JP4800669B2 - 照明装置およびそれを用いた表示装置 - Google Patents

照明装置およびそれを用いた表示装置 Download PDF

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Publication number
JP4800669B2
JP4800669B2 JP2005166953A JP2005166953A JP4800669B2 JP 4800669 B2 JP4800669 B2 JP 4800669B2 JP 2005166953 A JP2005166953 A JP 2005166953A JP 2005166953 A JP2005166953 A JP 2005166953A JP 4800669 B2 JP4800669 B2 JP 4800669B2
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JP
Japan
Prior art keywords
water
light
phosphor particles
circuit board
impermeable material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005166953A
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English (en)
Japanese (ja)
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JP2006343409A (ja
JP2006343409A5 (enExample
Inventor
範宏 出島
慎 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP2005166953A priority Critical patent/JP4800669B2/ja
Publication of JP2006343409A publication Critical patent/JP2006343409A/ja
Publication of JP2006343409A5 publication Critical patent/JP2006343409A5/ja
Application granted granted Critical
Publication of JP4800669B2 publication Critical patent/JP4800669B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Liquid Crystal (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2005166953A 2005-06-07 2005-06-07 照明装置およびそれを用いた表示装置 Expired - Fee Related JP4800669B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005166953A JP4800669B2 (ja) 2005-06-07 2005-06-07 照明装置およびそれを用いた表示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005166953A JP4800669B2 (ja) 2005-06-07 2005-06-07 照明装置およびそれを用いた表示装置

Publications (3)

Publication Number Publication Date
JP2006343409A JP2006343409A (ja) 2006-12-21
JP2006343409A5 JP2006343409A5 (enExample) 2008-06-26
JP4800669B2 true JP4800669B2 (ja) 2011-10-26

Family

ID=37640433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005166953A Expired - Fee Related JP4800669B2 (ja) 2005-06-07 2005-06-07 照明装置およびそれを用いた表示装置

Country Status (1)

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JP (1) JP4800669B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4863745B2 (ja) * 2005-11-28 2012-01-25 京セラ株式会社 蛍光体粒子および波長変換器ならびに発光装置
TWI508331B (zh) 2008-11-13 2015-11-11 Maven Optronics Corp 用於形成螢光轉換型發光元件之薄膜螢光層的系統及方法、以及用於螢光轉換型發光元件之薄膜螢光層
KR101154368B1 (ko) 2010-09-27 2012-06-15 엘지이노텍 주식회사 광변환부재 제조방법 및 그 제조방법으로 제조된 광변환부재를 포함하는 백라이트 유닛
WO2013035910A1 (en) * 2011-09-09 2013-03-14 Lg Innotek Co., Ltd. Fabricating method of thick film on large area substrate, thick film structure thereof, and back light unit and lcd using the same
CN110235259A (zh) * 2017-02-02 2019-09-13 西铁城电子株式会社 Led封装体及其制造方法
JP7439350B2 (ja) * 2017-03-24 2024-02-28 大日本印刷株式会社 発光装置、バックライト装置、および画像表示装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001352102A (ja) * 2000-06-07 2001-12-21 Matsushita Electric Ind Co Ltd 光半導体装置
JP2004152993A (ja) * 2002-10-30 2004-05-27 Okaya Electric Ind Co Ltd 発光ダイオード
JP2004273798A (ja) * 2003-03-10 2004-09-30 Toyoda Gosei Co Ltd 発光デバイス
KR100691143B1 (ko) * 2003-04-30 2007-03-09 삼성전기주식회사 다층 형광층을 가진 발광 다이오드 소자
JP4561056B2 (ja) * 2003-07-17 2010-10-13 ソニー株式会社 光源装置の製造方法
JP2005136224A (ja) * 2003-10-30 2005-05-26 Asahi Kasei Electronics Co Ltd 発光ダイオード照明モジュール

Also Published As

Publication number Publication date
JP2006343409A (ja) 2006-12-21

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