JP5392196B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device for cooling a semiconductor mounting body in which a semiconductor element and a plate-shaped metal body are integrated with a coolant.

  As a conventional semiconductor device, a flat cooling pipe through which a refrigerant flows is laminated to constitute a laminated cooler, a semiconductor mounting body is arranged between adjacent cooling pipes, and the stacked cooling device and the semiconductor mounting body are pressurized with a spring. Therefore, it is proposed that the gap between the cooling pipe and the semiconductor mounting body generated due to manufacturing variations be reduced (that is, the cooling pipe and the semiconductor mounting body are brought into surface contact) to improve heat transfer (For example, refer to Patent Document 1). In addition, when the clearance gap between a cooling pipe and a semiconductor mounting body is large, the clearance gap is also filled with grease.

  As another conventional semiconductor device, a semiconductor element and a heat dissipating metal body are sealed with a resin sealing material to form a semiconductor mounting body, and a part of the sealing material is a semiconductor mounting. There has been proposed a structure in which a coolant channel is formed so as to surround the body, and the semiconductor mounting body is cooled by bringing the coolant directly into contact with the heat radiating surface of the metal body (see, for example, Patent Document 2).

JP 2009-130964 A JP 2006-165534 A

  However, the former conventional device requires a spring or grease in order to improve heat transfer.

  On the other hand, the latter conventional device requires a seal between the sealing material and the heat dissipation surface of the metal body because the refrigerant directly contacts the heat dissipation surface of the metal body. It is difficult to seal. In addition, when a heat generating component (for example, a capacitor, a reactor, a circuit board, or the like) is disposed around the semiconductor device, the sealing material that forms the flow path of the refrigerant is resin, so the heat around the semiconductor device is It is difficult to absorb the refrigerant through the sealing material. Therefore, the temperature around the semiconductor device rises, and the heat resistance of the heat-generating components arranged around the semiconductor device must be increased, resulting in an increase in cost.

  In view of the above points, an object of the present invention is to obtain high heat conductivity without using a spring or grease. Another object is to facilitate sealing and to easily absorb ambient heat into the refrigerant.

  To achieve the above object, according to the first aspect of the present invention, a semiconductor in which a semiconductor element (111) and plate-like metal bodies (112, 113) disposed on both sides of the semiconductor element (111) are integrated. The mounting body (11) is provided, and when the direction in which the semiconductor element (111) and the metal body (112, 113) are stacked is defined as the stacking direction, both end surfaces of the semiconductor mounting body (11) in the stacking direction are heat dissipation surfaces. In the semiconductor device that is configured and the semiconductor mounting body (11) is cooled by the refrigerant, the semiconductor mounting body (11) and a metal cooling plate (13, 13) that sandwiches the semiconductor mounting body (11) from both sides in the stacking direction. 14) is integrated with the semiconductor cooling structure (1), and the semiconductor cooling structure (1) communicates the one end side and the other end side in the stacking direction of the semiconductor cooling structure (1), Between cooling plates (13, 14) A coolant channel (19) for circulating a coolant is provided, and a plurality of semiconductor cooling structures (1) are stacked along the stacking direction, and cooling plates (13, 14) in adjacent semiconductor cooling structures (1) are provided. A refrigerant circulation space (18) communicating with the refrigerant flow path (19) is formed between the two.

  According to this, since the semiconductor mounting body (11) is sandwiched between the cooling plates (13, 14), the gap between the semiconductor mounting body (11) and the cooling plates (13, 14) is reduced. High heat conductivity can be obtained without using a spring or grease.

Further, in the invention according to claim 1, semiconductors cooling structure (1) is disposed on both sides in a direction orthogonal to the stacking direction of the semiconductor mounting body (11), the cooling plate (13, 14) And a refrigerant channel (19) is provided in the spacer (12).

  According to this, the spacer (12) and the cooling plates (13, 14) that form the refrigerant flow path (19) and the refrigerant circulation space (18) are all made of metal, thereby making it easy to ensure sealing performance, and The heat around the semiconductor device is easily absorbed by the refrigerant.

In the invention described in claim 2, in the semiconductor device according to claim 1, the semiconductor cooling structure (1) is a cooling plate (13, 14) are formed separately, the spacer (12) The communication pipe (20) is provided, the communication pipe (20) is joined to the two cooling plates (13, 14), and the refrigerant channel (19) is formed by the communication pipe (20). It is characterized by.

  According to this, by making all the communication pipe (20) and the cooling plates (13, 14) forming the refrigerant flow path (19) and the refrigerant circulation space (18), it is easy to ensure the sealing performance, In addition, the heat around the semiconductor device is easily absorbed by the refrigerant.

In the invention described in claim 3, in the semiconductor device according to claim 1, the semiconductor cooling structure (1) is provided with cylindrical portion disposed in the spacer (12) to (143), cylindrical portion (143) Is formed integrally with one cooling plate (13, 14) of the two cooling plates (13, 14), and extends toward the other cooling plate (13, 14) so that the tip side is the other. The cooling plates (13, 14) are joined to each other, and the refrigerant flow path is formed by the cylindrical portion (143).

  According to this, since the cooling plates (13, 14) forming the refrigerant flow path (19) and the refrigerant circulation space (18) are made of metal, it is easy to ensure the sealing performance, and the heat around the semiconductor device is reduced. Easy to absorb in refrigerant.

According to a fourth aspect of the present invention, in the semiconductor device according to any one of the first to third aspects, one of the two cooling plates (13, 14) has a coolant flow. A protrusion (133) surrounding the opening of the passage (19) and the refrigerant circulation space (18) is provided, and between the cooling plate (13, 14) and the protrusion (133) facing the protrusion (133), It is sealed by an annular seal member (17) made of an elastic member.

  According to this, the space between the cooling plates (13, 14) and the protrusions (133) can be reliably sealed.

According to a fifth aspect of the present invention, in the semiconductor device according to any one of the first to fourth aspects, the cooling plate (13, 14) protrudes toward the refrigerant circulation space (18), so that the refrigerant and the cooling plate are cooled. It is characterized by comprising cooling fins (132, 142) that promote heat transfer between the plates (13, 14).

  According to this, the heat conductivity is further enhanced, and the semiconductor mounting body (11) can be cooled more reliably.

As in the invention described in claim 6 , in the semiconductor device according to any one of claims 1 to 5 , an insulating film (11) is provided between the semiconductor mounting body (11) and the cooling plates (13, 14). 15, 16) can be electrically insulated.

As in the invention described in claim 7, in the semiconductor device according to claim 6, the function of the insulating film (15, 16) joins the semiconductor mounting body (11) and cooling plate (13, 14) Can have.

According to an eighth aspect of the present invention, in the semiconductor device according to the third aspect , the thickness of the cylindrical portion (143) is reduced toward the other cooling plate (13, 14). .

  According to this, when manufacturing a cooling plate (13, 14) by casting, a molten metal tends to flow smoothly in a cylinder part (143).

The invention according to claim 9 is the semiconductor device according to claim 3 or 8 , characterized in that the outer peripheral surface of the cylindrical portion (143) is narrowed toward the other cooling plate (13, 14). And

  According to this, in the case where the cylindrical portion (143) is inserted into the through hole of the spacer (12), the assembly of the spacer (12) to the cylindrical portion (143) is facilitated.

According to a tenth aspect of the present invention, in the semiconductor device according to the second or third aspect , the spacer (12) is made of a thermoplastic resin.

  According to this, when the semiconductor mounting body (11), the spacer (12), the cooling plates (13, 14) and the like are integrated, the spacer (12) is softened by applying heat, thereby the semiconductor mounting body (11 ) And the cooling plates (13, 14) can be reliably brought into surface contact.

  In addition, the code | symbol in the bracket | parenthesis of each means described in this column and the claim shows the correspondence with the specific means as described in embodiment mentioned later.

1 is a diagram illustrating a semiconductor device according to a first embodiment of the present invention. It is sectional drawing which shows the semiconductor cooling structure in the semiconductor device of FIG. FIG. 2 is a cross-sectional view showing a state where semiconductor cooling structures in the semiconductor device of FIG. 1 are stacked. It is a perspective view which shows the insulating film in the semiconductor device of FIG. It is a disassembled perspective view of the semiconductor cooling structure in the semiconductor device which concerns on 2nd Embodiment of this invention. It is sectional drawing of the principal part in the semiconductor cooling structure of FIG. It is sectional drawing of the principal part of the semiconductor cooling structure in the semiconductor device which concerns on 3rd Embodiment of this invention. It is sectional drawing of the principal part which shows the modification of the semiconductor device which concerns on 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
FIG. 1A is a perspective view of the semiconductor device according to the first embodiment of the present invention, and FIG. 1B is an exploded perspective view of the semiconductor device of FIG. 2 is a cross-sectional view showing a semiconductor cooling structure in the semiconductor device of FIG. 1, FIG. 3 is a cross-sectional view showing a stacked state of the semiconductor cooling structure in the semiconductor device of FIG. 1, and FIG. 4 is in the semiconductor device of FIG. It is a perspective view which shows an insulating film.

  As shown in FIG. 1, the semiconductor device includes a plurality (three in the example) of semiconductor cooling structures 1 stacked, and a first lid 3 is disposed on one end side of these semiconductor cooling structures 1. The second lid member 4 is disposed on the other end side of these semiconductor cooling structures 1, and they are fastened by a large number of bolts 5.

  2 and 3, the semiconductor cooling structure 1 includes a semiconductor mounting body 11, a spacer 12, a first cooling plate 13, a second cooling plate 14, a first insulating film 15, a second insulating film 16, and An O-ring 17 is provided.

  The semiconductor mounting body 11 includes two semiconductor chips 111 as semiconductor elements. Specifically, one semiconductor chip 111 is composed of a power semiconductor element such as an IGBT (Insulated Gate Bipolar Transistor) or a thyristor, and the other semiconductor chip 111 is an FWD (Free Wheel Diode), for example. The semiconductor chip 111 has a rectangular parallelepiped thin plate shape.

  A first heat sink 112 as a first metal body is disposed facing one end surface of the two semiconductor chips 111, and a second heat sink 113 as a second metal body is disposed facing the other end surface of the two semiconductor chips 111. Has been. In other words, the semiconductor chip 111 and the heat sinks 112 and 113 are stacked. Hereinafter, the direction in which the semiconductor chip 111 and the heat sinks 112 and 113 are stacked is referred to as a stacking direction A. Here, the first heat sink 112 and the second heat sink 113 are made of a metal having good thermal conductivity and electrical conductivity, such as a copper alloy or an aluminum alloy. Further, the first heat sink 112 and the second heat sink 113 are substantially rectangular parallelepiped plates.

  One end surface of the two semiconductor chips 111 and the first heat sink 112 are bonded by a first solder 114 as a conductive bonding member, and the other end surface of the two semiconductor chips 111 and the second heat sink 113 are a first bonding as a conductive bonding member. They are joined by two solders 115.

  The semiconductor chip 111, the first heat sink 112, the second heat sink 113, the first solder 114, and the second solder 115 are integrated by a mold resin 116 as a sealing material. As the mold resin 116, a mold material such as an epoxy resin is used.

  Here, both end surfaces of the semiconductor mounting body 11 in the stacking direction A, that is, the surface on the anti-semiconductor chip side of the first heat sink 112 (the surface on the upper side in FIG. 2), and the anti-semiconductor chip side of the second heat sink 113 are shown. The surface (the surface on the lower side in FIG. 2) is exposed from the mold resin 116 and functions as a heat radiating surface for radiating the heat of the semiconductor chip 111.

  As described above, the semiconductor mounting body 11 includes the semiconductor chip 111, the first heat sink 112, the second heat sink 113, the first solder 114, the second solder 115, and the mold resin 116. Moreover, the semiconductor mounting body 11 is a substantially rectangular parallelepiped.

  The spacers 12 are made of a metal having good thermal conductivity such as an aluminum alloy, and are disposed on both sides of the semiconductor mounting body 11 in the direction orthogonal to the stacking direction A. The spacer 12 is a substantially rectangular parallelepiped, and a through hole 121 penetrating in the stacking direction A is formed. The dimension of the spacer 12 in the stacking direction A is the same as or slightly larger than the dimension of the semiconductor mounting body 11 in the stacking direction A.

  The first cooling plate 13 is made of a metal having good thermal conductivity such as an aluminum alloy, and is disposed on one end side in the stacking direction A of the semiconductor mounting body 11 and the spacer 12. The first cooling plate 13 has a substantially rectangular parallelepiped plate shape, and two through holes 131 that penetrate in the stacking direction A are formed.

  The first cooling plate 13 and the first cooling plate 13 protrude toward the refrigerant circulation space 18 (detailed later) on the surface on the anti-semiconductor mounting body side of the first cooling plate 13 (the surface on the upper side in FIG. 2) and the first cooling. A large number of cooling fins 132 are formed to promote heat transfer with the plate 13. In addition, a refrigerant | coolant is fluids, such as air, water, and oil.

  An opening of the through hole 131, the cooling fin 132, and an annular protrusion 133 surrounding the coolant circulation space 18 are formed on the surface of the first cooling plate 13 on the side opposite to the semiconductor mounting body (the surface on the upper side in FIG. 2). Has been. An annular groove 134 into which the O-ring 17 as a seal member is inserted is formed on the surface of the protrusion 133 on the side opposite to the semiconductor mounting body (the surface on the upper side in FIG. 2).

  The second cooling plate 14 is made of a metal having good thermal conductivity such as an aluminum alloy, and is disposed on the other end side in the stacking direction A of the semiconductor mounting body 11 and the spacer 12. The second cooling plate 14 has a substantially rectangular parallelepiped plate shape, and two through holes 141 penetrating in the stacking direction A are formed.

  The surface of the second cooling plate 14 on the side opposite to the semiconductor mounting body (the surface on the lower side in FIG. 2) protrudes toward the refrigerant circulation space 18, and the refrigerant flowing through the refrigerant circulation space 18 and the second cooling plate 14. A number of cooling fins 142 are formed to facilitate heat transfer therebetween.

  As shown in FIG. 4, the first insulating film 15 and the second insulating film 16 are rectangular thin films, and are disposed on both sides of the insulating layers 151 and 161 having high electrical insulation and the insulating layers 151 and 161. It consists of adhesive layers 152 and 162 that soften by heating and exhibit an adhesive function. Note that alumina or the like can be used for the insulating layers 151 and 161, and a material obtained by mixing alumina or the like with a resin can also be used.

  As shown in FIGS. 2 and 3, in the semiconductor cooling structure 1, the first insulating film 15 is disposed between the semiconductor mounting body 11 and the first cooling plate 13, and the semiconductor mounting body 11 and the second cooling plate 14 are arranged. The second insulating film 16 is disposed between the semiconductor mounting body 11, the spacer 12 is disposed on both sides of the semiconductor mounting body 11 in the direction orthogonal to the stacking direction A, and the semiconductor mounting body 11, the spacer 12, The first insulating film 15 and the second insulating film 16 are sandwiched and integrated by the first cooling plate 13 and the second cooling plate 14 from both sides in the stacking direction A.

  Specifically, the adhesive layer 152 of the first insulating film 15 is softened by heating, and the semiconductor mounting body 11 and the first cooling plate 13 are bonded by the softened adhesive layer 152. Similarly, the second insulating film The sixteen adhesive layers 162 are softened by heating, and the semiconductor mounting body 11 and the second cooling plate 14 are bonded by the softened adhesive layer 162. Moreover, the 1st cooling plate 13 and the spacer 12 are joined by adhesion | attachment, welding, etc., and the 2nd cooling plate 14 and the spacer 12 are also joined by adhesion | attachment, welding, etc. FIG.

  Here, when joining the spacer 12 and each cooling plate 13 and 14, it pressurizes from the outer side of each cooling plate 13 and 14, and compresses and deforms the spacer 12 to the lamination direction A, and thereby the semiconductor mounting body 11 and each each The gap between the cooling plates 13 and 14 can be reduced.

  In the semiconductor cooling structure 1 integrated in this way, the refrigerant circulation space 18 on one end side and the refrigerant circulation space 18 on the other end side in the stacking direction A in the semiconductor cooling structure 1 are formed in the through holes 121 of the spacer 12. The through holes 131 of the first cooling plate 13 and the through holes 141 of the second cooling plate 14 communicate with each other. Here, the boundary part between the through hole 121 of the spacer 12 and the through hole 131 of the first cooling plate 13 and the boundary part of the through hole 121 of the spacer 12 and the through hole 141 of the second cooling plate 14 are welded or the like. Are joined and sealed. The through hole 121 of the spacer 12, the through hole 131 of the first cooling plate 13, and the through hole 141 of the second cooling plate 14 constitute a refrigerant flow path through which the refrigerant flows. This is referred to as a refrigerant flow path 19.

  As shown in FIGS. 1 and 3, a plurality of semiconductor cooling structures 1 are used by being stacked in the stacking direction A, and a refrigerant circulation space is provided between cooling plates 13 and 14 in adjacent semiconductor cooling structures 1. 18 is formed. More specifically, of the two adjacent semiconductor cooling structures 1, the first cooling plate 13 and the protrusion 133 in one semiconductor cooling structure 1, and the second cooling plate 14 in the other semiconductor cooling structure 1 Thus, the refrigerant circulation space 18 is formed. The space between the protrusion 133 and the second cooling plate 14 is sealed by an O-ring 17.

  The 1st cover material 3 consists of metals, such as an aluminum alloy, and is a substantially rectangular parallelepiped board. The first lid member 3 includes an inlet pipe 31 serving as a refrigerant inlet and an outlet pipe 32 serving as a refrigerant outlet. A refrigerant circulation space 18 is formed between the semiconductor cooling structure 1 adjacent to the first lid member 3 and the first lid member 3, and the inlet pipe 31 and the outlet pipe 32 communicate with the refrigerant circulation space 18. . A gap between the protrusion 133 of the semiconductor cooling structure 1 adjacent to the first lid 3 and the first lid 3 is sealed by an O-ring 17.

  The 2nd cover material 4 consists of metals, such as an aluminum alloy, and is a substantially rectangular parallelepiped board. A coolant circulation space 18 is formed between the semiconductor cooling structure 1 adjacent to the second lid 4 and the second lid 4, and the second cooling plate 14 of the semiconductor cooling structure 1 adjacent to the second lid 4. And the second lid member 4 are sealed by an O-ring 17 disposed in the recess 41 of the second lid member 4.

  Then, the bolt 5 is passed through the bolt through hole (not shown) of the first lid member 3 and the bolt through hole 42 of the second lid member 4, and the bolt 5 and a nut (not shown) are screwed together, The semiconductor cooling structure 1, the first lid member 3, and the second lid member 4 are fastened.

  In the semiconductor device configured as described above, the semiconductor chip 111 is cooled as follows. First, the heat generated by the semiconductor chip 111 is transmitted to the first heat sink 112 via the first solder 114 and also transmitted to the second heat sink 113 via the second solder 115.

  On the other hand, the refrigerant guided to the inlet pipe 31 returns to the outlet pipe 32 through the refrigerant circulation space 18 and the refrigerant flow path 19 as indicated by an arrow B in FIG. When the refrigerant passes through the refrigerant circulation space 18, the refrigerant receives heat from the first heat sink 112 via the first cooling plate 13 and the first insulating film 15, and the second cooling plate 14 and the second insulating film 16. Heat is received from the second heat sink 113 via the heat sink. As a result, the heat generated by the semiconductor chip 111 is transferred to the refrigerant, and the semiconductor chip 111 is cooled.

  In the semiconductor device of the present embodiment described above, the semiconductor mounting body 11 is sandwiched between the first cooling plate 13 and the second cooling plate 14, and therefore, between the semiconductor mounting body 11 and each cooling plate 13, 14. Therefore, a high heat transfer property can be obtained without using a spring or grease.

  In addition, since the spacer 12 and the cooling plates 13 and 14 that form the refrigerant flow path 19 and the refrigerant circulation space 18 are all made of metal, it is easy to ensure sealing performance, and the heat around the semiconductor device 11 is removed from the spacer. 12 and the cooling plates 13 and 14 are easily absorbed by the refrigerant.

  Further, the cooling fins 132 and 142 provided on the cooling plates 13 and 14 further enhance the heat transfer between the coolant and the cooling plates 13 and 14, thereby further reliably cooling the semiconductor chip 111 of the semiconductor mounting body 11. be able to.

(Second Embodiment)
FIG. 5 is an exploded perspective view of the semiconductor cooling structure in the semiconductor device according to the second embodiment of the present invention, and FIG. 6 is a cross-sectional view of the main part of the semiconductor cooling structure in FIG.

  In the present embodiment, the configuration of the refrigerant flow path 19 and the material of the spacer 12 are different from those of the first embodiment, and the other parts are the same as those of the first embodiment. Therefore, only different portions will be described.

  As shown in FIGS. 5 and 6, a cylindrical communication pipe 20 is inserted into the through hole 121 of the spacer 12, the through hole 131 of the first cooling plate 13, and the through hole 141 of the second cooling plate 14. Both ends of the communication pipe 20 are joined to the cooling plates 13, 14, and the refrigerant circulation space 18 on one end side and the refrigerant circulation space 18 on the other end side in the stacking direction A in the semiconductor cooling structure 1 are connected by the communication pipe 20. It is communicated. That is, the through hole inside the communication pipe 20 constitutes the refrigerant flow path 19 through which the refrigerant flows.

  The communication pipe 20 and the cooling plates 13 and 14 are made of the same material and are made of a metal having good thermal conductivity such as an aluminum alloy or a copper alloy. The communication pipe 20 and the cooling plates 13 and 14 can be joined by welding the outer peripheral portions of both ends of the communication pipe 20 and the inner peripheral surfaces of the through holes 131 and 141 in the cooling plates 13 and 14. Since the welding location in this case is the surface side of each cooling plate 13 and 14, it is easy to weld.

  Note that both ends of the communication pipe 20 may be caulked to join the communication pipe 20 and the cooling plates 13 and 14, or the communication pipe 20 and the cooling plates 13 and 14 may be joined by welding and caulking. Good.

  The spacer 12 is made of resin, preferably a thermoplastic resin, and the dimension in the stacking direction A of the spacer 12 is larger than the dimension of the stacking direction A in the semiconductor mounting body 11. In this case, when the component parts are integrated to form the semiconductor cooling structure 1, the semiconductor mounting body 11, the spacer 12, and the insulating films 15 and 16 are laminated by the first cooling plate 13 and the second cooling plate 14. By pressing them while heating them while being sandwiched from both sides in the direction A, the spacer 12 can be compressed in the stacking direction A and the semiconductor mounting body 11 and the cooling plates 13 and 14 can be brought into close contact with each other. And after this, the communicating pipe 20 and each cooling plate 13 and 14 are joined.

(Third embodiment)
FIG. 7 is a cross-sectional view of the main part of the semiconductor cooling structure in the semiconductor device according to the third embodiment of the present invention.

  In the present embodiment, the configuration of the refrigerant channel 19 is different from that of the second embodiment, and the other parts are the same as those of the second embodiment.

  As shown in FIG. 7, the second cooling plate 14 is integrally formed with a cylindrical tube portion 143 extending toward the first cooling plate 13. More specifically, the cylindrical portion 143 has a constant inner diameter and outer diameter. The cylindrical portion 143 is inserted into the through hole 121 (see FIG. 5) of the spacer 12 and the through hole 131 (see FIG. 5) of the first cooling plate 13, and the tip of the cylindrical portion 143 is joined to the first cooling plate 13. In addition, the refrigerant circulation space 18 on one end side in the stacking direction A in the semiconductor cooling structure 1 and the refrigerant circulation space 18 on the other end side are communicated with each other by a cylinder portion 143. That is, the through hole inside the cylinder portion 143 constitutes the refrigerant flow path 19 through which the refrigerant flows.

  In addition, the cylinder part 143 and the 1st cooling plate 13 can be joined by welding the front-end | tip outer peripheral part of the cylinder part 143, and the internal peripheral surface of the through-hole 131 of the 1st cooling plate 13. FIG. Moreover, the front-end | tip part of the cylinder part 143 may be crimped, the cylinder part 143 and the 1st cooling plate 13 may be joined, and the cylinder part 143 and the 1st cooling plate 13 may be joined by welding and caulking.

  In the semiconductor device of this embodiment, the communication pipe 20 is unnecessary, so that the number of parts can be reduced, the insertion work of the communication pipe 20 is not required, and the number of welding points is reduced.

  Further, the second cooling plate 14 of the semiconductor device of the present embodiment includes a thin portion 144 at a portion facing the semiconductor mounting body 11 and a thick portion 145 thicker than the thin portion 144 at a portion facing the spacer 12. The step portion 146 between the thin portion 144 and the thick portion 145 is used for positioning of the semiconductor mounting body 11.

  And since it has the thick part 145, the area of the outer peripheral side surface of the 2nd cooling plate 14 increases, and it becomes easy to absorb the heat | fever around the semiconductor device 11. FIG. In addition, by further increasing the thickness of the thick part 145 (for example, by setting it to 1/2 or more of the thickness of the second cooling plate 14 including the cylinder part 143), the outer peripheral side surface of the second cooling plate 14 This further increases the area of the semiconductor device 11 and makes it easier to absorb the heat around the semiconductor device 11. Moreover, since it has the thick part 145, when manufacturing the 2nd cooling plate 14 by casting, a molten metal tends to flow into the cylinder part 143 smoothly.

  In the above embodiment, the inner diameter and the outer diameter of the cylinder portion 143 are constant, but the outer peripheral surface of the cylinder portion 143 is narrowed toward the first cooling plate 13 as in the modification shown in FIG. It may be. According to this, it becomes easy to insert the cylinder part 143 into the through hole 121 of the spacer 12, and the assembly of the spacer 12 to the cylinder part 143 becomes easy. Moreover, since the thickness of the cylinder part 143 becomes thin toward the 1st cooling plate 13, when manufacturing the 2nd cooling plate 14 by casting, a molten metal tends to flow smoothly in the cylinder part 143. FIG.

DESCRIPTION OF SYMBOLS 1 Semiconductor cooling structure 11 Semiconductor mounting body 12 Spacer 13 Cooling plate 14 Cooling plate 18 Refrigerant flow space 19 Refrigerant flow path 111 Semiconductor element 112 Metal body 113 Metal body

Claims (10)

A semiconductor mounting body (11) in which a semiconductor element (111) and plate-like metal bodies (112, 113) disposed on both sides of the semiconductor element (111) are integrated, and the semiconductor element (111) When the direction in which the metal bodies (112, 113) are stacked is defined as the stacking direction, both end surfaces of the semiconductor mounting body (11) in the stacking direction are configured as heat dissipation surfaces, and the semiconductor mounting body (11) In a semiconductor device that is cooled by a refrigerant,
A semiconductor cooling structure (1) in which the semiconductor mounting body (11) and a metal cooling plate (13, 14) sandwiching the semiconductor mounting body (11) from both sides in the stacking direction are integrated. ,
The semiconductor cooling structure (1) communicates the one end side and the other end side in the stacking direction of the semiconductor cooling structure (1) so that the refrigerant flows between the cooling plates (13, 14). Comprising a flow path (19),
Further, a plurality of the semiconductor cooling structures (1) are stacked along the stacking direction, and the refrigerant flow path (13, 14) is disposed between the cooling plates (13, 14) in the adjacent semiconductor cooling structures (1). 19) and the refrigerant circulation space communicating (18) is formed,
The semiconductor cooling structure (1) is disposed on both sides of the semiconductor mounting body (11) in a direction orthogonal to the stacking direction and is sandwiched between the cooling plates (13, 14). With
The semiconductor device, wherein the coolant channel (19) is provided in the spacer (12) . The semiconductor cooling structure (1) includes a communication pipe (20) formed separately from the cooling plates (13, 14) and disposed in the spacer (12).
The communication pipe (20) is joined to the two cooling plates (13, 14),
The semiconductor device according to claim 1 , wherein the coolant channel (19) is formed by the communication pipe (20). The semiconductor cooling structure (1) includes a cylindrical portion (143) disposed in the spacer (12),
The cylindrical portion (143) is integrally formed with one cooling plate (13, 14) of the two cooling plates (13, 14) and toward the other cooling plate (13, 14). It is extended and the tip side is joined to the other cooling plate (13, 14),
The semiconductor device according to claim 1 , wherein the refrigerant flow path is formed by the cylindrical portion (143). Of the two cooling plates (13, 14), one cooling plate (13, 14) includes an opening of the refrigerant flow path (19) and a protrusion (133) surrounding the refrigerant circulation space (18). ,
The cooling plate (13, 14) facing the projection (133) and the projection (133) are sealed by an annular seal member (17) made of an elastic member. the semiconductor device according to any one of claims 1 to 3. The cooling plate (13, 14) protrudes toward the refrigerant circulation space (18) and promotes heat transfer between the refrigerant and the cooling plate (13, 14). the semiconductor device according to any one of claims 1 to 4, characterized in that it comprises. Wherein between the semiconductor mounting body (11) and said cooling plate (13, 14) is any one of claims 1 to 5, characterized in that it is electrically insulated by an insulating film (15, 16) The semiconductor device described in one. The semiconductor device according to claim 6 , wherein the insulating films (15, 16) have a function of bonding the semiconductor mounting body (11) and the cooling plate (13, 14). 4. The semiconductor device according to claim 3 , wherein a thickness of the cylindrical portion (143) is reduced toward the other cooling plate (13, 14). The semiconductor device according to claim 3 or 8 , wherein an outer peripheral surface of the cylindrical portion (143) is narrowed toward the other cooling plate (13, 14). Wherein the spacer (12) The semiconductor device according to claim 2 or 3, characterized by comprising a thermoplastic resin.

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