low-viscosity sealing agent is further facilitated.

  Furthermore, as in the invention described in claim 4, a through-hole (21b, 31b) is formed on the second surface (21b, 31b) side opposite to the heat exchange element (26, 36) protruding side of the holding plate (21, 31). 43) and a sealing portion (67) provided so as to fill a gap between the fitting portion (45), such a sealing portion (67) is formed in advance before forming the sealing layers (27, 37). Thus, when forming the seal layer (27, 37), the sealant is less likely to leak to the thermoelectric element (12, 13) side through the gap between the through hole (43) and the fitting portion (45). Become. Thereby, formation of the sealing layer (27, 37) using a low-viscosity sealing agent is further facilitated.

In the invention according to claim 3, as in the invention according to claim 5 , the fitting portion (45) is connected to the rectangular plane portion (25, 25) with respect to the through hole (43) having a rectangular cross section. 35), and further, the root portions (22a, 32a) of the two projecting surfaces (26, 36) that project from the opposing two sides of the planar portion (25, 35) and constitute the heat exchange unit, and the planar portion Side surfaces having side plate portions (22b, 32b) projecting from the remaining two sides of (25, 35) and having a predetermined height corresponding to the root portions (22a, 32a) of the projecting surfaces (26, 36). Part.

In the invention described in claim 6 , a plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35). A series circuit (50), a holding plate (21, 31) in which a plurality of through holes (43) are formed, and a plurality of protruding so as to protrude from the first surface (21a, 31a) of the holding plate (21, 31). In the thermoelectric conversion device that includes a plurality of heat exchange elements (26, 36) that are held in the through holes (43) and directly connected to the plurality of electrode portions (25, 35), a plurality of heat exchange elements ( 26, 36) are fitted into the plurality of through holes (43) by fitting portions (45) formed on the connection side to the plurality of electrode portions (25, 35), respectively, and the holding plates (21, 31) is a sealing layer (27, 37) formed on the first surface (21a, 31a). And the second surface (21b, 31b) side opposite to the first surface (21a, 31a) is formed so as to fill a gap portion between the through hole (43) and the fitting portion (45). And a seal portion (67).

  Thus, the sealing layer (27, 37) is formed on the first surface (21a, 31a) which is the protruding side of the heat exchange element (26, 36), and the second surface (21b, 31b) on the opposite side. If a seal portion (67) is provided on the side to fill the gap between the through hole (43) and the fitting portion (45), water droplets attached to the heat exchange elements (26, 36) due to condensation or the like It is possible to reliably prevent intrusion into the thermoelectric element (12, 13) side through the gap between the through hole (43) and the fitting portion (45). In addition, by forming the seal portion (67) in advance before forming the seal layer (27, 37), the seal agent fits into the through hole (43) when forming the seal layer (27, 37). It becomes difficult to leak to the thermoelectric element (12, 13) side from the gap between the joint portion (45). Thereby, it becomes possible to form easily the sealing layers (27, 37) excellent in airtightness using a low-viscosity sealing agent.

In the thermoelectric conversion device of the present invention, as in the invention described in claim 7 , for example, the plurality of electrode portions (25, 35) are integrally formed with the plurality of heat exchange elements (26, 36), respectively. Can be configured. Thereby, compared with the case where a heat exchange element (26, 36) and a separate electrode member are provided, a thermoelectric conversion apparatus can be comprised with few components.

In the invention described in claim 8 , a plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35). A series circuit (50), a holding plate (21, 31) in which a plurality of through holes (43) are formed, and a plurality of protruding so as to protrude from the first surface (21a, 31a) of the holding plate (21, 31). In the manufacturing method of a thermoelectric conversion device comprising a plurality of heat exchange elements (26, 36) held in the through holes (43) and directly connected to the plurality of electrode portions (25, 35), the plurality of through holes A holding plate (21, 31) having a weir portion (21c, 31c) of a predetermined height on the first surface (21a, 31a) so as to surround a predetermined region including the region where (43) is formed is prepared. And a plurality of electrode portions (25, 25) of the plurality of heat exchange elements (26, 36). 5) The heat exchange module constituting step for constituting the heat exchange module (20, 30) by fitting the fitting portions (45) formed on the connection side to the plurality of through holes (43), respectively, And a sealing layer forming step of forming a sealing layer (27, 37) in the predetermined region on the first surface (21a, 31a) after the heat exchange module configuration step.

  As described above, the heat exchange element (26, 36) is fitted into the through hole (43) with respect to the holding plate (21, 31) having the weir portion (21c, 31c) on the first surface (21a, 31a). After the joint portion (454) is fitted to form the heat exchange module (20, 30), the seal layer (27, 37) is formed on the inner area of the weir portion (21c, 31c) on the first surface (21a, 31a). ) Can be prevented by the weir portions (21c, 31c) from flowing out beyond the seal layer (27, 37) formation region, and therefore the seal layer (27, 37) is formed using a low-viscosity sealant. Can be formed. Thereby, the gap is filled along the complicated shape of the meshing portion between the through hole (43) of the holding plate (21, 31) and the fitting portion (45) of the heat exchange element (26, 36). Seal layers (27, 37) having excellent airtightness can be easily formed. By forming such a sealing layer (27, 37), water droplets adhering to the heat exchange element (26, 36) due to dew condensation or the like form a gap between the through hole (43) and the fitting portion (45). It is possible to reliably prevent the penetration into the thermoelectric element (12, 13) side and prevent the occurrence of short circuit and migration on the thermoelectric element (12, 13) side due to the intrusion of water droplets. Can do.

The dam portions (21c, 31c) are formed on the outer peripheral portion of the holding plate (21, 31) so as to surround almost the entire area of the first surface (21a, 31a), for example, as in the invention according to claim 9. Provided.

In this case, as in the invention according to claim 10 , in the heat exchange module configuration step, after the heat exchange module (20, 30) is configured, the heat exchange element (26, 36) When the seal portion (67) is formed on the second surface (21b, 31b) side opposite to the projecting side so as to fill a gap portion between the through hole (43) and the fitting portion (45). When the seal layer (27, 37) is formed later in the seal layer forming step, the sealant is moved from the gap between the through hole (43) and the fitting portion (45) to the thermoelectric element (12, 13) side. It becomes difficult to leak. Thereby, formation of the sealing layer (27, 37) using a low-viscosity sealing agent is further facilitated.

In the invention described in claim 11 , a plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35). A series circuit (50), a holding plate (21, 31) in which a plurality of through holes (43) are formed, and a plurality of protruding so as to protrude from the first surface (21a, 31a) of the holding plate (21, 31). In the manufacturing method of a thermoelectric conversion device comprising a plurality of heat exchange elements (26, 36) held in the through holes (43) and directly connected to the plurality of electrode portions (25, 35), the holding plate (21 , 31) fitting portions (45) formed on the connection side to the plurality of electrode portions (25, 35) of the plurality of heat exchange elements (26, 36) are respectively fitted into the plurality of through holes (43). To form a heat exchange module (20, 30), and then a holding plate ( 1, 31) on the second surface (21 b, 31 b) side opposite to the first surface (21 a, 31 a), so as to fill a gap portion between the through hole (43) and the fitting portion (45). A heat exchange module forming step for forming a seal portion (67) on the surface, and a seal layer forming step for forming a seal layer (27, 37) on the first surface (21a, 31a) after the heat exchange module forming step, It is characterized by having.

Thus, before the formation of the sealing layer (27, 37), on the second surface (21b, 31b) side opposite to the heat exchange element (26, 36) protruding side of the holding plate (21, 31), By forming the seal portion (67) in advance so as to fill the gap portion between the through hole (43) and the fitting portion (45), a sealant is formed when forming the seal layers (27, 37). Is less likely to leak to the thermoelectric element (12, 13) side through the gap between the through hole (43) and the fitting portion (45). Thereby, like the invention of Claim 12 , it becomes possible to form a sealing layer (27, 37) using a lower viscosity sealing agent. Thereby, the gap is filled along the complicated shape of the meshing portion between the through hole (43) of the holding plate (21, 31) and the fitting portion (45) of the heat exchange element (26, 36). Seal layers (27, 37) having excellent airtightness can be easily formed.

At this time, as in the invention described in claim 13 , after forming the sealing layer (27, 37), the heat exchange module (20, 30) is connected to the thermoelectric element (12, 13) side, P-type thermoelectric elements (12) and N-type thermoelectric elements (13) are alternately connected in series by the electrode portions (25, 35) directly connected to the heat exchange elements (26, 36) to form a series circuit (50). Is formed on the heat exchange module (20, 30) that is not connected to the thermoelectric element (12, 13) side. 31) It is good to form a sealing layer (27, 37) on it. Thus, since the heat exchange module (20, 30) is not connected to the thermoelectric element (12, 13) side, it is easy to inspect the formed seal layers (27, 37) such as airtightness. Can be done.

Alternatively, as in the invention described in claim 14 , before forming the seal layer (27, 37), the heat exchange module (20, 30) is connected to the thermoelectric element (12, 13) side to form a thermoelectric conversion module. (200), that is, after the thermoelectric conversion module (200) is configured, the sealing layer (21a, 31a) on the first surface (21a, 31a) of the holding plate (21, 31) of the thermoelectric conversion module (200) 27, 37) can also be formed. In this case, since there is no soldering process for the thermoelectric conversion module configuration that requires heat resistance after the seal layers (27, 37) are formed, the heat resistance after curing is formed when the seal layers (27, 37) are formed. It is also possible to use a sealing agent having a relatively low property.

Moreover, in the manufacturing method of the thermoelectric conversion apparatus of this invention, as the invention of Claim 15 , for example, a plurality of electrode parts (25, 35) are each united with a plurality of heat exchange elements (26, 36). It can be set as the structure formed in this. Thereby, compared with the case where a heat exchange element (26, 36) and a separate electrode member are provided, a thermoelectric conversion apparatus can be comprised with few components.

  Incidentally, the reference numerals in parentheses of each means described above are an example showing the correspondence with the specific means described in the embodiments described later.

(First embodiment)
The thermoelectric conversion apparatus in 1st Embodiment of this invention is shown in FIGS. 1-5, and the structure is demonstrated using FIGS. 1-4 first. FIG. 1 is a schematic diagram showing the overall configuration of the thermoelectric conversion device 100, FIG. 2 is an arrow view seen from the direction indicated by arrow II shown in FIG. 1, and FIG. 3 is a main part of the thermoelectric conversion device 100 (thermoelectric conversion module). FIG. 4 is a side view taken along line IV in FIG. 1 showing the configuration of the main part 200 of the thermoelectric conversion device 100.

  As shown in FIG. 1, the thermoelectric conversion device 100 includes a thermoelectric element substrate 10, a heat absorbing electrode substrate 20 (corresponding to the heat exchange module of the present invention), and a heat dissipation electrode substrate 30 (corresponding to the heat exchange module of the present invention). The thermoelectric conversion module 200 is configured to be housed in a case composed of a pair of case members 28 and 38.

  As shown in FIGS. 1 to 4, the thermoelectric element substrate 10 includes a first insulating substrate 11 that is a holding plate and a thermoelectric element group including a plurality of P-type and N-type thermoelectric elements 12 and 13. These are configured integrally. Specifically, a plurality of fitting holes are formed in a substantially grid pattern on the first insulating substrate 11 made of a flat insulating material (for example, glass epoxy, phenol resin, PPS resin, LCP resin, or PET resin). The P-type thermoelectric elements 12 and the N-type thermoelectric elements 13 are alternately arranged in the fitting holes.

  The P-type thermoelectric element 12 is composed of a P-type semiconductor made of a Bi-Te-based compound, and the N-type thermoelectric element 13 is a minimal part composed of an N-type semiconductor composed of a Bi-Te-based compound. The upper end surface and the lower end surface are configured to protrude from the first insulating substrate 11. In the present embodiment, about 120 pairs of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 each having a size of about 1.5 mm square are held on the first insulating substrate 11.

  Next, as shown in FIG. 1, FIG. 3, and FIG. 4, the endothermic electrode substrate 20 includes a plurality of endothermic electrode members 22 made of a flat insulating material (for example, glass epoxy, phenol resin, PPS resin, LCP resin). Or a second insulating substrate 21 (corresponding to the holding plate of the present invention) and a third insulating substrate 23 which are holding plates made of PET resin or the like, and the heat dissipation electrode substrate 30 includes a plurality of heat dissipation electrode members. 32 is a fourth insulating substrate 31 (corresponding to the holding plate of the present invention) which is a holding plate made of a flat insulating material (for example, glass epoxy, phenol resin, PPS resin, LCP resin, or PET resin) and a fifth insulating material. It is integrated with the substrate 33.

  Specifically, a plurality of fitting holes 43 (corresponding to the through-holes of the present invention) are formed in the second insulating substrate 21 and the fourth insulating substrate 31 in a substantially grid pattern, and the heat absorption in the fitting holes 43. The base portions of the electrode member 22 and the heat radiation electrode member 32 are held as fitting portions 45. The third insulating substrate 23 and the fifth insulating substrate 33 are also formed with a plurality of fitting holes in a substantially grid pattern, and the end portions of the heat absorbing electrode member 22 and the heat radiating electrode member 32 are held in the fitting holes. Has been. Thereby, the adjacent heat absorption electrode member 22 and the heat radiation electrode member 32 are arranged in a substantially grid pattern with a predetermined gap so as to be electrically insulated from each other.

  The second insulating substrate 21 and the fourth insulating substrate 31 are provided with weir portions 21c and 31c on the outer peripheral portions of the first surfaces 21a and 31a on the protruding side of the heat absorbing and radiating electrode members 22 and 32, respectively. The dam portions 21c and 31c are formed integrally with the second insulating substrate 21 and the fourth insulating substrate 31 so as to surround almost the entire area of the first surfaces 21a and 31a of the second insulating substrate 21 and the fourth insulating substrate 31. ing. In the present embodiment, the height of the dam portions 21c and 31c is about 2 to 3 mm.

  The heat absorbing electrode member 22 and the heat radiating electrode member 32 are configured so as to have a substantially U-shaped cross section as shown in FIG. 4 using a thin plate material made of a conductive metal such as a copper material. The U-shaped bottom part forms a planar heat absorbing electrode part 25 and a heat radiating electrode part 35 (corresponding to the electrode part of the present invention), and heat is absorbed in a plane extending outward from the electrode parts 25, 35. And louvers 26 and 36 (corresponding to the heat exchange element of the present invention and the protruding surface) are formed. It is desirable to select a plate material having a plate thickness of 0.2 to 0.3 mm as a plate material for forming the endothermic and heat radiation electrode members 22 and 32, since the workability can be improved.

  The heat absorbing electrode member 22 and the heat radiating electrode member 32 are soldered to the thermoelectric elements 12 and 13 of the thermoelectric element substrate 10 at their electrode portions 25 and 35. Specifically, as shown in FIGS. 1, 3, and 4, the endothermic electrode member 22 is joined to the upper end surfaces of the thermoelectric elements 12, 13, and the radiating electrode member 32 is the lower end surface of the thermoelectric elements 12, 13. It is joined to.

  The electrode portions 25 and 35 are electrodes that electrically connect adjacent P-type thermoelectric elements 12 and N-type thermoelectric elements 13 among the thermoelectric element groups arranged on the thermoelectric element substrate 10. Specifically, as shown in FIG. 1, the endothermic electrode portion 25 connects the thermoelectric elements 13 and 12 so that a current flows from the adjacent N-type thermoelectric element 13 toward the P-type thermoelectric element 12. The heat dissipation electrode part 35 connects the thermoelectric elements 12 and 13 so that a current flows from the adjacent P-type thermoelectric element 12 toward the N-type thermoelectric element 13. Thereby, all the thermoelectric elements 12 and 13 are connected in series, and the series circuit 50 is formed.

  Further, the louvers 26 and 36 as heat exchange parts transmit heat absorption, heat absorption from the heat radiation electrode parts 25 and 35 and heat radiation, and radiate heat from the fluid in contact with the louver 26 to heat absorption or fluid in contact with the louver 26. These fins are formed by molding such as cutting and raising in a plane extending from the electrode portions 25 and 35. As described above, in the present embodiment, the louvers 26 and 36 as the heat exchanging portions and the electrode portions 25 and 35 are integrally formed as a part of the heat absorbing and radiating electrode portions 25 and 35.

  Note that the end portion of the endothermic electrode member 22 and the heat dissipating electrode member 32 are held in the fitting holes 43 formed in the second and fourth insulating substrates 21 and 31 as described above. Yes. As shown in FIGS. 1, 3, and 4, the fitting hole 43 penetrates from the first surfaces 21a, 31a of the second and fourth insulating substrates 21, 31 to the second surfaces 21b, 31b on the opposite side. The fitting portion 45 of the heat absorbing and radiating electrode members 22 and 32 is held in the through-hole 43, and the louvers 26 and 36 protrude from the first surfaces 21a and 31a, and the heat absorbing and radiating electrode portions 25 and 35 are configured to slightly protrude from the second surfaces 21b and 31b to the thermoelectric elements 12 and 13 side. Therefore, the louvers 26 and 36 which are heat exchange portions are prevented from protruding to the thermoelectric elements 12 and 13 side.

  Further, the tip portions of the heat absorbing electrode member 22 and the heat radiating electrode member 32 are held by the third insulating substrate 23 or the fifth insulating substrate 33 as described above, and the tips thereof are the upper surface of the third insulating substrate 23 or the fifth insulating substrate 23. It is configured to protrude slightly from the lower surface of the insulating substrate 33.

  In the series circuit 50 formed by connecting the thermoelectric elements 12 and 13 by the electrode portions 25 and 35, the thermoelectric elements 12 and 13 disposed at the ends thereof (the left and right thermoelectric elements 12a and 12a in FIG. 1 and FIG. 3). 13a) are provided with connection terminals 24a and 24b, respectively, and a positive side terminal and a negative side terminal of a DC power source (not shown) are connected to the connection terminals 24a and 24b, respectively.

  In the thermoelectric conversion module 200 configured as described above, when a voltage is applied to the connection terminal 24a as described above, a direct current is applied from the P-type thermoelectric element 12a to the adjacent N-type thermoelectric element 13 via the heat radiation electrode portion 35. In addition, a direct current flows through the series circuit 50 between the thermoelectric elements 12a and 13a at both ends, such as flowing from the N-type thermoelectric element 13 to the P-type thermoelectric element 12 through the heat absorbing electrode portion 25.

  At this time, the heat radiation electrode portion 35 disposed in the PN junction portion is in a high temperature state due to the Peltier effect, and the heat absorption electrode portion 25 disposed in the NP junction portion is in a low temperature state. The heat from the heat radiating electrode portion 35 is transmitted to the louver 36 of the heat radiating electrode member 32 and is radiated to the cooling fluid in contact with the louver 36. Further, the endothermic heat from the endothermic electrode portion 25 is transmitted to the louver 26 of the endothermic electrode member 22 and is absorbed from the fluid to be cooled that is in contact with the louver 26.

  Therefore, as shown in FIG. 1, the thermoelectric element substrate 10 is used as a partition wall, and the air passages are formed on the heat absorption electrode member 22 side and the heat radiation electrode member 32 side on both sides of the thermoelectric element substrate 10 by the case members 28 and 38, respectively. Then, heat is exchanged between the louvers 26, 36 and the air by circulating the air through the air passage, whereby the air flowing through the endothermic electrode member 22 side passage is cooled, and the heat dissipation side electrode member 32. The air flowing through the side passage is heated.

  At this time, in the thermoelectric conversion device 100, the louvers 26 and 36 that are heat exchange parts are connected without being insulated from the heat absorption parts and the electrode parts 25 and 35 that are heat radiation parts of the series circuit 50 as described above. Therefore, high heat exchange efficiency can be obtained. However, since an insulating substrate or the like is not disposed between the louvers 26 and 36 and the thermoelectric elements 12 and 13 side, water droplets adhering to the heat-absorbing side louver 26 due to condensation or air flowing through the louvers 26 and 36. The moisture contained in the thermoelectric elements 12 and 13 from the gaps between the fitting holes 43 of the second and fourth insulating substrates 21 and 31 and the heat absorption and fitting portions 45 of the heat radiation electrode members 22 and 32. May penetrate.

  Therefore, in the present thermoelectric conversion device 100, in order to prevent such water droplets from entering the thermoelectric elements 12 and 13, the first seal is formed on the first surfaces 21a and 31a of the second and fourth insulating substrates 21 and 31. A layer 27 and a second seal layer 37 (corresponding to the seal layer of the present invention) are provided. As shown in FIGS. 1, 3 and 4, the first seal layer 27 and the second seal layer 37 are formed in the inner regions of the weir portions 21 c and 31 c of the second and fourth insulating substrates 21 and 31, that is, It is formed over almost the entire area of one surface 21a, 31a and extends to the inside of the fitting portion 45 of the heat absorbing electrode member 22 and the heat radiating electrode member 32 (the back side of the electrode portions 25, 35) as shown in FIG. Is formed. In the present embodiment, the first and second seal layers 27 and 37 are formed of an epoxy resin-based sealant, and have a thickness of about 2 to 3 mm, which is substantially the same as the height of the dam portions 21c and 31c. Yes.

  Next, a method for manufacturing the thermoelectric conversion device 100 having the above configuration will be described with reference to FIGS. 1 and 3 to 5. This manufacturing method includes a thermoelectric element module configuration step, a heat exchange module configuration step, a seal layer formation step, and a thermoelectric conversion module configuration step. FIG. 5 shows components related to the heat exchange module configuration step (see FIG. 4). FIG. 3 shows an outline of the thermoelectric conversion module configuration process.

  In the thermoelectric element module configuration step, first, P-type thermoelectric elements 12 and N-type thermoelectric elements 13 are alternately arranged in a plurality of fitting holes formed in a substantially grid pattern in the first insulating substrate 11 to form an adhesive. Thus, the thermoelectric element substrate 10 which is a thermoelectric element module is configured. At this time, the assembly of the thermoelectric elements 12 and 13 to the first insulating substrate 11 can be performed using, for example, a mounter device which is a manufacturing device for assembling a semiconductor, an electronic component, or the like to the control substrate.

  In the heat exchange module configuration step, the heat absorption electrode substrate 20 and the heat dissipation electrode substrate 30 which are heat exchange modules are configured. Specifically, as shown in FIG. 5, fitting portions 45 of the endothermic electrode member 22 are fitted into a plurality of fitting holes 43 formed in a substantially grid pattern in the second insulating substrate 21, and further, the endothermic electrode. The end portion of the member 22 is fitted into a fitting hole formed in the third insulating substrate 23 to constitute the endothermic electrode substrate 20.

  Similarly, the fitting portions 45 of the heat radiation electrode member 32 are fitted into a plurality of fitting holes 43 formed in a substantially grid pattern on the fourth insulating substrate 31, and the tip portion of the heat radiation electrode member 32 is fifth insulated. The heat dissipation electrode substrate 30 is configured by being fitted into a fitting hole formed in the substrate 33. In FIG. 5, only the fitting portion between the second insulating substrate 21 and the third insulating substrate 23 and the heat absorbing electrode member 22 is shown, but the fourth insulating substrate 31, the fifth insulating substrate 33 and the heat dissipation electrode member 32 are shown. The fitting part has the same configuration.

  As shown in FIG. 5, the heat absorbing electrode member 22 and the heat radiating electrode member 32 have the heat absorbing electrode part 25 and the heat radiating electrode part 35 slightly from the second surfaces 21 b and 31 b of the second and fourth insulating substrates 21 and 31. Configured to protrude. The tip portions of the heat absorbing electrode member 22 and the heat radiating electrode member 32 are configured to protrude slightly from the upper surface of the third insulating substrate 23 or the lower surface of the fifth insulating substrate 33.

  The second insulating substrate 21 and the fourth insulating substrate 31 have the dam portions 21c and 31c as shown in FIGS. 2, 3 and 4 formed on the outer peripheral portions of the first surfaces 21a and 31a in advance. Yes. The dam portions 21c and 31c are formed by integrally forming the second and fourth insulating substrates 21 and 31, or the dam portions 21c and 31c may be formed by attaching a plate material or the like with an adhesive. Is possible.

  On the other hand, the heat absorbing electrode member 22 and the heat radiating electrode member 32 are formed, for example, by forming a flat metal plate into a substantially U shape by pressing or the like, and forming a flat heat absorbing electrode portion 25 or a heat radiating electrode portion 35 at the bottom. And a plane extending outwardly from the electrode portions 25 and 35 is formed into a louver shape in advance.

  Next, in the sealing layer forming step, the second insulating substrate 21 and the first surface 21a of the fourth insulating substrate 31 with respect to the heat absorbing electrode substrate 20 and the heat radiating electrode substrate 30 configured in the heat exchange module configuration step, First and second sealing layers 27 and 37 as shown in FIGS. 1, 3 and 4 are formed on 31a. Specifically, by injecting an epoxy resin-based sealant onto the first surfaces 21a and 31a of the second insulating substrate 21 and the fourth insulating substrate 31 by a dispenser, and putting the sealant in a high temperature bath, Seal layers 27 and 37 are formed. In the present embodiment, as described above, the seal layers 27 and 37 having a thickness of about 2 to 3 mm are formed.

  In the present embodiment, the first and second seal layers 27 and 37 are formed using the epoxy resin-based sealant as described above. However, the present invention is not limited to this. For example, a silicon resin-based sealant is used. It can also be used. However, in the present embodiment, after the first and second seal layers 27 and 37 are formed, soldering between the endothermic electrode substrate 20 and the heat dissipation electrode substrate 30 and the thermoelectric element substrate 10 is performed in the thermoelectric conversion module configuration process. Therefore, a sealant that can withstand the temperature during soldering after curing is selected. Desirably, a flexible resin material having a low hardness after curing may be selected so that generation of thermal stress can be prevented.

  In the present embodiment, the weir portions 21c and 31c are provided on the first surfaces 21a and 31a of the second and fourth insulating substrates 21 and 31, so that the first and second sealing layers 27 and 37 are formed. Since the weirs 21c and 31c can prevent the sealing agent injected onto the first surfaces 21a and 31a from flowing out of the formation region of the sealing layers 27 and 37, the sealing agent having a relatively low viscosity is used. The seal layers 27 and 37 can be formed, and the seal layers 27 and 37 having a uniform predetermined thickness can be formed.

  Next, in the thermoelectric conversion module configuration process, as shown in FIG. 3, the thermoelectric conversion module 200 is configured by sandwiching and combining the thermoelectric element substrate 10 between the heat absorbing electrode substrate 20 and the heat dissipation electrode substrate 30. Specifically, the heat absorbing electrode member 22 and the electrode portions 25 and 35 of the heat radiating electrode member 32 are joined to the upper end surface or lower end surface of the thermoelectric elements 12 and 13 by soldering at the joint portions, thereby obtaining the heat absorbing electrode member. 22 and the radiation electrode member 32 and the thermoelectric elements 12 and 13 are joined. At this time, paste solder or the like is thinly and uniformly applied to the upper or lower end surfaces of the thermoelectric elements 12 and 13 in advance by screen printing, and the electrode portions 25 and 35 are joined by soldering.

  Further, as shown in FIGS. 1 and 4, a sealant is applied also to the gap 17 between the outer peripheral portion of the second insulating substrate 21 and the fourth insulating substrate 31 and the thermoelectric element substrate 10, and this and the above seal By the first and second seal layers 27 and 37 formed in the layer forming step, a seal for preventing intrusion of water droplets or the like on the thermoelectric element substrate 10 side is completed.

  Finally, the case members 28 and 38 are assembled on the upper side and the lower side of the thermoelectric conversion module 200, respectively, to form an endothermic heat exchange part and a radiant heat exchange part through which air flows. At this time, the gap between the end portions of the heat absorbing and radiating electrode members 22 and 32 (third and fifth insulating substrates 23 and 33) and the case members 28 and 38 is filled with a packing (not shown). The position of the thermoelectric converter module 200 is fixed in the cases 28 and 38.

  As described above, in the present embodiment, the weir portions 21c and 31c are provided on the outer peripheral portions of the first surfaces 21a and 31a of the second and fourth insulating substrates 21 and 31, so that the first surfaces 21a and 31a When the sealing layers 27 and 37 are formed, the weir portions 21c and 31c can prevent the sealing agent from flowing out beyond the region where the sealing layers 27 and 37 are formed, so that a low-viscosity sealing agent can be used. . Thereby, the gap is filled along the complicated shape of the meshing portion between the fitting hole 43 of the second and fourth insulating substrates 21 and 31 and the heat absorbing and fitting portion 45 of the heat radiation electrode members 22 and 32. It becomes possible to easily form the sealing layers 27 and 37 having excellent airtightness.

  Further, by forming such seal layers 27 and 37, water droplets adhering to the louver 26 due to condensation on the heat absorption side, water vapor, chemicals, dust, foreign matters, etc. contained in the air flowing through the louvers 26 and 36, It is possible to reliably prevent the thermoelectric elements 12 and 13 from entering through the gap between the fitting hole 43 and the fitting portion 45, and thereby the thermoelectric elements 12 and 13 and the electrode portions 25 and 35. Corrosion and damage, short circuit and migration can be prevented. In addition, it is possible to prevent the occurrence of migration caused by ionization of the heat exchange elements (26, 36) on the first surface (21a, 31a) side of the holding plates (21, 31) and the occurrence of a short circuit due to the migration.

  As in the present embodiment, when the sealing layers 27 and 37 are formed on the heat-absorbing electrode substrate 20 and the heat-dissipating electrode substrate 30 which are heat-exchange modules before being bonded to the thermoelectric element substrate 10, heat exchange is performed. Since the modules 20 and 30 are not joined to the thermoelectric element substrate 10, it is possible to easily inspect the airtightness and the like of the formed seal layers 27 and 37.

  In the present embodiment, the weir portions 21c and 31c are provided on the outer peripheral portions of the first surfaces 21a and 31a of the second insulating substrate 21 and the fourth insulating substrate 31, but the present invention is not limited thereto. It is only necessary that the formation region of the fitting hole 45 in the fourth insulating substrates 21 and 31 is included as an internal region of the dam portion 21c. For example, the entire first surfaces 21a and 31a of the second and fourth insulating substrates 21 and 31 are included. May be divided into several regions, and a dam portion 21c surrounding each of them may be provided.

(Second Embodiment)
A second embodiment of the present invention is shown in FIGS. In the present embodiment, the shapes of the fitting portions 45 of the heat absorbing electrode member 22 and the heat radiating electrode member 32 are changed with respect to the first embodiment. FIG. 6 is a front view showing a fitting portion between the heat absorption and radiation electrode members 22 and 32 and the second and fourth insulating substrates 21 and 31 in this embodiment, and FIG. 7 shows a similar fitting portion. It is a side view. FIG. 8 is a developed view showing the state of heat absorption and heat radiation electrode members 22 and 32 before molding.

  As shown in FIGS. 6 to 8, the heat absorbing and radiating electrode members 22 and 32 have side plate portions 22 b and 32 b (corresponding to the side surface portion of the present invention) in the fitting portion 45, which is a louver. Together with the flat base portions 22a and 32a (corresponding to the side surface portion of the present invention) and the electrode portions 25 and 35 (corresponding to the flat surface portion of the present invention) on which 26 and 36 are formed, a bathtub-shaped fitting portion 45 is formed. is doing. Due to the fitting portion 45 having such a shape, the heat absorbing and radiating electrode members 22 and 32 are fitted to the edge surface of the fitting hole 43 over the entire circumference in the fitting hole 43.

  The heat absorbing electrode member 22 and the heat radiating electrode member 32 are configured as follows, for example. As shown in FIG. 8, the rectangular portions constituting the louvers 26 and 36 and the electrode portions 25 and 35 are pressed against a flat metal plate provided with a protruding portion for forming the side plate portions 22 b and 32 b. The side plate portions 22b and 32b are formed by bending the projecting portion. Further, the flat surfaces extending outward from the electrode portions 25 and 35 are formed into a louver shape to complete the heat absorption and heat radiation electrode members 22 and 32 as shown in FIGS.

  The heat absorption and heat radiation electrode members 22 and 32 are fitted in the fitting holes 43 of the second insulating substrate 21 or the fourth insulating substrate 31 in the fitting portion 45 in the same heat exchange module configuration process as in the first embodiment. Further, the tip portion is fitted into the fitting hole of the third insulating substrate 23 or the fifth insulating substrate 33, thereby forming the heat absorbing electrode substrate 20 and the heat radiating electrode substrate 30 which are heat exchange modules.

  In addition, about the other structure in the thermoelectric conversion apparatus of this embodiment, and the process of that excepting the above in the manufacturing method, it is the same as that of the said 1st Embodiment.

  As described above, the bathtub-shaped fitting portion 45 is used as a fitting portion for fitting the heat absorbing electrode member 22 and the heat radiation electrode member 32 with the fitting hole 43 of the second insulating substrate 21 or the fourth insulating substrate 31. The gap between the fitting hole 43 and the fitting portion 45 is reduced, and the sealing agent is formed between the fitting hole 43 and the fitting portion 43 when the seal layers 27 and 37 are formed. It is difficult to leak from the gap to the thermoelectric elements 12 and 13 side. Thereby, formation of the sealing layers 27 and 37 using a low-viscosity sealing agent is further facilitated.

  In the present embodiment, the heat absorbing and radiating electrode members 22 and 32 are connected to the rectangular electrode portions 25 and 35 with respect to the rectangular fitting holes 43 formed in the second and fourth insulating substrates 21 and 31. Although it has a bathtub-shaped fitting portion 45 constituted by the base portions 22a and 32a and the side plate portions 22b and 32b of the louvers 26 and 36 protruding from the periphery thereof, not limited to this, for example, an oval shape Side portions where the heat absorbing and radiating electrode members 22 and 32 protrude from the periphery of the oval electrode portions 25 and 35 and fit around the entire circumference of the fitting hole with respect to the fitting hole. The structure which comprises the fitting part which consists of may be sufficient.

(Third embodiment)
A third embodiment of the present invention is shown in FIG. FIG. 9 shows a fitting portion between the heat absorption and radiation electrode members 22 and 32 and the second and fourth insulating substrates 21 and 31 in the present embodiment. As shown here, in the present embodiment, the heat absorbing electrode member 22 and the heat radiating electrode member 32 are provided on the second surfaces 21b and 31b side of the second insulating substrate 21 and the fourth insulating substrate 31 with respect to the first embodiment. Further, a seal portion 67 is provided so as to fill a gap between the fitting portion 45 and the fitting hole 43.

  In the heat exchange module configuration step similar to that of the first embodiment, the seal portion 67 is configured after the heat absorption electrode substrate 20 and the heat dissipation electrode substrate 30 that are heat exchange modules are formed, and then the second insulating substrate 21 and the fourth It is formed on the second surfaces 21 b and 31 b of the insulating substrate 31. Specifically, for example, it is formed by applying a relatively high-viscosity epoxy resin-based sealing agent to the gap between the fitting portion 45 and the fitting hole 43 by a dispenser or the like.

  Other configurations in the thermoelectric conversion device of the present embodiment and steps other than the above in the manufacturing method thereof are the same as those in the first embodiment.

  As described above, when the heat-absorbing electrode substrate 20 and the heat-dissipating electrode substrate 30 are configured, the heat-absorbing and heat-dissipating electrode members 22 and 32 are formed on the second surfaces 21b and 31b of the second and fourth insulating substrates 21 and 31. If the seal portion 67 is formed so as to fill the gap between the fitting portion 45 and the fitting hole 43, the fitting portion is formed when the seal layers 27 and 37 are formed in the subsequent seal layer forming step. It is possible to prevent the sealing agent from leaking through the gap between 45 and the fitting hole 43. Thereby, formation of the sealing layers 27 and 37 using a low-viscosity sealing agent is further facilitated.

  In the present embodiment, the heat absorbing electrode member 22 and the heat radiating electrode member 32 having the same shapes as those in the first embodiment are used. However, the heat absorption provided with the side plate portions 22b and 32b in the second embodiment, The radiating electrode members 22 and 32 may be used.

(Other embodiments)
In each of the above embodiments, the thermoelectric conversion module configuration step is performed after the seal layer forming step, that is, for the heat absorbing electrode substrate 20 and the heat radiating electrode substrate 30 which are heat exchange modules before being joined to the thermoelectric element substrate 10. The first and second sealing layers 27 and 37 are formed on the first surfaces 21a and 31a of the second insulating substrate 21 and the fourth insulating substrate 31, but the present invention is not limited thereto, and the heat absorbing electrode substrate 20 and the heat radiating electrode substrate 30 are not limited thereto. Are bonded to the thermoelectric element substrate 10 to form the thermoelectric conversion module 200, and then the first and second seal layers 27 and 37 are formed on the first surfaces 21a and 31a of the second insulating substrate 21 and the fourth insulating substrate 31, respectively. May be.

  According to this manufacturing method, there is no step requiring heat resistance such as soldering after the formation of the first and second seal layers 27 and 37. Therefore, when forming the first and second seal layers 27 and 37, It is also possible to use a sealant having a relatively low heat resistance after curing.

  In each of the above embodiments, the P-type thermoelectric element 12 and the N-type thermoelectric element 13 are directly connected by the electrode portions 25 and 35 of the heat absorbing electrode member 22 and the heat dissipation electrode member 32. Instead, as shown in FIG. 10, an electrode member 16 (corresponding to the electrode portion of the present invention) separate from the heat absorbing and radiating electrode members 22 and 32 is provided, whereby the adjacent P-type thermoelectric element 12 and N The structure which connects between the type | mold thermoelectric elements 13 may be sufficient.

  In this case, the electrode portions 25 and 35 of the heat absorbing and radiating electrode members 22 and 32 are joined to the electrode member 16. Specifically, in the thermoelectric element module configuration step similar to that in the first embodiment, after the thermoelectric elements 12 and 13 are assembled to the first insulating substrate 10 when the thermoelectric element substrate 10 is assembled, The electrode member 16 is joined to the upper end surface and the lower end surface of 13 by soldering, and the thermoelectric element substrate 10 is completed. In the thermoelectric conversion module configuration step, when the thermoelectric conversion module 200 is configured by joining the heat absorption electrode substrate 20 and the heat dissipation electrode substrate 30 to the thermoelectric element substrate 10, the heat absorption, electrode portions 25 of the heat dissipation electrode members 22, 32, 35 is bonded to the electrode member 16. The electrode member 16 is formed of a conductive metal such as a flat copper material.

  Thus, according to the configuration in which the electrode member 16 that is separate from the heat absorbing and radiating electrode members 22 and 32 is provided, the thermoelectric elements 12 and 13 are moved by the electrode member 16 when the thermoelectric element substrate 10 that is a thermoelectric element module is completed. Since the series circuit 50 is formed by the connection, an electrical inspection of the series circuit 50 such as a conduction failure between the thermoelectric elements 12 and 13 and the electrode member 16 is performed before the thermoelectric conversion module 200 is configured. This can be easily performed with only the thermoelectric element substrate 10.

  In the first embodiment, the heat-absorbing electrode member 22 and the heat-dissipating electrode member 32 are formed by the second and fourth insulating substrates 21 and 31 and the third and fifth insulating substrates 23 and 33, so that the root portion and the tip portion are formed. Although it was hold | maintained in both, it is not restricted to this, The 3rd insulation board | substrate 23 and the 5th insulation board | substrate 33 are removed, and the heat absorption and the thermal radiation electrode members 22 and 32 are the 2nd and 4th insulation board only in the root part. It is good also as a structure hold | maintained by 21 and 31. FIG.

  In the first to third embodiments, the thermoelectric element substrate 10 is formed by holding the plurality of thermoelectric elements 12 and 13 on the first insulating substrate 11 which is a holding plate. It is good also as a structure which does not use the 1st insulated substrate 11 by joining to any one electrode part 25 and 35 of the heat absorption electrode member 22 and the heat radiation electrode member 32, without hold | maintaining 12 and 13 to a holding plate. .

  In each of the above embodiments, the heat absorbing part 26 and the heat radiating part 36 are formed in a louver shape in the heat absorbing electrode member 22 and the heat radiating electrode member 32. However, the present invention is not limited to this, and the heat absorbing part 26 and the heat radiating part 36 are formed in an offset shape. May be. Alternatively, as the heat absorbing portion 26 and the heat radiating portion 36, corrugated fins can be formed by corrugated metal plates inside the heat absorbing and heat radiating electrode members 22 and 32 formed in a comb shape.

  In each of the above embodiments, a positive terminal of a DC power source (not shown) is connected to the connection terminal 24a side, and a negative terminal is connected to the connection terminal 24b side. The negative terminal may be connected to the connection terminal 24a side on the connection terminal 24b side. However, at this time, the upper electrode member 22 forms a heat radiating portion, and the lower electrode member 32 forms a heat absorbing portion.

  That is, the heat absorption side and the heat dissipation side can be switched by switching the flow direction of the current flowing through the series circuit 50 constituted by the thermoelectric elements 12 and 13. Incidentally, this type of thermoelectric conversion device is used, for example, for cooling a heat-generating component such as a semiconductor or an electric component or for heating a heating device or the like.

It is a schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 1st Embodiment. It is the arrow line view seen from the direction shown by arrow II in FIG. It is a disassembled block diagram which shows the structure of the principal part of the thermoelectric conversion apparatus in 1st Embodiment. FIG. 4 is a side view taken along line IV-IV shown in FIG. 1. It is a side view which shows the fitting part of the endothermic electrode member in 1st Embodiment. It is a front view which shows the fitting part of the heat absorption / radiation electrode member in 2nd Embodiment. It is a side view which shows the fitting part of the heat absorption / radiation electrode member in 2nd Embodiment. It is an expanded view which shows the structure of the heat absorption / radiation electrode member in 2nd Embodiment. It is a side view which shows the fitting part of the heat absorption / radiation electrode member in 3rd Embodiment. It is a schematic diagram which shows the structure of the principal part of the thermoelectric conversion apparatus in other embodiment.

Explanation of symbols

12 P-type thermoelectric element 13 N-type thermoelectric element 16 Electrode member (electrode part)
20 Endothermic electrode substrate (heat exchange module)
21 Second insulating substrate (holding plate)
21a 1st surface 21b 2nd surface 21c Weir part 22a Root part (side surface part) of endothermic electrode member
22b Side plate portion (side surface portion) of endothermic electrode member
25 Endothermic electrode part (plane part, electrode part)
26 louvers (heat exchange elements, protruding surfaces)
27 First seal layer (seal layer)
30 Radiation electrode substrate (heat exchange module)
31 Fourth insulating substrate (holding plate)
31a 1st surface 31b 2nd surface 31c Weir part 32a The base part (side part) of a thermal radiation electrode member
32b Side plate part (side surface part) of heat radiation electrode member
35 Heat dissipation electrode part (planar part, electrode part)
36 louvers (heat exchange element, protruding surface)
37 Second seal layer (seal layer)
43 Fitting hole (through hole)
45 Fitting part 67 Sealing part 50 Series circuit 100 Thermoelectric converter 200 Thermoelectric conversion module

Claims (15)

A plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35); The holding plate (21, 31) in which the through hole (43) is formed, and the plurality of through holes (43) so as to protrude from the first surface (21a, 31a) of the holding plate (21, 31). In a thermoelectric conversion device comprising a plurality of heat exchange elements (26, 36) held and directly connected to the plurality of electrode portions (25, 35),
The plurality of heat exchange elements (26, 36) are fitted into the plurality of through holes (43) by fitting portions (45) formed on the connection side to the plurality of electrode portions (25, 35), respectively. And
The holding plate (21, 31) is provided on the first surface (21a, 31a) so as to surround a predetermined region including a region where the plurality of through holes (43) are formed. A thermoelectric conversion device comprising a weir portion (21c, 31c) having a height of approximately 15 mm and a sealing layer (27, 37) formed in the predetermined region.   The said dam part (21c, 31c) is provided in the outer peripheral part of the said holding | maintenance board (21, 31) so that substantially the whole area | region of the said 1st surface (21a, 31a) may be surrounded. Item 2. The thermoelectric conversion device according to Item 1. The fitting portion (45) includes a plane portion (25, 35) having substantially the same cross-sectional shape as the through hole (43), and a side surface portion protruding from the outer peripheral portion of the plane portion (25, 35). 22a, 22b, 32a, 32b)
The said side part (22a, 22b, 32a, 32b) is fitted over the perimeter of the said through-hole (43) over the perimeter in the said through-hole (43). Or the thermoelectric conversion apparatus of 2.   The holding plate (21, 31) has the through hole (43), the fitting portion (45), and the second surface (21b, 31b) side opposite to the first surface (21a, 31a). The thermoelectric conversion device according to any one of claims 1 to 3, further comprising a seal portion (67) formed so as to fill a gap portion therebetween. The through hole (43) has a rectangular cross section;
The fitting part (45) has a rectangular flat part (25, 35) as the flat part, and the first part from two opposite sides of the outer periphery of the flat part (25, 35) as the side part. From the base part (22a, 32a) of the two projecting surfaces (26, 36) that project to the surface (21a, 31a) side and constitute the heat exchanging part, and the remaining two sides of the plane part (25, 35) The thermoelectric conversion device according to claim 3, further comprising two side plate portions (22b, 32b) protruding at predetermined rising heights corresponding to the root portions (22a, 32a). A plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35); The holding plate (21, 31) in which the through hole (43) is formed, and the plurality of through holes (43) so as to protrude from the first surface (21a, 31a) of the holding plate (21, 31). In a thermoelectric conversion device comprising a plurality of heat exchange elements (26, 36) held and directly connected to the plurality of electrode portions (25, 35),
The plurality of heat exchange elements (26, 36) are fitted into the plurality of through holes (43) by fitting portions (45) formed on the connection side to the plurality of electrode portions (25, 35), respectively. And
The holding plate (21, 31) is a seal layer (27, 37) formed on the first surface (21a, 31a) and a second side opposite to the first surface (21a, 31a). A thermoelectric conversion comprising a seal portion (67) formed so as to fill a gap portion between the through hole (43) and the fitting portion (45) on the surface (21b, 31b) side. apparatus. The thermoelectric device according to any one of claims 1 to 6 , wherein the plurality of electrode portions (25, 35) are integrally formed with the plurality of heat exchange elements (26, 36), respectively. Conversion device. A plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35); The holding plate (21, 31) in which the through hole (43) is formed, and the plurality of through holes (43) so as to protrude from the first surface (21a, 31a) of the holding plate (21, 31). In a method for manufacturing a thermoelectric conversion device comprising a plurality of heat exchange elements (26, 36) held and directly connected to the plurality of electrode portions (25, 35),
The holding plate having a weir portion (21c, 31c) having a predetermined height on the first surface (21a, 31a) so as to surround a predetermined region including a region where the plurality of through holes (43) are formed. (21, 31) are prepared, and the fitting portions (45) formed on the connection side of the plurality of heat exchange elements (26, 36) to the plurality of electrode portions (25, 35) A heat exchange module constituting step of forming a heat exchange module (20, 30) by fitting in each of the through holes (43);
A thermoelectric conversion comprising a sealing layer forming step of forming a sealing layer (27, 37) in the predetermined region on the first surface (21a, 31a) after the heat exchange module constituting step. Device manufacturing method. The said dam part (21c, 31c) is provided in the outer peripheral part of the said holding | maintenance board (21, 31) so that substantially the whole area | region of the said 1st surface (21a, 31a) may be surrounded. Item 9. A method for manufacturing a thermoelectric conversion device according to Item 8 . In the heat exchange module configuration step, after configuring the heat exchange module (20, 30), the second surface (21b) opposite to the first surface (21a, 31a) of the holding plate (21, 31). in 31b) side, according to claim 8 or 9, characterized in that to form a seal portion (67) to fill a gap portion between the through the fitting portion and the hole (43) (45) Manufacturing method of the thermoelectric conversion device. A plurality of P-type thermoelectric elements (12) and a plurality of N-type thermoelectric elements (13) are alternately connected in series by a plurality of electrode portions (25, 35); The holding plate (21, 31) in which the through hole (43) is formed, and the plurality of through holes (43) so as to protrude from the first surface (21a, 31a) of the holding plate (21, 31). In a method for manufacturing a thermoelectric conversion device comprising a plurality of heat exchange elements (26, 36) held and directly connected to the plurality of electrode portions (25, 35),
Fits formed in the plurality of through holes (43) of the holding plate (21, 31) on the connection side of the plurality of heat exchange elements (26, 36) to the plurality of electrode portions (25, 35). The mating portions (45) are respectively fitted to form the heat exchange module (20, 30), and then the opposite side of the first surface (21a, 31a) of the holding plate (21, 31). On the second surface (21b, 31b) side, a heat exchange module constituting step of forming a seal portion (67) so as to fill a gap portion between the through hole (43) and the fitting portion (45);
A method for manufacturing a thermoelectric conversion device, comprising: a sealing layer forming step of forming a sealing layer (27, 37) on the first surface (21a, 31a) after the heat exchange module constituting step. The sealant used for forming the seal layer (27, 37) in the seal layer forming step has a lower viscosity than the sealant used for forming the seal portion (67) in the heat exchange module constituting step. Item 12. The method for producing a thermoelectric conversion device according to Item 10 or 11 . After the sealing layer forming step, the plurality of P portions are formed by the plurality of electrode portions (25, 35) directly connected to the plurality of heat exchange elements (26, 36) of the heat exchange module (20, 30). Thermoelectric conversion module configuration comprising a thermoelectric conversion module (200) having the series circuit (50) configured by alternately connecting a series thermoelectric element (12) and the plurality of N type thermoelectric elements (13) in series The method for manufacturing a thermoelectric conversion device according to any one of claims 8 to 12 , further comprising a step. The plurality of the heat exchange modules (20, 30) directly connected to the plurality of heat exchange elements (26, 36) after the heat exchange module configuration step and before the seal layer forming step The plurality of P-type thermoelectric elements (12) and the plurality of N-type thermoelectric elements (13) are alternately connected in series by the electrode portions (25, 35) to have the series circuit (50). The method of manufacturing a thermoelectric conversion device according to any one of claims 8 to 12 , further comprising a thermoelectric conversion module constituting step of constituting the thermoelectric conversion module (200). The thermoelectric device according to any one of claims 8 to 14 , wherein the plurality of electrode portions (25, 35) are integrally formed with the plurality of heat exchange elements (26, 36), respectively. A method for manufacturing a conversion device.

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