JP4825172B2 - ボンディング装置用撮像装置及び撮像方法 - Google Patents

ボンディング装置用撮像装置及び撮像方法 Download PDF

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Publication number
JP4825172B2
JP4825172B2 JP2007152642A JP2007152642A JP4825172B2 JP 4825172 B2 JP4825172 B2 JP 4825172B2 JP 2007152642 A JP2007152642 A JP 2007152642A JP 2007152642 A JP2007152642 A JP 2007152642A JP 4825172 B2 JP4825172 B2 JP 4825172B2
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Japan
Prior art keywords
imaging
optical system
lens
optical path
image
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Expired - Fee Related
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JP2007152642A
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English (en)
Japanese (ja)
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JP2008306040A (ja
Inventor
滋 早田
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Shinkawa Ltd
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Shinkawa Ltd
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Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2007152642A priority Critical patent/JP4825172B2/ja
Priority to TW096139979A priority patent/TW200848689A/zh
Priority to KR1020070128940A priority patent/KR100955623B1/ko
Priority to CN2008101089695A priority patent/CN101320703B/zh
Priority to US12/157,059 priority patent/US20090059361A1/en
Publication of JP2008306040A publication Critical patent/JP2008306040A/ja
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Publication of JP4825172B2 publication Critical patent/JP4825172B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07173—Means for moving chips, wafers or other parts, e.g. conveyor belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H10W72/07523—Active alignment, e.g. using optical alignment using marks or sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Wire Bonding (AREA)
  • Studio Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2007152642A 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法 Expired - Fee Related JP4825172B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007152642A JP4825172B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法
TW096139979A TW200848689A (en) 2007-06-08 2007-10-25 Photography apparatus and method thereof for chip bonding device
KR1020070128940A KR100955623B1 (ko) 2007-06-08 2007-12-12 본딩 장치용 촬상 장치 및 촬상 방법
CN2008101089695A CN101320703B (zh) 2007-06-08 2008-06-05 焊接装置用摄像装置及摄像方法
US12/157,059 US20090059361A1 (en) 2007-06-08 2008-06-06 Imaging device and method for a bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007152642A JP4825172B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Publications (2)

Publication Number Publication Date
JP2008306040A JP2008306040A (ja) 2008-12-18
JP4825172B2 true JP4825172B2 (ja) 2011-11-30

Family

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JP2007152642A Expired - Fee Related JP4825172B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Country Status (4)

Country Link
US (1) US20090059361A1 (https=)
JP (1) JP4825172B2 (https=)
KR (1) KR100955623B1 (https=)
TW (1) TW200848689A (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5243284B2 (ja) * 2009-01-30 2013-07-24 株式会社新川 補正位置検出装置、補正位置検出方法及びボンディング装置
KR101245530B1 (ko) * 2011-05-26 2013-03-21 주식회사 탑 엔지니어링 광학검사장치 및 이를 구비하는 어레이 테스트 장치
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
CN104363320A (zh) * 2014-12-03 2015-02-18 成都凯裕电子电器有限公司 一种手机前后置摄像系统
WO2019082558A1 (ja) * 2017-10-26 2019-05-02 株式会社新川 ボンディング装置
TWI826789B (zh) * 2020-06-05 2023-12-21 日商新川股份有限公司 打線接合裝置
JP2025526048A (ja) * 2022-12-12 2025-08-07 エルジー エナジー ソリューション リミテッド バッテリー検査装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03242947A (ja) * 1990-02-21 1991-10-29 Hitachi Ltd ワイヤボンディング方法及びワイヤボンディング装置
JPH04240740A (ja) * 1991-01-25 1992-08-28 Nec Corp ボンディング装置
JPH05332739A (ja) * 1992-05-28 1993-12-14 Fujitsu Ltd 外観検査装置
JPH07270716A (ja) * 1994-03-31 1995-10-20 Ntn Corp 光学装置
JPH08285539A (ja) * 1995-04-18 1996-11-01 Hitachi Ltd パターン計測方法及びその装置
JP4666820B2 (ja) * 2001-06-25 2011-04-06 キヤノン株式会社 虹彩型光量調節装置、レンズ鏡筒および撮影装置
JP2003092248A (ja) * 2001-09-17 2003-03-28 Canon Inc 位置検出装置、位置決め装置及びそれらの方法並びに露光装置及びデバイスの製造方法
US6870684B2 (en) * 2001-09-24 2005-03-22 Kulicke & Soffa Investments, Inc. Multi-wavelength aperture and vision system and method using same
JP2006134917A (ja) * 2004-11-02 2006-05-25 Apic Yamada Corp 樹脂封止方法
JP4825171B2 (ja) * 2007-06-08 2011-11-30 株式会社新川 ボンディング装置用撮像装置及び撮像方法

Also Published As

Publication number Publication date
US20090059361A1 (en) 2009-03-05
TW200848689A (en) 2008-12-16
JP2008306040A (ja) 2008-12-18
KR20080107974A (ko) 2008-12-11
TWI340230B (https=) 2011-04-11
KR100955623B1 (ko) 2010-05-03

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