JP4825172B2 - ボンディング装置用撮像装置及び撮像方法 - Google Patents

ボンディング装置用撮像装置及び撮像方法 Download PDF

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Publication number
JP4825172B2
JP4825172B2 JP2007152642A JP2007152642A JP4825172B2 JP 4825172 B2 JP4825172 B2 JP 4825172B2 JP 2007152642 A JP2007152642 A JP 2007152642A JP 2007152642 A JP2007152642 A JP 2007152642A JP 4825172 B2 JP4825172 B2 JP 4825172B2
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Prior art keywords
imaging
optical system
lens
optical path
image
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Expired - Fee Related
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JP2007152642A
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Japanese (ja)
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JP2008306040A (ja
Inventor
滋 早田
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Shinkawa Ltd
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Shinkawa Ltd
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Priority to JP2007152642A priority Critical patent/JP4825172B2/ja
Priority to TW096139979A priority patent/TW200848689A/zh
Priority to KR1020070128940A priority patent/KR100955623B1/ko
Priority to CN2008101089695A priority patent/CN101320703B/zh
Priority to US12/157,059 priority patent/US20090059361A1/en
Publication of JP2008306040A publication Critical patent/JP2008306040A/ja
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
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  • Engineering & Computer Science (AREA)
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JP2007152642A 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法 Expired - Fee Related JP4825172B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2007152642A JP4825172B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法
TW096139979A TW200848689A (en) 2007-06-08 2007-10-25 Photography apparatus and method thereof for chip bonding device
KR1020070128940A KR100955623B1 (ko) 2007-06-08 2007-12-12 본딩 장치용 촬상 장치 및 촬상 방법
CN2008101089695A CN101320703B (zh) 2007-06-08 2008-06-05 焊接装置用摄像装置及摄像方法
US12/157,059 US20090059361A1 (en) 2007-06-08 2008-06-06 Imaging device and method for a bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007152642A JP4825172B2 (ja) 2007-06-08 2007-06-08 ボンディング装置用撮像装置及び撮像方法

Publications (2)

Publication Number Publication Date
JP2008306040A JP2008306040A (ja) 2008-12-18
JP4825172B2 true JP4825172B2 (ja) 2011-11-30

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US (1) US20090059361A1 (enExample)
JP (1) JP4825172B2 (enExample)
KR (1) KR100955623B1 (enExample)
TW (1) TW200848689A (enExample)

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JP5243284B2 (ja) * 2009-01-30 2013-07-24 株式会社新川 補正位置検出装置、補正位置検出方法及びボンディング装置
KR101245530B1 (ko) * 2011-05-26 2013-03-21 주식회사 탑 엔지니어링 광학검사장치 및 이를 구비하는 어레이 테스트 장치
JP6128337B2 (ja) * 2014-10-23 2017-05-17 パナソニックＩｐマネジメント株式会社 半導体装置の製造方法及び製造装置
CN104363320A (zh) * 2014-12-03 2015-02-18 成都凯裕电子电器有限公司 一种手机前后置摄像系统
KR102327786B1 (ko) * 2017-10-26 2021-11-17 가부시키가이샤 신가와 본딩 장치
TWI826789B (zh) 2020-06-05 2023-12-21 日商新川股份有限公司 打線接合裝置
CN119422052A (zh) * 2022-12-12 2025-02-11 株式会社Lg新能源 电池检查装置

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JPH04240740A (ja) * 1991-01-25 1992-08-28 Nec Corp ボンディング装置
JPH05332739A (ja) * 1992-05-28 1993-12-14 Fujitsu Ltd 外観検査装置
JPH07270716A (ja) * 1994-03-31 1995-10-20 Ntn Corp 光学装置
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