JP4786178B2 - 薄膜層の特性を変化させるプロセス、及び前記プロセスを適用する基板 - Google Patents
薄膜層の特性を変化させるプロセス、及び前記プロセスを適用する基板 Download PDFInfo
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- JP4786178B2 JP4786178B2 JP2004507374A JP2004507374A JP4786178B2 JP 4786178 B2 JP4786178 B2 JP 4786178B2 JP 2004507374 A JP2004507374 A JP 2004507374A JP 2004507374 A JP2004507374 A JP 2004507374A JP 4786178 B2 JP4786178 B2 JP 4786178B2
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Description
−Siの基板の表面をポーラス化することによって、高比表面積を有する2つのポーラス層が形成される。このうち、表面層は、多孔率が低く、一方、表面層と基板との間に挿入された後者の層は多孔率の増大をみせる。
−上記の結果得られた基板の表面を若干酸化(最大でも単層)することによって、クリスタリット(微結晶)を機械的に安定化させる。
−Siの薄膜層のエピタキシーの直前に、成長構造における基板を還元する。
−Siの薄膜層上にSiGeの層を格子不整に成長させる。
−高比表面積を有するナノ構造化サポート上に少なくとも1つの薄膜層を形成すること、及び
−ナノ構造化サポートを処理して、サポート内に内部歪みを発生させて、少なくとも前記薄膜層の平面内にその変形を引き起こすことによって、薄膜層の対応する変形を確実にして薄膜層の特性を変化させることからなる。
−金属又は半金属をベースとした高比表面積を有するナノ構造物。
−例えばポーラスシリコンなど高比表面積を有する半導体ナノ構造物、又はIV型、IV−IV型、III−V型、II−VI型などその他の半導体ナノ構造物。
−TiO2(アナターゼ、ルチル)、Al2O3、ZnOなどをベースとした高比表面積を有するナノ構造化誘電体。
−薄膜層1は、変形後、基板(ナノ構造化サポートおよび薄膜層)が過剰に曲がらないようにするため、ナノ構造化サポート2よりも十分薄い厚さでなければならない。
−薄膜層は、構造上の欠陥から変形が生じても実質的に弾性が保たれるよう、十分薄い厚さでなければならない。
・以下のような半導体
−IV−IV型:Si、Ge、SixGe1−x、SiC、SixGeyC1−x−y
−III−V型:GaxAl1−xAs、GaxIn1−xAs、AlxIn1−xAs、GaxIn1−xAsyP1−y、GaxAl1−xP、GaxAl1−xN、GaxIn1−xN、GaxIn1−xSb、GaxAl1−xSb、(GaxIn1−x)1−yTlyAs、(GaxIn1−x)1−yTlyP
−II−VI型:ZnxCd1−xTeySe1−y、CdxHg1−xTe
・YbaCuOなどの超半導体
・以下のような磁性体
−鉄、コバルト、ニッケル、それらの合金、一部の希土類などの強磁性体
−常磁性体
Claims (16)
- マイクロエレクトロニクス、ナノエレクトロニクス、又はマイクロテクノロジー、ナノテクノロジーの各分野で利用される基板(3)を形成するサポート(2)の表面上に形成される薄膜層(1)の特性を変化させるプロセスであって、
−高比表面積を有するナノ構造化サポート(2)上に少なくとも1つの薄膜層(1)を形成すること、及び
−前記高比表面積を有するナノ構造化サポート(2)を処理して、前記サポート内に内部歪みを発生させて、少なくとも前記薄膜層の平面内にその変形を引き起こすことによって、前記薄膜層の対応する変形を確実にして前記薄膜層の特性を変化させることからなることを特徴とするプロセス。 - 前記高比表面積を有するナノ構造化サポート(2)を化学的に処理して、そのナノ構造の膨張又は収縮に対応する変形を保証することからなることを特徴とする請求項1記載のプロセス。
- 高比表面積を有するナノ構造化サポート(2)を、金属、半導体、又は誘電体をベースとした様々なナノ構造物の中から選択することからなることを特徴とする請求項1記載のプロセス。
- 前記高比表面積を有するナノ構造化サポート(2)の処理後、前記薄膜層(1)上に結晶質のエピタキシャル成長を発生させることからなることを特徴とする請求項1又は2記載のプロセス。
- 前記高比表面積を有するナノ構造化サポート(2)の処理後に、前記薄膜層(1)上のエピタキシャル成長によって形成される前記結晶質の格子定数に対応する格子定数を有することが可能な薄膜層(1)を選択することからなることを特徴とする請求項4記載のプロセス。
- 前記高比表面積を有するナノ構造化サポート(2)上に予め歪ませた又は予め歪ませていない薄膜層(1)を形成することからなることを特徴とする請求項5記載のプロセス。
- 前記高比表面積を有するナノ構造化サポート(2)上に、少なくとも1つの中間層(21)を、前記薄膜層(1)と前記高比表面積を有するナノ構造化サポート(2)との間に形成することからなることを特徴とする請求項1記載のプロセス。
- 前記薄膜層(1)上に、半導体材料又は超半導体材料から選択した結晶質の前記エピタキシャル成長を形成することからなることを特徴とする請求項4、5、7のいずれか1項に記載のプロセス。
- 前記高比表面積を有するナノ構造化サポート(2)上に、圧電特性を有する材料から構成される薄膜層(1)を形成することからなることを特徴とする請求項1〜3のいずれか1項に記載のプロセス。
- 前記薄膜層(1)でリソグラフィー工程を実施して圧電領域(z)を実現することからなることを特徴とする請求項9記載のプロセス。
- 前記薄膜層において電荷がみられるように、前記高比表面積を有するナノ構造化サポート(2)を変形させることからなることを特徴とする請求項9又は10記載のプロセス。
- マイクロエレクトロニクス、ナノエレクトロニクス、又はマイクロテクノロジー、ナノテクノロジー用の基板であって、
高比表面積を有するナノ構造化サポート(2)によって形成される基板であり、
前記高比表面積を有するナノ構造化サポート(2)が、後続の処理で変形し、その表面上に前記サポートに対応して変形する少なくとも1つの薄膜層(1)が形成されることを特徴とする基板。 - 前記薄膜層(1)に形成された半導体結晶質又は超半導体結晶質のエピタキシャル層(4)を備えることを特徴とする請求項12記載の基板。
- 前記薄膜層(1)が圧電材料から構成されることを特徴とする請求項12記載の基板。
- 光電子素子の製造への請求項12記載の基板の適用。
- 電子部品の製造への請求項12記載の基板の適用。
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FR02/05731 | 2002-05-07 | ||
FR0205731A FR2839505B1 (fr) | 2002-05-07 | 2002-05-07 | Procede pour modifier les proprietes d'une couche mince et substrat faisant application du procede |
PCT/FR2003/001423 WO2003099707A2 (fr) | 2002-05-07 | 2003-05-07 | Procede pour modifier les proprietes d'une couche mince et substrat faisant application du procede |
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JP2010094004A Division JP2010212705A (ja) | 2002-05-07 | 2010-04-15 | 薄膜層の特性を変化させるプロセス、及び前記プロセスを適用する基板 |
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JP2005528987A JP2005528987A (ja) | 2005-09-29 |
JP2005528987A5 JP2005528987A5 (ja) | 2011-07-07 |
JP4786178B2 true JP4786178B2 (ja) | 2011-10-05 |
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JP2010094004A Pending JP2010212705A (ja) | 2002-05-07 | 2010-04-15 | 薄膜層の特性を変化させるプロセス、及び前記プロセスを適用する基板 |
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US (2) | US7553369B2 (ja) |
EP (1) | EP1501757B1 (ja) |
JP (2) | JP4786178B2 (ja) |
KR (1) | KR100855784B1 (ja) |
AU (1) | AU2003263225A1 (ja) |
FR (1) | FR2839505B1 (ja) |
WO (1) | WO2003099707A2 (ja) |
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FR2839505B1 (fr) * | 2002-05-07 | 2005-07-15 | Univ Claude Bernard Lyon | Procede pour modifier les proprietes d'une couche mince et substrat faisant application du procede |
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- 2003-05-07 AU AU2003263225A patent/AU2003263225A1/en not_active Abandoned
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FR2839505A1 (fr) | 2003-11-14 |
EP1501757A2 (fr) | 2005-02-02 |
US9102518B2 (en) | 2015-08-11 |
US20050229837A1 (en) | 2005-10-20 |
JP2010212705A (ja) | 2010-09-24 |
AU2003263225A1 (en) | 2003-12-12 |
US7553369B2 (en) | 2009-06-30 |
WO2003099707A3 (fr) | 2004-04-08 |
FR2839505B1 (fr) | 2005-07-15 |
JP2005528987A (ja) | 2005-09-29 |
KR20050007530A (ko) | 2005-01-19 |
WO2003099707A2 (fr) | 2003-12-04 |
US20090226680A1 (en) | 2009-09-10 |
EP1501757B1 (fr) | 2017-08-16 |
KR100855784B1 (ko) | 2008-09-01 |
AU2003263225A8 (en) | 2003-12-12 |
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