JP4824505B2 - Electronic component crimping apparatus and electronic component crimping method - Google Patents

Description

  The present invention relates to an electronic component crimping apparatus and an electronic component crimping method for accurately and quickly positioning a tape at a predetermined position when the tape is pulled out on a substrate.

  In recent years, with an increase in size of a screen, an increase in size of a substrate (particularly, a glass substrate) is also progressing. For this reason, when a tape (in particular, an ACF tape) for attaching electronic components to the substrate is attached to the substrate by batch bonding, the length of the tape tends to be long.

  However, in the conventional apparatus, when the tape is pulled out on the substrate, the tape is slackened, deviated from the path, or greatly vibrated. For this reason, a problem may arise in the tape sticking accuracy.

  The present invention has been made in consideration of such points, and when the tape is pulled out on the substrate, the tape can be accurately and quickly positioned at a predetermined position, and the operation of the electronic component crimping apparatus can be performed. An object of the present invention is to provide an electronic component crimping apparatus and an electronic component crimping method capable of improving the rate.

  The present invention includes a substrate stage that supports a substrate, a tape supply unit that is disposed on the upstream side of the substrate stage and that supplies a tape composed of release paper and an adhesive film, and is disposed on the downstream side of the tape supply unit, By holding the release paper of the tape supplied from the section and moving it from the upstream side to the downstream side, the drawer unit that supplies a predetermined length of tape onto the substrate and the substrate stage are arranged and drawn. A pressure unit that presses the tape release paper supplied onto the substrate by the unit and presses the adhesive film on the tape onto the substrate, and a downstream side of the substrate stage. A tape take-up unit that winds up the release paper remaining after the pressure bonding, and a tape supply unit and a tape take-up unit are arranged between the tape take-up unit and the tape take-up unit. A holding mechanism for restricting the movement of at least the side holds an electronic component bonding apparatus characterized by comprising a.

  With such a configuration, when the tape is pulled out on the substrate, the tape can be accurately and quickly positioned at a predetermined position, and the operating rate of the electronic component crimping apparatus can be improved.

  The present invention is the electronic component crimping device, wherein the holding mechanism is a side support disposed below the tape and supporting the tape from the side.

  The present invention is an electronic component crimping apparatus further comprising an optical unit that is disposed in the vicinity of a substrate stage and images the position of the substrate relative to the substrate stage.

  With such a configuration, the position of the substrate supported on the substrate stage with respect to the tape can be observed. For this reason, it becomes possible to position a board | substrate in the exact position with respect to a tape.

  The present invention is an electronic component crimping apparatus further comprising a tape guide provided on a side of a substrate stage, supporting the tape from the side and positioning the tape at a predetermined position on the substrate.

  With such a configuration, the tape can be positioned above a predetermined position of the substrate.

  The present invention is an electronic component crimping apparatus further comprising an adhesive film partial peeling portion that is disposed upstream of a substrate stage and that partially cuts and peels off an adhesive film of a tape.

  The present invention is the electronic component crimping apparatus, wherein the adhesive film partial peeling portion has a half cutter for cutting the adhesive film of the tape and a peeling head for peeling the adhesive film cut by the half cutter.

  The present invention is the electronic component crimping apparatus, wherein the side support has a pair of side walls that support the tape from the side, and the side walls form a notch having an inverted triangular cross section. is there.

  With such a configuration, it is possible to prevent the adhesive film of the tape from erroneously adhering to the side wall of the side support.

  The present invention is characterized in that the holding mechanism is disposed above the tape and includes a suction portion that sucks and holds the release paper of the tape from above, and the suction portion moves in the horizontal direction in synchronization with the drawer unit. Electronic component crimping device.

  With such a configuration, the adhesive film of the tape can be prevented from adhering to the holding mechanism.

  In the present invention, the holding mechanism is disposed below the tape, and includes a lower support body that supports the release paper remaining after the adhesive film is peeled off by the adhesive film partial peeling portion. The lower support body is a drawer unit. The electronic component crimping apparatus is characterized in that it moves in the horizontal direction in synchronization with the motor.

  With such a configuration, the adhesive film of the tape can be prevented from adhering to the holding mechanism.

  The present invention is the electronic component crimping device characterized in that the holding mechanism is movable in the vertical direction.

  With such a configuration, the adhesive film of the tape can be prevented from being pressure-bonded to the holding mechanism.

  The present invention includes a substrate support step for supporting a substrate by a substrate stage, a tape supply step for supplying a tape composed of a release paper and an adhesive film by a tape supply unit disposed on the upstream side of the substrate stage, and a tape supply By holding the release paper of the tape supplied from the tape supply unit and moving it from the upstream side to the downstream side by a drawing unit arranged on the downstream side of the unit, a predetermined length of tape is supplied onto the substrate A tape drawing step, a pressure bonding unit disposed opposite to the substrate stage, and a pressure bonding step of pressing the tape release paper supplied onto the substrate by the drawing unit to pressure-bond the tape adhesive film to the substrate; Tape take-up process for taking up the remaining release paper after the pressure-sensitive adhesive part is pressure-bonded to the substrate by the tape take-up part arranged on the downstream side of the stage When the drawer unit grips the tape and moves from the upstream side to the downstream side by the holding mechanism arranged between the tape supply unit and the tape take-up unit, the tape is held and at least lateral movement is restricted. An electronic component crimping method comprising: a holding step.

  With such a configuration, when the tape is pulled out on the substrate, the tape can be accurately and quickly positioned at a predetermined position, and the operating rate of the electronic component crimping apparatus can be improved.

  According to the present invention, when pulling out the tape onto the substrate, the holding mechanism can hold the tape and restrict at least the lateral movement of the tape. For this reason, when pulling out the said tape, a tape does not shake largely sideways, it can position to a predetermined position accurately and rapidly, and the operation rate of an electronic component crimping | compression-bonding apparatus can be improved.

First Embodiment Hereinafter, a first embodiment of an electronic component crimping apparatus according to the present invention will be described with reference to the drawings. Here, FIGS. 1A and 1B to FIG. 3 are views showing a first embodiment of the present invention.

  As shown in FIGS. 1A, 1B, and 2, the electronic component crimping apparatus is disposed on the upstream side of the substrate stage 51 that supports the substrate 60, the release paper 2, the adhesive film 3, and the substrate stage 51. A tape supply unit 20 that supplies the ACF tape 1 and a release paper (used ACF tape) 2 of the ACF tape 1 that is disposed on the downstream side of the tape supply unit 20 and is supplied from the tape supply unit 20. By moving from the upstream side to the downstream side, the drawer unit 5 that supplies the ACF tape 1 having a predetermined length onto the substrate 60 and the substrate stage 51 are arranged so as to face the substrate 60, and are supplied onto the substrate 60 by the drawer unit 5. A pressure unit 55 that presses the release paper 2 of the ACF tape 1 and presses the adhesive film 3 of the ACF tape 1 onto the substrate 60 and a downstream side of the substrate stage 51. And a tape winding portion 30 that winds remaining release paper after crimping an adhesive film 3 of the ACF tape 1 to the plate 60 (used ACF tape) 2. 2A is a cross-sectional view taken along the line II-II in FIG.

  Further, as shown in FIGS. 1A and 1B, a pressurizing mechanism 50 is configured by the substrate stage 51 and the pressurizing unit 55. Further, the drawer unit 5 has a pair of clampers 5a for freely holding the ACF tape 1.

  In the present application, the upstream side means upstream with respect to the flow of the ACF tape 1 flowing from the tape supply unit 20 to the tape winding unit 30, and the downstream side means that the tape supply unit 20 performs tape winding. It means that it is downstream with respect to the flow of the ACF tape 1 flowing to the take-up portion 30.

  1A and 1B, the substrate stage 51 is movable in the horizontal direction (XY direction), and the angle with respect to the vertical direction (Z direction) can be freely adjusted.

  As shown in FIGS. 1A and 1B, the tape supply unit 20 includes a supply reel 22 that winds and holds the ACF tape 1, and a supply motor 21 that rotationally drives the supply reel 22. ing. The tape winding unit 30 includes a winding reel 32 that winds and holds the ACF tape 1 and a winding motor 31 that rotationally drives the winding reel 32.

  Further, as shown in FIGS. 1A, 1B, and 2A, a drawing unit 5 is provided between the tape supply unit 20 and the tape winding unit 30 and below the ACF tape 1. When the ACF tape 1 is gripped and moved from the upstream side to the downstream side, the ACF tape 1 is supported from the side, and the movement of at least the side of the ACF tape 1 (the Y direction in FIGS. 1A and 1B). A side support body (holding mechanism) 10 that restricts the movement is disposed. In addition, the said side support body 10 is movable in the up-down direction (Z direction).

  Further, as shown in FIG. 2A, the side support 10 has a pair of side walls 11 that support the ACF tape 1 from the side. Is formed.

  As shown in FIGS. 1A and 1B, an optical unit 71 that images the position of the substrate 60 relative to the substrate stage 51 is disposed in the vicinity of the substrate stage 51.

  Further, as shown in FIGS. 1A and 1B, on the side of the substrate stage 51 (positive direction in the X direction), the ACF tape 1 is supported from the side, and the ACF tape 1 is fixed to the substrate 60 in a predetermined manner. A tape guide 72 that is positioned above the position is provided.

  As shown in FIGS. 1A and 1B, on the upstream side of the substrate stage 51 (on the left side of FIGS. 1A and 1B), a half cutter 41 for cutting the adhesive film 3 of the ACF tape 1 and An adhesive film partial peeling portion 40 having a peeling head 42 for peeling the adhesive film 3 cut by the half cutter 41 is disposed. The adhesive film 3 of the ACF tape 1 is partially cut and peeled off by the adhesive film partial peeling portion 40.

  Further, as shown in FIGS. 1A and 1B, above the half cutter 41 and the peeling head 42, when the adhesive film 3 of the ACF tape 1 is cut by the half cutter 41, and by the peeling head 42, the half cutter is provided. An adsorbing block 45 that adsorbs and holds the ACF tape 1 from above when the adhesive film 3 cut by 41 is peeled off is provided.

  Further, as shown in FIGS. 1A and 1B, a supply-side movable roller 25 that is movable in the vertical direction (Z direction) along the guide 23 between the tape supply unit 20 and the half cutter 41. A supply-side fixed roller 26 that receives the ACF tape 1 from the supply-side movable roller 25 is disposed. Similarly, between the drawing unit 5 and the tape winding unit 30, the winding side fixing roller 36 and the release paper (used ACF tape) 2 from the winding side fixing roller 36 are received, A winding side movable roller 35 that is movable in the vertical direction (Z direction) along the guide 33 is disposed.

  Note that a weight (not shown) is connected to the supply side movable roller 25 via a support roller (not shown). For this reason, an upward pulling force is applied to the supply side movable roller 25 by the weight. Similarly, a weight (not shown) is connected to the winding side movable roller 35 via a support roller (not shown). For this reason, an upward pulling force is also applied to the winding side movable roller 35 by the weight.

  As shown in FIGS. 1A and 1B, a clamp mechanism 39 for gripping the release paper (used ACF tape) 2 is provided between the winding side fixed roller 36 and the winding side movable roller 35. Is provided.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, the substrate 60 is supported by the substrate stage 51 (substrate support step 81) (see FIGS. 1A and 1B and FIG. 3). At this time, the position of the substrate 60 supported on the substrate stage 51 with respect to the ACF tape 1 is observed by the optical unit 71. Then, the substrate 60 is positioned by adjusting the angle of the substrate stage 51 with respect to the horizontal direction (XY direction) and the vertical direction (Z direction) (see FIGS. 1A and 1B).

  Next, the ACF tape 1 is clamped by the clamping mechanism 39 (clamping step 82) (see FIG. 1A and FIG. 3).

  Next, the ACF tape 1 composed of the release paper 2 and the adhesive film 3 is supplied by the tape supply unit 20 arranged on the upstream side of the substrate stage 51 (tape supply step 83) (FIG. 1A and FIG. 3). Specifically, the supply motor 21 of the tape supply unit 20 rotates the supply reel 22 in the direction of the arrow in FIG. 1A, and the ACF tape 1 is unwound from the supply reel 22.

  For this reason, the ACF tape 1 is slackened, and the supply side movable roller 25 is raised by the action of the weight connected to the supply side movable roller 25 (see FIG. 1A). When the supply-side movable roller 25 rises and reaches the upper limit position, the rotation drive of the supply motor 21 stops.

  At this time, the adhesive film 3 of the ACF tape 1 is already pressure-bonded to the substrate 60 by the pressurizing unit 55 by the tape winding unit 30 disposed on the downstream side of the substrate stage 51. Release paper 2) is wound up (previous tape winding step 93a) (see FIGS. 1A and 3).

  That is, the take-up motor 31 of the tape take-up unit 30 rotates the take-up reel 32 in the direction of the arrow in FIG. 1A, and the previous ACF tape (release paper 2) used for the take-up reel 32 is removed. It is wound up. For this reason, the distance between the used ACF tape (release paper 2) used last time and the clamp mechanism 39 is shortened, and the winding side movable roller 35 is connected to the winding side movable roller 35 by a weight (not shown). It descends against the tensile force applied upward by the action (see FIG. 1A). In addition, when the winding side movable roller 35 descends and reaches the lower limit position, the rotational driving of the winding motor 31 is stopped.

  Next, the clamp mechanism 39 releases the clamp of the ACF tape 1 (clamp release step 84) (see FIG. 1B and FIG. 3).

  Next, the used ACF tape (release paper 2) that has already been pressure-bonded to the substrate 60 by the pressurization unit 55 is disposed between the tape supply unit 20 and the tape take-up unit 30. It is gripped by the drawing unit 5 and moves from the upstream side to the downstream side (the positive direction in the X direction in FIG. 1B) (tape drawing step 85) (see FIGS. 1A, 1B, and 3). . As a result, the ACF tape 1 moves from the upstream side to the downstream side, and the ACF tape 1 having a predetermined length is supplied onto the substrate 60.

  Specifically, first, the drawer unit 5 opens in the negative direction in the X direction by a distance corresponding to the length of the ACF tape 1 to be pulled out from the drawing standby position (see FIG. 1A) with the clamper 5a opened. Move and move to the drawer start position (see FIG. 1B). Next, the drawer unit 5 closes the clamper 5a and grips the used ACF tape (release paper 2). Next, the drawer clamper 5a moves in the positive direction in the X direction by a distance corresponding to a predetermined drawer length while holding the previous ACF tape (release paper 2), and returns to the standby position (FIG. 1). (See (a)).

  Thus, when the ACF tape 1 is drawn onto the substrate 60 by the drawing unit 5, when the predetermined position of the ACF tape 1 reaches above the half cutter 41, the adhesive film 3 of the ACF tape 1 is cut by the half cutter 41. (Half-cut process 87) (see FIG. 1B and FIG. 3). Thereafter, when the location where the adhesive film 3 is cut by the half cutter 41 of the ACF tape 1 reaches above the adhesive film partial peeling portion 40, the adhesive film 3 at that location is peeled off by the adhesive film partial peeling portion 40. (Adhesive film peeling step 88) (see FIG. 1B and FIG. 3). Thus, when the adhesive film 3 of the ACF tape 1 is cut by the half cutter 41 or peeled off by the adhesive film partial peeling portion 40, the suction block 45 operates each time, and the ACF tape 1 is moved to the suction block 45. Adsorbed and held.

  As described above, since the ACF tape 1 moves from the upstream side to the downstream side (positive direction in the X direction), the supply side movable roller 25 of the tape supply unit 20 is connected to the supply side movable roller 25. It descends against the pulling force applied upward by the weight (see FIG. 1B).

  At this time, the used ACF tape (release paper 2) that has already been pressure-bonded to the substrate 60 by the pressure unit 55 is loosened. For this reason, the winding side movable roller 35 is raised by the weight connected to the winding side movable roller 35 (see FIG. 1B).

  In such a tape drawing process 85, the ACF tape 1 is supported from the side by the side support 10 disposed between the tape supply unit 20 and the pressure mechanism 50 and below the ACF tape 1. The movement of at least the side of the ACF tape 1 (the Y direction in FIGS. 1A and 1B) is restricted (holding step 90) (see FIGS. 1A and 1B, FIGS. 2 and 3). .

  For this reason, even when the ACF tape 1 is pulled out by the drawer unit 5, the ACF tape 1 is prevented from sagging, the ACF tape 1 is removed from the path, and the ACF tape 1 is vibrated greatly. can do. For this reason, the ACF tape 1 can be accurately and quickly positioned at a predetermined position, and the operating rate of the electronic component crimping apparatus can be improved.

  In addition, the notch 12 of the side support 10 has an inverted triangular cross section. For this reason, the adhesive film 3 of the ACF tape 1 is difficult to adhere to the side wall 11 of the side support 10. For this reason, it can prevent that the adhesion film 3 adheres to the side wall 11 of the side support body 10 accidentally.

  Next, the pressurizing unit 55 disposed facing the substrate stage 51 is lowered, and the release paper 2 of the ACF tape 1 supplied onto the substrate 60 is pressed. For this reason, the adhesive film 3 of the ACF tape 1 is pressure-bonded to the substrate 60 (crimping step 91) (see FIGS. 1A and 1B and FIG. 3).

  At this time, the side support 10 is also lowered in accordance with the lowering of the pressure unit 55. For this reason, the adhesive film 3 of the ACF tape 1 is not pressure-bonded to the side support 10.

  Next, the release paper 2 remaining after the pressure-sensitive adhesive unit 3 press-bonds the adhesive film 3 of the ACF tape 1 to the substrate 60 is wound up by the tape winding unit 30 disposed on the downstream side of the substrate stage 51 (tape). Winding step 93) (see FIG. 1 (a) and FIG. 3).

  Specifically, first, the ACF tape 1 is clamped by the clamp mechanism 39 (clamping step 82) (see FIG. 1A and FIG. 3).

  Next, the take-up motor 31 of the tape take-up unit 30 drives the take-up reel 32 to rotate in the direction of the arrow in FIG. 1A, and the used ACF tape (release paper 2) is used on the take-up reel 32. It is wound up. For this reason, the distance between the used ACF tape (release paper 2) and the clamp mechanism 39 is shortened, and the action of a weight (not shown) in which the winding side movable roller 35 is connected to the winding side movable roller 35. It descends against the pulling force applied in the upward direction (see FIG. 1A).

  At this time, the supply motor 21 of the tape supply unit 20 rotationally drives the supply reel 22 in the direction of the arrow in FIG. 1A, and the next ACF tape to be pressure-bonded to the substrate 60 is unwound from the supply reel 22. (Next tape supply step 83a) (see FIG. 1A and FIG. 3). For this reason, the next ACF tape is slackened, and the supply-side movable roller 25 is lifted by the action of a weight (not shown) connected to the supply-side movable roller 25 (see FIG. 1A).

  Thereafter, the above-described steps are repeated.

  By the way, in the above, as shown in FIG. 2 (a), it has a pair of side walls 11 that support the ACF tape 1 from the side, and the side wall 11 is formed with a notch 12 having an inverted triangular cross section. The explanation was made using the side support 10. However, the present invention is not limited to this. As shown in FIG. 2B, a pair of side walls 11 that support the ACF tape 1 and a bottom wall 13 provided between the side walls 11 have a rectangular cross section. You may use the side support body 10 in which the notch 12 was formed. In such a side support 10, as shown in FIG. 2B, the adhesive film 3 and the bottom wall 13 of the ACF tape 1 are not attached to the bottom wall 13 as shown in FIG. The gap G is sufficiently large.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. In the second embodiment shown in FIGS. 4 (a) and 4 (b), instead of using a side support 10 that is disposed below the ACF tape 1 and supports the ACF tape 1 from the side as a holding mechanism, A suction unit 10a that is disposed above the ACF tape 1 and holds the release paper 2 of the ACF tape 1 by suction from above is used, and the others are shown in FIGS. 1 (a) (b) to 3 (a) (b). This is substantially the same as the first embodiment shown in FIG. 4 (a) and 4 (b), the suction portion 10a can move in the horizontal direction in synchronization with the drawer unit 5. 4A corresponds to FIG. 1A, and FIG. 4B corresponds to FIG.

  In the second embodiment shown in FIGS. 4A and 4B, the same parts as those in the first embodiment shown in FIGS. 1A and 1B to FIGS. Detailed description will be omitted.

  During the tape drawing process 85, the release paper 2 of the ACF tape 1 is adsorbed from above by the adsorbing unit 10a disposed between the tape supply unit 20 and the pressurizing mechanism 50 and above the ACF tape 1. Thereafter, the suction portion 10a moves in the horizontal direction (the positive direction of the X direction) in synchronization with the drawer unit 5.

  For this reason, when the ACF tape 1 is pulled out by the drawing unit 5, the movement of the ACF tape 1 at least in the lateral direction (Y direction in FIGS. 4A and 4B) is restricted. As a result, it is possible to prevent the ACF tape 1 from sagging, the ACF tape 1 from going out of its path, or the ACF tape 1 from vibrating greatly. For this reason, the ACF tape 1 can be efficiently and quickly positioned at a predetermined position, and the operating rate of the electronic component crimping apparatus can be improved.

  Moreover, since the adsorption | suction part 10a adsorb | sucks the release paper 2 of ACF tape 1, the adhesive film 3 of ACF tape 1 does not adhere to the adsorption | suction part 10a.

  In addition, while the ACF tape 1 is drawn from the upstream side to the downstream side (positive direction in the X direction) in the tape drawing step 85, the suction portion 10a moves in the horizontal direction in synchronization with the drawing unit 5. For this reason, the ACF tape 1 can be more securely attracted and held.

  By the way, when the tape drawing process 85 is completed, the suction of the suction portion 10a is stopped. For this reason, when the release paper 2 of the ACF tape 1 is pressed by the pressure unit 55 and the adhesive film 3 of the ACF tape 1 is pressure-bonded to the substrate 60 in the pressure bonding step 91, the ACF tape 1 is adsorbed by the adsorption unit 10a. It has not been.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIGS. 5 (a) and 5 (b) and FIG. In the third embodiment shown in FIGS. 5A, 5B and 6, instead of using a side support 10 disposed below the tape 1 and supporting the tape 1 from the side as a holding mechanism. The release paper 2 that is disposed below the ACF tape 1 and remains after the adhesive film 3 is peeled off by the adhesive film partial peeling portion 40 is supported from the lower side, and the side (Y in FIGS. 5A and 5B). The lower support body 10b that regulates the movement of the direction) is used, and the others are substantially the same as those of the first embodiment shown in FIGS. . 5A and 5B, the lower support 10 b can move in the horizontal direction in synchronization with the drawer unit 5. FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 5 (a) corresponds to FIG. 1 (a), and FIG. 5 (b) corresponds to FIG. 1 (b).

  In the third embodiment shown in FIGS. 5A and 5B and FIG. 6, the same parts as those in the first embodiment shown in FIGS. 1A and 1B to FIGS. Are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 5 (a), 5 (b) and 6, between the adhesive film partial peeling portion 40 and the pressurizing mechanism 50 during the tape drawing-out process 85, disposed below the ACF tape 1 and below. The release paper 2 remaining after the adhesive film 3 is peeled off by the adhesive film partial peeling portion 40 is supported from below by the support 10b, and then the lower support 10b is synchronized with the drawer unit 5 in the horizontal direction (X direction). In the positive direction).

  For this reason, when the ACF tape 1 is pulled out by the drawing unit 5, the movement of the ACF tape 1 at least in the lateral direction (the Y direction in FIGS. 5A and 5B) is restricted. As a result, it is possible to prevent the ACF tape 1 from sagging, the ACF tape 1 from going out of its path, or the ACF tape 1 from vibrating greatly. For this reason, the ACF tape 1 can be efficiently and quickly positioned at a predetermined position, and the operating rate of the electronic component crimping apparatus can be improved.

  Further, the lower support 10b supports the release paper 2 remaining after the adhesive film 3 is peeled off by the adhesive film partial peeling portion 40 from below and from the side, and in the tape drawing process 85, the ACF tape 1 is on the upstream side. The lower support 10b moves in the horizontal direction in synchronization with the drawer unit 5 while being pulled out from the downstream side (positive direction in the X direction). For this reason, the adhesive film 3 of the ACF tape 1 does not adhere to the lower support 10b.

  Further, in the crimping step 91, when the pressure unit 55 disposed facing the substrate stage 51 is lowered and the release paper 2 of the ACF tape 1 supplied onto the substrate 60 is pressed, the pressure unit 55 In accordance with the lowering, the lower support 10b is also lowered. For this reason, it is possible to prevent the adhesive film 3 of the ACF tape 1 from being pressure-bonded to the bottom wall 13 of the lower support 10b.

1 is a side view showing an electronic component crimping apparatus according to a first embodiment of the present invention. Sectional drawing which cut | disconnected Fig.1 (a) by II-II. The flowchart which shows the electronic component crimping method by the 1st Embodiment of this invention. The side view which shows the electronic component crimping | compression-bonding apparatus by the 2nd Embodiment of this invention. The side view which shows the electronic component crimping | compression-bonding apparatus by the 3rd Embodiment of this invention. Sectional drawing which cut | disconnected Fig.5 (a) by VI-VI.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Tape 2 Release paper 3 Adhesive film 5 Drawer unit 5a Clamper 10 Side support body (holding mechanism)
10a Adsorption part (holding mechanism)
10b Lower support (holding mechanism)
DESCRIPTION OF SYMBOLS 11 Side wall 12 Notch 13 Bottom wall 20 Tape supply part 30 Tape winding part 40 Adhesive film partial peeling part 41 Half cutter 42 Peeling head 51 Substrate stage 55 Pressurization part 60 Substrate 71 Optical unit 72 Tape guide 81 Substrate support process 82 Clamp Process 83 Tape supply process 83a Next tape supply process 84 Clamp release process 85 Tape drawing process 87 Half cut process 88 Adhesive film peeling process 90 Holding process 91 Crimping process 93 Tape winding process 93a Previous tape winding process

Claims (8)

A substrate stage for supporting the substrate;
Said arranged upstream of the substrate stage, the tape supply unit for supplying a tape comprising a release paper and the adhesive film,
Wherein disposed on the downstream side of the tape supply portion, for supplying from an upstream side to grip the separation sheet of the tape to be fed by moving to the downstream side, the tape having a predetermined length onto a substrate from the tape supply unit A drawer unit;
Is arranged to face the substrate stage, wherein pressing the tape release paper supplied onto the substrate by the drawing unit, a pressing crimping the tape adhesive film on the substrate,
Said disposed downstream of the substrate stage, a tape winding portion for winding the remaining release paper after crimping the adhesive layer of the tape to the substrate by the pressing,
Holding the disposed between the tape supply portion and the tape winding portion, the drawer unit when moving from the upstream side to the downstream side by gripping the tape, to regulate the movement of at least the side to hold the tape Mechanism,
The electronic component crimping apparatus is characterized in that the holding mechanism includes an adsorbing portion that is arranged above the tape and adsorbs and holds the release paper of the tape from above . Wherein arranged in the vicinity of the substrate stage, the electronic component crimping apparatus according to claim 1, characterized in that further comprising an optical unit for imaging the position relative to the substrate stage of the substrate. 2. The electronic component crimping apparatus according to claim 1, further comprising a tape guide that is provided on a side of the substrate stage, supports the tape from the side, and positions the tape at a predetermined position on the substrate. 2. The electronic component crimping apparatus according to claim 1, further comprising an adhesive film partial peeling portion that is disposed upstream of the substrate stage and that partially cuts and peels off the adhesive film of the tape. 5. The electronic component crimping apparatus according to claim 4, wherein the adhesive film partial peeling portion includes a half cutter for cutting the adhesive film of the tape and a peeling head for peeling the adhesive film cut by the half cutter. The electronic component crimping apparatus according to claim 1, wherein the suction portion moves in the horizontal direction in synchronization with the drawer unit. The holding mechanism, the electronic component crimping apparatus according to claim 1, characterized in that it is a vertically movable. A substrate support step for supporting the substrate by the substrate stage;
The tape supply unit disposed upstream of the substrate stage, and the tape supplying step of supplying a tape comprising a release paper and the adhesive film,
The drawer unit disposed downstream of the tape supply portion, by moving from the upstream side to the downstream side by gripping the release paper of the tape supplied from the tape supply portion, the substrate tape of predetermined length A tape drawing process to be supplied above;
By pressing, which is arranged to face the substrate stage, and the crimping step of pressing the tape release paper supplied onto the substrate by the drawing unit, crimping the tape adhesive film on the substrate,
The tape winding portion disposed on the downstream side of the substrate stage, and the tape winding step for winding the remaining release paper after crimping the tape adhesive film to a substrate by the pressing,
Upstream the disposed tape above a between the tape supply portion and the tape winding portion, the holding mechanism consisting of the adsorption unit for attracting and holding the release paper of the tape from above, the drawer unit grips the tape When moving from the side to the downstream side, holding process for holding the tape and restricting at least the lateral movement;
An electronic component crimping method comprising:

Images