JP4795507B2 - 温度センサアレイ並びにその製造及び使用方法 - Google Patents

温度センサアレイ並びにその製造及び使用方法 Download PDF

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Publication number
JP4795507B2
JP4795507B2 JP2000110458A JP2000110458A JP4795507B2 JP 4795507 B2 JP4795507 B2 JP 4795507B2 JP 2000110458 A JP2000110458 A JP 2000110458A JP 2000110458 A JP2000110458 A JP 2000110458A JP 4795507 B2 JP4795507 B2 JP 4795507B2
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Japan
Prior art keywords
dielectric layer
patterned conductive
deposited
electrical connection
conductive layer
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Expired - Fee Related
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JP2000110458A
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Japanese (ja)
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JP2001008902A5 (enExample
JP2001008902A (ja
Inventor
クリスティーナ・ヘレナ・バルボーグ・ヘデングレン
ウィリアム・ポール・コーンラムフ
マーク・ルロイド・ミラー
ビーレ・ヒッブズ・オプサル−オング
エギディジャス・エドワード・ウズギリス
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General Electric Co
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General Electric Co
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Priority claimed from US09/313,531 external-priority patent/US6084174A/en
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Publication of JP2001008902A5 publication Critical patent/JP2001008902A5/ja
Application granted granted Critical
Publication of JP4795507B2 publication Critical patent/JP4795507B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K3/00—Thermometers giving results other than momentary value of temperature
    • G01K3/08—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values
    • G01K3/14—Thermometers giving results other than momentary value of temperature giving differences of values; giving differentiated values in respect of space
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H10N10/85—Thermoelectric active materials
    • H10N10/851—Thermoelectric active materials comprising inorganic compositions
    • H10N10/854—Thermoelectric active materials comprising inorganic compositions comprising only metals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Measuring And Recording Apparatus For Diagnosis (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
JP2000110458A 1999-04-12 2000-04-12 温度センサアレイ並びにその製造及び使用方法 Expired - Fee Related JP4795507B2 (ja)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US12874199P 1999-04-12 1999-04-12
US60/128741 1999-05-12
US09/313,531 US6084174A (en) 1996-04-17 1999-05-12 Method for detecting temperature gradients in biological tissue using a thermocouple array
US09/395135 1999-05-12
US09/313531 1999-05-12
US09/395,135 US6180867B1 (en) 1996-04-17 1999-09-13 Thermal sensor array and methods of fabrication and use

Publications (3)

Publication Number Publication Date
JP2001008902A JP2001008902A (ja) 2001-01-16
JP2001008902A5 JP2001008902A5 (enExample) 2009-09-17
JP4795507B2 true JP4795507B2 (ja) 2011-10-19

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000110458A Expired - Fee Related JP4795507B2 (ja) 1999-04-12 2000-04-12 温度センサアレイ並びにその製造及び使用方法

Country Status (3)

Country Link
US (1) US6180867B1 (enExample)
JP (1) JP4795507B2 (enExample)
DE (1) DE10017900A1 (enExample)

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Publication number Publication date
JP2001008902A (ja) 2001-01-16
DE10017900A1 (de) 2001-01-11
US6180867B1 (en) 2001-01-30

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