JP4830402B2 - Manufacturing method of semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device capable of easily identifying a characteristic characteristic of a semiconductor device from a chip and a manufacturing method thereof.

  High-frequency semiconductor devices have different characteristics for each chip, and these must be taken into account when used. Therefore, these characteristics are measured in the state of the wafer.

  Conventionally, as shown in FIG. 6, an address indicating the position of the chip 1 in the wafer (for example, X = 20, Y = 15) is attached to the surface of the chip 1. Data management of the semiconductor device is performed for each address (see, for example, Patent Document 1).

JP-A-11-214274

  A semiconductor device is manufactured by dividing a wafer processed for each lot into chips. Therefore, the intrinsic characteristics of the semiconductor device vary depending on the lot or wafer to which the semiconductor device belongs. However, since the lot name or wafer number to which the semiconductor device belongs is not known from the address information, it is difficult to identify the unique characteristics of the semiconductor device from the chip.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to obtain a semiconductor device and a method for manufacturing the same that can easily identify the unique characteristics of the semiconductor device from the chip. .

A method of manufacturing a semiconductor device according to the present invention includes a step of processing a wafer for each lot to manufacture a plurality of semiconductor devices on the wafer, a step of evaluating unique characteristics of each semiconductor device, A step of creating data associating unique characteristics with information of a lot name or wafer number to which the semiconductor device belongs, a step of attaching an identifier indicating the lot name or wafer number to which the semiconductor device belongs to the surface of each chip; Dividing the wafer for each semiconductor device, and the identifier includes two resistor strings in which a plurality of resistors are connected in series, and wiring that connects the two resistor strings. The wiring is formed by transferring using a stepper mask, and the resistance value of the identifier is adjusted by changing the position of the wiring by adjusting an offset amount during the transfer, Information of the semiconductor device by the resistance value of Besshi is characterized in that it is identified. Other features of the present invention will become apparent below.

  According to the present invention, unique characteristics of a semiconductor device can be easily identified from a chip.

Embodiment 1 FIG.
FIG. 1 is a top view showing a semiconductor device according to Embodiment 1 of the present invention. On the surface of the chip 1, a chip tag 2 is built as an identifier. However, the chip tag 2 may be embedded in the surface of the chip. In the chip tag 2, the lot name or wafer number to which the semiconductor device belongs is written.

  A method for manufacturing the semiconductor device will be described. First, a wafer is processed for each lot, and a plurality of semiconductor devices are manufactured on the wafer. Next, characteristics of each semiconductor device such as DC characteristics, RF characteristics, or bias conditions are evaluated in a wafer state.

  Next, data is created that associates the unique characteristics of each semiconductor device with information on the lot name or wafer number to which the semiconductor device belongs. Then, a chip tag 2 is created as an identifier on the surface of each chip on the wafer, and the lot name or wafer number to which the semiconductor device belongs is written in this chip tag 2. Thereafter, the wafer is divided for each semiconductor device.

  Here, the writing of information is not limited to after the evaluation after the chip is manufactured, but may be performed during the chip manufacturing process. Further, it may be written on the oxide film on the chip surface using a laser or the like, or may be written on the chip surface by ink jet or the like. These pieces of information are not limited to writing by character symbols, but may be written by a two-dimensional dot method as shown in FIG.

  According to the semiconductor device manufactured by the above process, the lot name or wafer number to which the semiconductor device belongs can be identified by reading the information of the chip tag 2. And from this information and the above-mentioned data, the characteristic characteristic of the corresponding semiconductor device can be easily identified. This characteristic can be used for chip combination and bias setting.

  Note that, after evaluating the unique characteristics of the semiconductor device, the unique characteristics of the semiconductor device may be directly written into the chip tag 2. Further, a chip address, a manufacturing date, etc. may be written in the chip tag 2.

Embodiment 2. FIG.
FIG. 3 is a top view showing an identifier according to Embodiment 2 of the present invention. First, two resistor arrays in which a plurality of resistors 3 are connected in series are formed in parallel on the surface of the chip. Next, the pad 4 is connected to one end of each resistor row.

  Then, by transferring using a stepper mask, the wiring 5 connecting the two resistor rows is formed. By adjusting the offset amount during the transfer, the position of the wiring 5 is changed and the resistance value of the identifier is adjusted. Based on the resistance value of this identifier, information such as the lot name or wafer number to which the semiconductor device belongs and unique characteristics of the semiconductor device are identified. Therefore, the lot name or wafer number can be identified by applying a needle to the pad 4 and measuring the resistance value of the identifier.

  By using the reference resistor 6, the lot name or wafer number is identified based on how many times the resistance value of the identifier is larger than the resistance value of the reference resistor 6, regardless of fluctuations between low resistance lots or wafers. can do.

Embodiment 3 FIG.
FIG. 4 is a top view showing an identifier according to Embodiment 3 of the present invention. A grid-like wiring in which a plurality of vertical wirings 10 and a plurality of horizontal wirings 11 are formed in different layers is provided. However, since an interlayer insulating film exists between the vertical wiring 10 and the horizontal wiring 11, they are insulated from each other.

  Resistor rows 12 and 13 each having a plurality of resistors connected in series are connected to the upper end or lower end and the right end or left end of the grid-like wiring. Pads 14 and 15 are provided at one ends of the resistor arrays 12 and 13, respectively.

  Then, the resistance value of the identifier is selected by selectively providing a contact hole 16 connecting one of the plurality of vertical wirings 10 and one of the plurality of horizontal wirings 11 at the intersection of the vertical wiring 10 and the horizontal wiring 11. Is done. The positioning of the contact hole 16 can be set for each wafer by changing the offset amount in the vertical and horizontal directions of the stepper mask.

  For example, one resistor in the vertical resistor row 13 is 10 kΩ, one resistor in the horizontal resistor row 12 is 1 kΩ, and a unit of 10 kΩ can be used for identifying a lot number and a unit of 1 kΩ for identifying a wafer number. In this case, if a contact hole is provided at the position of FIG. 3, the resistance between the pads 14 and 15 is 15Ω, and the semiconductor device is identified as belonging to the fifth wafer of the first lot.

Embodiment 4 FIG.
FIG. 5 is a top view showing an identifier according to Embodiment 4 of the present invention. Five resistors 18 are arranged in parallel on the chip via a base film 17. A pad 19 is connected to one end of each resistor 18, and a wiring 20 is connected to the other end. The wiring 20 is collectively connected to the pad 21.

  After chip manufacture, the resistor is cut according to the information to be written. The cutting of the resistor is performed by applying a current to both ends of the resistor or using a laser. Thereafter, by measuring the resistance value between the pad 19 and the pad 21, the information of the semiconductor device can be identified.

It is a top view which shows the semiconductor device which concerns on Embodiment 1 of this invention. It is a figure which shows the information written by the two-dimensional dot system. It is a top view which shows the identifier which concerns on Embodiment 2 of this invention. It is a top view which shows the identifier which concerns on Embodiment 3 of this invention. It is a top view which shows the identifier which concerns on Embodiment 4 of this invention. It is a top view which shows the conventional chip | tip.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Chip 2 Chip tag 3 Resistance 4, 14, 15, 19, 21 Pad 5 Wiring 6 Reference resistance 10 Vertical wiring 11 Horizontal wiring 12, 13 Resistance row 16 Contact hole 17 Base film 18 Resistance 20 Wiring

Claims (4)

  Processing a wafer for each lot to manufacture a plurality of semiconductor devices on the wafer; and
  Evaluating the unique characteristics of each semiconductor device;
  Creating data that associates the unique characteristics of each semiconductor device with information on the lot name or wafer number to which the semiconductor device belongs;
  Attaching an identifier indicating the lot name or wafer number to which the semiconductor device belongs to the surface of each chip;
  Dividing the wafer into the semiconductor devices, and
  The identifier has two resistance strings in which a plurality of resistors are connected in series, and a wiring that connects between the two resistance strings.
  The wiring is formed by transferring using a stepper mask,
  Change the position of the wiring by adjusting the offset amount during the transfer, and adjust the resistance value of the identifier,
  The method of manufacturing a semiconductor device, wherein information of the semiconductor device is identified by a resistance value of the identifier.   Processing a wafer for each lot to manufacture a plurality of semiconductor devices on the wafer; and
  Evaluating the unique characteristics of each semiconductor device;
  Creating data that associates the unique characteristics of each semiconductor device with information on the lot name or wafer number to which the semiconductor device belongs;
  Attaching an identifier indicating the lot name or wafer number to which the semiconductor device belongs to the surface of each chip;
  Dividing the wafer into the semiconductor devices, and
  The identifier includes a plurality of vertical wirings and a plurality of horizontal wirings formed in separate layers, a grid-like wiring, a resistance string connected to the plurality of vertical wirings, and a resistance string connected to the plurality of horizontal wirings And a contact hole connecting one of the plurality of vertical wirings and one of the plurality of horizontal wirings,
  The contact hole is formed by transferring using a stepper mask,
  Adjust the resistance value of the identifier by changing the position of the contact hole by adjusting the offset amount during the transfer,
  The method of manufacturing a semiconductor device, wherein information of the semiconductor device is identified by a resistance value of the identifier.   Processing a wafer for each lot to manufacture a plurality of semiconductor devices on the wafer; and
  Evaluating the unique characteristics of each semiconductor device;
  Attaching an identifier indicating the unique characteristics of the semiconductor device to the surface of each chip;
  Dividing the wafer into the semiconductor devices, and
  The identifier has two resistance strings in which a plurality of resistors are connected in series, and a wiring that connects between the two resistance strings.
  The wiring is formed by transferring using a stepper mask,
  Change the position of the wiring by adjusting the offset amount during the transfer, and adjust the resistance value of the identifier,
  The method of manufacturing a semiconductor device, wherein information of the semiconductor device is identified by a resistance value of the identifier.   Processing a wafer for each lot to manufacture a plurality of semiconductor devices on the wafer; and
  Evaluating the unique characteristics of each semiconductor device;
  Attaching an identifier indicating the unique characteristics of the semiconductor device to the surface of each chip;
  Dividing the wafer into the semiconductor devices, and
  The identifier includes a plurality of vertical wirings and a plurality of horizontal wirings formed in separate layers, a grid-like wiring, a resistance string connected to the plurality of vertical wirings, and a resistance string connected to the plurality of horizontal wirings And a contact hole connecting one of the plurality of vertical wirings and one of the plurality of horizontal wirings,
  The contact hole is formed by transferring using a stepper mask,
  Adjust the resistance value of the identifier by changing the position of the contact hole by adjusting the offset amount during the transfer,
  The method of manufacturing a semiconductor device, wherein information of the semiconductor device is identified by a resistance value of the identifier.

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