JP4797856B2 - 樹脂封入型回路装置 - Google Patents
樹脂封入型回路装置 Download PDFInfo
- Publication number
- JP4797856B2 JP4797856B2 JP2006199384A JP2006199384A JP4797856B2 JP 4797856 B2 JP4797856 B2 JP 4797856B2 JP 2006199384 A JP2006199384 A JP 2006199384A JP 2006199384 A JP2006199384 A JP 2006199384A JP 4797856 B2 JP4797856 B2 JP 4797856B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- resin
- recess
- heat source
- circuit elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000011347 resin Substances 0.000 claims description 32
- 229920005989 resin Polymers 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 24
- 230000020169 heat generation Effects 0.000 claims description 17
- 206010040844 Skin exfoliation Diseases 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
- H05K5/0095—Housing specially adapted for small components hermetically-sealed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/5213—Covers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/933—Special insulation
- Y10S439/936—Potting material or coating, e.g. grease, insulative coating, sealant or, adhesive
Landscapes
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Description
2、43 凹部
4 コネクタ部
11、12 凹部内壁
21、22、23、24、25、26 配線金属片
31、32、33 回路素子
38 集積回路
41、42 端子
91 仮想中心線
Claims (4)
- 回路素子収容用の凹部を有する樹脂製の回路ケースと、
リード端子を有して前記凹部に収容される複数の回路素子と、
前記凹部内に突出するリード端子接続部を有して前記回路ケースに固定される配線金属片と、
前記凹部に充填されて前記複数の回路素子と前記配線金属片の前記リード端子接続部とを被覆する封入樹脂と、を備え、
前記回路ケースの一部には前記回路素子以外の発熱源が配置されており、
前記複数の回路素子は、前記回路ケースの凹部の開口面に平行する同一平面上に配置されるとともに、前記発熱源に対して異なる距離であって、それぞれの長手方向が前記発熱源の長手方向と平行となるように配置されることを特徴とする樹脂封入型回路装置。 - 請求項1において、
前記複数の回路素子は、前記回路ケースの凹部の開口面に平行する同一平面上であって、前記凹部の対向する2つの内壁に対する仮想的な中心面に対して対称配置されることを特徴とする樹脂封入型回路装置。 - 請求項1または2において、
前記発熱源は、この発熱源の使用時における発熱によって、前記凹部内に充填された前記封入樹脂の温度が不均一になる位置に配置されていることを特徴とする樹脂封入型回路装置。 - 請求項1〜3のいずれかにおいて、
前記複数の回路素子は、前記発熱源からの距離が遠いほど発熱量が大きくなるように配置されていることを特徴とする樹脂封入型回路装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006199384A JP4797856B2 (ja) | 2006-07-21 | 2006-07-21 | 樹脂封入型回路装置 |
US11/790,393 US7473118B2 (en) | 2006-07-21 | 2007-04-25 | Resin sealing type circuit device |
GB0711846A GB2440416B (en) | 2006-07-21 | 2007-06-19 | Resin sealing type circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006199384A JP4797856B2 (ja) | 2006-07-21 | 2006-07-21 | 樹脂封入型回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008028167A JP2008028167A (ja) | 2008-02-07 |
JP4797856B2 true JP4797856B2 (ja) | 2011-10-19 |
Family
ID=38332372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006199384A Expired - Fee Related JP4797856B2 (ja) | 2006-07-21 | 2006-07-21 | 樹脂封入型回路装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7473118B2 (ja) |
JP (1) | JP4797856B2 (ja) |
GB (1) | GB2440416B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4797856B2 (ja) * | 2006-07-21 | 2011-10-19 | 株式会社デンソー | 樹脂封入型回路装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61264744A (ja) | 1985-05-17 | 1986-11-22 | Toshiba Corp | 半導体装置および半導体装置用基板 |
JPS63269553A (ja) * | 1987-04-27 | 1988-11-07 | Mitsubishi Electric Corp | 樹脂封止型半導体装置 |
US5550750A (en) * | 1993-05-28 | 1996-08-27 | Mentor Graphics Corporation | Method and system for integrating component analysis with multiple component placement |
JPH07115170A (ja) | 1993-08-23 | 1995-05-02 | Toppan Printing Co Ltd | マルチチップモジュール |
US5703542A (en) * | 1996-08-28 | 1997-12-30 | Locus Incorporated | Compact temperature stabilized crystal oscillator |
DE10018020C5 (de) * | 2000-04-11 | 2014-06-05 | Zf Friedrichshafen Ag | Gehäuse und Verfahren zu dessen Herstellung |
JP4352593B2 (ja) | 2000-07-13 | 2009-10-28 | 株式会社デンソー | 樹脂封入型回路装置 |
US6749462B2 (en) * | 2000-12-19 | 2004-06-15 | Au Optronics Corp. | Display unit |
JP4797856B2 (ja) * | 2006-07-21 | 2011-10-19 | 株式会社デンソー | 樹脂封入型回路装置 |
-
2006
- 2006-07-21 JP JP2006199384A patent/JP4797856B2/ja not_active Expired - Fee Related
-
2007
- 2007-04-25 US US11/790,393 patent/US7473118B2/en not_active Expired - Fee Related
- 2007-06-19 GB GB0711846A patent/GB2440416B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20080020620A1 (en) | 2008-01-24 |
GB2440416B (en) | 2011-08-17 |
GB2440416A (en) | 2008-01-30 |
JP2008028167A (ja) | 2008-02-07 |
GB0711846D0 (en) | 2007-07-25 |
US7473118B2 (en) | 2009-01-06 |
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