JP4779614B2 - Semiconductor device - Google Patents

Abstract

A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

Description

  The present invention relates to a semiconductor device including a semiconductor sensor chip such as a sound pressure sensor chip or a pressure sensor chip.

  2. Description of the Related Art Conventionally, a semiconductor device such as a pressure sensor or a silicon microphone manufactured using a silicon semiconductor has a semiconductor sensor chip that is formed in a substantially rectangular plate shape and has a recessed portion that is recessed from the front surface toward the back surface. There is something implemented and configured above. In this semiconductor device, in the semiconductor sensor chip, the thinned portion by the concave portion is a diaphragm (movable electrode) provided with, for example, a bridge resistor circuit, and when a pressure such as sound pressure is applied, the diaphragm is displaced or strained (hereinafter referred to as a diaphragm). It is possible for the bridge resistance circuit to detect this displacement as a change in electrical resistance and detect the pressure based on the change in electrical resistance according to the magnitude of the displacement.

Also, this type of semiconductor device is configured such that a cover (cover) is installed on the surface (upper surface) of a printed circuit board, and a semiconductor sensor chip is accommodated in a space defined by the cover. The cover is provided with an opening that allows communication between the inside and outside of the space, and through the opening, a fluctuating pressure such as a sound pressure generated outside can be guided into the space to reach the semiconductor sensor chip. Yes. Furthermore, the cover is provided with a conductive layer on the inner surface, and electromagnetic noise that attempts to enter the space through a portion other than the opening can be blocked by the electromagnetic shield of this conductive layer. . As a result, it is possible to prevent noise from reaching the semiconductor sensor chip and causing false vibrations in the diaphragm, and to accurately detect the pressure (see, for example, Patent Document 1 and Patent Document 2).
JP-T-2004-537182 US Pat. No. 6,781,231

  However, in the above-described semiconductor device, when the semiconductor device is mounted on a circuit board such as a mobile phone, a device for electrically connecting the conductive layer of the cover and the circuit board is required.

  Further, in the above semiconductor device, in order to form an electromagnetic shield, for example, it is necessary to install the cover while matching the conductive layer extended to the lower end of the cover with the connection terminal exposed on the upper surface of the printed circuit board. In addition, there is a problem that installation of the cover requires accuracy so that electrical discontinuity between the conductive layer and the connection terminal of the printed circuit board does not occur, and that installation takes time. For this reason, it has been strongly desired that the electromagnetic shield can be surely formed while the cover can be more easily installed, and the manufacturing cost can be reduced.

  In view of the above circumstances, the present invention provides a semiconductor device in which a lid for forming an electromagnetic shield can be easily installed, and a semiconductor device can be mounted on a circuit board and an electromagnetic shield can be easily formed. With the goal.

  In order to achieve the above object, the present invention provides the following means.

A semiconductor device according to the present invention is a semiconductor device including a semiconductor sensor chip formed with a diaphragm that is deformed by an applied pressure and detects the pressure according to the amount of deformation. A resin layer on which the diaphragm is positioned above the opening hole and the semiconductor sensor chip is installed; a plate-like stage disposed below the semiconductor sensor chip and sealed on the resin layer; and An external connection terminal having one end connected to the stage and having one surface exposed from the resin layer on the other end extended to the outside of the resin layer, and a space for housing the semiconductor sensor chip together with the upper surface of the resin layer It is provided and the conductive lid defining a said resin layer, picture a recess protrusion protruding upward on the side end of the upper surface accommodating the semiconductor sensor chip The lid is supported by the upper end of the protrusion and passes through the outside of the side surface of the resin layer, and a top plate part that defines the space for housing the semiconductor sensor chip. An electromagnetic shield forming terminal extending downward, and the electromagnetic shield forming terminal is provided with a notch extending from the lower end toward the upper end, and at least the lower end side is bisected, and the resin layer The external connection terminal extending outward is sandwiched and inserted into the notch, and the electromagnetic shield forming terminal and the external connection terminal are connected .

The semiconductor device of the present invention is a semiconductor device comprising a semiconductor sensor chip formed with a diaphragm that is deformed by an applied pressure and detects the pressure according to the amount of deformation, and has an opening hole that opens on an upper surface. A resin layer in which the diaphragm is positioned above the opening hole and the semiconductor sensor chip is installed; and a plate-like stage disposed below the semiconductor sensor chip and sealed in the resin layer; The semiconductor sensor chip is housed together with an external connection terminal having one end connected to the stage and having one surface exposed from the resin layer on the other end extended to the outside of the resin layer, and an upper surface of the resin layer A conductive lid that defines a space to be formed, and a protrusion projecting upward toward a side end of the upper surface of the resin layer includes a recess for housing the semiconductor sensor chip. The lid body is supported by the upper end of the protrusion, and includes a top plate portion that defines the space for housing the semiconductor sensor chip, and a side surface of the resin layer. An electromagnetic shield forming terminal extending downwardly through the outside, wherein the electromagnetic shield forming terminal includes a pair of side ends extending from the upper end toward the lower end on one side end side and on the other side One of the side end sides of the pair of side ends extending from the one end toward the other end is provided on the external connection terminal provided with an engaging portion that is recessed toward the end and extends to the outside of the resin layer. In addition, an engagement receiving portion that is recessed toward the other side end is provided. With the lid installed, the engagement portion and the engagement receiving portion are engaged to form the electromagnetic shield. A terminal and the external connection terminal are connected, and the outside of the electromagnetic shield forming terminal In the opposite view of al, the with the electromagnetic shield forming terminals and the external connection terminals, characterized in that it is connected so as to overlap with intersection.

Furthermore, in the semiconductor device of the present invention, the electromagnetic shield forming terminal is formed to hang down so as to cover the side surface of the resin layer from the side end of the top plate portion or the side end side of the top plate portion. It is desirable that the lower end of the side wall portion of the lid body is extended downward through the outside of the side surface of the resin layer and connected to the external connection terminal extending outside the resin layer .

Further, in the semiconductor device of the present invention, the resin layer is provided with a bending point on the side surface, and the side surface located below the bending point is an inclined surface that gradually inclines as it goes downward. The lid body is suspended from the lower end of the side wall portion of the lid body that is formed so as to cover the side edge of the top plate portion or the side edge side of the top plate portion so as to cover the side surface of the resin layer. However, a locking portion that is engaged with the side surface of the resin layer to hold the lid and the resin layer is provided, and the locking portion is a predetermined portion of the resin layer that is connected to the external connection terminal. In the state where the lid is installed at the position, it is desirable that the resin layer is formed along the side surface that is bent at the bending point of the resin layer.

Furthermore, in the semiconductor device of the present invention, it is more desirable that the stage is formed larger than the semiconductor sensor chip in a plan view from the upper surface side of the resin layer.

Further, in the semiconductor device of the present invention, the lid is formed to hang down on three side ends of the top plate portion formed in a substantially rectangular plate shape or on the three side end sides of the top plate portion. Each of the three side wall portions is provided with the locking portion, and the locking portion is horizontally moved with respect to the resin layer while being engaged with a side surface of the resin layer. It is desirable to be installed at a position.

According to the semiconductor device of the present invention, since the conductive lid is electrically connected to the external connection terminal and has the same potential , for example, the semiconductor device is installed on a circuit board such as a mobile phone, and at the same time, protrudes outward. The electromagnetic shield can be reliably formed by a simple operation in which the external connection terminal is brought into contact with the connection terminal of the circuit board and soldered. In addition, since an electromagnetic shield can be formed if a lid is installed and a part of the lid is connected to an arbitrary part of the external connection terminal, the lid is installed much like a conventional semiconductor device. Without requiring accuracy, the lid can be simply installed to form the electromagnetic shield, and the cost for manufacturing the semiconductor device can be reduced.

  Further, in the semiconductor device of the present invention, the lid is fixed to the external connection terminal exposed on the upper surface of the substrate via a conductive adhesive, or the electromagnetic shield forming terminal is provided on the lid. It is possible to electrically connect the lid body and the external connection terminal by installing the lid body and connecting the external body terminal to the external connection terminal extending to the outside of the substrate.

In the semiconductor device of the present invention, by the lid becomes the external connection terminal is electrically connected to the external connection terminals and stage potential, a stage disposed under the semiconductor sensor chip, It is possible to form an electromagnetic shield that encloses the semiconductor sensor chip with the lid disposed above. As a result, it is possible to make the pressure detected by the semiconductor device highly reliable while reducing the cost of manufacturing by simply installing the lid.

  Further, a protrusion is formed on the resin layer, and a part of the external connection terminal is exposed at the upper end of the protrusion, so that the lid is attached to the upper end of the protrusion via a conductive adhesive. The lid, the external connection terminal, and the stage can be reliably connected to each other with the same potential by a simple operation of fixing. As a result, the electromagnetic shield can be reliably formed with a simple operation, and thus the cost for manufacturing the semiconductor device can be reduced.

  In the semiconductor device of the present invention, the lid body is provided with an electromagnetic shield forming terminal extending downward from the side edge of the top plate portion through the outside of the side surface of the resin layer together with the top plate portion. The shield forming terminal is configured to be connected to the external connection terminal extending to the outside of the resin layer, so that the top plate portion is installed to be supported by the upper end of the protrusion, and the electromagnetic shield forming terminal It is possible to connect the terminal to the external connection terminal, and it is possible to form an electromagnetic shield that encloses the semiconductor sensor chip by the lid, the external connection terminal, and the stage by such a simple operation. The

  Furthermore, by providing the lid with a side wall portion that hangs from the side end side of the top plate portion so as to cover the side surface of the resin layer, an electromagnetic shield can be formed also on the side surface side of the resin layer. Can be more reliably protected from noise.

  Further, in the semiconductor device of the present invention, the electromagnetic shield forming terminal has at least a lower end side divided by a notch portion extending from the lower end toward the upper end, so that the lid is installed and the notch The external connection terminal extending outside the resin layer can be inserted into the portion while being inserted. As a result, the lid can be installed and the external connection terminal and the electromagnetic shield forming terminal can be reliably electrically connected, and the electromagnetic shield that wraps the semiconductor sensor chip can be reliably formed. Become. Therefore, since the electromagnetic shield can be reliably formed while installing the lid by such a simple operation, the labor for installing the lid can be reduced, and consequently the cost for manufacturing the semiconductor device can be reduced. It is possible.

  Furthermore, in the semiconductor device of the present invention, an engagement portion is provided on one side end side of the electromagnetic shield forming terminal, and an engagement receiving portion is provided on one side end side of the external connection terminal. Thus, for example, the lid is placed by sliding the top plate portion of the lid in contact with the upper end of the projection, and the engaging portion and the engagement receiving portion are engaged, and the external connection terminal and the electromagnetic shield It is possible to connect the forming terminals so as to overlap each other while intersecting. Further, when the lid is installed and the external connection terminal and the electromagnetic shield forming terminal are connected in this manner, the protrusion of the resin layer and the lid of the lid body are engaged by the engagement of the engagement portion and the engagement receiving portion. Since the top plate is held in close contact with the top plate, no adhesive is required to fix the lid to the resin layer, and the labor for installing the lid can be further reduced. This makes it possible to reduce the cost of manufacturing the product.

  Further, in the semiconductor device of the present invention, the lid is engaged with the side surface of the resin layer while being suspended from the side end of the top plate portion or the lower end of the side wall portion, and the latching portion that holds the lid and the resin layer. By being provided, it is possible to reliably hold and prevent the installed lid body from being displaced, and it is possible to reliably hold the connection state between the electromagnetic seal forming terminal and the external connection terminal.

  Further, in the semiconductor device of the present invention, the semiconductor sensor chip can be more reliably protected from noise by forming the stage larger than the semiconductor sensor chip in a plan view from the upper surface side of the resin layer. become.

  The semiconductor device according to the first embodiment of the present invention will be described below with reference to FIGS. The present embodiment relates to a semiconductor device for detecting sound pressure such as sound generated outside, and particularly to a QFN (Quad Flat Non-leaded package) type semiconductor device manufactured using a lead frame.

  As shown in FIGS. 1 to 5, the semiconductor device A of the present embodiment has a substantially rectangular plate-like stage 1 and one end 2 a connected to the stage 1 extending from the other end 2 b toward the outside of the semiconductor device A. An external connection terminal 2, a plurality of leads 3 extending from the side surface of the semiconductor device A toward the stage 1 so as to dispose one end 3 a on the stage 1 side, the stage 1, the external connection terminal 2, and the lead 3 and a resin layer 4 having an opening 4c extending from the upper surface (the upper surface of the substrate A1) 4a toward the lower surface 4b, and a semiconductor sensor having a substantially rectangular plate shape fixed to the upper surface 4a of the resin layer 4 A chip (sound pressure sensor chip) 5, an amplifier 6 which is also fixed to the upper surface 4 a of the resin layer 4 and amplifies an electrical signal output from the semiconductor sensor chip 5, and the semiconductor sensor chip 5, the amplifier 6 and the lead 3 are electrically connected. Contact The main structure is a wire 7 that is fixed to the resin layer 4 and a substantially dish-shaped lid 9 that covers the semiconductor sensor chip 5 and the amplifier 6 while defining a first space (space) 8 above them. It is an element. Here, in the present embodiment, the plurality of leads 3 are also terminals (external connection terminals) that are externally connected, but are electrically connected to an electromagnetic shield forming terminal 9d of the lid 9 to be described later and electromagnetically. The terminal forming the shield is referred to as an external connection terminal 2, and these are shown separately. The stage 1, the external connection terminal 2, the lead 3, and the resin layer 4 that seals these together constitute the substrate A1 of the present embodiment.

  As shown in FIGS. 3 and 5, the stage 1 is provided immediately below the opening hole 4 c of the resin layer 4, and the lower surface 1 a is exposed while being flush with the lower surface 4 b of the resin layer 4. The stage 1 is formed with such a size that the semiconductor sensor chip 5 and the amplifier 6 fixed to the upper surface 4a of the resin layer 4 are positioned on the stage 1 in plan view from the upper surface 4a side.

  On the other hand, as shown in FIGS. 1 to 5, the external connection terminal 2 is formed in a substantially flat band shape, one end 2 a is connected to the side end of the stage 1, and the plan view from the upper surface 1 b side of the stage 1. Thus, it extends toward the outside of the resin layer 4 while being orthogonal to the side edge of the stage 1. Further, the other end 2b side of the external connection terminal 2 slightly protrudes outward from the side surface (side surface of the substrate A1) 4d of the resin layer 4, and the lower surface (external connection terminal 2) on the protruding other end 2b side. 1c) 2c is provided on substantially the same horizontal plane as the lower surface 4b of the resin layer 4. Further, as shown in FIG. 3, the external connection terminal 2 has a bent portion 2e having an upper surface 2d positioned between the one end 2a and the other end 2b in parallel with the upper surface 1b of the stage 1. Is provided. The upper surface 2d of the bent portion 2e is exposed while being flush with the upper end 4f of a protrusion 4e of the resin layer 4 described later. Here, in the present embodiment, a pair of external connection terminals 2 are provided so as to face each other, but one of the external connection terminals 2 is mainly for supporting the stage 1 and is bent. The upper surface 2d of the portion 2e is positioned below the upper end 4f of the protrusion 4e of the resin layer 4.

  As shown in FIGS. 1 to 5, each of the plurality of leads 3 is formed in a substantially flat belt-like shape like the external connection terminals 2, and in the present embodiment, a pair of opposed resin layers 4 are opposed to each other. Two strips are provided on each side of the semiconductor sensor chip 5 on the side surface 4d side. Each of the two leads 3 extends in parallel with the external connection terminal 2, and the two leads 3 on the external connection terminal 2 side (one side surface 4d side of the resin layer 4) are for external connection. The terminals 2 are arranged in parallel at substantially equal intervals. On the other hand, one lead 3 is also provided on the side surface 4d side on the amplifier 6 side of the pair of side surfaces 4d orthogonal to the pair of side surfaces 4d in a plan view from the lower surface 4b side of the resin layer 4. The other ends 3b of these leads 3 are slightly protruded to the outside of the resin layer 4 in the same manner as the external connection terminals 2, and the protruded lower surface 3c on the other end 3b side is the lower surface 4b of the resin layer 4 and the external connection terminals 2 The other end 2b side of the lower surface (one surface) 2c is positioned and exposed on substantially the same horizontal plane. On the other hand, as shown in FIG. 3, the lead 3 is provided with a bent portion 3d on the way from the other end 3b to the one end 3a. The bent portion 3d causes the upper surface 3e on the one end 3a side to be connected to the other end 3b. It is located above the upper surface 3e on the 3b side, and is arranged and exposed on substantially the same horizontal plane as the upper surface 4a inside the protrusion 4e of the resin layer 4.

  As shown in FIGS. 1 to 5, the resin layer 4 for sealing the stage 1, the external connection terminal 2 and the lead 3 configured as described above has an upper surface 4a and a lower surface 4b which are parallel to each other, and an external connection. On the side surface (side end) 4d side that seals the bent portion 2e of the terminal 2 and the bent portion 3d of the lead 3, a protruding portion 4e protruding upward from the upper surface 4a is formed. The protrusion 4e extends along the side end 4d of the resin layer 4 and is continuously provided, and is formed so that its width gradually decreases toward the front end side (upper end 4f side) in the protruding direction. . A recess 4g is defined on the inner side of the upper surface 4a of the resin layer 4 by the protrusion 4e thus formed. Here, the above-mentioned opening hole 4c that is recessed from the upper surface 4a toward the lower surface 4b is provided on the upper surface 4a side that is located in the recess 4g of the resin layer 4, and this opening hole 4c is opened toward the upper surface 4a side. It extends toward the upper surface 1b of the stage 1 located below.

  On the other hand, as shown in FIGS. 2 to 4, the semiconductor sensor chip 5 of the present embodiment is formed in a substantially rectangular plate shape, and is recessed in a substantially central position in a plan view from the lower surface side and recessed from the lower surface to the upper surface. The portion thinned by the concave portion is a diaphragm (movable electrode) 5a. The diaphragm 5a can be deformed (vibrated) with a deformation amount corresponding to the magnitude of sound pressure such as sound applied to the diaphragm 5a. Further, a bridge resistor circuit (not shown) is formed on the upper surface side of the diaphragm 5a. The deformation of the diaphragm 5a is regarded as a change in electric resistance, and the sound pressure is detected by converting this into a pressure. It is possible to output an electrical signal corresponding to the magnitude of the pressure. The semiconductor sensor chip 5 configured as described above is fixed to the upper surface 4a of the resin layer 4 with an adhesive while the lower surface is opposed. At this time, the semiconductor sensor chip 5 is fixed so that the opening 4c of the resin layer 4 is disposed immediately below the diaphragm 5a and the diaphragm 5a and the opening 4c face each other. In the present embodiment, the semiconductor sensor chip 5 is installed on the upper surface 4 a of the resin layer 4, whereby the sealed second space 10 is defined by the concave portion and the opening hole 4 c of the resin layer 4. ing.

  In the present embodiment, an amplifier 6 such as an operational amplifier, which is an IC (Integrated Circuit), is also fixed to the upper surface 4a of the resin layer 4 with an adhesive. The amplifier 6 is a semiconductor sensor chip. 5 in parallel.

  The semiconductor sensor chip 5 and the amplifier 6 installed in this way are provided with a plurality of bonding pads, respectively, through which the semiconductor sensor chip 5 and the amplifier 6 and the semiconductor sensor chip 5 are connected. The amplifier 6 and the upper surface 3e exposed to the upper surface 4a of the resin layer 4 of the lead 3 and connected to the upper surface 3e positioned in the first space 8 are respectively connected by wires 7, so that the semiconductor sensor chip 5, the amplifier 6 and the lead 3 are connected. Electrically connected.

  As shown in FIGS. 1 to 3, the lid 9 is formed of a conductive material such as copper, and is formed in a substantially dish shape with the opening side facing downward, and has a substantially rectangular flat plate shape. It is comprised from the part 9a and the side wall part 9b drooping while connecting with the side edge of the top-plate part 9a. Further, the top plate portion 9a is formed with a through hole 9e penetrating from the upper surface to the lower surface (inner surface), and a coining portion 9f recessed from the upper surface to the inner surface side is formed on each side end in a plan view from the upper surface side. It extends in a row so as to exhibit a substantially rectangular shape. And the inner surface located in the coining part 9f protrudes below rather than the other part. In the lid body 9 formed as described above, the inner surface of the coining portion 9 f is fixed to the upper end 4 f of the protrusion 4 e of the resin layer 4 via the conductive adhesive 12, and the top plate portion 9 a is formed of the resin layer 4. The recess 4g is provided so as to cover the semiconductor sensor chip 5 and the amplifier 6. At this time, the side wall 9 b is provided so as to hang down toward the lower surface 4 b of the resin layer 4 and cover the side surface 4 d of the resin layer 4. Here, in the present embodiment, the top plate portion 9 a of the lid body 9 is fixed to the upper surface 2 d of the external connection terminal 2 exposed at the upper end 9 f of the protrusion 9 e of the resin layer 4 via the conductive adhesive 12. As a result, the conductive lid 9, the external connection terminal 2 and the stage 1 are electrically connected to each other and have the same potential.

  Next, a method for manufacturing the semiconductor device A having the above configuration will be described.

  The semiconductor device A of the present embodiment is manufactured using the lead frame 20. First, as shown in FIGS. 6 and 7, a rectangular frame portion 20 a that forms an outer peripheral rectangular frame, and the rectangular frame portion. A plurality of leads 3 projecting inward from the opposed outer peripheral side of 20a, and external connection terminals 2 projecting inward from the opposed outer peripheral side of the rectangular frame portion 20a, respectively, A lead frame 20 having a stage 1 connected to and supported by the external connection terminal 2 is prepared. The lead frame 20 configured as described above is formed by subjecting a thin metal plate to press processing, etching processing, or both processing. In the present embodiment, the bent portion of the lead 3 is formed. 3d and the bent portion 2e of the external connection terminal 2 are formed at this stage.

  When the lead frame 20 is prepared, as shown in FIG. 8, the rectangular frame portion 20a and a portion excluding the lead 3 and a part of the external connection terminal 2 are sandwiched between a pair of molds E and F. Tighten. Here, of the pair of molds E and F, one mold E arranged on the upper surface side of the lead frame 20 has a convex part E1 for forming the concave part 4g of the resin layer 4 or the resin layer 4. A recess E2 for defining the protrusion 4e and the side surface 4d of the resin layer 4 and a protrusion E3 for forming the opening hole 4c are provided. On the other hand, the other mold F disposed on the lower surface side of the lead frame 20 has a flat inner surface. In such a pair of molds E and F, the lead frame 20 is clamped, and the inner surface of the other mold F is outside the lower surface 1 a of the stage 1 and the bent portion 3 d of the lead 3. The lower surface 3c of the portion located at the position 2 and the lower surface 2c of the portion located outside the bent portion 2e of the external connection terminal 2 are abutted. Further, the inner surface of the convex portion E1 of one mold F is in contact with the upper surface 3e on the one end 3a side of the bent portion 3d of the lead 3, and the bottom surface of the concave groove portion E2 is the bent portion 2e of the external connection terminal 2. The upper surface 2d is contacted. Furthermore, the inner surface of the protrusion E3 is positioned slightly above the upper surface 1b of the stage 1.

  Thus, at the stage where the mold is clamped using the pair of molds E and F, a molten resin such as epoxy resin is injected into the cavity, and the stage 1, the external connection terminal 2 and the lead 3 are connected. The molds E and F are removed when the resin is filled and the resin is cured. Thereby, the recess 4g and the opening hole 4c are defined above the stage 1, and the resin layer 4 is formed in which the upper surface 2d of the bent portion 2e of the external connection terminal 2 is exposed at the upper end 4f of the protrusion 4e.

  In this embodiment, at this stage, for example, a plating layer such as silver, gold, or palladium is immersed in a plating solution (not shown) on the upper surface 3e on the one end 3a side, the lower surface 3c on the other end 3b side, or the like. After the formation, the leads 3 and the external connection terminals 2 extending outward from the resin layer 4 are cut. By the way, this plating layer is used to connect the lead 3 and the circuit board pattern (connection terminal), the semiconductor sensor chip 5 and the amplifier 6 when the semiconductor device A is mounted on a circuit board provided in a device such as a cellular phone. This is for improving the wettability of soldering when connecting the wire 7 for electrically connecting the lead 3. A plating layer is also formed on one surface 2c of the external connection terminal 2.

  Next, as shown in FIGS. 2 to 4, the semiconductor sensor chip 5 and the amplifier 6 are fixedly provided side by side on the upper surface 4a of the recess 4g of the resin layer 4 with an adhesive interposed therebetween. At this time, the semiconductor sensor chip 5 is installed so that the lower surface thereof faces the upper surface 4a of the recess 4g, and the diaphragm 5a is disposed immediately above the opening hole 4c and faces this. Further, wires 7 are bonded to the bonding pads of the semiconductor sensor chip 5 and the amplifier 6 and the lead 3 to electrically connect the semiconductor sensor chip 5, the amplifier 6 and the lead 3.

  And the substantially dish-shaped lid body 9 in which the top plate portion 9a and the side wall portion 9b are formed in advance is installed. At this time, the inner surface of the coining portion 9 f of the top plate portion 9 a is fixed to the upper end 4 f of the protrusion 4 e of the resin layer 4 via the conductive adhesive 12. In this embodiment, when the coining portion 9f is fixed to the upper end 4f of the protrusion 4e, the upper surface 2d of the external connection terminal 2 exposed at the upper end 4f of the protrusion 4e and the top plate portion 9a of the lid 9 (coining) 9f) is only required to be electrically connected via the conductive adhesive 12, and in particular through the conductive adhesive 12, the installation position of the lid body 9 is not required to be very precise. ing. In the present embodiment, since the lid body 9 is provided with the side wall portion 9b, the lid body 9 is covered so as to cover the concave portion 4g of the resin layer 4, and the side wall portion 9b is covered with the side surface 4d of the resin layer 4. So that the inner surface of the top plate portion 9a (coining portion 9f) of the lid body 9 is electrically connected to the external connection terminal 2 exposed at the upper end 4f of the protrusion 4e. It will be guided and installed. The manufacturing of the semiconductor device A of the present embodiment is completed at a stage where the lid 9 is installed relatively easily so that the lid 9 and the external connection terminal 2 are electrically connected in this way.

  Next, operations and effects of the semiconductor device A manufactured as described above will be described.

  The semiconductor device A of this embodiment is used by being mounted on a circuit board provided in a device such as a mobile phone. When mounting the semiconductor device A of this embodiment on a circuit board, the lower surface 3c of the lead 3 is exposed in advance while being flush with the lower surface 4b of the resin layer 4, so that the semiconductor is placed at a predetermined position on the circuit board. While the device A is installed, the lower surface 3c of the lead 3 comes into contact with the connection terminal of the circuit board. Then, the contacted lead 3 and the connection terminal of the circuit board are connected by soldering.

  Further, in the present embodiment, since the one surface 2c of the external connection terminal 2 exposed from the resin layer 4 is provided on substantially the same horizontal plane as the lower surface 3c of the lead 3, this external connection terminal is the same as described above. The first surface 2c of 2 also mounts the semiconductor device A on the circuit board and contacts the connection terminals of the circuit board. For this reason, when connecting the lead 3 and the circuit board by soldering, it is possible to easily connect each other by simultaneously soldering the one surface 2c of the external connection terminal 2 and the connection terminal of the circuit board. It is said. Therefore, the lid 9, the external connection terminal 2 and the stage 1 are easily set to the same potential, and an electromagnetic shield is formed by the lid 9 and the stage 1 so as to wrap the semiconductor sensor chip 5 and the amplifier 6. .

  Here, the semiconductor device A of the present embodiment installed on the circuit board in this way guides sound pressure such as sound generated outside to the first space 8 through the through hole 9e of the lid 9. This sound pressure reaches the diaphragm 5a of the semiconductor sensor chip 5 and vibrates the diaphragm 5a with a deformation amount corresponding to the magnitude of the sound pressure. Then, due to the deformation of the diaphragm 5a, the bridge resistance circuit recognizes the amount of deformation as a change in electric resistance and converts it into a pressure to detect the sound pressure. At this time, since the electric signal output from the diaphragm 5a is sent to the amplifier 6 and amplified, it is possible to detect the sound pressure more accurately. On the other hand, electromagnetic noise generated outside acts on the semiconductor device A in addition to the sound pressure to be detected. This type of noise may pass through the resin layer 4 and reach the semiconductor sensor chip 5 to cause a false vibration of the diaphragm 5a.

  However, in the semiconductor device A of the present embodiment, the semiconductor sensor chip 5 and the amplifier 6 in the first space 8 are arranged so that the top plate portion 9a and the side wall portion 9b of the lid body 9 that covers the upper side and the side portion of the semiconductor sensor chip 5 and the amplifier 6 Is surrounded by an electromagnetic shield formed by the stage 1 covering the surface. As a result, the noise transmitted through the resin layer 4 is blocked by the electromagnetic shield that encloses the semiconductor sensor chip 5 and the amplifier 6 and does not reach the semiconductor sensor chip 5. Therefore, the pressure detected by the semiconductor device A of the present embodiment is not affected by noise and is highly reliable.

  Therefore, in the semiconductor device A described above, the top plate portion 9a is fixed to the protrusion 4e of the resin layer 4 via the conductive adhesive 12 while the side wall portion 9b of the lid 9 is along the side surface 4d of the resin layer 4. It is possible to electrically connect the external connection terminal 2 exposed to the upper end 4f of the protrusion 4e and the lid body 9 by a simple operation. Then, for example, the semiconductor device A can be installed on a circuit board of a device such as a mobile phone and connected to the connection terminal of the circuit board by a simple operation of soldering the one surface 2c of the external connection terminal 2. An electromagnetic shield that encloses the semiconductor sensor chip 5 and the amplifier 6 can be formed. For this reason, it is possible to reliably form an electromagnetic shield without requiring much accuracy in installing the lid body 9 as compared with the conventional semiconductor device, and the labor required for installing the lid body 9 can be reduced. Therefore, it is possible to reduce the cost for manufacturing the semiconductor device A.

  Further, in the semiconductor device A of the present embodiment, the upper side is covered with the top plate portion 9a of the lid body 9, the side surface 4d of the resin layer 4 is covered with the side wall portion 9b of the lid body 9, and the lower side is covered with the semiconductor sensor. By covering the semiconductor sensor chip 5 and covering the semiconductor sensor chip 5 with the stage 1 formed larger than the chip 5, it is possible to reliably protect the semiconductor sensor chip 5 from noise. Thereby, the sound pressure detected by the semiconductor sensor chip 5 can be made highly accurate, and the semiconductor device A can be made highly reliable.

  In addition, this invention is not limited to said 1st Embodiment, In the range which does not deviate from the meaning, it can change suitably. For example, in the present embodiment, the lid body 9 is configured to include the top plate portion 9a and the side wall portion 9b. However, the side wall portion 9b is not necessarily provided, and is configured only by the top plate portion 9a. It may be done.

  In the present embodiment, a coining portion 9f is formed on the lid 9, and the inner surface of the coining portion 9f is connected to the upper end 4f of the protrusion 4e of the resin layer 4 via the conductive adhesive 12. However, it is not always necessary to provide the coining portion 9f on the lid 9, and the inner surface of the top plate portion 9a is used as a flat surface, and this flat surface is bonded and fixed to the upper end 4f of the protrusion 4e using the conductive adhesive 12. You may do it. Furthermore, although the description has been made on the assumption that the through hole 9e is provided in the top plate portion 9a of the lid 9, and the sound pressure generated outside is guided to the first space 8 through the through hole 9e, the lid 9 A through hole 9e is not provided in the top plate portion 9a, and a hole connected to the external space while being in communication with the opening hole 4c formed in the resin layer 4 is provided in the stage 1, and the outside is connected through the opening hole 4c and the hole. The sound pressure generated in step 1 may be configured to reach the diaphragm 5a. That is, it is good also as a structure which detects pressures, such as a sound pressure, by making the 1st space 8 into a sealed state and making the 2nd space 10 into the open space which connects with the exterior. In the present embodiment, the lower surface 1a of the stage 1 covering the lower side of the semiconductor sensor chip 5 is exposed while being flush with the lower surface 4b of the resin layer 4, but the stage 1 is exposed to the lower surface 1a. May be provided on the upper surface 4 a side of the resin layer 4 so as to be disposed in the resin layer 4. Furthermore, although the opening hole 4c of the resin layer 4 is assumed to extend slightly above the upper surface 1b of the stage 1, the opening hole 4c is formed so that the bottom thereof reaches the upper surface 1b of the stage 1. It may be.

  In the present embodiment, the semiconductor device A includes the semiconductor sensor chip 5 and the amplifier 6. However, the semiconductor device A may be configured to include only the semiconductor sensor chip 5, for example, a mobile phone or the like. The electric signal output from the semiconductor sensor chip 5 may be amplified by an amplifier provided separately on the circuit board of the apparatus.

  Further, although the semiconductor sensor chip 5 is fixed to the upper surface 4a of the resin layer 4 with the lower surface opposed, the semiconductor sensor chip 5 is installed with the upper surface of the semiconductor sensor chip 5 opposed to the upper surface 4a of the resin layer 4. Is also good. That is, the diaphragm 5a may be arranged on the opening hole 4c side.

  In the present embodiment, the through hole 9e of the lid body 9 is provided just above the diaphragm 5a of the semiconductor sensor chip 5. However, the through hole 9e connects the first space 8 and the outside. If it forms so that it may connect, the installation position does not need limitation. For example, when the through-hole 9e is formed by shifting from the upper side of the diaphragm 5a in the lateral direction, not only does the pressure detection accuracy decrease, but conversely, moisture or the like has entered the first space 8 through the through-hole 9e. At this time, it is possible to prevent the moisture and the like from coming into direct contact with the diaphragm 5a, and it is possible to maintain or increase the pressure detection accuracy.

  Next, a semiconductor device according to a second embodiment of the present invention will be described with reference to FIGS. The present embodiment relates to a semiconductor device for detecting sound pressure such as sound generated outside, and particularly to a QFP (Quad Flat Package) type semiconductor device manufactured using a lead frame. Here, in description of this embodiment, the same code | symbol is attached | subjected with respect to the structure which is common in 1st Embodiment, and the description about the detail is abbreviate | omitted. In the present embodiment, similarly to the first embodiment, the substrate B1 is configured by combining the stage 1, the external connection terminals 2, the leads 3, and the resin layer 4 for sealing them.

  In the semiconductor device B of the present embodiment, the configuration of the lead 3, the external connection terminal 2, the resin layer 4, and the lid 9 is different from that of the semiconductor device A of the first embodiment. As shown in FIGS. 9 to 11, the lead 3 of the present embodiment has a portion that is sealed by the resin layer 4 extending horizontally, and extends outside the side surface 4 d of the resin layer 4. The portion is formed so as to hang down to the lower surface 4 b side of the resin layer 4. In the present embodiment, the hanging portion is a hanging portion 3 f, and the hanging portion 3 f is bent at the lower end side toward the outside in the horizontal direction of the semiconductor device B, and the lower surface 3 c is substantially the same horizontal plane as the lower surface 4 b of the resin layer 4. It is formed so as to be arranged on the top.

  In addition, the external connection terminal 2 has a bent portion 2f formed in a portion sealed from the resin layer 4 on the way from the one end 2a connected to the stage 1 to the other end 2b. The upper surface 2d positioned above by 2f is arranged on substantially the same horizontal plane as the upper surface 3e on the one end 3a side of the lead 3. Thereby, in this embodiment, the external connection terminal 2 is not exposed to the upper end 4f of the protrusion 4e of the resin layer 4, and the external connection terminal 2 is moved from the portion positioned above the bent portion 2f to While maintaining the horizontal position, the resin layer 4 is slightly protruded and extended.

  In the resin layer 4 of the present embodiment, a bending point H is provided on a side surface 2d located substantially on the same horizontal plane as the upper surface 3e on the one end 3a side of the lead 3 and the upper surface 2d on the other end 2b side of the external connection terminal 2. ing. The side surface 4d located below the bending point H is an inclined surface that gradually inclines toward the inside of the semiconductor device B as it goes downward. Further, the lower surface 4 b of the resin layer 4 is located on substantially the same horizontal plane as the lower surface 3 c of the lead 3 and the lower surface 1 a of the stage 1.

  Similarly to the first embodiment, the lid body 9 is fixed to the upper end 4f of the protrusion 4e of the resin layer 4, and extends downward from the side end of the top plate 9a to protrude the protrusion 4e. And a side wall portion 9b formed so as to cover the side surface 4d. On the other hand, the lid body 9 of the present embodiment extends from the side end of the top plate portion 9a to the lower end 9c of the side wall portion 9b along the side wall portion 9b, and further extends downward from the lower end 9c of the side wall portion 9b. An electromagnetic shield forming terminal 9d (hereinafter referred to as a shield terminal 9d) is provided. The shield terminal 9d is divided into two by a notch 9i extending toward the side edge of the top plate 9a connected from the lower end to the upper end, and each of the divided shield terminals 9d is provided on the side wall 9b. A slit 9l reaching the side edge of the top plate portion 9a from the lower end 9c is formed with a gap between the side wall portion 9b. Here, in the present embodiment, the shield terminal 9d divided into two by the notch 9i is referred to as two shield terminals 9d.

  The lid 9 formed in this way is externally connected to the notch 9i between the two shield terminals 9d and extends to the outside of the resin layer 4 in a state of being integrally installed on the resin layer 4. The terminal 2 is inserted, and the external connection terminal 2 is sandwiched and held between the two shield terminals 9d. Thus, the two shield terminals 9d are brought into contact with the external connection terminals 2, and the conductive lid 9, the external connection terminals 2, and the stage 1 are electrically connected.

  Next, a method for manufacturing the semiconductor device B having the above configuration will be described.

  The semiconductor device B of this embodiment is manufactured using the lead frame 20 as shown in FIG. 6 shown in the first embodiment. However, in this embodiment, when the lead frame 20 is prepared, the above-described bent portion 2f is formed in the external connection terminal 2, and the upper surface 2d on the other end 2b side of the bent portion 2f is the upper surface 2d of the stage 1. It is formed so as to be positioned above the upper surface 1b. Note that the hanging portion 3f of the lead 3 that extends to the outside of the resin layer 4 and bends so as to hang down is not formed at this stage, but extends straight outward in the horizontal direction.

  Such a rectangular frame portion 20a of the lead frame 20 and a portion excluding a part of the lead 3 and the external connection terminal 2 are clamped between a pair of molds M and N. Here, in the present embodiment, of the pair of molds M and N, the other mold N arranged on the lower surface side of the lead frame 20 is positioned below the bending point H of the resin layer 4. A concave portion N1 is provided that has the side surface 4d as an inclined surface that gradually inclines in the downward direction. On the other hand, one mold M is formed in substantially the same manner as one mold E shown in the first embodiment. When the mold is clamped using such a pair of molds M and N, the molten resin is injected into the cavities of the molds M and N, and the molds M and N are fixed when the resin is cured. By removing, the resin layer 4 of the present embodiment is formed.

  In this embodiment, at this stage, the lead 3 and the external connection terminal 2 extending outward from the resin layer 4 are cut leaving a predetermined length, and the lead 3 extends outward from the resin layer 4. The bent portion is bent downward to form the hanging portion 3f. At this time, the bottom surface 3 c of the hanging portion 3 f is formed so as to be disposed on substantially the same horizontal plane as the bottom surface 4 b of the resin layer 4. As in the first embodiment, the semiconductor sensor chip 5 and the amplifier 6 are fixed to the upper surface 4a of the resin layer 4 and the wire 7 is connected.

  Next, the lid 9 on which the top plate portion 9a, the side wall portion 9b, and the shield terminal 9d are formed in advance is installed with the inner surface of the top plate portion 9a fixed to the upper end 4f of the protrusion 4e of the resin layer 4 with an adhesive. In this embodiment, the external connection terminal 2 extending to the outside of the resin layer 4 is inserted into the notch 9i between the two shield terminals 9d at this time, and the external connection is made with the two shield terminals 9d. The terminal 2 for use is inserted. As a result, the two shield terminals 9d and the external connection terminals 2 are held in contact with each other and are electrically connected to each other. Thus, the manufacture of the semiconductor device B is completed at the stage where the lid body 9 is installed.

  Next, functions and effects of the semiconductor device B manufactured as described above will be described.

  Also in the semiconductor device B of the present embodiment, as in the first embodiment, the semiconductor device B is such that the lower surface 3c of the hanging portion 3f of the lead 3 is brought into contact with a connection terminal of a circuit board provided in a device such as a mobile phone. The semiconductor device B is mounted by a simple operation of installing the device B and connecting the circuit board and the lead 3 by soldering.

  On the other hand, in the present embodiment, the semiconductor device B is installed on the circuit board, and the lower surface 1a of the stage 1 exposed while being flush with the lower surface 4b of the resin layer 4 of the external connection terminal 2 is provided on the circuit board. It is supposed to be in contact with the connection terminal. As a result, the lid 9 and the stage 1 electrically connected via the external connection terminal 2 are in the same potential state, and the semiconductor sensor chip 5 is wrapped by the electromagnetic shield formed by the lid 9 and the stage 1. Will be.

  Therefore, according to the semiconductor device B described above, with the simple operation of fixing the top plate portion 9a to the protrusion 4e of the resin layer 4 while keeping the side wall portion 9b of the lid body 9 along the side surface 4d of the resin layer 4, While inserting the external connection terminal 2 into the notch 9i between the two shield terminals 9d, the external connection terminal 2 is sandwiched between the two shield terminals 9d, and the external connection terminal 2 and the lid body 9 are inserted. Can be electrically connected. Further, for example, the semiconductor device B can be installed on the circuit board of a device such as a mobile phone, and the connection terminals of the circuit board and the stage 1 can be brought into contact with each other. It is possible to form a wrapping electromagnetic shield. Therefore, the lid 9 can be simply installed to reliably form the electromagnetic shield, and the cost for manufacturing the semiconductor device B can be reduced.

  Further, in the semiconductor device B of the present embodiment, the lid body 9 is firmly held by the lid body 9 being installed so as to sandwich the external connection terminal 2 with the two shield terminals 9d of the lid body 9. Thus, it is possible to prevent the lid body 9 after being installed from being displaced or detached.

  In addition, this invention is not limited to said 2nd Embodiment, In the range which does not deviate from the meaning, it can change suitably. For example, in this embodiment, the two shield terminals 9d have a notch portion 9i extending from the lower end to the upper end connected to the side end of the top plate portion 9a, and the side end of the top plate portion 9a from the lower end 9c of the side wall portion 9b. It is assumed that the notch 9i is formed from the lower end of the shield terminal 9d, but is defined by the two slits 9l that extend to the two shield terminals 9d and form a gap between the side wall 9b. The side wall 9b extends to a portion located below the lower end 9c, that is, only the lower end side of the shield terminal 9d extending downward is branched into two forks by the notch 9i. The external connection terminal 2 may be sandwiched between the notches 9i.

  Further, in the present embodiment, the semiconductor device B is installed on the circuit board and the stage 1 comes into contact with the connection terminal of the circuit board, and an electromagnetic shield is formed by the lid body 9, the external connection terminal 2, and the stage 1. However, like the lead 3, for example, a portion extending outward from the resin layer 4 of the external connection terminal 2 is formed so as to hang down, and is one surface located on the same horizontal plane as the lower surface 3c of the lead 3. The semiconductor device B may be installed on the circuit board, and the one surface may be brought into contact with the connection terminal of the circuit board to be electrically connected to each other.

  In the present embodiment, the lid 9 is described as having the side wall 9b. However, as shown in FIGS. 13 and 14, the semiconductor device B is configured without the side wall 9b. You may do it. In this case, the electromagnetic shielding effect may be reduced as much as the side wall portion 9b is not provided, but the other effects are the same as those of the semiconductor device B of the present embodiment.

  Next, a semiconductor device according to a third embodiment of the present invention will be described with reference to FIGS. The present embodiment relates to a QFP type semiconductor device manufactured using a lead frame, like the semiconductor device B of the second embodiment. Here, in description of this embodiment, the same code | symbol is attached | subjected with respect to the structure which is common in 1st and 2nd embodiment, and the description about the detail is abbreviate | omitted.

  Whereas the semiconductor device B of the second embodiment is configured to connect the shield terminal 9d and the external connection terminal 2 while installing the lid 9 on the resin layer 4 from above, the present embodiment As shown in FIG. 16, the semiconductor device C of the embodiment is installed on the resin layer 4 while moving the lid 9 in the horizontal direction (arrow a direction) and connects the shield terminal 9 d and the external connection terminal 2. It is said that. The semiconductor device C of this embodiment is different from the semiconductor device B of the second embodiment in the configuration of the lid 9 and the external connection terminal 2. As in the first and second embodiments, the substrate C1 of the present embodiment is configured by combining the stage 1, the external connection terminal 2, the lead 3, and the resin layer 4 for sealing them, In the present embodiment, a state in which the lid 9 is removed from the semiconductor device C (a case where the semiconductor sensor chip 5 and the amplifier 6 are fixed and electrically connected to the substrate C1) is referred to as a device main body C2. .

  Similarly to the second embodiment, the lid body 9 of the present embodiment is composed of a top plate portion 9a, a side wall portion 9b, and a shield terminal 9d, while four of the top plate portion 9a formed in a substantially rectangular plate shape. Side wall portions 9b are provided only on three side end sides of one side end side, and the side wall portion 9b is not provided on the remaining one side end side, and an opening 9j is formed.

  Further, the three side wall portions 9b of the lid body 9 are respectively provided with locking portions 9h extending downward from the lower end 9c. As shown in FIG. 15, the locking portion 9 h has a lower end positioned above the lower surface 4 b of the resin layer 4 in a state where the lid 9 is integrated with the resin layer 4, and a bending point H It is formed so as to be along the side surface 4d of the resin layer 4 that is bent at the boundary, and engages with the side surface 4d. That is, the locking part 4h has a substantially U shape with a bending point T that coincides with the bending point H of the resin layer 4 between the upper end and the lower end connected to the lower end 9c of the side wall part 9b. Formed, the portion from the upper end to the bending point T gradually extends toward the outer side of the lid body 9 toward the bending point T, and the portion from the bending point T to the lower end gradually extends to the lower end. It is formed to face inward.

  Further, the shield terminal 9d of the lid body 9 is extended downward with the upper end connected to the lower end 9c of the side wall portion 9b located substantially above the external connection terminal 2 with the lid body 9 installed. . The shield terminal 9d has an upper end extending along the side wall portion 9b, and a lower end extending toward the inner side of the lid body 9 toward the lower end. It is formed in a letter shape. Further, the lower end of the shield terminal 9d is bent toward the side surface 4d of the resin layer 4 with the lid body 9 installed, and the lower end portion is arranged on substantially the same horizontal plane as the lower surface 3c of the lead 3. Another surface 9g is formed. In addition, the lower end portion of the shield terminal 9d has a pair of side ends 9k and 9m extending downward toward one side end 9k on the opening 9j side of the lid 9 toward the other side end 9m. A recessed engaging portion 9n is provided. The engaging portion 9n is recessed so as to exhibit a U-shape when viewed from the outside of the shield terminal 9d.

  On the other hand, in the same manner as the lead 3, the external connection terminal 2 has a portion extending outward from the resin layer 4 that hangs downward, and a lower surface 3 c of the lead 3 (with a lid 9 attached) at its lower end. A surface 2c is formed which is positioned on substantially the same horizontal plane as the surface 9g) of the shield terminal 9d in the installed state. In addition, the portion of the external connection terminal 2 that extends outward from the resin layer 4 and hangs down is opposite to the other side end 2g on the side of the lead 3 that is juxtaposed between the pair of side ends 2g and 2h that extend downward. On one side end 2g side, an engagement receiving portion 2i that is recessed toward the other side end 2g is formed. The engagement receiving portion 2i is recessed so as to exhibit a U-shape when viewed from the outside of the external connection terminal 2.

  Next, a method for manufacturing the semiconductor device C having the above configuration will be described. Here, in the present embodiment, a method of installing the lid body 9 and electrically connecting the lid body 9 and the external connection terminal 2 (stage 1) will be described.

In the semiconductor device C of the present embodiment, the lid body 9 is installed so as to guide the device main body C2 from the opening 9j side to the inside surrounded by the top plate portion 9a and the side wall portion 9b. That is, while the horizontal position of the inner surface of the top plate portion 9a and the upper end 4f of the protrusion 4e of the resin layer 4 are substantially matched, the extending direction of the side wall portion 9b where the shield terminal 9d is formed and the external connection terminal The opening 9j of the lid 9 is directed toward the apparatus main body C2 while matching the extending direction of the side surface 4d of the resin layer 4 on the second side. Then, the lid body 9 is moved horizontally to insert the apparatus main body C2 into the opening 9j. At this time, the inner surface of the top plate portion 9a is slidably contacted (slided) while being in contact with the upper end 4f of the protrusion 4e of the resin layer 4, and the lid body 9 is installed so as to cover the upper portion of the apparatus main body C2. . Further, the substantially U-shaped locking portions 9h formed on each of the pair of side wall portions 9b along the moving direction of the lid body 9 (the direction of the arrow a) serve as the bending point T of the resin layer 4 The resin layer 4 is slid while being brought into contact with the side surface 4 d of the resin layer 4 while being engaged with the resin layer 4 while being coincident with the point H and the surface (inner surface) on the resin layer 4 side. Thus, the lid 9 is slid along the bending point T of the resin layer 4 by sliding while the locking portion 9h is engaged. Then, when the engaging portion 9h of the side wall portion 9b located on the rear side in the moving direction of the lid body 9 is brought into contact with and engaged with the side surface 4d of the resin layer 4, the lid body 9 is installed at a predetermined position. .

  In the present embodiment, when the lid body 9 is installed as described above, the engagement of the shield terminal 9d by the engagement portion 9n of the shield terminal 9d and the engagement receiving portion 2i of the external connection terminal 2 is established. The upper end portion located above the joint portion 9n is on the outer upper side of the external connection terminal 2, and the lower end portion portion located below the engagement portion 9n is the inner surface side (resin layer) of the external connection terminal 2. 4 side). That is, by forming the engagement portion 9n and the engagement receiving portion 2i, the shield terminal 9d and the external connection terminal 2 are combined so as to intersect with each other, and the shield terminal 9d is viewed from the opposite side. The terminal 9d and the external connection terminal 2 are arranged so as to overlap each other. At this time, one side end 9k portion of the engaging portion 9n of the shield terminal 9d and one side end 2g portion of the engagement receiving portion 2i of the external connection terminal 2 are in contact with each other in this state. The shield terminal 9d and the external connection terminal 2 are connected and connected. In this state, the outer surface of the portion located below the engaging portion 9n of the shield terminal 9d is in surface contact with the inner surface of the external connection terminal 2, and each of the shield terminal 9d and the external connection terminal 2 is in contact with each other. Each surface 2c, 9g formed at the lower end is positioned on substantially the same horizontal plane. Thereby, while installing the cover body 9, the shield terminal 9d and the external connection terminal 2 are electrically connected. In addition, in the state installed as mentioned above, the shield terminal 9d and the external connection terminal 2 may be soldered, for example, and the electrical connection between them may be made more reliable.

  In addition, the lid body 9 installed in the apparatus main body C2 as described above is in a state in which the locking portion 9h is in surface contact with the side surface 4d in the vertical direction with the inner surface of the lid portion 9 at the bending point H of the resin layer 4. Since it is engaged, the lid 9 is held by the locking portion 9h, and the connection state between the shield terminal 9d and the external connection terminal 2 is held. At this time, the inner surface of the top plate portion 9a of the lid body 9 is held in close contact with the upper end 4f of the protrusion 4e of the resin layer 4. In the semiconductor device C of this embodiment, the lid body 9 is The resin layer 4 does not need to be fixed using an adhesive.

  The semiconductor device C of the present embodiment with the lid body 9 mounted in this manner is similar to the first and second embodiments when, for example, the lead 3 is mounted on a circuit board provided in a device such as a mobile phone. The lower surface 3c of the drooping portion 3f is brought into contact with a connection terminal of the circuit board and can be connected to each other by soldering.

  Further, both the surfaces 2c and 9g of the external connection terminal 2 and the shield terminal 9d are in contact with the connection terminals of the circuit board, and by soldering these at the same time as the soldering of the leads 3, the external connection terminals 2 An electromagnetic shield that encloses the semiconductor sensor chip 5 is formed by the lid body 9 and the stage 1 that are electrically connected via each other.

  Therefore, according to the semiconductor device C described above, the shield terminal 9d and the external device can be connected to the outside by a simple operation of horizontally installing the lid body 9 so as to guide the apparatus body C2 from the opening 9j of the lid body 9 to the inside. The connection terminal 2 can be connected, and an electromagnetic shield that encloses the semiconductor sensor chip 5 can be formed along with the installation of the semiconductor device C on the circuit board. Accordingly, the lid 9 can be simply installed and the electromagnetic shield can be reliably formed, so that the labor for installing the lid 9 can be reduced, and the cost for manufacturing the semiconductor device C can be reduced. It becomes possible.

  Further, in the semiconductor device C of the present embodiment, the lid body 9 is securely held by the locking portion 9h, and the inner surface of the top plate portion 9a of the lid body 9 is in close contact with the protruding portion 4e of the resin layer 4. By being held, it is not necessary to fix the lid 9 and the resin layer 4 with an adhesive. Therefore, also from this point, it is possible to reduce the labor for installing the lid body 9 and to reduce the cost for manufacturing the semiconductor device C.

  In addition, this invention is not limited to said 3rd Embodiment, In the range which does not deviate from the meaning, it can change suitably. For example, in the present embodiment, the shield terminal 9d is provided with an engaging portion 9n, and the shield terminal 9d is connected to the lower surface 1c of the lower end of the external connection terminal 2 at the lower end extending below the engaging portion 9n. The shield terminal 9d has only to be configured to have one surface located on substantially the same horizontal plane, and the shield terminal 9d only needs to be electrically connected to the external connection terminal 2 while being provided with the lid body 9. 9g may not be formed.

1 is a perspective view showing a semiconductor device according to a first embodiment of the present invention. 1 is an exploded perspective view of a semiconductor device according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view of the semiconductor device shown in FIG. 1. FIG. 3 is a view taken along line XX in FIG. 2. FIG. 3 is a view taken along line YY in FIG. 2. It is a figure which shows the lead frame used for manufacture of the semiconductor device which concerns on 1st Embodiment of this invention. FIG. 7 is a view taken along line XX in FIG. 6 and a view taken along line YY in FIG. It is a figure which shows the state which formed the resin layer using a pair of metal mold | die in 1st Embodiment of this invention. It is a perspective view which shows the semiconductor device which concerns on 2nd Embodiment of this invention. It is a disassembled perspective view which shows the semiconductor device which concerns on 2nd Embodiment of this invention. FIG. 10 is a cross-sectional view of the semiconductor device shown in FIG. 9. It is a figure which shows the state which formed the resin layer using a pair of metal mold | die in 2nd Embodiment of this invention. It is a perspective view which shows the modification of the semiconductor device which concerns on 2nd Embodiment of this invention. It is a disassembled perspective view which shows the modification of the semiconductor device which concerns on 2nd Embodiment of this invention. It is a perspective view which shows the semiconductor device which concerns on 3rd Embodiment of this invention. It is a disassembled perspective view which shows the semiconductor device which concerns on 3rd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Stage, 2 ... External connection terminal, 2a ... One end, 2b ... Other end, 2c ... One surface, 2d ... Upper surface, 2g ... Other side end, 2h ... One side end, 2i ... Engagement receiving part, 3 ... Lead, 3c ... Lower surface, 4 ... Resin layer, 4a ... Upper surface, 4b ... Lower surface, 4c ..Opening hole, 4d ... side edge (side surface), 4e ... projection 4e ... upper end, 4g ... concave, 4h ... locking part, 5 ... semiconductor sensor chip, 6 ... Amplifier, 7 ... Wire, 8 ... First space (space), 9 ... Lid, 9a ... Top plate, 9b ... Side wall, 9c ... Lower end , 9d ... Electromagnetic shield forming terminals (shield terminals), 9e ... through-holes, 9f ... coining part, 9g ... one side, 9h ... locking part, 9i ... notch part 9j ... Opening portion, 9k, one side end, 9m, the other side end, 9n, an engaging portion, 10, a second space, A, B, C, a semiconductor device, A1 , B1, C1... Substrate, C2... Device main body, H, T, S.

Claims (6)

A semiconductor device comprising a semiconductor sensor chip formed with a diaphragm that is deformed by an applied pressure and detects the pressure according to the deformation amount,
An opening hole is provided on the upper surface, the resin layer on which the diaphragm is positioned above the opening hole and the semiconductor sensor chip is installed; and the resin layer disposed below the semiconductor sensor chip and sealed to the resin layer A plate-shaped stage, one end connected to the stage, an external connection terminal having one surface exposed from the resin layer on the other end side extended to the outside of the resin layer, and an upper surface of the resin layer And a conductive lid that defines a space for housing the semiconductor sensor chip,
In the resin layer, a protrusion projecting upward on the side end side of the upper surface is continuously provided so as to define a recess for housing the semiconductor sensor chip, and the lid is formed of the protrusion. A top plate part that defines the space that is supported by the upper end and accommodates the semiconductor sensor chip, and an electromagnetic shield forming terminal that extends downward through the outside of the side surface of the resin layer,
The electromagnetic shield forming terminal is provided with a notch extending from the lower end toward the upper end, and at least the lower end side is divided into two, and the external connection terminal extending to the outside of the resin layer is the notch The semiconductor device is characterized in that the electromagnetic shield forming terminal and the external connection terminal are connected while being inserted into the semiconductor device. A semiconductor device comprising a semiconductor sensor chip formed with a diaphragm that is deformed by an applied pressure and detects the pressure according to the deformation amount,
An opening hole is provided on the upper surface, the resin layer on which the diaphragm is positioned above the opening hole and the semiconductor sensor chip is installed; and the resin layer disposed below the semiconductor sensor chip and sealed to the resin layer A plate-shaped stage, one end connected to the stage, an external connection terminal having one surface exposed from the resin layer on the other end side extended to the outside of the resin layer, and an upper surface of the resin layer And a conductive lid that defines a space for housing the semiconductor sensor chip,
In the resin layer, a protrusion projecting upward on the side end side of the upper surface is continuously provided so as to define a recess for housing the semiconductor sensor chip, and the lid is formed of the protrusion. A top plate part that defines the space that is supported by the upper end and accommodates the semiconductor sensor chip, and an electromagnetic shield forming terminal that extends downward through the outside of the side surface of the resin layer,
The electromagnetic shield forming terminal is provided with an engaging portion that is recessed toward one side end of the pair of side ends extending from the upper end toward the lower end, and is disposed outside the resin layer. The extended external connection terminal is provided with an engagement receiving portion that is recessed toward the other side end on one side end side of the pair of side ends extending from the one end toward the other end. In the state where the lid is installed, the engagement portion and the engagement receiving portion are engaged to connect the electromagnetic shield forming terminal and the external connection terminal, and to form the electromagnetic shield A semiconductor device , wherein the electromagnetic shield forming terminal and the external connection terminal are connected so as to intersect and overlap each other when viewed from the outside of the terminal for use . The semiconductor device according to claim 1 or 2 ,
From the lower end of the side wall portion of the lid, the electromagnetic shield forming terminal is formed so as to cover the side surface of the resin layer from the side end of the top plate portion or the side end side of the top plate portion. The semiconductor device is characterized in that it extends downward through the outside of the side surface of the resin layer and is connected to the external connection terminal extending to the outside of the resin layer. The semiconductor device according to claim 1 or 2 ,
The resin layer is provided with a bending point on the side surface, and the side surface located below the bending point is an inclined surface that gradually inclines as it goes downward,
The lid body is suspended from the lower end of the side wall portion of the lid body that is formed so as to cover the side edge of the top plate portion or the side edge side of the top plate portion so as to cover the side surface of the resin layer. While being engaged with the side surface of the resin layer, there is provided a locking portion that holds the lid and the resin layer,
The locking portion is along the side surface that is bent at the bending point of the resin layer in a state where the lid is installed at a predetermined position of the resin layer connected to the external connection terminal. A semiconductor device formed. The semiconductor device according to claim 1 or 2 ,
The semiconductor device, wherein the stage is formed larger than the semiconductor sensor chip in a plan view from the upper surface side of the resin layer. The semiconductor device according to claim 4 .
The lid body has three side ends of the top plate portion formed in a substantially rectangular plate shape, or three side wall portions formed by hanging down on the three side end sides of the top plate portion, respectively. A locking portion is provided, and the locking portion is horizontally moved with respect to the resin layer while being engaged with a side surface of the resin layer, and is installed at a predetermined position of the resin layer. Semiconductor device.

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