JP3928681B2 - Semiconductor device and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device having various circuits formed on the surface thereof, a method for manufacturing the same, and a liquid jet recording head on which such a semiconductor device is mounted.
[0002]
[Prior art]
In a conventional semiconductor device, various circuits are generally formed on the surface, and identification symbols such as numbers and alphabets for identifying the semiconductor device are formed. Note that in this specification, a semiconductor device may be referred to as a chip. FIG. 19 is a plan view of an example of a conventional semiconductor device. For example, if the product name of the chip is “A1001”, as shown in FIG. 19A, “A1001” is patterned at one corner of the chip and used to identify the chip.
[0003]
Further, when a plurality of chips are formed on a semiconductor wafer, there are cases where it is desired to represent the positions of individual chips arranged in the wafer. Even in such a case, symbols representing positions in the wafer can be patterned for each chip. For example, when twelve chips are formed on one wafer as shown in FIG. 19B, the orientation flat OF is down and the horizontal (X-axis) direction in FIG. Number 1, 2, 3 from the middle right. Also, numbers 1, 2, 3, 4 are assigned to the vertical direction (Y-axis direction) in the figure from the lower side in the figure. Each chip is a combination of a number in the X-axis direction and a number in the Y-axis direction, and a different number can be assigned to each chip. Here, a number given in the form of XY can be used to identify the position of the chip in the wafer. By patterning this number on the chip, the position in the wafer can be identified even if the chip is separated from the wafer.
[0004]
However, since these identification symbols and the like are formed at the same time when the circuit is formed, they are formed on the same surface as the circuit. For this reason, in applications where other members are joined to the surface on which the circuit is formed, there is a problem that the identification symbol recorded on the chip cannot be identified. For example, a liquid jet recording head used in a liquid jet recording apparatus is configured by joining an ejection element substrate on which an element for ejecting liquid is formed and a channel substrate on which a liquid flow path is formed. In such a case, the identification symbol formed on the ejection element substrate or the channel substrate becomes indistinguishable when the two are joined. Therefore, even if it becomes necessary to know the identification symbol of the chip at a later date, there is a problem that the chip cannot be specified and it becomes difficult to solve the problem.
[0005]
[Problems to be solved by the invention]
The present invention has been made in view of the above-described circumstances. For example, the surface on which the circuit is formed by bonding another member to the surface on which the circuit of the substrate is formed or being covered with the other member. An object of the present invention is to provide a semiconductor device capable of identifying a mark indicating information unique to the semiconductor device even when it is not seen, and a method of manufacturing such a semiconductor device.
[0006]
[Means for Solving the Problems]
According to the present invention, in a semiconductor device configured by bonding another member to a substrate on which a circuit is formed, information unique to the semiconductor device is provided on the same surface of the substrate as the circuit or at least one of the other members. A mark that can be displayed is formed, the mark is formed so as to straddle an area where the wafer is cut, and the information is exposed and displayed on a cross section when the wafer is cut and separated from the wafer. It is characterized by.
[0007]
As described above, when the mark is exposed to the cross section when cut and separated from the wafer, it is possible to identify the mark from the cross section even when another member is bonded to the substrate. .
[0008]
The information shown by the mark exposed on the end face can indicate the type of semiconductor device, the external shape, the arrangement position in the wafer before the semiconductor device is cut and separated, and the like. It can also be information indicating the shape dimension of the semiconductor device, and the shape dimension can be measured from the exposed mark. Based on these pieces of information indicated by the marks, after the semiconductor device is manufactured, it is possible to easily perform inspection or identify the semiconductor device.
[0009]
Further, as such a semiconductor device, a liquid jet recording head is formed by forming a circuit of at least an ejecting element that ejects liquid using the substrate as an ejecting element substrate and bonding the other member to the substrate as a separately formed channel substrate. Can be configured. At this time, since the mark is exposed at the end face, it is possible to acquire information unique to the ejection element substrate even after bonding with the channel substrate. The mark can also be formed on the channel substrate side.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 is a perspective view showing an example of a liquid jet recording head including the first embodiment of the semiconductor device of the present invention. In the figure, 1 is an ejection element substrate, 2 is a channel substrate, 3 is a resin layer, 4 is a nozzle, 5 is a reservoir, and 6 is a mark. The liquid jet recording head shown in FIG. 1 is obtained by joining two silicon substrates and then cutting and separating them into individual liquid jet recording heads.
[0011]
The ejection element substrate 1 has an ejection element for ejecting a liquid. The ejection element substrate 1 can be manufactured by a manufacturing apparatus and a manufacturing method such as LSI. For example, a heat storage layer such as silicon oxide is provided on the surface of a single crystal silicon wafer, and an injection element is formed on the heat storage layer. Here, as an example, a thermal type liquid jet recording head is used, and a heating element using polysilicon is used as the jetting element. A plurality of ejection elements are arranged in a row, and signal lines for supplying electric power and electric signals are connected. Then, heat is generated by a signal propagated from a drive circuit or the like provided in the same chip or outside the chip, and liquid is ejected. A protective film composed of a single layer or a plurality of layers, such as silicon oxide, silicon nitride, and tantalum, is provided on the top of the injection element to protect the injection element. In such a process of forming each layer, a pattern to be the mark 6 is formed. When the mark 6 is formed, the mark 6 is formed so as to be exposed at the end face.
[0012]
A thick resin layer 3 is formed on the ejection element substrate 1. For the resin layer 3, for example, a photosensitive polymer resin, more specifically, a photosensitive polyimide resin can be used. A pit for limiting the growth area of bubbles generated in the liquid due to heat generated by the injection element is formed on the upper part of the injection element. The pits can be formed by applying a photosensitive polymer resin and then patterning it by a photolithography process. The thickness of the resin layer 3 can be arbitrarily selected from the range of several μm to 50 μm in accordance with the target characteristics of the liquid jet recording head. When a photosensitive polyimide resin is used as the resin layer 3, it may be dissolved in the liquid as it is applied. For example, heat is applied to cure the resin layer 3 so as not to dissolve in the liquid.
[0013]
In the channel substrate 2, a reservoir 5 and a liquid flow path provided individually corresponding to each ejection element are formed. The liquid flow path communicates with the reservoir 5 and the opening serves as the nozzle 4. Individual liquid channels and reservoirs 5 can be formed using anisotropic etching, and in particular the reservoir 5 is formed as a through hole. The opening of the reservoir 5 shown is a liquid supply port. Here, for example, a wet anisotropic etching method in which an etching mask is patterned on a silicon wafer having a (100) crystal plane as a surface and then etching is performed using a heated potassium hydroxide (KOH) aqueous solution or the like. Individual liquid flow paths and reservoirs 5 are formed. The individual liquid flow paths and the reservoirs 5 formed by using this anisotropic etching have a shape having a predetermined angle.
[0014]
The jetting element substrate 1 and the channel substrate 2 manufactured as described above are bonded in a state of sandwiching the polyimide layer 3 in a wafer state, and then cut and separated into individual liquid jet recording heads using a grindstone or the like.
[0015]
The mark 6 is exposed on the end face of the liquid jet recording head cut and separated in this way. As described above, the mark 6 can be provided when a circuit is formed on the ejection element substrate 1. In particular, it can be formed in the same step as the step of forming a signal line or the like for supplying electric power or an electric signal to the ejection element provided on the ejection element substrate 1. Here, aluminum is used as the signal line. After the aluminum is deposited on the heating element substrate by vapor deposition or the like, patterning is performed by a photolithography process, and the mark 6 is formed in a form separated from the signal line and the circuit pattern through a process such as etching. Can do. Alternatively, after the resin layer 3 is applied, it can be formed in the same manner as the pits by patterning by a photolithography process. Of course, other layers may be used, and the mark 6 may be composed of a plurality of layers.
[0016]
In the example shown in FIG. 1, the mark 6 is exposed in the same cross section as the nozzle 4, but may be configured to be exposed on any cut surface of the liquid jet recording head. For example, if the mark 6 is arranged on the same cut surface as the nozzle 4 and the cutting quality of the cut surface of the nozzle 4 is considered to be deteriorated, the mark 6 is placed on another cut surface that is not related to the cut surface of the nozzle 4. May be provided. Moreover, you may provide not only in one surface but in multiple surfaces among four cut surfaces.
[0017]
FIG. 2 is an explanatory diagram of a first example of a mark. Here, an example is shown in which a chip is identified by the number of marks appearing on the end face. 2A shows an example of one mark 6, FIG. 2B shows an example of two marks 6, and FIG. 2C shows an example of three marks 6. In FIG. For example, as shown in FIG. 2A, it is assumed that a liquid jet recording head having one mark is a basic liquid jet recording head. Further, as shown in FIG. 2B, it is assumed that the liquid jet recording head having two marks is obtained by improving the liquid flow path of the basic type liquid jet recording head. Further, as shown in FIG. 2C, it is assumed that the liquid jet recording head having three marks is a liquid jet recording head having an improved internal circuit. The improvement of the liquid flow path and the internal circuit cannot be understood from the appearance of the liquid jet recording head as shown in FIG. Further, for example, even if a symbol is formed on the circuit formation surface of the ejection element substrate as in the prior art, it is difficult to confirm the formed symbol because the channel substrate 2 is bonded. However, in the present invention, since the mark 6 is exposed on the end face of the liquid jet recording head, it is possible to confirm which liquid jet recording head is by checking the mark. For example, if the number of marks exposed on the end face is one as shown in FIG. 2A, the liquid jet recording head is of a basic type. If the number of marks exposed on the end face is two as shown in FIG. 2B, the liquid jet recording head is a type with an improved liquid flow path. Further, if the number of marks exposed on the end face is three as shown in FIG. 2C, it can be determined that the liquid jet recording head is a type with an improved internal circuit. As described above, even if the liquid jet recording heads have the same appearance, each liquid jet recording head can be identified after manufacturing by forming the mark 6 exposed on the end face at the time of manufacturing.
[0018]
FIG. 3 is a perspective view showing another example of the liquid jet recording head provided with the first embodiment of the semiconductor device of the present invention. In the figure, the same parts as those in FIG. 7 is a mark. In this example, the mark 7 is provided on the channel substrate 3. The mark 7 can be provided separately from the liquid channel in the same step as the step of forming the individual liquid channel, for example. As described above, when the liquid channel is formed by anisotropic etching, the mark 7 can also be formed by anisotropic etching. In this case, the shape exposed at the end face is substantially triangular or trapezoidal. Also in this case, the mark 7 may be formed so as to be exposed in any cross section of the liquid jet recording head.
[0019]
FIG. 4 is an explanatory diagram of a second example of the mark. As shown in FIG. 3, an example is shown in which chips are identified by the number of marks 7 formed on the channel substrate 3. For example, when the number of marks exposed on the end face is one as shown in FIG. 2A, and when there are two marks 7 as shown in FIG. As shown in FIG. 4, the type of the liquid jet recording head can be specified according to the number of the marks 7 as in the case where the number of the marks 7 is three. In this case, even if the appearance of the liquid jet recording head is the same, the type can be identified if the marks are different.
[0020]
Note that the mark 6 provided on the ejection element substrate 1 side as shown in FIG. 1 and the mark 7 provided on the channel substrate 2 side may be combined. Further, the size of the mark 6 or the mark 7 is not limited. For example, the mark 6 or the mark 7 may be formed in a size that can be visually recognized or formed in a size that can be recognized by a microscope or an imaging device.
[0021]
In the above example, the chip is identified based on the number of marks appearing on the end face. However, the mark can be used for various other purposes. For example, a mark exposed on the cut surface may be used as a method of knowing the position (chip location) of each chip arranged in the wafer within the wafer. For example, as described with reference to FIG. 19B, the chip location can be represented by a combination of a number in the horizontal direction (X direction) and a number in the vertical direction (Y direction). A combination of these numbers may be replaced with a code and displayed on the end face by a mark.
[0022]
FIG. 5 is an explanatory diagram of an example of a chip location coding method, and FIG. 6 is an explanatory diagram of an example of a coded mark. The number in the horizontal direction (X direction) and the number in the vertical direction (Y direction) indicating the chip location can be encoded by being replaced with digital binary (bit) notation as shown in FIG. 5, for example. . In this example, the numbers from 1 to 3 that can be taken in the horizontal direction are expressed in binary notation, where “1” is “01”, “2” is “10”, and “3” is “11”. be able to. Similarly, a vertical number (i.e., a number from 1 to 4) can also be expressed in binary notation. For example, “1” can be expressed as “001”, “2” as “010”, “3” as “011”, and “4” as “100”. The number of binary digits only needs to satisfy the maximum number in decimal notation on the chip location. Here, the horizontal direction is 2 digits in binary, and the vertical direction is 3 digits in binary.
[0023]
In this way, after the chip location is read in binary notation, the read binary notation is patterned. For example, when the chip location is a decimal number of 2-3, the binary number is 10-011. FIG. 6 shows this converted into a pattern. In the example shown in FIG. 6, binary numbers “1” or “0” are shown depending on the presence or absence of patterns arranged at equal intervals. For example, for the horizontal X-axis, the first digit pattern is “1”, the next digit pattern is “0”, and “10” is expressed as a binary number as a whole. Similarly, for the Y axis in the vertical direction, there is no pattern, and there is a pattern, so “011” is shown in binary. It is desirable that the distance n between individual patterns be the same.
[0024]
In addition, a pair of double-width patterns are arranged outside the pattern indicating the horizontal and vertical numbers. This double-width pattern indicates that a pattern indicating a chip location is arranged inside the pattern, so that a pattern indicating a chip location can be easily searched. Also, a pattern (double-width pattern) that separates both patterns is arranged between the horizontal and vertical patterns. These outer and separation patterns are provided in order to simplify the recognition of the chip location pattern, and need not be provided. Further, it is desirable to change the dimensions of the chip location pattern and other patterns as shown in FIG.
[0025]
FIG. 7 is a partial front view showing an example of the liquid jet recording head in which the third example of the mark is exposed on the end face. Here, the mark 6 is formed on the ejection element substrate so that the pattern encoded as described above is exposed from the cut surface. Thus, if the mark 6 is formed so as to be exposed on the end face of the liquid jet recording head, the marks 6 exposed on the cut end face can be used even after the liquid jet recording head formed on the semiconductor wafer is cut. You can know the chip location. In this case, since the chip location is encoded and displayed by the mark 6, for example, the mark 6 may be read as an image and decoded using an image processing apparatus or the like.
[0026]
FIG. 8 is a partial front view showing an example of the liquid jet recording head in which the fourth example of the mark is exposed on the end face. In this example, a mark exposed on the end face is used as a means for easily knowing the positions of a large number of nozzles 4 formed on the liquid jet recording head. As shown in FIG. 8, marks 6 are exposed below the nozzles 4 at predetermined intervals for a number of nozzles 4. As a specific example, in a liquid jet recording head in which 160 nozzles 4 are arranged in a straight line, 16 marks 6 can be arranged every ten. It is desirable to arrange the mark 6 directly below the nozzle 4.
[0027]
FIG. 9 is a partial front view showing an example of the liquid jet recording head in which the fifth example of the mark is exposed on the end surface. Similar to the example shown in FIG. 8, an example is shown in which marks exposed on the end face are used as means for easily knowing the positions of the nozzles 4 formed in large numbers in the liquid jet recording head. In the example shown in FIG. 8, each mark 6 is the same, but in the example shown in FIG. 9, the number of marks is changed depending on the position where the mark 6 is applied. For example, the number of marks may be simply expressed as one-tenth of the number of nozzles, such that the 10th nozzle is represented by one mark and the 20th nozzle is represented by two marks.
[0028]
Further, for example, when the number of nozzles increases or the nozzle interval is narrow, there may be a case where many marks cannot be arranged. In such a case, the number of nozzles to be represented may be converted into binary notation and used as the number of marks. Further, instead of using numbers, the mark size may be changed.
[0029]
8 and 9, the marks 6 are formed according to the number of nozzles 4 arranged in the liquid jet recording head. However, the present invention is not limited to this. For example, in a multi-color integrated liquid jet recording head, nozzles for each color are used. Mark 6 may be formed to indicate a range of four. For example, when there is a so-called dummy nozzle that is not used for normal recording, it is possible to display the type of nozzle, such as distinguishing the dummy nozzle from other nozzles.
[0030]
Next, a case where the outer shape of the liquid jet recording head is measured using marks exposed on the cut surface will be described. FIG. 10 is a perspective view showing an example of a liquid jet recording head equipped with a plurality of individual liquid jet recording heads. In the figure, 11 is an individual liquid jet recording head, and 12 is a heat dissipation substrate. The configuration shown in FIG. 10 shows a recording unit called a so-called Full Width Array. A plurality of individual liquid jet recording heads 11 are connected in a linear or staggered pattern on the heat dissipation substrate 12, and the sheet width can be printed collectively. Each individual liquid jet recording head 11 has a configuration as shown in FIG. In the configuration in which the individual liquid jet recording heads 11 are arranged linearly as shown in FIG. 10, the head interval in the individual liquid jet recording heads 11 to be connected needs to be smaller than the interval between the nozzles 4.
[0031]
In this way, when connecting a plurality of individual liquid jet recording heads 11, poor image quality occurs if the intervals between the nozzles 4 at the joints are not constant. For this purpose, it is necessary to accurately grasp the positions of the nozzles in the arrangement direction of the nozzles 4 in each individual liquid jet recording head 11. Here, a method of measuring the position of the nozzle 4 from the side end face of the individual liquid jet recording head 11 with a mark exposed on the end face will be described.
[0032]
FIG. 11 is a plan view showing an example of a pattern whose shape can be measured. In the figure, 13 and 14 are patterns. When the shape such as the position of the nozzle 4 is measured as described above, for example, a pattern as shown in FIG. 11 is formed on the ejection element substrate, for example. In this pattern, one linear pattern 13 and another pattern 14 having an angle θ from the linear pattern 13 are combined. Note that the angle θ is an angle of tan θ = 0.5 as an example here. Of course, the angle θ is arbitrary.
[0033]
FIG. 12 is a plan view of an example of the individual liquid jet recording head in which the pattern shown in FIG. 11 is formed. FIG. 12 shows a state before cutting at both the left and right end portions. Patterns 13 and 14 as shown in FIG. 11 are formed at both ends in the arrangement direction of the nozzles 4 as shown in FIG. At this time, the patterns 13 and 14 are formed so as to cross the ideal cutting position.
[0034]
FIG. 13 is a front view showing an end surface of the individual liquid jet recording head shown in FIG. 12 after cutting. Reference numeral 15 denotes a mark. By cutting the side edge of the individual liquid jet recording head 11 shown in FIG. 12, the patterns 13 and 14 are also cut, and the two marks 15 are exposed as shown in FIG. For example, when the ideal position indicated by the one-dot chain line in FIG. 12 is cut so as to be the end face, the side end face of the individual liquid jet recording head is placed between the centers of the marks 15 as shown in FIG. Is assumed to be L1.
[0035]
When the distance XR, XL between the nozzle 4 and the cut surface is shifted from the ideal cutting position so as to be reduced, the distance L2 between the centers of the marks 15 is L1> L2 as shown in FIG. Become. On the contrary, when the distance XR, XL between the nozzle 4 and the cut surface is shifted from the ideal cutting position in a direction in which the distance increases, the distance L3 between the centers of the marks 15 is L1 as shown in FIG. <L3. As described above, when the angle θ of the patterns 13 and 14 is tan θ = 0.5, from the distance X between the nozzle 4 and the cut surface at the ideal cutting position and the distance L between the centers of the marks 15 at that time. , X = L × 0.5−a (constant).
[0036]
Note that the pattern is not limited to the pattern shown in FIG. 11, and any pattern may be used as long as the mark exposed on the end face changes due to the shift of the cutting position. FIG. 14 is a plan view showing another example of a pattern whose shape can be measured. The pattern shown in FIG. 14A shows an example in which the two patterns 13 and 14 are provided with a certain angle. In this case, since the distance between the marks changes more greatly than the pattern shown in FIG. 11 in accordance with the deviation of the cutting position, the measurement can be performed with high accuracy.
[0037]
Further, as shown in FIG. 14B, it can be configured by a large number of patterns in which the formation positions are shifted. When cutting, it is possible to measure the cutting position depending on which pattern mark is exposed or how many patterns are exposed.
[0038]
Furthermore, by repeatedly forming patterns such as FIG. 11 and FIG. 14 (A), it is possible to measure the degree when the cutting position is skewed.
[0039]
15 is a plan view of an example of a liquid jet recording head formed so that the pattern shown in FIG. 11 appears as a mark on the nozzle surface, and FIG. 16 is a cross-sectional view showing an example of a liquid flow path in the liquid jet recording head. is there. In FIG. 12, the distance between the nozzle position and the side end surface was measured when the side surface of the liquid jet recording head was cut. Similarly, as shown in FIG. 15, the length of the liquid channel can be measured by forming the pattern so that it appears as a mark on the nozzle surface. Particularly in the liquid jet recording head, the length BTCL of the liquid flow path shown in FIGS. 15 and 16 is an important parameter in terms of jetting characteristics. By managing the dimensional accuracy of the length BTCL of the liquid flow path, uniform image quality can be obtained regardless of the manufacturing variation of each liquid jet recording head.
[0040]
As an example, as shown in FIG. 15, the patterns 13 and 14 shown in FIG. 11 are arranged at desired positions on the ejection element substrate. Here, as shown in FIG. 15, patterns 13 and 14 are formed at both ends of the plurality of arranged liquid flow paths so as to cross the cutting positions. In this case, the patterns 13 and 14 need to be precisely aligned with the liquid flow channel in the extending direction of the liquid flow channel.
[0041]
In the case of cutting at an ideal cutting position so that the position indicated by the alternate long and short dash line in FIG. 15 becomes the nozzle surface, the distance between the centers of the marks 15 exposed on the cutting surface is, for example, as shown in FIG. Let L1. When the cutting position is shifted in the direction in which the liquid flow path is shortened, the distance L2 between the centers of the marks 15 is L1> L2, as shown in FIG. Conversely, when the cutting position is shifted in the direction in which the liquid flow path becomes longer, the distance L3 between the centers of the marks 15 is L1 <L3 as shown in FIG. Thereby, it is possible to know whether or not the length BTCL of the liquid channel is a predetermined length and whether it is longer or shorter than the predetermined length. As described above, when the angle θ of the patterns 13 and 14 is tan θ = 0.5, the distance L between the centers of the marks 15 is measured to thereby deviate from the ideal liquid channel length BTCL. The quantity can be determined by (measured value of L−L1) × 0.5.
[0042]
In the case of measuring the length BTCL of the liquid flow path, the mark exposed on the end face is not limited to the pattern as shown in FIG. Any pattern may be used as long as it is a pattern to be used.
[0043]
FIG. 17 is a schematic plan view showing an example of forming a pattern to be a mark on a semiconductor wafer. In the figure, 21 is a semiconductor wafer, 22 is a chip region, 23 is a cutting region, and 24 is a pattern. When forming the pattern 24 to be a mark exposed on the end face, it is formed so as to extend from the chip region 22 to the cutting region 23 at least in the state of the semiconductor wafer 21. At this time, for example, as shown in FIG. 17, a pattern 24 may be formed so as to straddle the cutting region 23 and cover a plurality of chip regions 22.
[0044]
As described above, the mark exposed on the cut surface can be used for various identification and measurement means of the semiconductor device as described above. These are merely representative examples and can be used for various other identifications and measurements. Further, the above-described identification and measurement can be automatically performed by reading the marks exposed on the cut surface with an image input device such as an imaging device and identifying the marks with an image processing device or the like. It is also possible to determine whether or not the image has been cut into a desired shape by identifying the mark by the image processing apparatus. A signal output from the image processing apparatus can be determined by a determination apparatus, and if it is cut into a desired shape, OK can be determined. Otherwise, NG can be determined. The semiconductor device that has become NG may be controlled to be removed from the line. By performing such automatic mark identification and control, man-hours such as worker inspection can be reduced and efficient production can be performed.
[0045]
FIG. 18 is a schematic configuration perspective view showing an example of a liquid jet recording apparatus equipped with a liquid jet recording head. In the figure, 31 is a recording medium, 32 is a liquid jet recording head, 33 is a carriage, 34 is a liquid cartridge, 35 is a guide shaft, 36 is a guide rail, and 37 is a flexible cable.
[0046]
The recording medium 31 is composed of any recordable medium such as paper, postcard, cloth, and the like. The recording medium 31 is transported to a position facing the liquid jet recording head 32 by a transport mechanism.
[0047]
The liquid jet recording head 32 is the various liquid jet recording heads as described above, and includes the semiconductor device of the present invention. Recording is performed by ejecting liquid onto the opposed recording medium 31 by the ejecting element provided in the liquid ejecting recording head 32. A liquid cartridge 34 is attached to the liquid jet recording head 32, and the liquid to be jetted is supplied from the liquid cartridge 34.
[0048]
The liquid jet recording head 32 and the liquid cartridge 34 are mounted on the carriage 33. In this example, two sets of the liquid jet recording head 32 and the liquid cartridge 34 are mounted on the carriage 33. The carriage 33 is configured to be slidable along a guide shaft 35 and a guide rail 36 that extend in a direction orthogonal to the conveyance direction of the recording medium 31.
[0049]
The recording medium 31 is conveyed from the direction of arrow A. The liquid jet recording head 32 moves in a direction substantially perpendicular to the direction of the arrow A as the carriage 33 slides along the guide shaft 35 and the guide rail 36. At this time, recording data, a control signal, and electric power are supplied through the flexible cable 37, and recording is performed in a band-like area having a width in which the ejection elements are arranged in the liquid ejection recording head 32. An image is formed on the recording medium 31 by repeatedly performing such a recording operation for each band-like region.
[0050]
In the above description, an example in which the semiconductor device of the present invention is applied to a liquid jet recording head having a structure in which two substrates are joined is shown. However, the present invention is not limited to this. For example, the present invention can also be applied to various devices such as micromachines, various sensors, various semiconductor devices manufactured using silicon wafers, fine mechanical devices, and the like.
[0051]
【The invention's effect】
As is apparent from the above description, according to the present invention, since the mark is exposed on the cut surface, for example, even when the mark forming surface of the semiconductor device cannot be confirmed, by using the exposed mark, It is possible to easily specify the type and shape of the external shape and the arrangement in the wafer before the semiconductor device is cut and separated. In addition, there is an effect that the measurement of the cutting accuracy and the internal configuration can be easily and accurately performed by the mark exposed on the cut surface.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an example of a liquid jet recording head provided with a first embodiment of a semiconductor device of the invention.
FIG. 2 is an explanatory diagram of a first example of a mark.
FIG. 3 is a perspective view showing another example of the liquid jet recording head including the first embodiment of the semiconductor device of the invention.
FIG. 4 is an explanatory diagram of a second example of a mark.
FIG. 5 is an explanatory diagram of an example of a chip location encoding method;
FIG. 6 is an explanatory diagram of an example of a coded mark.
FIG. 7 is a partial front view illustrating an example of a liquid jet recording head in which a third example of a mark is exposed on an end surface.
FIG. 8 is a partial front view illustrating an example of a liquid jet recording head in which a fourth example of a mark is exposed on an end surface.
FIG. 9 is a partial front view illustrating an example of a liquid jet recording head in which a fifth example of a mark is exposed on an end surface.
FIG. 10 is a perspective view illustrating an example of a liquid jet recording head on which a plurality of individual liquid jet recording heads are mounted.
FIG. 11 is a plan view showing an example of a pattern whose shape can be measured.
12 is a plan view of an example of an individual liquid jet recording head in which the pattern shown in FIG. 11 is formed. FIG.
13 is a front view showing an end surface of the individual liquid jet recording head shown in FIG. 12 after cutting.
FIG. 14 is a plan view showing another example of a pattern whose shape can be measured.
FIG. 15 is a plan view of an example of a liquid jet recording head formed so that the pattern shown in FIG. 11 appears as a mark on the nozzle surface.
FIG. 16 is a cross-sectional view illustrating an example of a liquid flow path in the liquid jet recording head.
FIG. 17 is a schematic plan view showing an example of forming a pattern to be a mark on a semiconductor wafer.
FIG. 18 is a schematic perspective view showing an example of a liquid jet recording apparatus equipped with a liquid jet recording head.
FIG. 19 is a plan view of an example of a conventional semiconductor device.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Jetting device board | substrate, 2 ... Channel board | substrate, 3 ... Resin layer, 4 ... Nozzle, 5 ... Reservoir, 6, 7 ... Mark, 11 ... Individual liquid jet recording head, 12 ... Heat dissipation board, 13, 14 ... Pattern, 21 DESCRIPTION OF SYMBOLS Semiconductor wafer, 22 ... Chip area, 23 ... Cutting area, 24 ... Pattern, 31 ... Recording medium, 32 ... Liquid jet recording head, 33 ... Carriage, 34 ... Liquid cartridge, 35 ... Guide shaft, 36 ... Guide rail, 37 ... Flexible cable.

Claims (7)

  In a semiconductor device configured by bonding another member to a substrate on which a circuit is formed, a mark capable of displaying information unique to the semiconductor device on the same surface of the substrate or at least one of the other members The mark is formed so as to straddle a region where the wafer is cut, and is exposed to the cross section when the wafer is cut and separated to display the information. Semiconductor device.   The semiconductor device according to claim 1, wherein the mark is formed on both the substrate and the other member.   The semiconductor device according to claim 1, wherein the mark displays information indicating a type of the semiconductor device.   3. The semiconductor device according to claim 1, wherein the mark displays information indicating an arrangement position in the wafer before the semiconductor device is cut and separated.   The semiconductor device according to claim 1, wherein the mark displays information indicating an external shape of the semiconductor device.   3. The semiconductor device according to claim 1, wherein the mark displays information indicating a shape dimension of the semiconductor device, and the shape dimension can be measured from the display by the mark.   A circuit corresponding to a plurality of semiconductor devices is formed on a semiconductor wafer, and a mark capable of displaying information unique to the semiconductor device is formed so as to extend over at least a region to be the semiconductor device, and the semiconductor A method of manufacturing a semiconductor device, comprising: cutting a wafer to expose the mark on an end face of an individual semiconductor device.

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