JP4815557B2 - Pellicle frame peeling method and apparatus, and peeling jig used therefor - Google Patents

Description

  The present invention relates to a pellicle frame peeling method and apparatus for peeling a pellicle frame attached with an adhesive to protect a pattern on a glass substrate, and a peeling jig used therefor.

  In recent years, a photomask used when manufacturing a semiconductor device or an LCD is a pattern in which a corresponding pattern is formed and the pattern is transferred by exposure, and a pellicle film needs to be shielded from dust and the like. The pellicle frame is attached with an adhesive. The glass substrate of the pellicle frame and the photomask is recyclable, and it is required to peel the pellicle film without damaging the pellicle film and without damaging the photomask.

  Conventionally, a photomask with a pellicle frame attached is used to recycle the photomask or pellicle frame when it is used up or when the pattern formation of the photomask becomes defective. It must be peeled off more. Regarding such peeling of the pellicle frame, there is one proposed in the following patent document, for example.

JP 2000-305252 A JP 2002-131892 A

  In the above-mentioned patent document 1, when peeling the pellicle from the reticle, it is proposed that the pellicle frame is slowly peeled from the long side while the pressure-sensitive adhesive layer is heated. For example, the heating temperature is set to 40 ° C. to 150 ° C. Has been. Further, in Patent Document 2, a mask is fixed to a pellicle fixed on a mask with an adhesive material, and a pin-shaped jig is inserted into a jig hole of a pellicle frame, and a jig hole is inserted. It has been proposed that the jig is moved forward or backward with an insertion lever and peeled off from the mask by lifting the jig with a pulling lever.

  However, since the peeling method proposed in Patent Document 1 melts the pressure-sensitive adhesive by heating, there is a possibility that the pressure-sensitive adhesive may remain on the reticle side, so it is necessary to control the force slowly and moderately. There is a problem that it requires skill. Further, the peeling method proposed in Patent Document 2 is to peel the pellicle frame easily, but since the adhesive material is in a solidified state, a part of the adhesive material tends to remain on the mask side, There is a problem that it is necessary to provide a cleaning step for removal.

  Accordingly, the present invention has been made in view of the above problems, and an object of the present invention is to provide a pellicle frame peeling method, an apparatus therefor, and a peeling jig that reliably avoids remaining of an adhesive on a glass substrate when peeling the pellicle frame. And

  In order to solve the above problems, in the invention of claim 1, a pellicle for peeling a pellicle frame having a pellicle film attached with an adhesive to protect the pattern from a glass substrate on which a predetermined pattern is formed. A method of peeling the frame, the step of heating and melting the adhesive, and cooling the pellicle frame after melting the adhesive, and the glass substrate side adhesive portion and the pellicle frame side adhesive portion of the adhesive Providing a temperature difference between the glass substrate and the pellicle frame when the pellicle frame is cooled to cause a temperature difference between the glass substrate side adhesive portion and the pellicle frame side adhesive portion of the adhesive. And a step of peeling off.

  The invention according to claim 2 is the pellicle frame peeling method according to claim 1, wherein when the pellicle frame is peeled, the glass substrate side adhesive portion is in a molten state and the pellicle frame side adhesive portion is cooled. It is set as the structure which is a hardening state by the effect.

  The invention according to claim 3 is a pellicle frame peeling apparatus for peeling a pellicle frame provided with a pellicle film attached with an adhesive to protect the pattern from a glass substrate on which a predetermined pattern is formed, Heating means for heating and melting the adhesive, and cooling the pellicle frame after melting by the heating of the adhesive interposed between the glass substrate and the pellicle frame. Cooling means for providing a temperature difference between the substrate side adhesive part and the pellicle frame side adhesive part, and the glass substrate side adhesive part and pellicle frame side adhesive part in the adhesive when the pellicle frame is cooled by the cooling means And a peeling means for peeling the pellicle frame from the glass substrate when a temperature difference occurs between the two and the glass substrate.

  According to a fourth aspect of the present invention, a pellicle frame that peels off a pellicle frame including a pellicle film attached with an adhesive to protect the pattern from the glass substrate on which the predetermined pattern is formed is heated with the adhesive. A peeling jig for use in a peeling apparatus, wherein the pellicle frame is cooled after melting by the heating of a fixing portion for fixing the pellicle frame and the adhesive interposed between the glass substrate and the pellicle frame. A cooling part for providing a temperature difference between the glass substrate side adhesive part and the pellicle frame side adhesive part of the adhesive, and the pellicle frame by the cooling part is cooled to the glass substrate side in the adhesive When a temperature difference occurs between the adhesive portion and the pellicle frame side adhesive portion, a peeling portion that engages with the glass substrate and peels from the pellicle frame is provided.

  According to the present invention, the adhesive is heated and melted, the pellicle frame is cooled after the adhesive is melted, and a temperature difference is caused between the glass substrate side adhesive portion and the pellicle frame side adhesive portion of the adhesive. By providing and peeling the pellicle frame from the glass substrate, it is possible to reliably prevent the adhesive from remaining on the glass substrate when peeling the pellicle frame.

Hereinafter, the best embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows an overall configuration diagram of a pellicle frame peeling apparatus according to the present invention. In FIG. 1, a pellicle frame peeling device 11 has a conveyance rail 13 guided into a heating device 12, and a movable body 14 is movable on the conveyance rail 13 by, for example, a ring. A peeling jig 15 (described with reference to FIG. 2) is mounted on the moving body 14.

  In the heating device 12, two sets of infrared lamps (hereinafter referred to as halogen lamps as an example) 21A, 21B and 21C, 21D are arranged in a vertical state as the heating source of the heating means. A soaking plate 22 is disposed below the pair of halogen lamps 21A to 21D. Although not shown, these halogen lamps 21A to 21D can control the irradiation output. The soaking plate 22 is for converting infrared light into heat (photothermal conversion) to uniformly heat an adhesive having a pellicle frame, which will be described later, for example, a glass plate or chrome film whose surface is blackened The silicon wafer which gave can be used. The soaking plate 22 is not necessarily provided as long as the heating plate 22 is uniformly heated only by the halogen lamps 21A to 21D.

  In this embodiment, a light source heating infrared lamp is shown as a heating source, but electrical heating such as a hot plate may be adopted. However, it takes 20 minutes to 40 minutes to heat the adhesive to a preferable temperature of about 130 ° C. for melting the adhesive, whereas the light source heating takes about 2 minutes to heat the preferable temperature of about 130 ° C. Therefore, the light source heating is preferable.

  Then, the block diagram of the peeling jig | tool of FIG. 1 is shown in FIG. 2 (A) and 2 (B), the peeling jig 15 has an inner space 32 formed inside the pedestal 31 and is formed on the outside of the inner space 32 of the pedestal 31 at a position opposite to the cooling means. Cooling blocks 33A and 33B, which are cooling units constituting the, are arranged. For example, two fixing protrusions 34 are provided on the surface of the cooling blocks 33A and 33B on the inner space 32 side as fixing portions for fixing a pellicle frame to be described later. In this case, the cooling block 33B is fixed on the pedestal 31, but the cooling block 33A is movable.

  In addition, movable blocks 35A and 35B are arranged outside the inner space 32 and at other opposing positions where the cooling blocks 33A and 33B are arranged. The movable blocks 35A and 35B are provided on the back side (not shown) of the pedestal 31 so as to be movable toward the inner space 32, and are moved by rotating the movable levers 36A and 36B.

  Furthermore, a movable mechanism 37 is provided on the base 31 to make the cooling block 33A movable toward the inner space 32 side. The movable mechanism 37 has a movable rod 39 fixed to a mounting plate 38 provided in the cooling block 33A. The movable rod 39 is appropriately moved in the direction of the inner space 32 by a movable lever 40 with a biasing member such as a spring interposed therebetween. It can be moved freely. The fixed state and cooled state of the pellicle frame will be described with reference to FIG.

  On the other hand, rotation support members 41A and 41B are provided on the movable blocks 35A and 35B. The rotation support members 41A and 41B are inclined at an inclined base portion serving as a fulcrum of rotation, and are peeled at substantially the center. The levers 42A and 42B are integrally formed. Engaging members 43 that engage with a photomask, which is a glass substrate to which a pellicle frame described later is attached, are provided at both ends of the rotation support members 41A and 41B. That is, by rotating the peeling levers 42A and 42B outward with the inclined base portions of the rotation support members 41A and 41B as fulcrums, the engaging member 43 is lifted upward by this principle. The rotating support members 41A and 41B, the peeling levers 42A and 42B, and the engaging member 43 constitute a peeling means (peeling portion).

  Here, FIG. 3 shows an explanatory diagram of a photomask to which a pellicle frame is attached. In FIG. 3, a pellicle frame 51 is chrome-treated, and a pellicle film 52 is attached to one end thereof, and two fixing holes 53 are formed on opposite sides to which the fixing protrusions 34 are fitted. . The other end of the pellicle frame 51 is positioned so as to include a surface on which a predetermined pattern is formed on the photomask 54 that is a glass substrate, and is attached by an adhesive 55. The pellicle film 52 has a conventional composition, thickness, and the like, and the photomask 54 has a predetermined pattern formed on a 9-inch glass substrate having a thickness of 10 mm, for example. As the adhesive 55, for example, a thermoplastic material, for example, a silicon-based or epoxy-based material that melts at about 100 ° C. or higher is employed.

  FIG. 4 is an explanatory diagram for fixing the pellicle frame. FIG. 4B is a plan view from the photomask 54 side. 4 (A) and 4 (B), the pellicle frame 51 attached to the photomask 54 is rotated on the movable lever 40 in FIG. 2 while being placed on the outer sides of the inner space 32 on the pedestal 31. When the cooling block 33A is moved in the direction of the inner space 32 by moving, the fixed projections 34, 34 are fitted into the fixing holes 53, 53 on one side of the pellicle frame 51, and the opposite sides are pressed against the cooling block 33B. At this time, the fixed protrusions 34 and 34 are fitted into the fixed holes 53 and 53.

  That is, the fixing protrusions 34 and 34 of the pellicle frame 51 are fixed to the fixing holes 53 and 53, respectively, and the cooling blocks 33A and 33B are brought into contact with the opposite sides of the pellicle frame 51, respectively. To be cooled. Then, the movable blocks 35A and 35B are moved in the direction of the inner space 32 by rotating the movable levers 36A and 36B in FIG. 2, and the respective engaging members 43 provided at both ends of the rotation support members 41A and 41B. Is in the engaged state (see FIG. 8A) at the corresponding portion of the photomask 54.

  Next, FIG. 5 shows an explanatory diagram of heating for peeling the pellicle frame. First, with the pellicle frame 51 shown in FIG. 3 facing down, the pellicle frame 51 is placed outside the four sides of the inner space 32 of the peeling jig 15 shown in FIG. 2 and placed on the movable body 14 shown in FIG. The peeling jig 15 is positioned in the heating device 12 by being transported on the transport rail 13. This state is shown in FIGS. 5 (A) and 5 (B).

  In this case, with respect to the pellicle frame 51, the movable blocks 35A and 35B (engagement members 43) are separated as shown in FIG. 5 (A), and the cooling is performed as shown in FIG. 5 (B). The blocks 33A and 33B are separated from each other. In this state, the halogen lamps 21A to 21D are turned on to heat and melt the adhesive 55 with the pellicle frame 51 attached to the photomask 54 at 100 to 150 ° C, preferably 130 ° C. In this case, by uniformly heating the photomask 54 with the soaking plate 22, the adhesive 55 is also heated uniformly.

  FIG. 6 shows an explanatory diagram of the temperature state on the pellicle frame side of the photomask, FIG. 7 shows an explanatory diagram of pellicle frame cooling, and FIG. 8 shows an explanatory diagram of pellicle frame peeling. 6, when the peeling jig 15 is positioned in the heating device 13 as shown in FIG. 5A (this state is set to room temperature 20 ° C.), when the halogen lamps 21A to 21D are turned on, 2 minutes The temperature on the adhesive side of the photomask 54 (mask temperature) can be raised to 130 ° C., and this is maintained for about 1 minute to melt the adhesive 55. Thereafter, the output of the halogen lamps 21A to 21D is lowered to lower the mask temperature to near 100 ° C., the halogen lamps 21A to 21D are turned off, and the peeling jig 15 is taken out from the heating device 12.

  7A, the cooling block 33A is moved in the direction of the inner space 32 by rotating the movable lever 40 in FIG. 2, thereby fixing the fixing holes 53, 53 on one side of the pellicle frame 51. The fixed protrusions 34 and 34 are fitted to each other, the opposite side is pressed against the cooling block 33B, and the fixed protrusions 34 and 34 are fitted and fixed to the fixing holes 53 and 53, and the opposite side of the pellicle frame 51 is fixed. Then, the cooling blocks 33A and 33B are brought into contact with each other to be cooled by natural cooling.

  Further, as shown in FIG. 8A, the movable blocks 35A and 35B are moved in the direction of the inner space 32 by rotating the movable levers 36A and 36B in FIG. 2, and both ends of the rotation support members 41A and 41B are moved. Each of the engaging members 43 provided on the photomask 54 is engaged with the corresponding portion of the photomask 54.

  As the pellicle frame 51 is cooled by the cooling blocks 33A and 33B, as shown in FIG. 7B, the adhesive 55 becomes the photomask (glass substrate) side adhesive portion 55A and the pellicle frame side adhesive portion 55B. There is a temperature difference. That is, when the mask temperature is about 100 ° C., the temperature on the adhesive side (pellicle frame temperature) of the pellicle frame 51 when cooled by the cooling blocks 33A and 33B is about 70 ° C., which causes a temperature difference. The pellicle frame side adhesive portion 55B is hardened as solidification proceeds from the pellicle frame 51 side.

  Therefore, as shown in FIG. 8B, by rotating the release levers 42A and 42B outward, the respective engagement members 43 use the inclined base portions of the rotation support members 41A and 41B as the fulcrum to hold the photomask 54. Push up. As a result, the fixed pellicle frame 51 and the photomask 54 are peeled off.

  That is, since the pellicle frame side adhesive portion 55B is in a cured state, it is in an adhesive state with the pellicle frame 51. On the other hand, since the photomask side adhesive portion 55A is in a molten state, the photomask 54 and the pellicle frame 51 are in contact with each other. Is peeled off, the molten photomask side adhesive portion 55A is left on the pellicle frame side adhesive portion 55B side, and the adhesive 55 is not left on the photomask 54 side.

  As described above, when the pellicle frame 51 and the photomask 54 are peeled off, the adhesive 55 can be reliably prevented from remaining on the photomask (glass substrate) 54 without requiring a particularly skilled peeling operation. It is. This eliminates the need for a cleaning process.

  In the above embodiment, the cooling block 33A is movable, the movable blocks 35A and 35B are movable, and the peeling levers 42A and 42B are manually rotated. It can also be done automatically. In this case, the peeling levers 42A and 42B are not required for automatic peeling, and a mechanism for raising the respective engaging members 43 by a motor may be used. Moreover, although the case where the cooling by the cooling blocks 33A and 33B is natural cooling has been described in the above embodiment, water cooling, air cooling, or electronic forced cooling may be used.

  The pellicle frame peeling apparatus according to the present invention is suitable for peeling a pellicle frame attached with an adhesive to protect a pattern formed on a glass substrate such as a photomask with a pellicle film from the glass substrate.

1 is an overall configuration diagram of a pellicle frame peeling apparatus according to the present invention. It is a block diagram of the peeling jig | tool of FIG. It is explanatory drawing of the photomask with which the pellicle frame was attached. It is explanatory drawing of pellicle frame fixation. It is explanatory drawing of the heating for pellicle frame peeling. It is explanatory drawing of the temperature state by the side of the pellicle frame of a photomask. It is explanatory drawing of pellicle frame cooling. It is explanatory drawing of pellicle frame peeling.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Pellicle frame peeling apparatus 12 Heating apparatus 15 Peeling jig 21A-21D Halogen lamp 22 Soaking plate 32 Inner space 33A, 33B Cooling block 34 Fixed protrusion 37 Movable mechanism 40 Movable lever 41A, 41B Rotating support material 42A, 42B Lever 43 Engaging member 51 Pellicle frame 52 Pellicle film 53 Fixing hole 54 Photomask 55 Adhesive

Claims (4)

A pellicle frame peeling method for peeling a pellicle frame provided with a pellicle film attached with an adhesive to protect the pattern from a glass substrate on which a predetermined pattern is formed,
Heating and melting the adhesive; and
Cooling the pellicle frame after melting the adhesive and providing a temperature difference between the glass substrate side adhesive portion and the pellicle frame side adhesive portion of the adhesive;
A step of peeling the pellicle frame from the glass substrate when the pellicle frame is cooled and a temperature difference occurs between the glass substrate side adhesive part and the pellicle frame side adhesive part in the adhesive;
A pellicle frame peeling method comprising:   2. The pellicle frame peeling method according to claim 1, wherein when the pellicle frame is peeled, the glass substrate side adhesive part is in a molten state and the pellicle frame side adhesive part is in a cured state by a cooling effect. A pellicle frame peeling method characterized by the above. A pellicle frame peeling device for peeling a pellicle frame including a pellicle film attached with an adhesive to protect the pattern from a glass substrate on which a predetermined pattern is formed,
Heating means for heating and melting the adhesive;
The pellicle frame is cooled after melting by the heating of the adhesive interposed between the glass substrate and the pellicle frame, and the glass substrate side adhesive portion and the pellicle frame side adhesive portion of the adhesive Cooling means for providing a temperature difference between
A peeling means for peeling the pellicle frame from the glass substrate when the pellicle frame is cooled by the cooling means and a temperature difference occurs between the glass substrate side adhesive portion and the pellicle frame side adhesive portion of the adhesive. When,
A pellicle frame peeling apparatus comprising: Peeling used in a pellicle frame peeling device that peels a pellicle frame provided with a pellicle film attached with an adhesive to protect the pattern by heating with the adhesive from a glass substrate on which a predetermined pattern is formed There is a jig,
A fixing portion for fixing the pellicle frame;
The pellicle frame is cooled after melting by the heating of the adhesive interposed between the glass substrate and the pellicle frame, and the glass substrate side adhesive portion and the pellicle frame side adhesive portion of the adhesive A cooling section providing a temperature difference between
When the pellicle frame is cooled by the cooling unit and a temperature difference occurs between the glass substrate side adhesive portion and the pellicle frame side adhesive portion in the adhesive, the pellicle frame engages with the glass substrate and A peeling part to be peeled;
A peeling jig characterized by comprising:

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