JP2008021931A - Thermoelectric conversion device - Google Patents

Thermoelectric conversion device Download PDF

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JP2008021931A
JP2008021931A JP2006194530A JP2006194530A JP2008021931A JP 2008021931 A JP2008021931 A JP 2008021931A JP 2006194530 A JP2006194530 A JP 2006194530A JP 2006194530 A JP2006194530 A JP 2006194530A JP 2008021931 A JP2008021931 A JP 2008021931A
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thermoelectric element
thermoelectric
heat exchange
sealing member
electrode
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Akio Matsuoka
彰夫 松岡
Isao Azeyanagi
功 畔柳
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Denso Corp
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Denso Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermoelectric conversion device capable of preventing a thermoelectric element from being soaked. <P>SOLUTION: The thermoelectric conversion device has thermoelectric elements 12 and 13 including a p-type thermoelectric element 12 and an n-type thermoelectric element 13, heat exchanging members 22 and 32 provided to exchange heat between the thermoelectric elements 12 and 13 and air, and a filmy sealing member 14 which is disposed between the thermoelectric elements 12 and 13 and heat exchanging members 22 and 32 and has an opening hole 14c bored. The thermoelectric elements 12 and 13 are bonded to the heat exchanging members 22 and 32 with solder 16 provided in the opening hole 14c, the heat exchanging members 22 and 32 have parts disposed opposite to an outer periphery of the opening hole 14c of the sealing member 14, and the heat exchanging members 22 and 32 and sealing member 14 are fixed at the parts. Consequently, the thermoelectric elements can be prevented from being soaked. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、N型熱電素子、P型熱電素子からなる直列回路に直流電流を流通させることで吸熱、放熱が得られる熱電変換装置に関するものであり、熱電素子への熱交換部材に付着する結露水の浸水防止に関する。   The present invention relates to a thermoelectric conversion device that can absorb heat and dissipate heat by passing a direct current through a series circuit composed of an N-type thermoelectric element and a P-type thermoelectric element, and condensation that adheres to a heat exchange member to the thermoelectric element. It relates to the prevention of water inundation.

従来、この種の熱電変換装置として、例えば、特許文献1のように、N型熱電素子およびP型熱電素子を含む複数の熱電素子を平面状に配設し、各熱電素子の一端面に吸熱側熱交換部材を設けるとともに、他端面に放熱側熱交換部材を設けて、それぞれの電極部が隣接する熱電素子間を電気的に直列接続するように構成している装置が知られている。   Conventionally, as this type of thermoelectric conversion device, for example, as in Patent Document 1, a plurality of thermoelectric elements including an N-type thermoelectric element and a P-type thermoelectric element are arranged in a planar shape, and one end surface of each thermoelectric element absorbs heat. 2. Description of the Related Art An apparatus is known in which a side heat exchange member is provided and a heat radiation side heat exchange member is provided on the other end surface so that each electrode portion is electrically connected in series between adjacent thermoelectric elements.

その装置では、複数の熱電素子を収容する熱電素子収容室と複数の熱交換部材を収容する熱交換部収容室とを仕切る仕切り板にそれぞれの熱交換部材が設けられている。この熱交換部材は、その断面形状がコ字状からなり、平面状の電極部と、電極部の両端から電極部と直角に延びた一対の両脚部とから形成され、その電極部が熱電素子の端面に対向するようにその両脚部が仕切り板に形成された貫通穴を貫通するように設けている。
特開平5−175556号公報
In the apparatus, each heat exchange member is provided on a partition plate that partitions a thermoelectric element accommodation chamber accommodating a plurality of thermoelectric elements and a heat exchange portion accommodation chamber accommodating a plurality of heat exchange members. This heat exchange member has a U-shaped cross section, and is formed of a planar electrode portion and a pair of both leg portions extending at right angles to the electrode portion from both ends of the electrode portion, and the electrode portion is a thermoelectric element. These leg portions are provided so as to penetrate through holes formed in the partition plate so as to face the end surface of the partition plate.
JP-A-5-175556

しかしながら、例えば、熱交換部収容室が上方に吸熱側、下方に放熱側となるように通電されると吸熱側の熱交換部材で結露水が発生する。上記特許文献1では、仕切り板の貫通穴は、熱交換部材との間が気密されていないので吸熱側の熱交換部材で発生した結露水が貫通穴を通過して熱電素子収容室側に漏れることがある。これにより、熱電素子に結露水が浸水することでマイグレーションを引き起こす問題がある。   However, for example, when the heat exchange unit accommodation chamber is energized so as to be on the heat absorption side upward and on the heat radiation side below, condensed water is generated by the heat exchange member on the heat absorption side. In Patent Document 1, since the through hole of the partition plate is not hermetically sealed with the heat exchange member, condensed water generated in the heat exchange member on the heat absorption side passes through the through hole and leaks to the thermoelectric element accommodation chamber side. Sometimes. Thereby, there exists a problem which causes migration because condensed water infiltrates into a thermoelectric element.

そこで、本発明の目的は、熱電素子への浸水を防止できる熱電変換装置を提供することにある。   Then, the objective of this invention is providing the thermoelectric conversion apparatus which can prevent the water immersion to a thermoelectric element.

上記目的を達成するために、請求項1ないし請求項12に記載の技術的手段を採用する。すなわち、請求項1に記載の発明では、空気通路内に配置され、この空気通路内を流れる空気と熱交換することで空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、この熱電素子(12、13)および空気と熱交換可能に設けられた熱交換部材(22、32)と、熱電素子(12、13)と熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
熱電素子(12、13)と熱交換部材(22、32)とは、開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、熱交換部材(22、32)には、封止部材(14)のうち開口孔(14c)の外周部と対向配置される部位が形成されており、この部位において熱交換部材(22、32)と封止部材(14)とが固着されていることを特徴としている。
In order to achieve the above object, the technical means described in claims 1 to 12 are employed. That is, the invention according to claim 1 is a thermoelectric conversion device that cools or heats air by exchanging heat with air that is disposed in the air passage and flows in the air passage,
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13), and heat exchanging members (22, 13) provided to be able to exchange heat with the thermoelectric elements (12, 13) and air 32) and a film-shaped sealing member (14) having an opening hole (14c) disposed between the thermoelectric element (12, 13) and the heat exchange member (22, 32). And
The thermoelectric elements (12, 13) and the heat exchange members (22, 32) are bonded to each other by the conductive adhesive (16) provided in the opening hole (14c), and are attached to the heat exchange members (22, 32). A portion of the sealing member (14) is formed so as to be opposed to the outer peripheral portion of the opening hole (14c), and the heat exchange member (22, 32) and the sealing member (14) are fixed to each other at this portion. It is characterized by being.

この発明によれば、開口孔(14c)の外周部と熱交換部材(22、32)の対向配置される部位とが固着されることにより、吸熱側の熱交換部材(22、32)で発生した結露水が開口孔(14c)に浸水することはない。従って、熱電素子(12、13)と熱交換部材(22、32)との接着箇所および熱電素子(12、13)への浸水を防止できる。   According to the present invention, the heat exchange member (22, 32) on the heat absorption side is generated by fixing the outer peripheral portion of the opening hole (14c) and the portion of the heat exchange member (22, 32) facing each other. Condensed water that has not been immersed in the opening hole (14c). Accordingly, it is possible to prevent the thermoelectric elements (12, 13) and the heat exchange members (22, 32) from adhering to each other and water intrusion into the thermoelectric elements (12, 13).

また、熱電素子(12、13)と熱交換部材(22、32)とを開口孔(14c)に設けられた導電性接着剤(16)によって直接接着できることにより、熱抵抗を小さくすることができる。従って、熱交換効率が上昇し熱電変換効率の向上が図れる。   Further, since the thermoelectric elements (12, 13) and the heat exchange members (22, 32) can be directly bonded by the conductive adhesive (16) provided in the opening hole (14c), the thermal resistance can be reduced. . Accordingly, the heat exchange efficiency is increased and the thermoelectric conversion efficiency can be improved.

請求項2に記載の発明では、空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、この熱電素子(12、13)および空気と熱交換可能に設けられた熱交換部材(22、32)と、熱電素子(12、13)と熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、熱電素子(12、13)と熱交換部材(22、32)とは、開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、熱電素子(12、13)には、封止部材(14)のうち開口孔(14c)の外周部と対向配置される部位が形成されており、この部位において熱電素子(12、13)と封止部材(14)とが固着されていることを特徴としている。
The invention according to claim 2 is a thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage.
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13), and heat exchanging members (22, 13) provided to be able to exchange heat with the thermoelectric elements (12, 13) and air 32) and a film-shaped sealing member (14) having an opening hole (14c) disposed between the thermoelectric element (12, 13) and the heat exchange member (22, 32). The thermoelectric elements (12, 13) and the heat exchange members (22, 32) are bonded to each other by the conductive adhesive (16) provided in the opening hole (14c), and are attached to the thermoelectric elements (12, 13). Is formed with a portion of the sealing member (14) opposite to the outer peripheral portion of the opening hole (14c), and the thermoelectric elements (12, 13) and the sealing member (14) are fixed to each other. It is characterized by being.

この発明によれば、上述の請求項1では、開口孔(14c)の外周部と熱交換部材(22、32)の対向配置される部位とを固着するように構成したが、これに限らず、開口孔(14c)の外周部と熱電素子(12、13)の対向配置される部位とを固着する構成でも良い。これにより、吸熱側の熱交換部材(22、32)で発生した結露水が開口孔(14c)を通過して熱電素子(12、13)に浸水することはない。従って、熱電素子(12、13)への浸水を防止できる。   According to the present invention, in the first aspect described above, the outer peripheral portion of the opening hole (14c) and the portion where the heat exchange members (22, 32) are arranged to face each other are fixed. Further, a configuration may be adopted in which the outer peripheral portion of the opening hole (14c) and the portion where the thermoelectric elements (12, 13) are arranged to face each other are fixed. Thereby, the dew condensation water which generate | occur | produced in the heat exchange member (22, 32) by the side of heat absorption does not pass through the opening hole (14c), and is immersed in the thermoelectric element (12, 13). Accordingly, it is possible to prevent water from entering the thermoelectric elements (12, 13).

また、開口孔(14c)が開口された状態の封止部材(14)を熱電素子(12、13)側に固着させる方が、封止部材(14)を平面状に配置することができるため開口孔(14c)の外周部を熱電素子(12、13)に容易に固着することができるとともに、気密の確保が容易である。   Further, the sealing member (14) in a state where the opening hole (14c) is opened is fixed to the thermoelectric element (12, 13) side because the sealing member (14) can be arranged in a planar shape. The outer peripheral portion of the opening hole (14c) can be easily fixed to the thermoelectric elements (12, 13), and airtightness is easily ensured.

請求項3に記載の発明では、空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、P型熱電素子(12)とN型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、この電極部材(15)および空気と熱交換可能に設けられた熱交換部材(22、32)と、電極部材(15)と熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
電極部材(15)と熱交換部材(22、32)とは、開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、電極部材(15)と熱電素子(12、13)とは、導電性接着剤(16)によって互いに接着され、熱交換部材(22、32)には、封止部材(14)のうち開口孔(14c)の外周部と対向配置される部位が形成されており、この部位において熱交換部材(22、32)と封止部材(14)とが固着されていることを特徴としている。
According to a third aspect of the present invention, there is provided a thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage.
While electrically connecting the thermoelectric element (12, 13) including the P-type thermoelectric element (12) and the N-type thermoelectric element (13), the P-type thermoelectric element (12) and the N-type thermoelectric element (13), An electrode member (15) provided so as to be able to exchange heat with these thermoelectric elements (12, 13), a heat exchange member (22, 32) provided so as to be able to exchange heat with the electrode member (15) and air, and electrodes A film-like sealing member (14) in which an opening hole (14c) is formed and disposed between the member (15) and the heat exchange member (22, 32);
The electrode member (15) and the heat exchange member (22, 32) are bonded to each other by the conductive adhesive (16) provided in the opening hole (14c), and the electrode member (15) and the thermoelectric elements (12, 13). ) Are bonded to each other by the conductive adhesive (16), and the heat exchange member (22, 32) has a portion of the sealing member (14) that is disposed opposite to the outer peripheral portion of the opening hole (14c). The heat exchange member (22, 32) and the sealing member (14) are fixed to each other at this portion.

この発明によれば、上述の請求項1では、熱電素子(12、13)と熱交換部材(22、32)とを導電性接着剤(16)で直接接着するように構成したが、これに限らず、熱電素子(12、13)と熱交換部材(22、32)との間に別体の電極部材(15)を設けて構成しても良い。   According to the present invention, in the above-described first aspect, the thermoelectric element (12, 13) and the heat exchange member (22, 32) are directly bonded with the conductive adhesive (16). Not limited to this, a separate electrode member (15) may be provided between the thermoelectric elements (12, 13) and the heat exchange members (22, 32).

この場合には、上述の請求項1と同じように、開口孔(14c)の外周部と熱交換部材(22、32)の対向配置される部位とを固着することにより、吸熱側の熱交換部材(22、32)で発生した結露水が開口孔(14c)に浸水することはない。従って、熱交換部材(22、32)と電極部材(15)との接着箇所、電極部材(15)と熱電素子(12、13)との接着箇所および熱電素子(12、13)への浸水を防止できる。   In this case, as in the first aspect, the heat exchange on the heat absorption side is performed by fixing the outer peripheral portion of the opening hole (14c) and the portion of the heat exchange member (22, 32) facing each other. Condensed water generated in the members (22, 32) is not immersed in the opening hole (14c). Therefore, the adhesion location between the heat exchange member (22, 32) and the electrode member (15), the adhesion location between the electrode member (15) and the thermoelectric element (12, 13), and water immersion in the thermoelectric element (12, 13) are prevented. Can be prevented.

請求項4に記載の発明では、空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、P型熱電素子(12)とN型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、この電極部材(15)および空気と熱交換可能に設けられた熱交換部材(22、32)と、電極部材(15)と熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
電極部材(15)と熱交換部材(22、32)とは、開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、電極部材(15)と熱電素子(12、13)とは、導電性接着剤(16)によって互いに接着され、電極部材(15)には、封止部材(14)のうち開口孔(14c)の外周部と対向配置される部位が形成されており、この部位において電極部材(15)と封止部材(14)とが固着されていることを特徴としている。
The invention according to claim 4 is a thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage.
While electrically connecting the thermoelectric element (12, 13) including the P-type thermoelectric element (12) and the N-type thermoelectric element (13), the P-type thermoelectric element (12) and the N-type thermoelectric element (13), An electrode member (15) provided so as to be able to exchange heat with these thermoelectric elements (12, 13), a heat exchange member (22, 32) provided so as to be able to exchange heat with the electrode member (15) and air, and electrodes A film-like sealing member (14) in which an opening hole (14c) is formed and disposed between the member (15) and the heat exchange member (22, 32);
The electrode member (15) and the heat exchange member (22, 32) are bonded to each other by the conductive adhesive (16) provided in the opening hole (14c), and the electrode member (15) and the thermoelectric elements (12, 13). ) Are bonded to each other by a conductive adhesive (16), and the electrode member (15) is formed with a portion of the sealing member (14) disposed opposite to the outer peripheral portion of the opening hole (14c). In this portion, the electrode member (15) and the sealing member (14) are fixed.

この発明によれば、上述の請求項3では、開口孔(14c)の外周部と熱交換部材(22、32)の対向配置される部位とを固着するように構成したが、これに限らず、開口孔(14c)の外周部と電極部材(15)の対向配置される部位とを固着する構成でも良い。これにより、吸熱側の熱交換部材(22、32)で発生した結露水が開口孔(14c)を通過して熱電素子(12、13)に浸水することはない。従って、電極部材(15)と熱電素子(12、13)との接着箇所および熱電素子(12、13)への浸水を防止できる。   According to the present invention, in the above-described third aspect, the outer peripheral portion of the opening hole (14c) and the portion where the heat exchange members (22, 32) are arranged to face each other are fixed. Further, a configuration may be adopted in which the outer peripheral portion of the opening hole (14c) and the portion of the electrode member (15) disposed to face each other are fixed. Thereby, the dew condensation water which generate | occur | produced in the heat exchange member (22, 32) by the side of heat absorption does not pass through the opening hole (14c), and is immersed in the thermoelectric element (12, 13). Accordingly, it is possible to prevent adhesion between the electrode member (15) and the thermoelectric elements (12, 13) and water immersion in the thermoelectric elements (12, 13).

請求項5に記載の発明では、空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、P型熱電素子(12)とN型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、電極部材(15)および空気と熱交換可能に設けられた熱交換部材(22、32)と、熱電素子(12、13)と電極部材(15)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
熱電素子(12、13)と電極部材(15)とは、開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、電極部材(15)と熱交換部材(22、32)とは、導電性接着剤(16)によって互いに接着され、電極部材(15)には、封止部材(14)のうち開口孔(14c)の外周部と対向配置される部位が形成されており、この部位において電極部材(15)と封止部材(14)とが固着されていることを特徴としている。
The invention according to claim 5 is a thermoelectric conversion device which is arranged in an air passage and cools or heats the air by exchanging heat with the air flowing in the air passage.
While electrically connecting the thermoelectric element (12, 13) including the P-type thermoelectric element (12) and the N-type thermoelectric element (13), the P-type thermoelectric element (12) and the N-type thermoelectric element (13), An electrode member (15) provided so as to be able to exchange heat with these thermoelectric elements (12, 13), a heat exchange member (22, 32) provided so as to be able to exchange heat with the electrode member (15) and air, and a thermoelectric element (12, 13) and an electrode member (15) and a film-like sealing member (14) in which an opening hole (14c) is formed,
The thermoelectric element (12, 13) and the electrode member (15) are bonded to each other by the conductive adhesive (16) provided in the opening hole (14c), and the electrode member (15) and the heat exchange member (22, 32). ) Are bonded to each other by a conductive adhesive (16), and the electrode member (15) is formed with a portion of the sealing member (14) disposed opposite to the outer peripheral portion of the opening hole (14c). In this portion, the electrode member (15) and the sealing member (14) are fixed.

この発明によれば、上述の請求項3、請求項4では、熱交換部材(22、32)と電極部材(15)との間に封止部材(14)を配置するように構成したが、これに限らず、熱電素子(12、13)と電極部材(15)との間に封止部材(14)を配置して開口孔(14c)の外周部と電極部材(15)の対向配置される部位とを固着するように構成しても良い。   According to the present invention, in the above-described third and fourth aspects, the sealing member (14) is arranged between the heat exchange member (22, 32) and the electrode member (15). Not limited to this, the sealing member (14) is disposed between the thermoelectric elements (12, 13) and the electrode member (15), and the outer peripheral portion of the opening hole (14c) and the electrode member (15) are disposed to face each other. You may comprise so that the site | part which adheres may adhere.

これにより、吸熱側の熱交換部材(22、32)で発生した結露水が開口孔(14c)を通過して熱電素子(12、13)に浸水することはない。従って、電極部材(15)と熱電素子(12、13)との接着箇所および熱電素子(12、13)への浸水を防止できる。   Thereby, the dew condensation water which generate | occur | produced in the heat exchange member (22, 32) by the side of heat absorption does not pass through the opening hole (14c), and is immersed in the thermoelectric element (12, 13). Accordingly, it is possible to prevent adhesion between the electrode member (15) and the thermoelectric elements (12, 13) and water immersion in the thermoelectric elements (12, 13).

請求項6に記載の発明では、空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、P型熱電素子(12)とN型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、この電極部材(15)および空気と熱交換可能に設けられた熱交換部材(22、32)と、熱電素子(12、13)と電極部材(15)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
熱電素子(12、13)と電極部材(15)とは、開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、電極部材(15)と熱交換部材(22、32)とは、導電性接着剤(16)によって互いに接着され、熱電素子(12、13)には、封止部材(14)のうち開口孔(14c)の外周部と対向配置される部位が形成されており、この部位において熱電素子(12、13)と封止部材(14)とが固着されていることを特徴としている。
The invention according to claim 6 is a thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with the air flowing in the air passage.
While electrically connecting the thermoelectric element (12, 13) including the P-type thermoelectric element (12) and the N-type thermoelectric element (13), the P-type thermoelectric element (12) and the N-type thermoelectric element (13), The thermoelectric elements (12, 13) and the electrode member (15) provided so as to be able to exchange heat, the electrode members (15) and the heat exchange members (22, 32) provided so as to be able to exchange heat with air, It has a film-like sealing member (14) in which an opening hole (14c) is formed while being arranged between the elements (12, 13) and the electrode member (15),
The thermoelectric element (12, 13) and the electrode member (15) are bonded to each other by the conductive adhesive (16) provided in the opening hole (14c), and the electrode member (15) and the heat exchange member (22, 32). ) Are bonded to each other by the conductive adhesive (16), and the thermoelectric elements (12, 13) are formed with portions of the sealing member (14) that are arranged to face the outer peripheral portion of the opening hole (14c). In this portion, the thermoelectric elements (12, 13) and the sealing member (14) are fixed.

この発明によれば、上述の請求項5では、熱電素子(12、13)と電極部材(15)との間に封止部材(14)を配置して開口孔(14c)の外周部と電極部材(15)の対向配置される部位とを固着するように構成したが、これに限らず、開口孔(14c)の外周部と熱電素子(12、13)の対向配置される部位とを固着するように構成しても良い。   According to the present invention, in claim 5 described above, the sealing member (14) is disposed between the thermoelectric element (12, 13) and the electrode member (15), and the outer peripheral portion of the opening hole (14c) and the electrode Although it comprised so that the site | part arrange | positioned facing member (15) might be fixed, not only this but the outer peripheral part of opening hole (14c) and the site | part arrange | positioned facing thermoelectric elements (12, 13) are fixed. You may comprise so that it may do.

これにより、吸熱側の熱交換部材(22、32)で発生した結露水が開口孔(14c)を通過して熱電素子(12、13)に浸水することはない。従って、熱電素子(12、13)への浸水を防止できる。   Thereby, the dew condensation water which generate | occur | produced in the heat exchange member (22, 32) by the side of heat absorption does not pass through the opening hole (14c), and is immersed in the thermoelectric element (12, 13). Accordingly, it is possible to prevent water from entering the thermoelectric elements (12, 13).

請求項7に記載の発明では、封止部材(14)は、樹脂フィルムに接着層が積層されていることを特徴としている。この発明によれば、開口孔(14c)の外周部に、熱交換部材(22、32)、電極部材(15)または熱電素子(12、13)のいずれかの対向配置される部位を容易に接着剤で固着できる。   In the invention according to claim 7, the sealing member (14) is characterized in that an adhesive layer is laminated on the resin film. According to the present invention, the portion of the heat exchange member (22, 32), the electrode member (15), or the thermoelectric element (12, 13) that is disposed opposite to the outer peripheral portion of the opening hole (14c) can be easily formed. Can be fixed with an adhesive.

また、樹脂フィルムからなる封止部材(14)は、例えば、配線パターンとスルーホールとを有するプリント基板よりも加工性が良好であるため製造上の部品コストの低減が図れる。さらに、樹脂フィルムはプリント基板よりもフレキシブル性あるため、熱交換部材(22、32)と電極部材(15)との接着箇所、電極部材(15)と熱電素子(12、13)との接着箇所が近傍に存在するような装置では熱応力が緩和されることで接着箇所の信頼性の向上が図れる。   Moreover, since the sealing member (14) made of a resin film has better processability than, for example, a printed board having a wiring pattern and a through hole, it is possible to reduce manufacturing component costs. Furthermore, since the resin film is more flexible than the printed circuit board, the adhesion location between the heat exchange member (22, 32) and the electrode member (15), the adhesion location between the electrode member (15) and the thermoelectric element (12, 13). In an apparatus in which there is in the vicinity, the reliability of the bonded portion can be improved by relaxing the thermal stress.

請求項8に記載の発明では、封止部材(14)は、接着層を有するカバーレイフィルムにより形成されていることを特徴としている。この発明によれば、開口孔(14c)の外周部に、接着剤で熱交換部材(22、32)、電極部材(15)または熱電素子(12、13)のいずれかの対向配置される部位を容易に接着剤で固着できる。さらに、樹脂フィルムに接着層を形成する工程を省略できることで部品コストの低減ができる。   The invention according to claim 8 is characterized in that the sealing member (14) is formed of a coverlay film having an adhesive layer. According to this invention, the part of the heat exchange member (22, 32), electrode member (15), or thermoelectric element (12, 13) that is disposed opposite to the outer periphery of the opening hole (14c) with an adhesive. Can be easily fixed with an adhesive. Furthermore, a part cost can be reduced by omitting the step of forming the adhesive layer on the resin film.

請求項9に記載の発明では、封止部材(14)は、樹脂フィルムにボンディングシートが積層されていることを特徴としている。この発明によれば、開口孔(14c)の外周部に、接着剤で熱交換部材(22、32)、電極部材(15)または熱電素子(12、13)のいずれかの対向配置される部位を容易に固着できる。さらに、樹脂フィルムに接着層を形成する工程を省略できることで部品コストの低減ができる。   In the invention according to claim 9, the sealing member (14) is characterized in that a bonding sheet is laminated on a resin film. According to this invention, the part of the heat exchange member (22, 32), electrode member (15), or thermoelectric element (12, 13) that is disposed opposite to the outer periphery of the opening hole (14c) with an adhesive. Can be fixed easily. Furthermore, a part cost can be reduced by omitting the step of forming the adhesive layer on the resin film.

請求項10に記載の発明では、封止部材(14)は、熱可塑性の樹脂フィルムであることを特徴としている。この発明によれば、熱可塑性の樹脂フィルムで形成することで、開口孔(14c)の外周部に熱交換部材(22、32)、電極部材(15)または熱電素子(12、13)のいずれかの対向配置される部位で押圧を掛けることで容易に固着できる。これにより、接着剤が不要となることで部品コストの低減が図れる。   The invention according to claim 10 is characterized in that the sealing member (14) is a thermoplastic resin film. According to this invention, any one of the heat exchange member (22, 32), the electrode member (15), or the thermoelectric element (12, 13) is formed on the outer peripheral portion of the opening hole (14c) by being formed of a thermoplastic resin film. It can be easily fixed by applying a pressure at the oppositely arranged parts. This eliminates the need for an adhesive, thereby reducing component costs.

請求項11に記載の発明では、封止部材(14)は、ポリイミド樹脂、ポリエチレンナフタレート樹脂、またはポリエチレンテレフタレート樹脂のいずれか一つの樹脂により形成されていることを特徴としている。   The invention according to claim 11 is characterized in that the sealing member (14) is formed of any one of a polyimide resin, a polyethylene naphthalate resin, and a polyethylene terephthalate resin.

この発明によれば、これらの樹脂フィルムはプリント基板よりも加工がし易く部品コストの低減ができる。また、開口孔(14c)の外周部に熱交換部材(22、32)、電極部材(15)または熱電素子(12、13)のいずれかの対向配置される部位で押圧を掛けることで容易に固着できる。   According to the present invention, these resin films are easier to process than printed boards, and the cost of components can be reduced. In addition, it is easy to apply pressure to the outer peripheral portion of the opening hole (14c) at a position where the heat exchange member (22, 32), the electrode member (15), or the thermoelectric element (12, 13) is disposed oppositely. Can stick.

請求項12に記載の発明では、封止部材(14)は、熱電素子(12、13)と電極部材(15)との接着箇所、電極部材(15)と熱交換部材(22、32)との接着箇所、または熱電素子(12、13)と熱交換部材(22、32)との接着箇所のいずれかが外方に露出しないようにその表面の一部または全面にシール部材(17)を塗布したことを特徴としている。   In the invention according to claim 12, the sealing member (14) includes the adhesion portion between the thermoelectric element (12, 13) and the electrode member (15), the electrode member (15), and the heat exchange member (22, 32). A sealing member (17) is provided on a part or the whole of the surface so that any one of the bonding portions of the thermoelectric element (12, 13) and the heat exchange member (22, 32) is not exposed to the outside. It is characterized by having been applied.

この発明によれば、これらの接着箇所がシール部材(17)により覆われるため結露水の浸水を防止できる。これにより、結露水による半田の成分がイオン化するマイグレーションの発生を防止することができる。   According to this invention, since these adhesion | attachment locations are covered with a sealing member (17), the infiltration of condensed water can be prevented. As a result, it is possible to prevent the occurrence of migration in which the solder components are ionized by the condensed water.

なお、上記各手段の括弧内の符号は、後述する実施形態の具体的手段との対応関係を示すものである。   In addition, the code | symbol in the bracket | parenthesis of each said means shows a corresponding relationship with the specific means of embodiment mentioned later.

(第1実施形態)
以下、本発明の第1実施形態における熱電変換装置を図1ないし図6に基づいて説明する。図1は本実施形態における固定板23を配設する前の熱電変換装置の外観形状を示す平面図であり、図2は図1に示すA−A断面図である。図3は熱電変換装置の全体構成を示す分解模式図である。また、図4は図2に示すC−C断面図であり、図5は図1に示すB−B断面図である。
(First embodiment)
Hereinafter, the thermoelectric conversion apparatus in 1st Embodiment of this invention is demonstrated based on FIG. 1 thru | or FIG. FIG. 1 is a plan view showing the external shape of the thermoelectric conversion device before the fixing plate 23 is disposed in the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA shown in FIG. FIG. 3 is an exploded schematic view showing the overall configuration of the thermoelectric converter. 4 is a cross-sectional view taken along the line CC shown in FIG. 2, and FIG. 5 is a cross-sectional view taken along the line BB shown in FIG.

本実施形態の熱電変換装置は、車両に搭載される冷却装置もしくは加熱装置に適用させた熱電変換装置であり、例えば、車両用のシートの着座部内と背当部内とにそれぞれ熱電変換装置を配設し、その熱電変換装置により冷却された冷風をシート表面から吹き出すシート空調装置に適用させている。   The thermoelectric conversion device of the present embodiment is a thermoelectric conversion device applied to a cooling device or a heating device mounted on a vehicle.For example, a thermoelectric conversion device is arranged in each of a seating portion and a backrest portion of a vehicle seat. And is applied to a sheet air conditioner that blows out the cold air cooled by the thermoelectric converter from the sheet surface.

従って、本実施形態の熱電変換装置は、設置空間の狭い車両用のシート内に搭載できるように熱電変換装置の小型化を図っている。熱電変換装置は、図1ないし図5に示すように、複数のP型熱電素子12と複数のN型熱電素子13とを所定の配列形状に配列してなる熱電素子基板10、一対の封止部材14、吸熱側に配設される吸熱熱交換部材22、放熱側に配設される放熱熱交換部材32、吸熱側に配設される第1固定板23、放熱側に配設される第2固定板33、および一対のケース部材28から構成している。   Therefore, the thermoelectric conversion device of the present embodiment is miniaturized so that the thermoelectric conversion device can be mounted in a vehicle seat having a small installation space. As shown in FIGS. 1 to 5, the thermoelectric conversion device includes a thermoelectric element substrate 10 in which a plurality of P-type thermoelectric elements 12 and a plurality of N-type thermoelectric elements 13 are arranged in a predetermined arrangement shape, and a pair of seals. Member 14, endothermic heat exchange member 22 disposed on the heat absorption side, heat radiation heat exchange member 32 disposed on the heat dissipation side, first fixing plate 23 disposed on the heat absorption side, first disposed on the heat dissipation side It consists of two fixed plates 33 and a pair of case members 28.

熱電素子基板10は、図2ないし図5に示すように、熱電素子12、13を保持する保持板11、P型、N型からなる熱電素子12、13を一体的に構成している。具体的には、絶縁材料(例えば、ガラスエポキシ、PPS樹脂、LCP樹脂もしくはPET樹脂など)からなる保持板11に、一対のP型熱電素子12とN型熱電素子13とを交互に略碁盤目状に複数対配列してなる熱電素子群を列設させて一体的に構成している。   As shown in FIGS. 2 to 5, the thermoelectric element substrate 10 integrally includes a holding plate 11 that holds the thermoelectric elements 12 and 13, and thermoelectric elements 12 and 13 that are P-type and N-type. Specifically, a pair of P-type thermoelectric elements 12 and N-type thermoelectric elements 13 are alternately arranged in a substantially grid pattern on a holding plate 11 made of an insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin). A plurality of thermoelectric element groups arranged in pairs in a line are arranged in an integral manner.

なお、保持板11は、全体が矩形状(図4参照)に形成されており、外縁を額縁状に形成し、その額縁の内側は、額縁の板厚よりも薄く形成して複数の熱電素子12、13を略碁盤目状に複数対配列している。額縁の両端に後述する一対の封止部材14が接着される。これにより、保持板11の額縁から結露水が内部に浸水することを防止している。   The holding plate 11 is formed in a rectangular shape (see FIG. 4) as a whole, and the outer edge is formed in a frame shape, and the inner side of the frame is formed thinner than the plate thickness of the frame to form a plurality of thermoelectric elements. A plurality of pairs 12 and 13 are arranged in a substantially grid pattern. A pair of sealing members 14 to be described later are bonded to both ends of the frame. This prevents the condensed water from entering the inside of the frame of the holding plate 11.

P型熱電素子12はBi−Te系化合物からなるP型半導体により構成され、N型熱電素子12はBi−Te系化合物からなるN型半導体により構成された極小部品である。なお、P型熱電素子12およびN型熱電素子13は、その上端面、下端面が保持板11の額縁面から突き出さないように形成されている。なお、熱電素子12、13は、全体形状が直方体状に形成して、保持板11の額縁とほぼ同等の板厚で形成されている。   The P-type thermoelectric element 12 is composed of a P-type semiconductor made of a Bi—Te-based compound, and the N-type thermoelectric element 12 is a minimal component composed of an N-type semiconductor made of a Bi—Te-based compound. The P-type thermoelectric element 12 and the N-type thermoelectric element 13 are formed so that the upper end surface and the lower end surface thereof do not protrude from the frame surface of the holding plate 11. The thermoelectric elements 12 and 13 are formed in a rectangular parallelepiped shape, and have a plate thickness substantially equal to the frame of the holding plate 11.

封止部材14は、熱交換部材22、32と熱電素子12、13との間に配設され、その一端面に複数の熱交換部材22、32を保持している。本実施形態では、低温側の熱交換部材22に付着した結露水が内部の熱電素子12、13自体、および熱電素子12、13と熱交換部材22、32との接合部16へ浸水させないように複数の熱交換部材22、32を封止部材14の一端面に固着させる構成としている。   The sealing member 14 is disposed between the heat exchange members 22 and 32 and the thermoelectric elements 12 and 13, and holds the plurality of heat exchange members 22 and 32 on one end face thereof. In the present embodiment, the dew condensation water adhering to the heat exchange member 22 on the low temperature side is prevented from being submerged into the internal thermoelectric elements 12, 13 themselves and the joint 16 between the thermoelectric elements 12, 13 and the heat exchange members 22, 32. The plurality of heat exchange members 22 and 32 are fixed to one end surface of the sealing member 14.

封止部材14は、樹脂フィルム状からなり、全体形状が保持板11とほぼ同等の矩形状に形成されている。さらに、封止部材14には、熱電素子基板10に配列された熱電素子群のうち、隣接するP型熱電素子12およびN型熱電素子13に対応する部位に略碁盤目状に複数の開口孔14cが形成されている。   The sealing member 14 has a resin film shape, and is formed in a rectangular shape whose overall shape is substantially the same as that of the holding plate 11. Further, the sealing member 14 includes a plurality of opening holes in a substantially grid pattern at portions corresponding to the adjacent P-type thermoelectric elements 12 and N-type thermoelectric elements 13 in the thermoelectric element group arranged on the thermoelectric element substrate 10. 14c is formed.

その開口孔14cは後述する熱交換部材22、32の電極部25、35と熱電素子12、13とが直接接合される接合部16である。つまり、後述する熱交換部材22、32の電極部25、35と熱電素子12、13とを接合するときに、開口孔14cに、半田を充填させて電極部25、35と熱電素子12、13の端面とを半田により接合する接合部16である。   The opening 14c is a joint portion 16 where the electrode portions 25 and 35 of the heat exchange members 22 and 32 described later and the thermoelectric elements 12 and 13 are directly joined. That is, when the electrode portions 25 and 35 of the heat exchange members 22 and 32 described later are joined to the thermoelectric elements 12 and 13, the opening 14 c is filled with solder to fill the electrode portions 25 and 35 and the thermoelectric elements 12 and 13. It is the junction part 16 which joins the end surface of this with solder.

従って、その開口孔14cは、電極部25、35の外形よりも小さい開口で形成されている。そして、その開口孔14cを蓋するように電極部25、35を配設して封止部材14の片面に複数の熱交換部材22、32を保持している。本実施形態では、封止部材14として、樹脂フィルム14aの両面に導電性接着剤である接着剤からなる接着層14bが積層されたカバーレイフィルムを用いている。   Therefore, the opening hole 14 c is formed with an opening smaller than the outer shape of the electrode portions 25 and 35. And the electrode parts 25 and 35 are arrange | positioned so that the opening hole 14c may be covered, and the several heat exchange members 22 and 32 are hold | maintained on the single side | surface of the sealing member 14. FIG. In the present embodiment, as the sealing member 14, a coverlay film in which an adhesive layer 14b made of an adhesive that is a conductive adhesive is laminated on both surfaces of a resin film 14a is used.

そして、隣接するP型熱電素子12およびN型熱電素子13に対応する部位に開口孔14cが形成されている。従って、開口孔14cの外周部には接着剤からなる接着層14bが形成されているため、その開口孔14cを蓋するように電極部25、35を固着することで開口孔14cの外周部を封止できる。(詳しくは、後述する製造方法における組付け手順にて記載する。)
ここで、樹脂フィルム14aは、例えば、ポリイミド樹脂、ポリエチレンナフタレート樹脂(PEN樹脂)、またはポリエチレンテレフタレート樹脂(PET樹脂)のいずれか一つの絶縁体の樹脂により形成されている。
An opening 14 c is formed in a portion corresponding to the adjacent P-type thermoelectric element 12 and N-type thermoelectric element 13. Therefore, since the adhesive layer 14b made of an adhesive is formed on the outer peripheral portion of the opening hole 14c, the outer peripheral portion of the opening hole 14c is fixed by fixing the electrode portions 25 and 35 so as to cover the opening hole 14c. Can be sealed. (Details will be described in the assembly procedure in the manufacturing method described later.)
Here, the resin film 14a is formed of, for example, a resin of any one of a polyimide resin, a polyethylene naphthalate resin (PEN resin), or a polyethylene terephthalate resin (PET resin).

なお、ここでは、封止部材14として、カバーレイフィルムを用いたが、これに限らず、樹脂フィルム14aの両面にボンディング層(例えば、半田などの導電性接着剤)14bを積層させたボンディングシートを用いても良い。   Here, a cover lay film is used as the sealing member 14, but the present invention is not limited to this, and a bonding sheet in which bonding layers (for example, a conductive adhesive such as solder) 14 b are laminated on both surfaces of the resin film 14 a. May be used.

ところで、この封止部材14には、開口孔14cに配設される熱交換部材22、32が吸熱側と放熱側とに分かれて配置される。具体的には、図2および図3に示すように、上方に配設される封止部材14には複数の吸熱熱交換部材22が配設され、下方に配設される封止部材14には複数の放熱熱交換部材32が配設される。   By the way, in this sealing member 14, the heat exchange members 22 and 32 disposed in the opening hole 14c are arranged separately on the heat absorption side and the heat dissipation side. Specifically, as shown in FIGS. 2 and 3, a plurality of endothermic heat exchange members 22 are disposed on the sealing member 14 disposed on the upper side, and the sealing member 14 disposed on the lower side is disposed on the sealing member 14 disposed on the lower side. A plurality of heat radiation heat exchange members 32 are disposed.

また、上下の封止部材14は、それぞれが熱電素子基板10の両面に配置して熱電素子12、13と熱交換部材22、32とが接合される。このときに、それぞれの封止部材14の外縁が保持板11の額縁に接着される。これにより、保持板11の額縁外方から結露水が熱電素子基板10内に浸水することはない。   In addition, the upper and lower sealing members 14 are arranged on both surfaces of the thermoelectric element substrate 10 so that the thermoelectric elements 12 and 13 and the heat exchange members 22 and 32 are joined. At this time, the outer edge of each sealing member 14 is bonded to the frame of the holding plate 11. Thereby, the dew condensation water does not enter the thermoelectric element substrate 10 from the outside of the frame of the holding plate 11.

しかも、このときに、上方に配置される封止部材14の開口孔14cに形成される接合部16は、隣接するN型熱電素子13からP型熱電素子12に向けて電流を流すための電極となっている。また、下方に配置される開口孔14cに形成される接合部16は、隣接するP型熱電素子12からN型熱電素子13に電流を流すための電極となっている。   In addition, at this time, the joint 16 formed in the opening 14c of the sealing member 14 disposed above is an electrode for flowing current from the adjacent N-type thermoelectric element 13 toward the P-type thermoelectric element 12. It has become. In addition, the joint 16 formed in the opening 14 c disposed below serves as an electrode for flowing current from the adjacent P-type thermoelectric element 12 to the N-type thermoelectric element 13.

次に、熱交換部材22、32は、銅材などの導電性金属からなる薄肉の板材を用いて、図5に示すように、断面が略U字状からなり底部に平面状の吸熱、放熱電極部25、35を形成し、その電極部25、35から外方に延出された平面にルーバー状の熱交換部26、36を形成している。   Next, as shown in FIG. 5, the heat exchange members 22 and 32 are thin plate materials made of a conductive metal such as a copper material. As shown in FIG. Electrode portions 25 and 35 are formed, and louver-like heat exchange portions 26 and 36 are formed on a plane extending outward from the electrode portions 25 and 35.

また、熱交換部26、36は、吸熱、放熱電極部25、35から伝熱される熱を吸熱、放熱するためのフィンであり、切り起こしなどの成形加工により電極部25、35と一体に形成している。そして、その吸熱、放熱電極部25、35の一端面が封止部材14の開口孔14cを蓋するように配設される。   The heat exchanging portions 26 and 36 are fins for absorbing and radiating heat transferred from the heat absorbing and radiating electrode portions 25 and 35, and are formed integrally with the electrode portions 25 and 35 by molding such as cutting and raising. is doing. The end surfaces of the heat absorbing and radiating electrode portions 25 and 35 are disposed so as to cover the opening hole 14 c of the sealing member 14.

ここで、電極部25、35は、上述したように、開口孔14cよりも外形が大きくなるように形成される。より具体的には、図6(b)に示すように、封止部材14には実線で示す矩形状の開口孔14cが形成されている。   Here, as described above, the electrode portions 25 and 35 are formed so that the outer shape is larger than the opening hole 14c. More specifically, as shown in FIG. 6B, the sealing member 14 is formed with a rectangular opening 14c indicated by a solid line.

従って、長辺側および短辺側がL1(例えば、0.2〜1mm程度)大きくなる2点鎖線で示すような矩形状の外形の電極部25、35となっている。換言すると、L1は接着代であって、電極部25、35を開口孔14cに配設したときに、この接着代により開口孔14cを封止できる。これにより、開口孔14cの外周部と対向する部位が電極部25、35の底面に形成されている。   Accordingly, the electrode portions 25 and 35 have a rectangular outer shape as indicated by a two-dot chain line in which the long side and the short side are larger by L1 (for example, about 0.2 to 1 mm). In other words, L1 is a bonding margin, and when the electrode portions 25 and 35 are disposed in the opening hole 14c, the opening hole 14c can be sealed by this bonding margin. Thereby, the site | part which opposes the outer peripheral part of the opening hole 14c is formed in the bottom face of the electrode parts 25 and 35. As shown in FIG.

また、互いに隣り合う熱交換部材22、32同士は、互いに電気的に絶縁するように、所定の隙間を設けて封止部材14に配設されている。ここで、図2および図3に示す符号23、33は固定板であり、熱交換部材22、32の他端側を保持するための保持部材である。これにより、互いに隣り合う熱交換部材22、32同士間に所定の隙間を設けるとともに、隣り合う熱交換部材22、32同士が電気的に絶縁されている。   Further, the heat exchange members 22 and 32 adjacent to each other are disposed on the sealing member 14 with a predetermined gap so as to be electrically insulated from each other. Here, reference numerals 23 and 33 shown in FIGS. 2 and 3 are fixing plates, which are holding members for holding the other end sides of the heat exchange members 22 and 32. Thus, a predetermined gap is provided between the heat exchange members 22 and 32 adjacent to each other, and the adjacent heat exchange members 22 and 32 are electrically insulated from each other.

この固定板23、33は、上述した保持板11と同じように、平板状の絶縁材料(例えば、ガラスエポキシ、PPS樹脂、LCP樹脂、もしくはPET樹脂など)からなり、電極部25、35の他端側が貫通するように図示しない固定穴が形成されている。   The fixing plates 23 and 33 are made of a flat insulating material (for example, glass epoxy, PPS resin, LCP resin, or PET resin) in the same manner as the holding plate 11 described above. A fixing hole (not shown) is formed so that the end side penetrates.

また、図1中に示す左右端に配設される熱電素子12、13の末端には、電源端子である端子24a、24bが設けられ、その端子24a、24bには、図示しない直流電源の正側端子を端子24aに接続し、負側端子を端子24bに接続するようにしている。   In addition, terminals 24a and 24b, which are power terminals, are provided at the ends of the thermoelectric elements 12 and 13 disposed at the left and right ends shown in FIG. 1, and the terminals 24a and 24b are connected to a positive power source (not shown). The side terminal is connected to the terminal 24a, and the negative side terminal is connected to the terminal 24b.

これにより、上方側に形成される接合部16および吸熱熱交換部材22は、隣接するN型熱電素子13からP型熱電素子12に電気的に接続するように複数個配設され、下方側に形成される接合部16および放熱熱交換部材32は、隣接するP型熱電素子12からN型熱電素子13に電気的に接続するように複数個配設されている。   As a result, a plurality of joints 16 and endothermic heat exchange members 22 formed on the upper side are disposed so as to be electrically connected from the adjacent N-type thermoelectric element 13 to the P-type thermoelectric element 12, and on the lower side. A plurality of formed joint portions 16 and heat radiation heat exchange members 32 are disposed so as to be electrically connected from the adjacent P-type thermoelectric element 12 to the N-type thermoelectric element 13.

ところで、端子24aから入力された直流電源は、図2中に示す左端のP型熱電素子12から下方に形成された接合部16を介してN型熱電素子13に直列的に流れ、次に、このN型熱電素子13から上方に形成された接合部16を介してP型熱電素子12に直列的に流れる。   By the way, the DC power input from the terminal 24a flows in series from the leftmost P-type thermoelectric element 12 shown in FIG. 2 to the N-type thermoelectric element 13 through the junction 16 formed below, It flows in series from the N-type thermoelectric element 13 to the P-type thermoelectric element 12 through a joint 16 formed upward.

このときに、PN接合部を構成する下方に形成された接続部は、ペルチェ効果によって高温の状態となり、NP接合部を構成する上方に形成された接合部16は低温の状態となる。つまり、上方側に配置された熱交換部26は吸熱熱交換部を形成して低温状態の熱が伝熱されて被冷却流体に接触され、下方側に設置された熱交換部36は放熱熱交換部を形成して高温状態の熱が伝熱されて冷却流体に接触される。   At this time, the connection part formed below that constitutes the PN junction part is in a high temperature state due to the Peltier effect, and the junction part 16 formed above that constitutes the NP junction part is in a low temperature state. That is, the heat exchanging part 26 arranged on the upper side forms an endothermic heat exchanging part, heat in a low temperature state is transferred to contact with the fluid to be cooled, and the heat exchanging part 36 installed on the lower side is radiated heat. An exchange part is formed and heat in a high temperature state is transferred to contact the cooling fluid.

言い換えると、図2に示すように、熱電素子基板10を区画壁として、ケース部材28により、熱電素子基板10の両側に送風通路を形成し、その送風通路に熱交換媒体である空気を流通することで、熱交換部26,36と空気とが熱交換され、熱電素子基板10を区画壁として、上側の熱交換部26で空気を冷却することができ、下側の熱交換部36で空気を加熱することができる。   In other words, as shown in FIG. 2, with the thermoelectric element substrate 10 as a partition wall, the case member 28 forms a ventilation passage on both sides of the thermoelectric element substrate 10, and distributes air as a heat exchange medium through the ventilation passage. Thus, heat exchange between the heat exchange units 26 and 36 and the air is performed, and the air can be cooled by the upper heat exchange unit 26 using the thermoelectric element substrate 10 as a partition wall, and the air can be cooled by the lower heat exchange unit 36. Can be heated.

なお、本実施形態では、直流電源の正側端子を端子24a側に接続し、負側端子を端子24b側に接続して端子24aに直流電源を入力させたが、これに限らず、直流電源の正側端子を端子24b側に接続し、負側端子を端子24a側に接続して端子24bに直流電源を入力させても良い。ただし、このときには、上方の吸熱熱交換部材22が放熱熱交換部を形成し、下方の放熱熱交換部材32が吸熱熱交換部を形成する。   In the present embodiment, the positive terminal of the DC power source is connected to the terminal 24a side, the negative terminal is connected to the terminal 24b side, and the DC power source is input to the terminal 24a. The positive terminal may be connected to the terminal 24b side, the negative terminal may be connected to the terminal 24a side, and a DC power supply may be input to the terminal 24b. However, at this time, the upper endothermic heat exchange member 22 forms a heat dissipation heat exchange portion, and the lower endothermic heat exchange member 32 forms an endothermic heat exchange portion.

次に、以上の構成による熱電変換装置の製造方法について説明する。まず、熱電素子12、13は、図2ないし図4に示すように、保持板11に設けられた基板穴にP型とN型を交互に略碁盤目状に複数個配列して熱電素子基板10を一体的に構成する。なお、複数の熱電素子12、13は接着剤により基板穴に固定されている。   Next, the manufacturing method of the thermoelectric conversion apparatus by the above structure is demonstrated. First, as shown in FIGS. 2 to 4, the thermoelectric elements 12, 13 are arranged in a plurality of P-type and N-type alternately in a substantially grid pattern in a substrate hole provided in the holding plate 11. 10 are integrally formed. The plurality of thermoelectric elements 12 and 13 are fixed to the substrate holes with an adhesive.

ここで、熱電素子12、13は、半導体、電子部品などを制御基板に組み付けるための製造装置であるマウンター装置を用いて組み付けても良い。これによれば、熱電素子12、13の素子寸法が1.5mm×1.5mm程度以上であれば、容易に摘むことができるので生産性が低下することなく組付けができる。   Here, the thermoelectric elements 12 and 13 may be assembled using a mounter device which is a manufacturing apparatus for assembling a semiconductor, an electronic component or the like to the control board. According to this, if the element dimensions of the thermoelectric elements 12 and 13 are about 1.5 mm × 1.5 mm or more, the thermoelectric elements 12 and 13 can be easily picked up and can be assembled without lowering the productivity.

本実施形態では、封止部材14に複数の熱交換部材22、32を保持させた後に熱電素子基板10に組み付けるように構成している。より具体的には、図6(a)ないし図6(e)に示す組付け手順によって熱電変換装置を組み立てている。以下、図6(a)ないし図6(e)に基づいて説明する。   In the present embodiment, the plurality of heat exchange members 22 and 32 are held by the sealing member 14 and then assembled to the thermoelectric element substrate 10. More specifically, the thermoelectric conversion device is assembled by the assembly procedure shown in FIGS. 6 (a) to 6 (e). Hereinafter, a description will be given based on FIGS. 6 (a) to 6 (e).

まず、図6(a)に示すように、樹脂フィルム14aの両面に接着剤からなる接着層14bが積層されたカバーレイフィルムを用いて保持板11の外形と同等の外形形状に形成する。そして、図6(b)に示すように、熱電素子基板10に配設された一対の熱電素子12、13に対応する部位に複数の開口孔14cを形成する。ここで、複数の開口孔14cはプレス加工で行えば外形切断を含めて一工程で加工することができる。   First, as shown to Fig.6 (a), it forms in the external shape equivalent to the external shape of the holding | maintenance board 11 using the coverlay film by which the adhesive layer 14b which consists of an adhesive agent was laminated | stacked on both surfaces of the resin film 14a. Then, as shown in FIG. 6 (b), a plurality of opening holes 14 c are formed in portions corresponding to the pair of thermoelectric elements 12 and 13 disposed on the thermoelectric element substrate 10. Here, the plurality of opening holes 14c can be processed in one step including cutting of the outer shape by press working.

なお、開口孔14cは、上述したように、2点鎖線で示す電極部25、35 の外形よりも、長辺側および短辺側がL1(例えば、0.2〜1mm程度)程度小さくなる矩形状の貫通穴を形成している。これにより、開口孔14cの外周部と対向する部位が電極部25、35の底面に形成されている。   As described above, the opening 14c has a rectangular shape in which the long side and the short side are smaller than the outer shape of the electrode portions 25 and 35 indicated by the two-dot chain line by about L1 (for example, about 0.2 to 1 mm). The through hole is formed. Thereby, the site | part which opposes the outer peripheral part of the opening hole 14c is formed in the bottom face of the electrode parts 25 and 35. As shown in FIG.

そして、図6(c)に示すように、開口孔14cを蓋するように電極部25、35の底面を押圧させて熱交換部材22、32を封止部材14に接着する。つまり、封止部材14において、開口孔14cの外周部が電極部25、35と接着されることで開口孔14cを封止することができる。   Then, as shown in FIG. 6C, the heat exchange members 22 and 32 are bonded to the sealing member 14 by pressing the bottom surfaces of the electrode portions 25 and 35 so as to cover the opening holes 14 c. That is, in the sealing member 14, the opening hole 14 c can be sealed by bonding the outer peripheral part of the opening hole 14 c to the electrode parts 25 and 35.

ここで、マウンター装置を用いて複数の熱交換部材22、32を封止部材14に組み付ければ、それぞれの開口孔14cに複数の熱交換部材22、32が容易に組み付けることができる。   Here, if the plurality of heat exchange members 22 and 32 are assembled to the sealing member 14 using the mounter device, the plurality of heat exchange members 22 and 32 can be easily assembled to the respective opening holes 14c.

また、熱電素子基板10の上方に配設する封止部材14には複数の吸熱熱交換部材22が保持され、熱電素子基板10の下方に配設する封止部材14には複数の放熱熱交換部材32が保持される。これにより、複数の開口孔14cの外周部が接着層14bで封止されることで、吸熱側で発生した結露水が封止部材14の外方から開口孔14cに浸水することはない。   The sealing member 14 disposed above the thermoelectric element substrate 10 holds a plurality of endothermic heat exchange members 22, and the sealing member 14 disposed below the thermoelectric element substrate 10 has a plurality of heat dissipation heat exchanges. The member 32 is held. Thus, the outer peripheral portions of the plurality of opening holes 14c are sealed with the adhesive layer 14b, so that the dew condensation water generated on the heat absorption side does not enter the opening holes 14c from the outside of the sealing member 14.

そして、図6(d)に示すように、複数の開口孔14cに露出する電極部25、35には、導電性接着剤である半田16を充填する。これにより、接合部16が開口孔14cに形成される。   Then, as shown in FIG. 6D, the electrode portions 25 and 35 exposed in the plurality of opening holes 14c are filled with solder 16 which is a conductive adhesive. Thereby, the joining part 16 is formed in the opening hole 14c.

そして、図6(e)に示すように、複数の吸熱熱交換部材22が保持された封止部材14と複数の放熱熱交換部材32が保持された封止部材14との間に、熱電素子基板10を挟んで組み合わせ、それぞれの接合部16にそれぞれの一対の熱電素子12、13とを当接させて一斉に半田付けにより接合する。   As shown in FIG. 6 (e), a thermoelectric element is interposed between the sealing member 14 holding the plurality of endothermic heat exchange members 22 and the sealing member 14 holding the plurality of radiant heat exchange members 32. A pair of thermoelectric elements 12 and 13 are brought into contact with each joint 16 and joined together by soldering at the same time.

これにより、熱電素子12、13の端面と電極部25、35とが半田16を介して直接接合される。これにより、電極部材を設けずに複数の熱電素子12、13を電気的に直接接続することができる。   As a result, the end faces of the thermoelectric elements 12 and 13 and the electrode portions 25 and 35 are directly joined via the solder 16. Thereby, the some thermoelectric elements 12 and 13 can be electrically connected directly, without providing an electrode member.

また、このときに、封止部材14の外縁全周に押圧を掛けることで、封止部材14の外縁が保持板11の額縁に接着される。これにより、結露水が封止部材14の外方から熱電素子12、13自体、電極部25、35と熱電素子12、13の端面との接合部16に浸水することはない。   At this time, the outer edge of the sealing member 14 is pressed to the entire outer periphery of the sealing member 14, whereby the outer edge of the sealing member 14 is bonded to the frame of the holding plate 11. Accordingly, the dew condensation water does not enter the thermoelectric elements 12 and 13 themselves, the joint portions 16 between the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13 from the outside of the sealing member 14.

なお、本実施形態では、上方および下方に形成される接合部16を一斉に接合するように構成したが、これに限らず、熱電素子基板10に吸熱熱交換部材22が保持された封止部材14を重ねて接合部16と一対の熱電素子12、13とを当接させて片面のみ一斉に接合し、その後、熱電素子基板10を反転した後に、放熱熱交換部材32が保持された封止部材14を重ねて接合部16と一対の熱電素子12、13とを接合するようにしても良い。   In addition, in this embodiment, although it comprised so that the junction part 16 formed above and below might be joined simultaneously, it is not restricted to this, The sealing member by which the endothermic heat exchange member 22 was hold | maintained at the thermoelectric element board | substrate 10 14, the joining portion 16 and the pair of thermoelectric elements 12 and 13 are brought into contact with each other to join only one side at a time, and then the thermoelectric element substrate 10 is reversed, and then the heat radiation heat exchange member 32 is held. The member 14 may be stacked to join the joint 16 and the pair of thermoelectric elements 12 and 13 together.

これにより、上方側に形成される接合部16がNP接合部を形成し、隣接する熱電素子12、13を直列的に接続されるとともに、下方側に形成される接合部16がPN接合部を形成し、隣接する熱電素子12、13を電気的に直列接続される。   Thereby, the junction 16 formed on the upper side forms an NP junction, and the adjacent thermoelectric elements 12 and 13 are connected in series, and the junction 16 formed on the lower side becomes a PN junction. The adjacent thermoelectric elements 12 and 13 are electrically connected in series.

そして、吸熱熱交換部材22と放熱熱交換部材32との電極部25、35に対して他端側の端部をそれぞれの固定板23、33に形成された固定穴に配設して固定する。これにより、熱交換部材22、32の端部が固定板23、32に固定されることで隣り合う熱交換部材22、32相互で所定の隙間が形成されることで電気的に絶縁される。   And the end part of the other end side is arrange | positioned with respect to the electrode parts 25 and 35 of the endothermic heat exchange member 22 and the radiation heat exchange member 32, and it fixes to the fixing hole formed in each fixing plate 23 and 33. . As a result, the end portions of the heat exchange members 22 and 32 are fixed to the fixing plates 23 and 32, so that a predetermined gap is formed between the adjacent heat exchange members 22 and 32, thereby being electrically insulated.

そして、固定板22の上方側、固定板32の下方側、およびこれらの側方をケース部材28により空気経路を形成するように組み付けることで、上方側に吸熱熱交換部が形成され、下方側に放熱熱交換部が形成されて、これに空気を流通させることで冷風、温風を得ることが可能となる。   Then, by assembling the upper side of the fixed plate 22, the lower side of the fixed plate 32, and these sides so as to form an air path by the case member 28, an endothermic heat exchanging portion is formed on the upper side, and the lower side A heat radiating heat exchanging portion is formed in the air, and it is possible to obtain cold air and hot air by circulating air therethrough.

なお、この種の熱電変換装置として、シート空調装置の他に、半導体や電気部品などの発熱部品の冷却用や暖房装置などの加熱用に用いられる。   In addition to the seat air conditioner, this type of thermoelectric converter is used for cooling a heat-generating component such as a semiconductor or an electrical component or for heating a heating device.

以上の第1実施形態による熱電変換装置によれば、封止部材14に形成された開口孔14cの外周部と熱交換部材22、32の電極部25、35の対向配置される部位とが接着剤で固着されることにより、吸熱側の熱交換部材22、32で発生した結露水が開口孔14cに浸水することはない。従って、内部に収容される熱電素子12、13の端面と電極部25、35との接着箇所および熱電素子12、13自体への浸水を防止できる。   According to the thermoelectric conversion device according to the first embodiment described above, the outer peripheral portion of the opening hole 14c formed in the sealing member 14 and the portion where the electrode portions 25 and 35 of the heat exchange members 22 and 32 are disposed to be bonded are bonded. By being fixed with the agent, the dew condensation water generated in the heat exchange members 22 and 32 on the heat absorption side does not enter the opening hole 14c. Accordingly, it is possible to prevent water from entering the adhesion portion between the end faces of the thermoelectric elements 12 and 13 accommodated inside and the electrode portions 25 and 35 and the thermoelectric elements 12 and 13 themselves.

また、熱電素子12、13と電極部25、35とを開口孔14cに設けられた半田16によって直接接着できることにより、熱抵抗を小さくすることができる。従って、熱交換効率が上昇し熱電変換効率の向上が図れる。   Further, since the thermoelectric elements 12 and 13 and the electrode portions 25 and 35 can be directly bonded by the solder 16 provided in the opening hole 14c, the thermal resistance can be reduced. Accordingly, the heat exchange efficiency is increased and the thermoelectric conversion efficiency can be improved.

また、封止部材14は、樹脂フィルムに接着層が積層されていることにより、開口孔14cの外周部に、電極部25、35の対向配置される部位を容易に接着剤で固着できる。さらに、樹脂フィルムからなる封止部材14は、例えば、配線パターンとスルーホールとを有するプリント基板よりも加工性が良好であるため製造上の部品コストの低減が図れる。   Moreover, the sealing member 14 can adhere | attach the site | part by which the electrode parts 25 and 35 are opposed to an outer peripheral part of the opening hole 14c easily with an adhesive agent by laminating | stacking the adhesive layer on the resin film. Furthermore, since the sealing member 14 made of a resin film has better processability than, for example, a printed circuit board having a wiring pattern and a through hole, it is possible to reduce manufacturing component costs.

また、樹脂フィルムはプリント基板よりもフレキシブル性あるため、電極部25、35と熱電素子12、13との接着箇所が近傍に存在するような装置では熱応力が緩和されることで接着箇所の信頼性の向上が図れる。   In addition, since the resin film is more flexible than the printed circuit board, in an apparatus in which the adhesion portion between the electrode portions 25 and 35 and the thermoelectric elements 12 and 13 exists in the vicinity, the thermal stress is relieved so that the reliability of the adhesion portion is improved. Can improve the performance.

なお、封止部材14において、接着層を有するカバーレイフィルムで形成することにより、開口孔14cの外周部に、電極部25、35の対向配置される部位を容易に接着剤で固着できる。さらに、樹脂フィルムに接着層を形成する工程を省略できることで部品コストの低減ができる。   In addition, by forming the sealing member 14 with a cover lay film having an adhesive layer, a portion where the electrode portions 25 and 35 are arranged to face each other can be easily fixed to the outer peripheral portion of the opening hole 14c with an adhesive. Furthermore, a part cost can be reduced by omitting the step of forming the adhesive layer on the resin film.

また、封止部材14をボンディングシートが積層されている樹脂フィルムで形成することにより、開口孔14cの外周部に、電極部25、35の対向配置される部位を容易に接着剤で固着できる。さらに、樹脂フィルムに接着層を形成する工程を省略できることで部品コストの低減ができる。   In addition, by forming the sealing member 14 with a resin film on which a bonding sheet is laminated, a portion where the electrode portions 25 and 35 are arranged to face each other can be easily fixed to the outer peripheral portion of the opening hole 14c with an adhesive. Furthermore, a part cost can be reduced by omitting the step of forming the adhesive layer on the resin film.

また、樹脂フィルム14aをポリイミド樹脂、ポリエチレンナフタレート樹脂、またはポリエチレンテレフタレート樹脂のいずれか一つの絶縁体の樹脂により形成されていることにより、これらの樹脂フィルム14aはプリント基板よりも加工がし易く部品コストの低減ができる。また、開口孔14cの外周部に電極部25、35で押圧を掛けることで容易に封止することができる。   Further, since the resin film 14a is formed of a resin of any one of a polyimide resin, a polyethylene naphthalate resin, and a polyethylene terephthalate resin, these resin films 14a are easier to process than a printed circuit board. Cost can be reduced. Moreover, it can seal easily by pressing with the electrode parts 25 and 35 to the outer peripheral part of the opening hole 14c.

(第2実施形態)
以上の第1実施形態では、封止部材14に熱電素子12、13と熱交換部材22、32とを接合するための開口孔14cを形成し、その開口孔14cを蓋するように電極部25、35を固着させて、その開口孔14に露出する電極部25、35に熱電素子12、13を配置して半田18で接合するように構成したが、これに限らず、開口孔14cを蓋するように熱電素子12、13を固着させて、その開口孔14に露出する熱電素子12、13に電極部25、35を配置して半田18で接合するように構成しても良い。
(Second Embodiment)
In the first embodiment described above, the opening portion 14c for joining the thermoelectric elements 12 and 13 and the heat exchange members 22 and 32 is formed in the sealing member 14, and the electrode portion 25 is covered with the opening hole 14c. , 35 are fixed, and the thermoelectric elements 12 and 13 are arranged on the electrode portions 25 and 35 exposed in the opening hole 14 and joined with the solder 18, but the present invention is not limited thereto, and the opening hole 14c is covered with the lid. As described above, the thermoelectric elements 12 and 13 may be fixed, and the electrode portions 25 and 35 may be disposed on the thermoelectric elements 12 and 13 exposed in the opening 14 and joined by the solder 18.

具体的には、図7に示すように、開口孔14cが形成された封止部材14を熱電素子基板10の両面に配設した後に、その封止部材14に複数の熱交換部材22、32を組み付けるようにしている。   Specifically, as shown in FIG. 7, after the sealing member 14 in which the opening hole 14 c is formed is disposed on both surfaces of the thermoelectric element substrate 10, a plurality of heat exchange members 22 and 32 are provided on the sealing member 14. Assemble.

より具体的には、図8(a)ないし図8(e)に示す組付け手順によって熱電変換装置を組み立てている。以下、図8(a)ないし図8(e)に基づいて説明する。まず、図8(a)に示すように、樹脂フィルム14aの両面に接着剤から成る接着層14bが積層されたカバーレイフィルムを用いて保持板11の外形と同等の外形形状に形成する。   More specifically, the thermoelectric converter is assembled by the assembly procedure shown in FIGS. 8 (a) to 8 (e). Hereinafter, a description will be given with reference to FIGS. 8A to 8E. First, as shown in FIG. 8A, an outer shape equivalent to the outer shape of the holding plate 11 is formed using a coverlay film in which an adhesive layer 14b made of an adhesive is laminated on both surfaces of a resin film 14a.

そして、図8(b)に示すように、熱電素子基板10に配設された熱電素子12、13に対応する部位に複数の開口孔14cを形成する。本実施形態の開口孔14cは、2点鎖線で示す熱電素子12、13の端面の外形よりも、長辺側および短辺側がL1(例えば、0.2〜1mm程度)程度小さくなる矩形状の貫通穴を形成している。   And as shown in FIG.8 (b), the some opening hole 14c is formed in the site | part corresponding to the thermoelectric elements 12 and 13 arrange | positioned in the thermoelectric element board | substrate 10. As shown in FIG. The opening hole 14c of the present embodiment is a rectangular shape in which the long side and the short side are smaller by about L1 (for example, about 0.2 to 1 mm) than the outer shape of the end faces of the thermoelectric elements 12 and 13 indicated by the two-dot chain line. A through hole is formed.

これにより、開口孔14cの外周部と対向する部位が熱電素子12、13の端面に形成されている。そして、図8(c)に示すように、熱電素子12、13の端面で開口孔14cを蓋するように封止部材14を熱電素子12、13の端面に押圧させて接着で固着する。これにより、それぞれの開口孔14cの外周部が接着代L1で接着されて封止することができる。   Thereby, the site | part facing the outer peripheral part of the opening hole 14c is formed in the end surface of the thermoelectric elements 12 and 13. FIG. And as shown in FIG.8 (c), the sealing member 14 is pressed on the end surface of the thermoelectric elements 12 and 13 so that the opening hole 14c may be covered with the end surface of the thermoelectric elements 12 and 13, and it adheres and adheres. Thereby, the outer peripheral part of each opening hole 14c can be adhere | attached by the adhesion allowance L1, and can be sealed.

また、このときに、封止部材14の外縁全周に押圧を掛けることで、封止部材14の外縁が保持板11の額縁に接着される。これにより、結露水が封止部材14の外方から熱電素子12、13自体、電極部25、35と熱電素子12、13の端面との接合部16に浸水することはない。   At this time, the outer edge of the sealing member 14 is pressed to the entire outer periphery of the sealing member 14, whereby the outer edge of the sealing member 14 is bonded to the frame of the holding plate 11. Accordingly, the dew condensation water does not enter the thermoelectric elements 12 and 13 themselves, the joint portions 16 between the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13 from the outside of the sealing member 14.

そして、図8(d)に示すように、複数の開口孔14cに露出する熱電素子12、13の端面には、導電性接着剤である半田16を充填する。これにより、接合部16が開口孔14cに形成される。   And as shown in FIG.8 (d), the solder 16 which is a conductive adhesive is filled into the end surface of the thermoelectric elements 12 and 13 exposed to the some opening hole 14c. Thereby, the joining part 16 is formed in the opening hole 14c.

そして、図8(e)に示すように、それぞれの開口孔14cを蓋するように複数の電極部25、35を配置して一斉に半田16で接合される。これにより、開口孔14cの外周部を含めて半田16により電極部25、35が封止部材14に接合される。つまり、複数の熱交換部材22、32が封止部材14に保持される。   Then, as shown in FIG. 8E, a plurality of electrode portions 25 and 35 are arranged so as to cover the respective opening holes 14c, and are joined together by the solder 16. Thereby, the electrode parts 25 and 35 are joined to the sealing member 14 by the solder 16 including the outer peripheral part of the opening hole 14c. That is, the plurality of heat exchange members 22 and 32 are held by the sealing member 14.

従って、熱電素子12、13の端面と電極部25、35とが半田16を介して直接接合される。さらに、外方の開口孔14cの外周部が半田16で気密されることで、吸熱側で発生した結露水が封止部材14の外方から開口孔14cに浸水することはない。   Therefore, the end faces of the thermoelectric elements 12 and 13 and the electrode portions 25 and 35 are directly joined via the solder 16. Furthermore, the outer peripheral portion of the outer opening 14c is hermetically sealed with the solder 16, so that dew condensation water generated on the heat absorption side does not enter the opening 14c from the outside of the sealing member 14.

なお、例えば、半田16が劣化して封止部材14の外方から開口孔14cに浸水があっても、熱電素子12、13の端面が接着剤で固着されていることで熱電素子12、13自体に浸水することはない。   Note that, for example, even if the solder 16 deteriorates and the opening 14c is submerged from the outside of the sealing member 14, the end surfaces of the thermoelectric elements 12 and 13 are fixed with an adhesive so that the thermoelectric elements 12 and 13 are fixed. It does not flood itself.

ところで、本実施形態では、熱交換部材22、32を封止部材14に配設するときに、封止部材14の接合部16の平面度が、上記第1実施形態よりも良いため開口孔14cの外周部を容易に熱電素子12、13の端面に固着することができる。   By the way, in this embodiment, when arrange | positioning the heat exchange members 22 and 32 in the sealing member 14, since the flatness of the junction part 16 of the sealing member 14 is better than the said 1st Embodiment, it is the opening hole 14c. Can be easily fixed to the end faces of the thermoelectric elements 12 and 13.

また、熱交換部材22、32は、断面が略U字状に形成されていることで、電極部25、35の底面がR状に折り曲げられている。このため、封止部材14をRに沿って固着する必要がある。ところが、熱電素子12、13は、全体形状が略直方体状に形成されていることで、熱電素子12、13の端面に封止部材14を接着するときは固着しやすい。従って、封止部材14に電極部25、35を接着させるよりも、封止部材14に熱電素子12、13を接着させる方が固着しやすい。   Moreover, the heat exchange members 22 and 32 have a substantially U-shaped cross section, so that the bottom surfaces of the electrode portions 25 and 35 are bent in an R shape. For this reason, it is necessary to adhere the sealing member 14 along R. However, since the thermoelectric elements 12 and 13 are formed in a substantially rectangular parallelepiped shape, the thermoelectric elements 12 and 13 are easily fixed when the sealing member 14 is bonded to the end faces of the thermoelectric elements 12 and 13. Therefore, it is easier to adhere the thermoelectric elements 12 and 13 to the sealing member 14 than to adhere the electrode portions 25 and 35 to the sealing member 14.

以上の構成による熱電変換装置によれば、封止部材14の開口孔14cの外周部に、熱電素子12、13の端面を固着させ、さらに、複数の開口孔14cに露出する熱電素子12、13の端面に、半田16を充填させて、その開口孔14cに電極部25、35を配置して接合することにより、封止部材14の外方から開口孔14cに浸水があっても、熱電素子12、13の端面が接着剤で固着されていることで熱電素子12、13自体に浸水することはない。   According to the thermoelectric conversion device having the above configuration, the end surfaces of the thermoelectric elements 12 and 13 are fixed to the outer peripheral portion of the opening hole 14c of the sealing member 14, and the thermoelectric elements 12 and 13 exposed to the plurality of opening holes 14c are further fixed. By filling the end surface of the solder 16 with the solder 16 and arranging and joining the electrode portions 25 and 35 to the opening hole 14c, the thermoelectric element can be used even if the opening hole 14c is submerged from the outside of the sealing member 14. Since the end faces of 12 and 13 are fixed with an adhesive, the thermoelectric elements 12 and 13 themselves are not submerged.

また、本実施形態のほうが電極部25、35の底面を接着させる第1実施形態よりも、熱電素子12、13の端面のほうが平面状に形成されることで開口孔14cの外周部との接着が容易にできるとともに、気密の確保が容易である。   In addition, the end face of the thermoelectric elements 12 and 13 is formed in a planar shape in the present embodiment rather than the first embodiment in which the bottom surfaces of the electrode parts 25 and 35 are bonded, thereby bonding to the outer peripheral part of the opening 14c. It is easy to ensure airtightness.

(第3実施形態)
本実施形態では、電極部25、35と熱電素子12、13の端面とが接合する接合部16を封止部材14の外方に露出させないようにシール部材を塗布させたものである。例えば、第2実施形態では、電極部25、35と熱電素子12、13の端面とを半田16で接合する場合、封止部材14は熱電素子12、13の端面に接着されている。
(Third embodiment)
In the present embodiment, a sealing member is applied so that the joining portion 16 where the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13 are joined is not exposed to the outside of the sealing member 14. For example, in the second embodiment, when the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13 are joined with the solder 16, the sealing member 14 is bonded to the end faces of the thermoelectric elements 12 and 13.

このために、電極部25、35と熱電素子12、13の端面とを接合する半田16は封止部材14で気密することができない。そこで、本実施形態では、電極部25、35と熱電素子12、13の端面とを接合した後に、図9に示すように、少なくとも電極部25、35の外形に沿ってシール部材17を塗布している。   For this reason, the solder 16 that joins the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13 cannot be hermetically sealed by the sealing member 14. Therefore, in this embodiment, after joining the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13, as shown in FIG. 9, the seal member 17 is applied along at least the outer shape of the electrode portions 25 and 35. ing.

なお、ここでは、シール部材17を局所的に塗布させたが、これに限らず、封止部材14の外方表面全体に塗布させても良い。さらに、第1実施形態のような構成においても、電極部25、35と熱電素子12、13の端面とを接合した後に、少なくとも電極部25、35の外形に沿ってシール部材17を塗布するようにしても良い。   Here, the seal member 17 is locally applied. However, the present invention is not limited to this, and the seal member 17 may be applied to the entire outer surface of the sealing member 14. Furthermore, also in the configuration as in the first embodiment, after joining the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13, the sealing member 17 is applied along at least the outer shape of the electrode portions 25 and 35. Anyway.

以上の構成によれば、接合部16がシール部材17により覆われるため封止部材14の外方から結露水を接合部16への浸水を防止することができる。従って、結露水による半田16の成分がイオン化するマイグレーションの発生を防止することができる。   According to the above configuration, since the joint portion 16 is covered with the seal member 17, it is possible to prevent the condensed water from entering the joint portion 16 from the outside of the sealing member 14. Therefore, it is possible to prevent the occurrence of migration in which the components of the solder 16 are ionized due to dew condensation water.

(第4実施形態)
以上の実施形態では、接着層14bを有するカバーレイフィルム、もしくは樹脂フィルム14aにボンディング層が積層されたボンディングシートにより封止部材14を形成したが、これに限らず、熱可塑性の樹脂フィルムで封止部材14を形成しても良い。
(Fourth embodiment)
In the above embodiment, the sealing member 14 is formed by the coverlay film having the adhesive layer 14b or the bonding sheet in which the bonding layer is laminated on the resin film 14a. However, the sealing member 14 is not limited to this and is sealed by a thermoplastic resin film. The stop member 14 may be formed.

具体的には、図10(a)に示すように、封止部材14を熱可塑性の樹脂フィルム14aで形成するとともに所定の位置に複数の開口孔14cを形成する。そして、封止部材14を加熱させて、開口孔14cを蓋するように複数の熱交換部材32の電極部35に圧着させる。これにより、開口孔14cの外周部が電極部35で圧着されることで、複数の熱交換部材32が封止部材14に保持される。   Specifically, as shown in FIG. 10A, the sealing member 14 is formed of a thermoplastic resin film 14a and a plurality of opening holes 14c are formed at predetermined positions. And the sealing member 14 is heated, and it is crimped | bonded to the electrode part 35 of the several heat exchange member 32 so that the opening hole 14c may be covered. Thereby, the outer peripheral part of the opening hole 14c is crimped | bonded by the electrode part 35, and the several heat exchange member 32 is hold | maintained at the sealing member 14. FIG.

また、図10(b)に示すように、封止部材14を熱可塑性の樹脂フィルム14aで形成するとともに所定の位置に複数の開口孔14cを形成する。そして、封止部材14を加熱させて、開口孔14cを蓋するように複数の熱電素子12、13の端面に圧着させる。これにより、開口孔14cの外周部が熱電素子12、13の端面に圧着で固着されることで、封止部材14が熱電素子基板10に配設できる。以上の構成によれば、接着剤もしくは半田などの導電性接着剤が不要となることで部品コストの低減が図れる。   Further, as shown in FIG. 10B, the sealing member 14 is formed of a thermoplastic resin film 14a, and a plurality of opening holes 14c are formed at predetermined positions. And the sealing member 14 is heated, and it is crimped | bonded to the end surface of the several thermoelectric elements 12 and 13 so that the opening hole 14c may be covered. Thus, the sealing member 14 can be disposed on the thermoelectric element substrate 10 by fixing the outer peripheral portion of the opening hole 14 c to the end surfaces of the thermoelectric elements 12 and 13 by pressure bonding. According to the above configuration, the cost of components can be reduced by eliminating the need for a conductive adhesive such as an adhesive or solder.

(第5実施形態)
上記第1実施形態では、封止部材14に熱電素子12、13と熱交換部材22、32とを接合するための開口孔14cを形成し、その開口孔14cを蓋するように電極部25、35を固着させて、その開口孔14に露出する電極部25、35に熱電素子12、13を配置して半田18で接合するように構成したが、これに限らず、具体的には、図11に示すように、P型熱電素子12とN型熱電素子13とを電気的に接続する別体の電極部材15を設けて、熱電素子12、13の端面に電極部材15の一端面を半田で接合し、その電極部材15の他端面に開口孔14cに充填された半田16を介して電極部25、35とを接合するように構成しても良い。
(Fifth embodiment)
In the first embodiment, the opening 14c for joining the thermoelectric elements 12 and 13 and the heat exchange members 22 and 32 to the sealing member 14 is formed, and the electrode portion 25 and the opening 14c are covered. 35 is fixed, and the thermoelectric elements 12 and 13 are arranged in the electrode portions 25 and 35 exposed in the opening holes 14 and are joined by the solder 18. However, the present invention is not limited to this, and specifically, FIG. 11, a separate electrode member 15 that electrically connects the P-type thermoelectric element 12 and the N-type thermoelectric element 13 is provided, and one end face of the electrode member 15 is soldered to the end faces of the thermoelectric elements 12 and 13. The electrode portions 25 and 35 may be joined to the other end surface of the electrode member 15 via the solder 16 filled in the opening hole 14c.

また、本実施形態では、開口孔14cが形成される封止部材14は、熱交換部材22、32と電極部材15との間に配設され、熱交換部材22、32に電極部材15とが接合される前工程において、複数の熱交換部材22、32は、接着剤により封止部材14に保持されている。   In the present embodiment, the sealing member 14 in which the opening hole 14 c is formed is disposed between the heat exchange members 22 and 32 and the electrode member 15, and the electrode member 15 is disposed on the heat exchange members 22 and 32. In the pre-process to be joined, the plurality of heat exchange members 22 and 32 are held on the sealing member 14 with an adhesive.

電極部材15は、平板状の銅材などの導電性金属から形成され、熱電素子基板10に配列された熱電素子群のうち、隣接する一対のP型熱電素子12およびN型熱電素子13を電気的に直列接続する電極である。   The electrode member 15 is formed of a conductive metal such as a flat copper material, and electrically connects a pair of adjacent P-type thermoelectric elements 12 and N-type thermoelectric elements 13 among the thermoelectric element groups arranged on the thermoelectric element substrate 10. The electrodes are connected in series.

より具体的には、図11に示すように、上方に配置される電極部材15は、隣接するN型熱電素子13からP型熱電素子12に向けて電流を流すための電極であり、下方に配置される電極部材15は、隣接するP型熱電素子12からN型熱電素子13に電流を流すための電極である。   More specifically, as shown in FIG. 11, the electrode member 15 disposed above is an electrode for allowing a current to flow from the adjacent N-type thermoelectric element 13 toward the P-type thermoelectric element 12. The arranged electrode member 15 is an electrode for causing a current to flow from the adjacent P-type thermoelectric element 12 to the N-type thermoelectric element 13.

換言すると、上方側に配設される電極部材15がNP接合部を形成し、隣接する熱電素子12、13を直列的に接続されるとともに、下方側に配設される電極部材15がPN接合部を形成し、隣接する熱電素子12、13を電気的に直列接続される。   In other words, the electrode member 15 disposed on the upper side forms an NP junction, the adjacent thermoelectric elements 12 and 13 are connected in series, and the electrode member 15 disposed on the lower side is connected with the PN junction. The adjacent thermoelectric elements 12 and 13 are electrically connected in series.

そして、電極部材15は、図12に示すように、熱電素子基板10に隣接して配列された熱電素子12、13の両端面に電気的に直列接続するように複数の電極部材15が半田付けにより接合される。より具体的には、熱電素子12、13の端面に予めペーストハンダ16などをスクリーン印刷で薄く均一に塗っておいてから半田付けで接合される。   As shown in FIG. 12, the electrode member 15 is soldered so that the electrode members 15 are electrically connected in series to both end faces of the thermoelectric elements 12 and 13 arranged adjacent to the thermoelectric element substrate 10. Are joined together. More specifically, paste solder 16 or the like is applied thinly and uniformly to the end faces of the thermoelectric elements 12 and 13 in advance by screen printing, and then joined by soldering.

なお、複数の熱交換部材22、32は、第1実施形態(図6(c)参照)と同じように、開口孔14cを蓋するように電極部25、35の底面を押圧させて熱交換部材22、32を封止部材14に接着する。これにより、開口孔14cの外周部が電極部25、35と接着されることで開口孔14cを封止することができる。   As in the first embodiment (see FIG. 6C), the plurality of heat exchange members 22 and 32 exchange heat by pressing the bottom surfaces of the electrode portions 25 and 35 so as to cover the opening 14c. The members 22 and 32 are bonded to the sealing member 14. Thereby, the outer peripheral part of the opening hole 14c is adhere | attached with the electrode parts 25 and 35, and the opening hole 14c can be sealed.

そして、複数の熱交換部材22、32が保持された封止部材14と熱電素子基板10との組付けは、第1実施形態と同じように、複数の吸熱熱交換部材22が保持された封止部材14と複数の放熱熱交換部材32が保持された封止部材14との間に、熱電素子基板10を挟んで組み合わせ、それぞれの接合部16にそれぞれの電極部材15とを当接させて一斉に半田付けにより接合する。   Then, the assembly of the sealing member 14 holding the plurality of heat exchange members 22 and 32 and the thermoelectric element substrate 10 is performed in the same manner as in the first embodiment by sealing the plurality of endothermic heat exchange members 22. The thermoelectric element substrate 10 is sandwiched between the stop member 14 and the sealing member 14 holding the plurality of heat radiation heat exchange members 32, and the respective electrode members 15 are brought into contact with the respective joint portions 16. Join together by soldering.

これにより、電極部材15と電極部25、35とが半田16を介して直接接合される。なお、このときに、封止部材14の外縁全周に押圧を掛けることで、フィルム状の封止部材14の外縁が保持板11の額縁に接着される。これにより、結露水が封止部材14の外方から熱電素子12、13自体、電極部25、35と熱電素子12、13の端面との接合部16に浸水することはない。   Thereby, the electrode member 15 and the electrode parts 25 and 35 are directly joined via the solder 16. At this time, the outer edge of the film-shaped sealing member 14 is bonded to the frame of the holding plate 11 by pressing the entire outer periphery of the sealing member 14. Accordingly, the dew condensation water does not enter the thermoelectric elements 12 and 13 themselves, the joint portions 16 between the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13 from the outside of the sealing member 14.

以上の構成によれば、上記第1実施形態では、熱電素子12、13と熱交換部材22、32とを半田16で直接接着するように構成したが、これに限らず、熱電素子12、13と熱交換部材22、32との間に別体の電極部材15を設けて構成しても良い。   According to the above configuration, in the first embodiment, the thermoelectric elements 12 and 13 and the heat exchange members 22 and 32 are directly bonded with the solder 16, but the present invention is not limited thereto, and the thermoelectric elements 12 and 13 are configured. A separate electrode member 15 may be provided between the heat exchange members 22 and 32.

この場合には、上記第1実施形態と同じように、開口孔14cの外周部と電極部25、35の対向配置される部位とを固着することにより、吸熱側の熱交換部材22、32で発生した結露水が開口孔14cに浸水することはない。従って、電極部25、35と電極部材15との接着箇所、電極部材15と熱電素子12、13との接着箇所および熱電素子12、13への浸水を防止できる。   In this case, in the same manner as in the first embodiment, the heat exchange members 22 and 32 on the heat absorption side are fixed by fixing the outer peripheral portion of the opening hole 14c and the portions where the electrode portions 25 and 35 are opposed to each other. The generated dew condensation water does not enter the opening hole 14c. Accordingly, it is possible to prevent the adhesion between the electrode portions 25 and 35 and the electrode member 15, the adhesion between the electrode member 15 and the thermoelectric elements 12 and 13, and water immersion in the thermoelectric elements 12 and 13.

(第6実施形態)
上記第5実施形態では、別体の電極部材15を設けて熱電素子12、13の端面に電極部材15の一端面を半田で接合して熱電素子基板10を構成し、その熱電素子基板10に複数の熱交換部材22、32が保持された封止部材14を組み付けるように構成したが、これに限らず、別体の電極部材15を設けて熱電素子12、13の端面に電極部材15の一端面を半田で接合して熱電素子基板10を構成し、その熱電素子基板10に封止部材14を配設した後に、複数の熱交換部材22、32を組み付けるように構成しても良い。
(Sixth embodiment)
In the fifth embodiment, a separate electrode member 15 is provided, and one end surface of the electrode member 15 is joined to the end surfaces of the thermoelectric elements 12 and 13 by soldering to constitute the thermoelectric element substrate 10. The sealing member 14 in which the plurality of heat exchange members 22 and 32 are held is assembled. However, the present invention is not limited to this, and a separate electrode member 15 is provided, and the electrode members 15 are provided on the end faces of the thermoelectric elements 12 and 13. The thermoelectric element substrate 10 may be configured by joining one end surfaces thereof with solder, and after the sealing member 14 is disposed on the thermoelectric element substrate 10, a plurality of heat exchange members 22 and 32 may be assembled.

具体的には、図13に示すように、熱電素子12、13の端面に電極部材15の一端面を半田16で接合して熱電素子基板10を構成した後に、その熱電素子基板10の両面に開口孔14cが形成された封止部材14を配設する。   Specifically, as shown in FIG. 13, after one end surface of the electrode member 15 is joined to the end surfaces of the thermoelectric elements 12 and 13 with solder 16 to form the thermoelectric element substrate 10, the thermoelectric element substrate 10 is formed on both surfaces of the thermoelectric element substrate 10. The sealing member 14 in which the opening hole 14c is formed is disposed.

これにより、封止部材14の外縁全周に押圧を掛けることで、フィルム状の封止部材14の外縁が保持板11の額縁に接着される。これにより、結露水が封止部材14の外方から熱電素子12、13自体、電極部25、35と熱電素子12、13の端面との接合部16に浸水することはない。   Thereby, the outer edge of the film-shaped sealing member 14 is bonded to the frame of the holding plate 11 by pressing the entire outer periphery of the sealing member 14. Accordingly, the dew condensation water does not enter the thermoelectric elements 12 and 13 themselves, the joint portions 16 between the electrode portions 25 and 35 and the end faces of the thermoelectric elements 12 and 13 from the outside of the sealing member 14.

そして、封止部材14の開口孔14cに半田16を充填した後に複数の熱交換部材22、32を固着させて配置した後に電極部材15と電極部25、35とを一斉に接合させる。これにより、電極部材15と電極部25、35とが半田16を介して直接接合される。   Then, after filling the opening 16c of the sealing member 14 with the solder 16, the plurality of heat exchange members 22 and 32 are fixed and arranged, and then the electrode member 15 and the electrode portions 25 and 35 are joined together. Thereby, the electrode member 15 and the electrode parts 25 and 35 are directly joined via the solder 16.

以上の構成によれば、上記第5実施形態では、開口孔14cの外周部と電極部25、35の対向配置される部位とを固着するように構成したが、これに限らず、開口孔14cの外周部と電極部材15の対向配置される部位とを固着する構成でも良い。これにより、吸熱側の熱交換部材22、32で発生した結露水が開口孔14cを通過して熱電素子12、13に浸水することはない。従って、電極部材15と熱電素子12、13との接着箇所および熱電素子12、13自体への浸水を防止できる。   According to the above configuration, in the fifth embodiment, the outer peripheral portion of the opening hole 14c and the portion where the electrode portions 25 and 35 are arranged to be opposed to each other are fixed. The structure which adhere | attaches the outer peripheral part of this and the site | part arrange | positioned facing the electrode member 15 may be sufficient. Thereby, the dew condensation water generated by the heat exchange members 22 and 32 on the heat absorption side does not pass through the opening hole 14c and enter the thermoelectric elements 12 and 13. Therefore, it is possible to prevent water from entering the bonding portion between the electrode member 15 and the thermoelectric elements 12 and 13 and the thermoelectric elements 12 and 13 themselves.

(第7実施形態)
上記第5および第6実施形態では、熱交換部材22、32と電極部材15との間に封止部材14を配置するように構成したが、これに限らず、熱電素子12、13と電極部材15との間に封止部材14を配置して開口孔14cの外周部と電極部材15の対向配置される部位とを固着するように構成しても良い。
(Seventh embodiment)
In the fifth and sixth embodiments, the sealing member 14 is arranged between the heat exchange members 22 and 32 and the electrode member 15. However, the present invention is not limited thereto, and the thermoelectric elements 12 and 13 and the electrode member are arranged. The sealing member 14 may be disposed between the outer peripheral portion of the opening hole 14 c and the portion of the electrode member 15 facing the electrode member 15.

具体的には、図14および図15に示すように、P型熱電素子12とN型熱電素子13とを電気的に接続する別体の電極部材15を設け、開口孔14cが形成される封止部材14は熱電素子12、13と電極部材15との間に配設される。   Specifically, as shown in FIGS. 14 and 15, a separate electrode member 15 that electrically connects the P-type thermoelectric element 12 and the N-type thermoelectric element 13 is provided, and the opening 14c is formed. The stop member 14 is disposed between the thermoelectric elements 12 and 13 and the electrode member 15.

そして、封止部材14は開口孔14cの外周部と電極部材15の対向配置される部位とを固着させる。そして、封止部材14の開口孔14cに半田16を充填した後に、熱電素子基板10に配置した後に電極部材15と熱電素子12、13とを一斉に接合させる。   And the sealing member 14 fixes the outer peripheral part of the opening hole 14c, and the site | part by which the electrode member 15 is opposingly arranged. And after filling the opening hole 14c of the sealing member 14 with the solder 16 and arrange | positioning on the thermoelectric element board | substrate 10, the electrode member 15 and the thermoelectric elements 12 and 13 are joined simultaneously.

そして、その熱電素子基板10に配設された電極部材15に電極部25、35を配置して半田16で一斉に接合する。これにより、複数の熱交換部材22、32が熱電素子基板10に設けられる。   Then, the electrode portions 25 and 35 are disposed on the electrode member 15 disposed on the thermoelectric element substrate 10 and are joined together by the solder 16. Accordingly, the plurality of heat exchange members 22 and 32 are provided on the thermoelectric element substrate 10.

これにより、吸熱側の熱交換部材22、32で発生した結露水が開口孔14cを通過して熱電素子12、13に浸水することはない。従って、電極部材15と熱電素子12、13との接着箇所および熱電素子12、13への浸水を防止できる。   Thereby, the dew condensation water generated by the heat exchange members 22 and 32 on the heat absorption side does not pass through the opening hole 14c and enter the thermoelectric elements 12 and 13. Accordingly, it is possible to prevent adhesion between the electrode member 15 and the thermoelectric elements 12 and 13 and water intrusion to the thermoelectric elements 12 and 13.

(第8実施形態)
上記第7実施形態では、熱電素子12、13と電極部材15との間に封止部材14を配置して開口孔14cの外周部と電極部材15の対向配置される部位とを固着するように構成したが、これに限らず、開口孔14cの外周部と熱電素子12、13の対向配置される部位とを固着するように構成しても良い。
(Eighth embodiment)
In the seventh embodiment, the sealing member 14 is disposed between the thermoelectric elements 12 and 13 and the electrode member 15 so that the outer peripheral portion of the opening hole 14c and the portion where the electrode member 15 is disposed are fixed. Although comprised, it is not restricted to this, You may comprise so that the outer peripheral part of the opening hole 14c and the site | part by which the thermoelectric elements 12 and 13 are opposingly arranged may be fixed.

具体的には、図16に示すように、熱電素子12、13の端面で開口孔14cを蓋するように封止部材14を熱電素子12、13の端面に押圧させて接着で固着する。そして、封止部材14の開口孔14cに半田16を充填した後に、電極部材15を開口孔14cに配置させて半田16で電極部材15と熱電素子12、13とを一斉に接合する。   Specifically, as shown in FIG. 16, the sealing member 14 is pressed against the end surfaces of the thermoelectric elements 12 and 13 so as to cover the opening holes 14 c with the end surfaces of the thermoelectric elements 12 and 13, and is fixed by adhesion. Then, after the opening hole 14 c of the sealing member 14 is filled with the solder 16, the electrode member 15 is disposed in the opening hole 14 c and the electrode member 15 and the thermoelectric elements 12 and 13 are joined together by the solder 16.

そして、封止部材14に配設された電極部材15に電極部25、35を配置して半田16で一斉に接合する。これにより、複数の熱交換部材22、32が熱電素子基板10に設けられる。   Then, the electrode portions 25 and 35 are disposed on the electrode member 15 disposed on the sealing member 14 and are joined together by the solder 16. Accordingly, the plurality of heat exchange members 22 and 32 are provided on the thermoelectric element substrate 10.

これにより、吸熱側の熱交換部材22、32で発生した結露水が開口孔14cを通過して熱電素子12、13に浸水することはない。従って、熱電素子12、13への浸水を防止できる。   Thereby, the dew condensation water generated by the heat exchange members 22 and 32 on the heat absorption side does not pass through the opening hole 14c and enter the thermoelectric elements 12 and 13. Accordingly, it is possible to prevent water from entering the thermoelectric elements 12 and 13.

(他の実施形態)
上記第1ないし第3および第5ないし第8実施形態では、接着層14bを有するカバーレイフィルム、もしくは樹脂フィルム14aにボンディング層が積層されたボンディングシートにより封止部材14を形成したが、これに限らず、樹脂フィルム14aに半田などの接合部材が積層されたフィルムで封止部材14を形成しても良い。
(Other embodiments)
In the first to third and fifth to eighth embodiments, the sealing member 14 is formed by the coverlay film having the adhesive layer 14b or the bonding sheet in which the bonding layer is laminated on the resin film 14a. The sealing member 14 may be formed of a film in which a bonding member such as solder is laminated on the resin film 14a.

また、以上の実施形態では、本発明を車両に搭載されるシート空調装置に適用させたが、車両とは限らず、ペルチェ素子により送風空気を冷却もしくは加熱する冷却装置もしくは加熱装置に適用させても良い。   In the above embodiment, the present invention is applied to a seat air conditioner mounted on a vehicle. However, the present invention is not limited to a vehicle, and may be applied to a cooling device or a heating device that cools or heats blown air using a Peltier element. Also good.

本発明の第1実施形態における固定板を配設する前の熱電変換装置の外観形状を示す平面図である。It is a top view which shows the external appearance shape of the thermoelectric conversion apparatus before arrange | positioning the stationary plate in 1st Embodiment of this invention. 図1に示すA−A断面図である。It is AA sectional drawing shown in FIG. 本発明の第1実施形態における熱電変換装置の全体構成を示す分解模式図である。It is a disassembled schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 1st Embodiment of this invention. 図2に示すC−C断面図CC cross section shown in FIG. 図1に示すB−B断面図である。It is BB sectional drawing shown in FIG. (a)ないし(e)は本発明の第1実施形態における封止部材14の製造方法における組付け手順を示す説明図である。(A) thru | or (e) is explanatory drawing which shows the assembly | attachment procedure in the manufacturing method of the sealing member 14 in 1st Embodiment of this invention. 本発明の第2実施形態における固定板を配設する前の熱電変換装置の外観形状を示す平面図である。It is a top view which shows the external appearance shape of the thermoelectric conversion apparatus before arrange | positioning the stationary plate in 2nd Embodiment of this invention. (a)ないし(e)は本発明の第2実施形態における封止部材14の製造方法における組付け手順を示す説明図である。(A) thru | or (e) is explanatory drawing which shows the assembly | attachment procedure in the manufacturing method of the sealing member 14 in 2nd Embodiment of this invention. 本発明の第3実施形態における熱電変換装置の概略構成を示す断面図である。It is sectional drawing which shows schematic structure of the thermoelectric conversion apparatus in 3rd Embodiment of this invention. (a)および(b)は本発明の第4実施形態における封止部材14の製造方法における組付けを示す説明図である。(A) And (b) is explanatory drawing which shows the assembly | attachment in the manufacturing method of the sealing member 14 in 4th Embodiment of this invention. 本発明の第5実施形態における熱電変換装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the thermoelectric conversion apparatus in 5th Embodiment of this invention. 本発明の第5実施形態における熱電変換装置の全体構成を示す分解模式図である。It is a disassembled schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 5th Embodiment of this invention. 本発明の第6実施形態における熱電変換装置の全体構成を示す分解模式図である。It is a disassembled schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 6th Embodiment of this invention. 本発明の第7実施形態における熱電変換装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the thermoelectric conversion apparatus in 7th Embodiment of this invention. 本発明の第7実施形態における熱電変換装置の全体構成を示す分解模式図である。It is a disassembled schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 7th Embodiment of this invention. 本発明の第8実施形態における熱電変換装置の全体構成を示す分解模式図である。It is a disassembled schematic diagram which shows the whole structure of the thermoelectric conversion apparatus in 8th Embodiment of this invention.

符号の説明Explanation of symbols

12…P型熱電素子、熱電素子
13…N型熱電素子、熱電素子
14…封止部材
14c…開口孔
15…電極部材
16…半田(導電性接着剤)
17…シール部材
22…吸熱熱交換部材、熱交換部材
32…吸熱熱交換部材、熱交換部材
DESCRIPTION OF SYMBOLS 12 ... P-type thermoelectric element, thermoelectric element 13 ... N-type thermoelectric element, thermoelectric element 14 ... Sealing member 14c ... Opening hole 15 ... Electrode member 16 ... Solder (conductive adhesive)
17 ... Seal member 22 ... Endothermic heat exchange member, heat exchange member 32 ... Endothermic heat exchange member, heat exchange member

Claims (12)

空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、
前記熱電素子(12、13)および前記空気と熱交換可能に設けられた熱交換部材(22、32)と、
前記熱電素子(12、13)と前記熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
前記熱電素子(12、13)と前記熱交換部材(22、32)とは、前記開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、
前記熱交換部材(22、32)には、前記封止部材(14)のうち前記開口孔(14c)の外周部と対向配置される部位が形成されており、
前記部位において前記熱交換部材(22、32)と前記封止部材(14)とが固着されていることを特徴とする熱電変換装置。
A thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage,
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13);
A heat exchange member (22, 32) provided so as to be able to exchange heat with the thermoelectric element (12, 13) and the air;
A film-shaped sealing member (14) having an opening (14c) formed between the thermoelectric element (12, 13) and the heat exchange member (22, 32);
The thermoelectric element (12, 13) and the heat exchange member (22, 32) are bonded to each other by a conductive adhesive (16) provided in the opening hole (14c),
The heat exchange member (22, 32) is formed with a portion of the sealing member (14) that is disposed opposite to the outer peripheral portion of the opening hole (14c),
The thermoelectric conversion device, wherein the heat exchange member (22, 32) and the sealing member (14) are fixed to each other at the site.
空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、
前記熱電素子(12、13)および前記空気と熱交換可能に設けられた熱交換部材(22、32)と、
前記熱電素子(12、13)と前記熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
前記熱電素子(12、13)と前記熱交換部材(22、32)とは、前記開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、
前記熱電素子(12、13)には、前記封止部材(14)のうち前記開口孔(14c)の外周部と対向配置される部位が形成されており、
前記部位において前記熱電素子(12、13)と前記封止部材(14)とが固着されていることを特徴とする熱電変換装置。
A thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage,
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13);
A heat exchange member (22, 32) provided so as to be able to exchange heat with the thermoelectric element (12, 13) and the air;
A film-shaped sealing member (14) having an opening (14c) formed between the thermoelectric element (12, 13) and the heat exchange member (22, 32);
The thermoelectric element (12, 13) and the heat exchange member (22, 32) are bonded to each other by a conductive adhesive (16) provided in the opening hole (14c),
The thermoelectric element (12, 13) is formed with a portion of the sealing member (14) that is disposed opposite the outer peripheral portion of the opening hole (14c),
The thermoelectric conversion device, wherein the thermoelectric element (12, 13) and the sealing member (14) are fixed to each other at the site.
空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、
前記P型熱電素子(12)と前記N型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、
前記電極部材(15)および前記空気と熱交換可能に設けられた熱交換部材(22、32)と、
前記電極部材(15)と前記熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
前記電極部材(15)と前記熱交換部材(22、32)とは、前記開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、
前記電極部材(15)と前記熱電素子(12、13)とは、導電性接着剤(16)によって互いに接着され、
前記熱交換部材(22、32)には、前記封止部材(14)のうち前記開口孔(14c)の外周部と対向配置される部位が形成されており、
前記部位において前記熱交換部材(22、32)と前記封止部材(14)とが固着されていることを特徴とする熱電変換装置。
A thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage,
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13);
The P-type thermoelectric element (12) and the N-type thermoelectric element (13) are electrically connected to each other, and an electrode member (15) provided to be able to exchange heat with these thermoelectric elements (12, 13);
A heat exchange member (22, 32) provided so as to be able to exchange heat with the electrode member (15) and the air;
A film-like sealing member (14) having an opening hole (14c) formed between the electrode member (15) and the heat exchange member (22, 32);
The electrode member (15) and the heat exchange member (22, 32) are bonded to each other by a conductive adhesive (16) provided in the opening hole (14c),
The electrode member (15) and the thermoelectric element (12, 13) are bonded to each other by a conductive adhesive (16),
The heat exchange member (22, 32) is formed with a portion of the sealing member (14) that is disposed opposite to the outer peripheral portion of the opening hole (14c),
The thermoelectric conversion device, wherein the heat exchange member (22, 32) and the sealing member (14) are fixed to each other at the site.
空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、
前記P型熱電素子(12)と前記N型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、
前記電極部材(15)および前記空気と熱交換可能に設けられた熱交換部材(22、32)と、
前記電極部材(15)と前記熱交換部材(22、32)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
前記電極部材(15)と前記熱交換部材(22、32)とは、前記開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、
前記電極部材(15)と前記熱電素子(12、13)とは、導電性接着剤(16)によって互いに接着され、
前記電極部材(15)には、前記封止部材(14)のうち前記開口孔(14c)の外周部と対向配置される部位が形成されており、
前記部位において前記電極部材(15)と前記封止部材(14)とが固着されていることを特徴とする熱電変換装置。
A thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage,
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13);
The P-type thermoelectric element (12) and the N-type thermoelectric element (13) are electrically connected to each other, and an electrode member (15) provided to be able to exchange heat with these thermoelectric elements (12, 13);
A heat exchange member (22, 32) provided so as to be able to exchange heat with the electrode member (15) and the air;
A film-like sealing member (14) having an opening hole (14c) formed between the electrode member (15) and the heat exchange member (22, 32);
The electrode member (15) and the heat exchange member (22, 32) are bonded to each other by a conductive adhesive (16) provided in the opening hole (14c),
The electrode member (15) and the thermoelectric element (12, 13) are bonded to each other by a conductive adhesive (16),
The electrode member (15) is formed with a portion of the sealing member (14) disposed opposite to the outer peripheral portion of the opening hole (14c),
The thermoelectric conversion device, wherein the electrode member (15) and the sealing member (14) are fixed to each other at the site.
空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、
前記P型熱電素子(12)と前記N型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、
前記電極部材(15)および前記空気と熱交換可能に設けられた熱交換部材(22、32)と、
前記熱電素子(12、13)と前記電極部材(15)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
前記熱電素子(12、13)と前記電極部材(15)とは、前記開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、
前記電極部材(15)と前記熱交換部材(22、32)とは、導電性接着剤(16)によって互いに接着され、
前記電極部材(15)には、前記封止部材(14)のうち前記開口孔(14c)の外周部と対向配置される部位が形成されており、
前記部位において前記電極部材(15)と前記封止部材(14)とが固着されていることを特徴とする熱電変換装置。
A thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage,
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13);
The P-type thermoelectric element (12) and the N-type thermoelectric element (13) are electrically connected, and the thermoelectric elements (12, 13) and an electrode member (15) provided so as to be able to exchange heat,
A heat exchange member (22, 32) provided so as to be able to exchange heat with the electrode member (15) and the air;
A film-shaped sealing member (14) having an opening (14c) formed between the thermoelectric elements (12, 13) and the electrode member (15);
The thermoelectric elements (12, 13) and the electrode member (15) are bonded to each other by a conductive adhesive (16) provided in the opening hole (14c),
The electrode member (15) and the heat exchange member (22, 32) are bonded to each other by a conductive adhesive (16),
The electrode member (15) is formed with a portion of the sealing member (14) disposed opposite to the outer peripheral portion of the opening hole (14c),
The thermoelectric conversion device, wherein the electrode member (15) and the sealing member (14) are fixed to each other at the site.
空気通路内に配置され、この空気通路内を流れる空気と熱交換することで前記空気を冷却または加熱する熱電変換装置であって、
P型熱電素子(12)とN型熱電素子(13)を含む熱電素子(12、13)と、
前記P型熱電素子(12)と前記N型熱電素子(13)とを電気的に接続するとともに、これら熱電素子(12、13)と熱交換可能に設けられた電極部材(15)と、
前記電極部材(15)および前記空気と熱交換可能に設けられた熱交換部材(22、32)と、
前記熱電素子(12、13)と前記電極部材(15)との間に配置されるとともに、開口孔(14c)が形成されたフィルム状の封止部材(14)とを有し、
前記熱電素子(12、13)と前記電極部材(15)とは、前記開口孔(14c)に設けられた導電性接着剤(16)によって互いに接着され、
前記電極部材(15)と前記熱交換部材(22、32)とは、導電性接着剤(16)によって互いに接着され、
前記熱電素子(12、13)には、前記封止部材(14)のうち前記開口孔(14c)の外周部と対向配置される部位が形成されており、
前記部位において前記熱電素子(12、13)と前記封止部材(14)とが固着されていることを特徴とする熱電変換装置。
A thermoelectric conversion device that is arranged in an air passage and cools or heats the air by exchanging heat with air flowing in the air passage,
Thermoelectric elements (12, 13) including a P-type thermoelectric element (12) and an N-type thermoelectric element (13);
The P-type thermoelectric element (12) and the N-type thermoelectric element (13) are electrically connected to each other, and an electrode member (15) provided to be able to exchange heat with these thermoelectric elements (12, 13);
A heat exchange member (22, 32) provided so as to be able to exchange heat with the electrode member (15) and the air;
A film-shaped sealing member (14) having an opening (14c) formed between the thermoelectric elements (12, 13) and the electrode member (15);
The thermoelectric elements (12, 13) and the electrode member (15) are bonded to each other by a conductive adhesive (16) provided in the opening hole (14c),
The electrode member (15) and the heat exchange member (22, 32) are bonded to each other by a conductive adhesive (16),
The thermoelectric element (12, 13) is formed with a portion of the sealing member (14) that is disposed opposite the outer peripheral portion of the opening hole (14c),
The thermoelectric conversion device, wherein the thermoelectric element (12, 13) and the sealing member (14) are fixed to each other at the site.
前記封止部材(14)は、樹脂フィルムに接着層が積層されていることを特徴とする請求項1ないし請求項6のいずれか一項に記載の熱電変換装置。   The thermoelectric conversion device according to any one of claims 1 to 6, wherein the sealing member (14) has an adhesive layer laminated on a resin film. 前記封止部材(14)は、接着層を有するカバーレイフィルムにより形成されていることを特徴とする請求項7に記載の熱電変換装置。   The thermoelectric conversion device according to claim 7, wherein the sealing member (14) is formed of a coverlay film having an adhesive layer. 前記封止部材(14)は、樹脂フィルムにボンディングシートが積層されていることを特徴とする請求項7に記載の熱電変換装置。   The thermoelectric conversion device according to claim 7, wherein the sealing member (14) is formed by laminating a bonding sheet on a resin film. 前記封止部材(14)は、熱可塑性の樹脂フィルムであることを特徴とする請求項1ないし請求項6のいずれか一項に記載の熱電変換装置。   The thermoelectric conversion device according to any one of claims 1 to 6, wherein the sealing member (14) is a thermoplastic resin film. 前記封止部材(14)は、ポリイミド樹脂、ポリエチレンナフタレート樹脂、またはポリエチレンテレフタレート樹脂のいずれか一つの樹脂により形成されていることを特徴とする請求項7ないし請求項10のいずれか一項に記載の熱電変換装置。   11. The sealing member according to claim 7, wherein the sealing member is formed of any one of a polyimide resin, a polyethylene naphthalate resin, and a polyethylene terephthalate resin. 11. The thermoelectric conversion device as described. 前記封止部材(14)は、前記熱電素子(12、13)と前記電極部材(15)との接着箇所、前記電極部材(15)と前記熱交換部材(22、32)との接着箇所、または前記熱電素子(12、13)と前記熱交換部材(22、32)との接着箇所のいずれかが外方に露出しないようにその表面の一部または全面にシール部材(17)を塗布したことを特徴とする請求項1ないし請求項9のいずれか一項に記載の熱電変換装置。   The sealing member (14) includes a bonding portion between the thermoelectric element (12, 13) and the electrode member (15), a bonding portion between the electrode member (15) and the heat exchange member (22, 32), Alternatively, a seal member (17) is applied to a part of or the entire surface of the thermoelectric element (12, 13) and the heat exchange member (22, 32) so that any one of the adhesion portions is not exposed to the outside. The thermoelectric conversion device according to any one of claims 1 to 9, wherein the thermoelectric conversion device is characterized.
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