JP4754245B2 - Manufacturing method of light emitting element unit - Google Patents

Manufacturing method of light emitting element unit Download PDF

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JP4754245B2
JP4754245B2 JP2005085884A JP2005085884A JP4754245B2 JP 4754245 B2 JP4754245 B2 JP 4754245B2 JP 2005085884 A JP2005085884 A JP 2005085884A JP 2005085884 A JP2005085884 A JP 2005085884A JP 4754245 B2 JP4754245 B2 JP 4754245B2
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light emitting
emitting element
substrate
luminance
emitting elements
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JP2006269756A (en
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正和 大橋
謙一 宇留賀
政律 伊藤
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Fujikura Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Description

本発明は、発光ダイオード（以下、ＬＥＤと記す。）などの発光素子を基板に実装したＬＥＤユニット等の発光素子ユニットの製造方法に関する。 The present invention is a light emitting diode (hereinafter, LED and referred.) Relates to a light-emitting element unit of production how the LED unit such as a light emitting element is mounted on a substrate, such as.

従来より、ＬＥＤ等の発光素子を表示装置、照明装置及び交通信号機などの用途に適用するために、多数の発光素子を基板上に実装し一体化したＬＥＤユニット等が知られている。
ＬＥＤ等の発光素子は、製造条件の微妙な変化などにより、個々に定電流を通電した場合、電圧値にばらつきが発生し易い。このようにばらつきが発生したまま、基板に発光素子を多数実装して照明装置や表示装置を構成した場合、実装した発光素子の間で輝度のばらつきが発生してしまう。その問題を解消するためには、特許文献１に開示されているように、その電圧値が基板に実装した複数の発光素子間で均一になるようにその抵抗値を選択して、個々の発光素子に抵抗器を接続することが提案されている。これにより、輝度ばらつきのない品質の良好な照明装置、表示装置などを得ることができる。図４にその電気回路を示す。 2. Description of the Related Art Conventionally, in order to apply light emitting elements such as LEDs to applications such as display devices, lighting devices, and traffic signals, LED units and the like in which a large number of light emitting elements are mounted on a substrate and integrated are known.
A light emitting element such as an LED is likely to vary in voltage value when a constant current is individually applied due to a subtle change in manufacturing conditions. When a lighting device or a display device is configured by mounting a large number of light emitting elements on a substrate with such variations, luminance variations occur between the mounted light emitting elements. In order to solve the problem, as disclosed in Patent Document 1, the resistance value is selected so that the voltage value is uniform among a plurality of light emitting elements mounted on the substrate, and individual light emission is performed. It has been proposed to connect a resistor to the element. Thereby, it is possible to obtain an illumination device, a display device, and the like having good quality with no luminance variation. FIG. 4 shows the electric circuit.

しかし、その抵抗器を組み立てる作業は長い加工時間を要するために、結果として製品のコストアップを招いてしまう。また、抵抗器のサイズが大きいために、装置全体のサイズも大型化してしまう問題点があった。また、電気抵抗の種類は限られているので、高精度で輝度を調整することは困難である。   However, assembling the resistor requires a long processing time, resulting in an increase in the cost of the product. Moreover, since the size of the resistor is large, there is a problem that the size of the entire device is increased. In addition, since the types of electrical resistance are limited, it is difficult to adjust the luminance with high accuracy.

一方、特許文献２には、基板上に抵抗調整体を用意し、レーザ照射により抵抗値を調整する方法が開示されている。この方法によれば、厳密な抵抗値に調整することが可能となる。
特開平４−１３２２７５号公報 特開２０００−１３３５０６号公報 On the other hand, Patent Document 2 discloses a method of preparing a resistance adjusting body on a substrate and adjusting the resistance value by laser irradiation. According to this method, it is possible to adjust to a strict resistance value.
JP-A-4-132275 JP 2000-133506 A

しかしながら、特許文献２に記載された調整方法では、基板上の電子部品の搭載部側に抵抗調整体を設けた場合、さらにその電子部品が発光素子であった場合、発光面とレーザ照射面が同一面となるため、レーザ加工により発光素子や配線が劣化する可能性がある。
また、本調整方法を実施するには、（１）レーザ照射、（２）照射停止、（３）発光素子を発光させて輝度を測定、（４）必要な輝度に達していない場合は再度レーザ照射する、という手順で輝度調整をするために手間がかかる。またこのレーザ照射時、及び輝度測定時はいずれも固定治具に基板が精度良くセットされていないと正確な調整、測定ができない問題がある。 However, in the adjustment method described in Patent Document 2, when the resistance adjuster is provided on the electronic component mounting portion side on the substrate, and when the electronic component is a light emitting element, the light emitting surface and the laser irradiation surface are Since they are on the same plane, there is a possibility that the light emitting element and the wiring may be deteriorated by laser processing.
In order to carry out this adjustment method, (1) laser irradiation, (2) stop irradiation, (3) measure the luminance by emitting light from the light emitting element, and (4) laser again if the required luminance is not reached. It takes time and effort to adjust the brightness in the procedure of irradiating. In addition, there is a problem that accurate adjustment and measurement cannot be performed unless the substrate is accurately set on the fixing jig at the time of laser irradiation and luminance measurement.

本発明は前記事情に鑑みてなされ、輝度のばらつきがなく低コストで生産可能な発光素子ユニットとその製造方法、この発光素子ユニットを用いた表示装置、照明装置及び交通信号機の提供を目的とする。   The present invention has been made in view of the above circumstances, and an object thereof is to provide a light emitting element unit that can be produced at low cost without variation in luminance, a manufacturing method thereof, a display device using the light emitting element unit, a lighting device, and a traffic signal. .

本発明は、ホーロー基板である基板の一方の面側に複数の発光素子を直列につないでなる段を複数並列に設け、各段を構成する前記複数の発光素子の一端を通電用の電極に接続し、他端を前記基板に設けられたスルーホール内に充填された導電部材に接続し、前記基板の裏面側に、前記導電部材に接続するように、抵抗調整部を含む電気抵抗体を設けて、前記導電部材を介して、前記複数の発光素子と前記電気抵抗体を電気的に接続し、
前記基板の一方の面側から前記複数の発光素子の輝度を測定可能であり、かつ、前記基板の裏面側の前記抵抗調整部にレーザ光を照射可能な加工装置に前記基板をセットし、
前記複数の発光素子を発光させてその輝度を測定し、該輝度が目標値と異なる場合には、裏面側の前記抵抗調整部にレーザ光を照射して前記輝度が目標値に合致するように前記抵抗調整部を溶断し、これによって輝度調整がなされた発光素子ユニットを得ることを
特徴とする発光素子ユニットの製造方法を提供する。 The present invention provides a plurality of stages in which a plurality of light emitting elements are connected in series on one surface side of a substrate which is an enamel substrate, and one end of the plurality of light emitting elements constituting each stage is used as an energizing electrode. An electrical resistor including a resistance adjusting unit is connected so that the other end is connected to a conductive member filled in a through hole provided in the substrate, and is connected to the conductive member on the back side of the substrate. Providing, electrically connecting the plurality of light emitting elements and the electric resistor via the conductive member;
It is possible to measure the luminance of the plurality of light emitting elements from one surface side of the substrate, and set the substrate in a processing apparatus capable of irradiating the resistance adjustment unit on the back surface side of the substrate with laser light,
When the luminance is measured by causing the plurality of light emitting elements to emit light and the luminance is different from a target value, the resistance adjustment unit on the back side is irradiated with laser light so that the luminance matches the target value. A method of manufacturing a light emitting element unit is provided, wherein the resistance adjusting portion is melted to obtain a light emitting element unit whose brightness is adjusted thereby.

本発明の発光素子ユニットは、基板の一方の面側に発光素子が実装され、前記発光素子の輝度調整用の電気抵抗体が発光素子実装面の裏面側に配置されている構成としたものなので、発光素子の輝度を調整する際、発光素子実装面側から発光素子の輝度を測定しながら、裏面側の電気抵抗体を加工することができ、調整の度毎に測定機械上から基板を外すことなく抵抗調整することができるので、簡単にかつ正確に輝度の調整を行うことができる。また、電気抵抗体の加工時に発光素子実装面側の発光素子や配線を損傷したり、性能低下を生じることなく電気抵抗体を加工することができる。   The light emitting element unit of the present invention has a structure in which a light emitting element is mounted on one surface side of the substrate, and an electric resistor for brightness adjustment of the light emitting element is disposed on the back surface side of the light emitting element mounting surface. When adjusting the brightness of the light emitting element, the electrical resistor on the back side can be processed while measuring the brightness of the light emitting element from the light emitting element mounting surface side, and the substrate is removed from the measuring machine for each adjustment. Therefore, the brightness can be adjusted easily and accurately. In addition, the electrical resistor can be processed without damaging the light-emitting element or the wiring on the light-emitting element mounting surface side or causing the performance to deteriorate during the processing of the electrical resistor.

本発明の発光素子ユニットの製造方法は、基板の一方の面側に発光素子を実装し、かつ発光素子実装面の裏面側に前記発光素子と電気的に接続された抵抗調整部を含む電気抵抗体を設け、前記発光素子を発光させてその輝度を測定し、該輝度が目標値と異なる場合には、前記輝度が目標値に合致するように抵抗調整部をレーザ加工、電動やすり等によって加工し、これによって抵抗調整を行うので、調整の度毎に測定機械上から基板を外すことなく抵抗調整することができ、簡単にかつ正確に輝度の調整を行うことができる。また、電気抵抗体の加工時に発光素子実装面側の発光素子や配線を損傷したり、性能低下を生じることなく電気抵抗体を加工することができる。   The method for manufacturing a light emitting element unit according to the present invention includes mounting a light emitting element on one surface side of a substrate, and including a resistance adjusting portion electrically connected to the light emitting element on a back surface side of the light emitting element mounting surface. If the brightness is different from the target value, the resistance adjustment unit is processed by laser processing, electric file, etc. so that the brightness matches the target value. Thus, the resistance is adjusted, so that the resistance can be adjusted without removing the substrate from the measuring machine for each adjustment, and the brightness can be adjusted easily and accurately. In addition, the electrical resistor can be processed without damaging the light-emitting element or the wiring on the light-emitting element mounting surface side or causing the performance to deteriorate during the processing of the electrical resistor.

以下、図面を参照して本発明の実施形態を説明する。
図１〜図３は、本発明の発光素子ユニットの一実施形態を示す図であり、図１は発光素子ユニットの断面図、図２は平面図、図３は底面図である。これらの図中、符号１０は発光素子ユニット、１１はホーロー基板、１１ａは発光素子実装面、１１ｂは裏面、１２は発光素子、１３は電極、１４はボンディングワイヤ、１５ａ及び１５ｂはスルーホール、１６は導電部材、１７は電気抵抗体としての抵抗調整部、１８はレーザ光である。 Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1 to 3 are diagrams showing an embodiment of a light emitting element unit according to the present invention. FIG. 1 is a sectional view of the light emitting element unit, FIG. 2 is a plan view, and FIG. 3 is a bottom view. In these drawings, reference numeral 10 is a light emitting element unit, 11 is a hollow substrate, 11a is a light emitting element mounting surface, 11b is a back surface, 12 is a light emitting element, 13 is an electrode, 14 is a bonding wire, 15a and 15b are through holes, 16 Is a conductive member, 17 is a resistance adjusting section as an electric resistor, and 18 is a laser beam.

本実施形態の発光素子ユニット１０は、ホーロー基板１１の一方の面（発光素子実装面１１ａ）に複数個の発光素子１２が実装され、その裏面１１ｂに発光素子１２と電気的に接続された電気抵抗体としての抵抗調整部１７が設けられた構成になっている。   In the light emitting element unit 10 of this embodiment, a plurality of light emitting elements 12 are mounted on one surface (light emitting element mounting surface 11a) of the enamel substrate 11, and the light emitting element 12 is electrically connected to the back surface 11b. The resistance adjusting unit 17 as a resistor is provided.

前記発光素子実装面１１ａには、複数の発光素子１２と、複数の電極１３と、各発光素子１２の電極端子と電極１３とを電気的に接続している複数のボンディングワイヤ１４とが設けられている。図２の例示においては、長方形状をなしているホーロー基板１１の発光素子実装面１１ａ上に、９個の発光素子１２を３列３段の格子状に配列して実装している。また、発光素子実装面１１ａの一方の側縁部（図１〜図３において右側縁部）には通電用の長い電極１３が設けられ、さらに各発光素子１２の間には２列３段のつなぎ用の電極１３が設けられている。これらの発光素子１２及び電極１３の個数、配列、電極形状等は本例示にのみ限定されない。   The light emitting element mounting surface 11 a is provided with a plurality of light emitting elements 12, a plurality of electrodes 13, and a plurality of bonding wires 14 that electrically connect the electrode terminals and the electrodes 13 of each light emitting element 12. ing. In the illustration of FIG. 2, nine light emitting elements 12 are arranged and mounted in a three-row, three-stage grid pattern on a light emitting element mounting surface 11 a of a hollow enamel substrate 11. A long electrode 13 for energization is provided on one side edge (right edge in FIGS. 1 to 3) of the light emitting element mounting surface 11 a, and two rows and three stages are provided between the light emitting elements 12. A connecting electrode 13 is provided. The number, arrangement, electrode shape, and the like of the light emitting element 12 and the electrode 13 are not limited to this example.

また、ホーロー基板１１の他方の側縁部（図１〜図３において左側縁部）には、格子状に配列された各段毎の発光素子１２に対応する３つの円形状のスルーホール１５ａが穿設され、かつ該スルーホール１５ａよりも側縁側に１本の長いスルーホール１５ｂが穿設されている。これらのスルーホール１５ａ，１５ｂ内には、半田等の導電性材料からなる導電部材１６が充填されている。これらのスルーホール１５ａ，１５ｂのうち、側縁寄りのスルーホール１５ｂの導電部材１６は、通電用の電極として用いられる。また各段毎の発光素子１２に対応する３つの円形状のスルーホール１５ａ内に充填されている導電部材１６は、ボンディングワイヤ１４を介して発光素子１２の一方の電極端子と電気的に接続されている。   Further, on the other side edge portion (left side edge portion in FIGS. 1 to 3) of the enamel substrate 11, three circular through holes 15 a corresponding to the light emitting elements 12 for each stage arranged in a lattice shape are formed. A long through hole 15b is formed on the side edge side of the through hole 15a. The through holes 15a and 15b are filled with a conductive member 16 made of a conductive material such as solder. Of these through holes 15a and 15b, the conductive member 16 of the through hole 15b near the side edge is used as an electrode for energization. The conductive member 16 filled in the three circular through holes 15a corresponding to the light emitting elements 12 in each stage is electrically connected to one electrode terminal of the light emitting element 12 through the bonding wires 14. ing.

本実施形態において、ホーロー基板１１の裏面１１ｂに設けられた抵抗調整部１７は、比較的抵抗率の高い材料からなる薄膜からなり、各段毎の発光素子１２に対応する３つの円形状のスルーホール１５ａに充填された導電部材１６と、側縁側の長いスルーホール１５ｂに充填された導電部材１６とをつなぐように、ホーロー基板１１の裏面１１ｂに固着されている。この抵抗調整部１７の構成材料としては、例えば、窒化タンタル、ニッケル−クロム合金、ニッケル−クロム−シリコン合金、モリブデン−シリコン合金、タングステン、モリブデン、チタン、クロム等の高い抵抗率を持つ薄膜などが挙げられる。この薄膜は加圧する方法、あるいは金属ペーストとしてスクリーン印刷などにより塗布し、焼き付ける方法などによりホーロー基板１１の裏面１１ｂに取り付けられる。   In the present embodiment, the resistance adjusting portion 17 provided on the back surface 11b of the enamel substrate 11 is made of a thin film made of a material having a relatively high resistivity, and has three circular through holes corresponding to the light emitting elements 12 in each stage. The conductive member 16 filled in the hole 15a is fixed to the back surface 11b of the enamel substrate 11 so as to connect the conductive member 16 filled in the long through hole 15b on the side edge side. Examples of the constituent material of the resistance adjusting unit 17 include a thin film having high resistivity such as tantalum nitride, nickel-chromium alloy, nickel-chromium-silicon alloy, molybdenum-silicon alloy, tungsten, molybdenum, titanium, and chromium. Can be mentioned. The thin film is attached to the back surface 11b of the enamel substrate 11 by a method of pressurizing or applying a metal paste by screen printing and baking.

この抵抗調整部１７は、格子状に配列された各段毎の発光素子１２の輝度（発光強度）が目標値と合致するよう、そのために必要な電気抵抗を持つように個別に加工されている。この加工は、例えば、レーザ光１８を照射して抵抗調整部１７を適宜溶断することにより行われるが、これに限定されない。例えば、電動やすりなどにより抵抗部を削り、抵抗調整を行ってもよい。   The resistance adjusting unit 17 is individually processed so as to have an electric resistance necessary for the luminance (light emission intensity) of the light emitting elements 12 arranged in a grid pattern to match the target value. . This processing is performed by, for example, irradiating the laser light 18 and fusing the resistance adjusting unit 17 as appropriate, but is not limited thereto. For example, the resistance may be adjusted by scraping the resistance portion with an electric file or the like.

本実施形態の発光素子ユニット１０において用いられるホーロー基板１１としては、所定の形状とした低炭素鋼などの金属材料からなるコア金属の表面に、ガラス粉末を電着などの方法により付着させ、一定温度で焼成することにより作製される。この際、コア金属にスルーホール１５ａ，１５ｂとなる孔を開けておけば、その孔内にもガラス粉末が付着するので、基板として見た場合、スルーホール１５ａ，１５ｂ内の壁面が絶縁性を有するという特徴を持つ。そのため、前述のように導電部材１６をスルーホール１５ａ，１５ｂ内に入れて、基板の裏側に電子回路を形成することが可能となる。また、レーザ照射による温度上昇においても基板自体は劣化しない。   As enamel substrate 11 used in light emitting element unit 10 of this embodiment, glass powder is made to adhere to the surface of core metal which consists of metal materials, such as low carbon steel made into predetermined shape, by methods, such as electrodeposition, and is constant. It is produced by firing at a temperature. At this time, if the core metal is provided with holes to be the through holes 15a and 15b, the glass powder adheres to the holes, so that when viewed as a substrate, the wall surfaces in the through holes 15a and 15b have insulating properties. It has the characteristic of having. Therefore, it is possible to form an electronic circuit on the back side of the substrate by placing the conductive member 16 in the through holes 15a and 15b as described above. Further, the substrate itself does not deteriorate even when the temperature is increased by laser irradiation.

このホーロー基板１１を構成するコア材は金属で構成されているので、放熱性が良好であることから、このホーロー基板１１上に実装された発光素子１２や電気抵抗体としての抵抗調整部１７が発熱したとしても、その熱は基板全体に効率良く吸収されるとともに、基板全体を介して大気中に放散され、その結果、発光素子１２や抵抗調整部１７が高温になることなく、正常、かつ安定に発光素子１２を発光させることができる。   Since the core material constituting the enamel substrate 11 is made of metal and has good heat dissipation, the light emitting element 12 mounted on the enamel substrate 11 and the resistance adjusting unit 17 as an electric resistor are provided. Even if the heat is generated, the heat is efficiently absorbed by the entire substrate and is dissipated into the atmosphere through the entire substrate. As a result, the light emitting element 12 and the resistance adjusting unit 17 are normal without being heated to high temperatures. The light emitting element 12 can emit light stably.

本実施形態の発光素子ユニット１０において用いられる発光素子１２は、特に限定されないが、ＬＥＤ、レーザダイオード（ＬＤ）などの半導体発光素子、有機ＥＬ素子などが好適に用いられる。また本発明において用いる発光素子１２の発光色は、特に限定されず、青色、緑色、赤色あるいはそれ以外の発光色でも良く、さらに、窒化物系化合物半導体からなる青色発光の半導体素子と、該青色系の光の少なくとも一部を吸収して可視波長域の光に波長変換する蛍光体（例えば、セリウムで賦活されたイットリウム・アルミニウム・ガーネット蛍光体など）を組み合わせた白色ＬＥＤを用いても良い。また、ホーロー基板１１に並べて実装される複数の発光素子１２は、例えば交通信号機等の用途には、同じ発光色のＬＥＤ等であっても良いし、異なる発光色のＬＥＤ等を順次、又はランダムに配置して表示装置としても良い。さらに、大面積のホーロー基板１１上に、多数の青色ＬＥＤ、緑色ＬＥＤ、赤色ＬＥＤを順次、又はランダムに配置することで、ＬＥＤを用いた表示装置を構成することができる。また、発光素子１２として白色ＬＥＤを用い、多数の白色ＬＥＤを大型のホーロー基板１１に縦横に実装することで、大面積の平面型照明装置を構成することもできる。   Although the light emitting element 12 used in the light emitting element unit 10 of this embodiment is not specifically limited, Semiconductor light emitting elements, such as LED and a laser diode (LD), an organic EL element, etc. are used suitably. The light emission color of the light emitting element 12 used in the present invention is not particularly limited, and may be blue, green, red, or any other light emission color. Further, a blue light emitting semiconductor element made of a nitride compound semiconductor and the blue light emitting element 12 may be used. A white LED combined with a phosphor that absorbs at least part of the light of the system and converts the wavelength into light in the visible wavelength range (for example, yttrium, aluminum, garnet phosphor activated by cerium) may be used. In addition, the plurality of light emitting elements 12 mounted side by side on the enamel substrate 11 may be LEDs of the same light emission color, for example, for traffic traffic lights or the like, or LEDs of different light emission colors are sequentially or randomly. It is good also as arrange | positioning to a display apparatus. Furthermore, by arranging a large number of blue LEDs, green LEDs, and red LEDs sequentially or randomly on a large-area enamel substrate 11, a display device using LEDs can be configured. In addition, by using a white LED as the light emitting element 12 and mounting a large number of white LEDs vertically and horizontally on a large enamel substrate 11, a large-area planar illumination device can be configured.

本実施形態の発光素子ユニット１０において用いられる電極１３は、銀ペーストや銅ペーストを印刷などの方法により塗布し、それを所定温度で焼成して形成されたものが好ましい。また、銅箔を貼り合わせて電子回路を形成しても良い。
また、発光素子１２の電極端子とそれぞれの電極１３とを繋ぐボンディングワイヤ１４としては、金細線などが用いられる。このボンディングワイヤ１４は、従来より発光素子１２等の接続に用いるワイヤボンディング装置を用いてボンディングすることができる。 The electrode 13 used in the light-emitting element unit 10 of the present embodiment is preferably formed by applying a silver paste or a copper paste by a method such as printing and firing it at a predetermined temperature. Alternatively, an electronic circuit may be formed by bonding a copper foil.
Further, as the bonding wire 14 that connects the electrode terminal of the light emitting element 12 and each electrode 13, a fine gold wire or the like is used. The bonding wire 14 can be bonded using a wire bonding apparatus conventionally used for connecting the light emitting element 12 and the like.

本実施形態の発光素子ユニット１０は、必要に応じて発光素子実装面１１ａ側と裏面１１ｂ側のいずれか一方又は両方を、樹脂により封止してもよい。封止樹脂としては、光透過率の高いエポキシ系の熱硬化型樹脂、紫外線硬化型樹脂、熱硬化性のシリコン樹脂などが用いられる。また、発光素子１２を樹脂で封止する際に、透明樹脂中に粉末蛍光体を分散させた樹脂を用い、前述したような白色ＬＥＤを構成することもできる。   In the light emitting element unit 10 of the present embodiment, one or both of the light emitting element mounting surface 11a side and the back surface 11b side may be sealed with resin as necessary. As the sealing resin, an epoxy thermosetting resin having a high light transmittance, an ultraviolet curable resin, a thermosetting silicon resin, or the like is used. Moreover, when sealing the light emitting element 12 with resin, white LED as mentioned above can also be comprised using resin which disperse | distributed powder fluorescent substance in transparent resin.

本実施形態の発光素子ユニット１０は、図２に例示したように、ホーロー基板１１の発光素子実装面１１ａ上に、３段３列の格子状に合計９個の発光素子１２を実装し、各段３つの発光素子１２を直列につなぎ、各段３つの発光素子１２の一端を通電用の電極１３に接続し、他端をスルーホール１５ａに充填された導電部材１６に接続している。さらに、このスルーホール１５ａの導電部材１６は、抵抗調整部１７を介して左側縁側のスルーホール１５ｂに充填された導電部材１６に接続されている。この発光素子ユニット１０の回路構成は、図４に示す電気回路図と同じである。ただし、図４中の抵抗Ｒは、本実施形態では抵抗調整部１７となる。この発光素子ユニット１０は、通電用の右側縁側の電極１３と左側縁側の導電部材１６の間に通電することで、３段３列の発光素子１２を発光させることができる。   As illustrated in FIG. 2, the light emitting element unit 10 of the present embodiment has a total of nine light emitting elements 12 mounted on a light emitting element mounting surface 11 a of the enamel substrate 11 in a three-stage, three-row grid pattern. The three light emitting elements 12 in the stage are connected in series, one end of each of the three light emitting elements 12 is connected to the energizing electrode 13, and the other end is connected to the conductive member 16 filled in the through hole 15a. Further, the conductive member 16 of the through hole 15 a is connected to the conductive member 16 filled in the through hole 15 b on the left edge side through the resistance adjusting portion 17. The circuit configuration of the light emitting element unit 10 is the same as the electric circuit diagram shown in FIG. However, the resistor R in FIG. 4 becomes the resistance adjusting unit 17 in this embodiment. The light emitting element unit 10 can emit light from the light emitting elements 12 in three stages and three rows by energizing between the electrode 13 on the right side for energization and the conductive member 16 on the left side.

本実施形態の発光素子ユニット１０は、ホーロー基板の一方の面（発光素子実装面１１ａ）側に発光素子１２が実装され、発光素子１２の輝度調整用の電気抵抗体となる抵抗調整部１７が発光素子実装面１１ａの裏面１１ｂ側に配置された構成としたものなので、発光素子１２の輝度を調整する際、発光素子実装面１１ａ側から発光素子１２の輝度を測定しながら、裏面１１ｂ側の抵抗調整部１７を加工することができ、調整の度毎に測定機械上から基板を外すことなく抵抗調整することができるので、簡単にかつ正確に輝度の調整を行うことができる。また、抵抗調整部１７の加工時に発光素子実装面１１ａ側の発光素子１２や配線を損傷したり、性能低下を生じることなく抵抗調整部１７を加工することができる。   In the light emitting element unit 10 of the present embodiment, the light emitting element 12 is mounted on one surface (light emitting element mounting surface 11a) side of the enamel substrate, and the resistance adjusting unit 17 serving as an electric resistor for adjusting the luminance of the light emitting element 12 is provided. Since the light emitting element mounting surface 11a is arranged on the back surface 11b side, when adjusting the luminance of the light emitting element 12, the luminance of the light emitting element 12 is measured from the light emitting element mounting surface 11a side. The resistance adjusting unit 17 can be processed, and the resistance can be adjusted without removing the substrate from the measuring machine every time adjustment is performed, so that the brightness can be adjusted easily and accurately. In addition, the resistance adjusting unit 17 can be processed without damaging the light emitting element 12 and the wiring on the light emitting element mounting surface 11a side or causing a performance degradation when the resistance adjusting unit 17 is processed.

次に、本発明に係る発光素子ユニットの製造方法の一実施形態として、前述した発光素子ユニット１０を製造する場合を例として説明する。
発光素子ユニット１０を製造するには、まず、所定の形状とした低炭素鋼などの金属材料からなるコア金属にスルーホール１５ａ，１５ｂを穿設し、次いで該コア金属の表面にガラス粉末を電着などの方法により付着させ、次いで一定温度で焼成することによりホーロー層を形成してホーロー基板１１を作製する。 Next, as an embodiment of a method for manufacturing a light emitting element unit according to the present invention, a case where the above-described light emitting element unit 10 is manufactured will be described as an example.
In order to manufacture the light emitting element unit 10, first, through holes 15 a and 15 b are drilled in a core metal made of a metal material such as low carbon steel having a predetermined shape, and then glass powder is applied to the surface of the core metal. The enamel substrate 11 is formed by forming the enamel layer by attaching it by a method such as deposition and then baking at a constant temperature.

次に、ホーロー基板１１の一方の面（発光素子実装面１１ａ）側に、電極１３を形成すると共に、発光素子１２を実装する。また、ホーロー基板１１のスルーホール１５ａ，１５ｂ内に半田を充填する。さらに、裏面１１ｂの所定位置に、高い抵抗率を持つ薄膜を加圧などの方法により貼り付けて抵抗調整部１７を形成する。これら各部材の形成・実装の順番は限定されず、各部材の材質等に応じて適宜選択することができる。例えば、電極１３として銀等を用いる場合には、ホーロー基板１１の発光素子実装面１１ａ側に銀ペーストを印刷した後、ホーロー基板１１を焼成して電極１３を形成し、その後発光素子１２の実装、抵抗調整部１７の形成、スルーホール１５ａ，１５ｂへの半田充填の各工程を順次又は適宜入れ替えて実施することができる。   Next, the electrode 13 is formed on one surface (light emitting element mounting surface 11a) side of the enamel substrate 11, and the light emitting element 12 is mounted. In addition, solder is filled into the through holes 15 a and 15 b of the enamel substrate 11. Further, a thin film having a high resistivity is attached to a predetermined position on the back surface 11b by a method such as pressurization to form the resistance adjusting unit 17. The order of formation and mounting of these members is not limited, and can be appropriately selected according to the material of each member. For example, when silver or the like is used as the electrode 13, after silver paste is printed on the light emitting element mounting surface 11 a side of the enamel substrate 11, the enamel substrate 11 is baked to form the electrode 13, and then the light emitting element 12 is mounted. The steps of forming the resistance adjusting portion 17 and filling the through holes 15a and 15b with solder can be sequentially or appropriately replaced.

次に、ワイヤボンディング装置を用い、それぞれの発光素子１２の電極端子と電極１３、及び該電極端子とスルーホール１５ａに充填された導電部材１６とを、ボンディングワイヤ１４によって接続する。これによって、図２に示すように、３段３列の格子状に配列された発光素子１２の各段３つの発光素子１２が直列につながれ、各段３つの発光素子１２の一端が通電用の電極１３に接続され、他端がスルーホール１５ａの導電部材１６に接続される。さらに、このスルーホール１５ａの導電部材１６は、抵抗調整部１７を介して左側縁側のスルーホール１５ｂの導電部材１６に接続されていることから、抵抗Ｒが未調整ながら、図４に示す回路構成が得られる。   Next, by using a wire bonding apparatus, the electrode terminal of each light emitting element 12 and the electrode 13 and the conductive member 16 filled in the through hole 15a are connected to the electrode terminal by the bonding wire 14. As a result, as shown in FIG. 2, the three light emitting elements 12 of each stage of the light emitting elements 12 arranged in a three-stage and three-row grid pattern are connected in series, and one end of each of the three light emitting elements 12 of each stage is connected to the energization. The other end is connected to the electrode 13 and the other end is connected to the conductive member 16 of the through hole 15a. Furthermore, since the conductive member 16 of the through hole 15a is connected to the conductive member 16 of the through hole 15b on the left edge side via the resistance adjusting portion 17, the circuit configuration shown in FIG. Is obtained.

なお、前記電気回路の形成は、前述した例示に限定されず、発光素子１２の電極端子の配置などに応じて適宜変更可能である。例えば、ワイヤボンディングに代えて、電極部上に金バンプなどを配置してフリップチップ実装することもできる。また、上下面に電極端子を持つ発光素子構造の場合は、電極１３上に発光素子１２を導電ペーストなどによりボンディングし、実装時に電極１３との電気的接続を図っても良い。   In addition, formation of the said electric circuit is not limited to the illustration mentioned above, According to arrangement | positioning of the electrode terminal of the light emitting element 12, etc., it can change suitably. For example, in place of wire bonding, flip bump mounting can be performed by arranging gold bumps on the electrode portion. In the case of a light-emitting element structure having electrode terminals on the upper and lower surfaces, the light-emitting element 12 may be bonded on the electrode 13 with a conductive paste or the like so as to be electrically connected to the electrode 13 during mounting.

次に、抵抗調整部１７を加工して発光素子１２の輝度調整を行う。
前述したように、個々の発光素子１２は、所定の輝度を得るための電圧値にばらつきを持つため、発光素子１２に通電する電気回路内に適当な抵抗値を持った電気抵抗体を挿入して所定の輝度が得られるように調整する必要がある。本例示では、発光素子１２に通電してその輝度を測定しながら、ホーロー基板１１の裏面１１ｂ側に設けた抵抗調整部１７を適宜加工して、３つの発光素子１２が直列に接続された各段毎の電気回路の抵抗を調整し、発光素子１２の輝度が均一になるように輝度調整する。 Next, the resistance adjustment unit 17 is processed to adjust the luminance of the light emitting element 12.
As described above, since the individual light emitting elements 12 have variations in voltage values for obtaining a predetermined luminance, an electric resistor having an appropriate resistance value is inserted into an electric circuit that supplies current to the light emitting elements 12. Therefore, it is necessary to adjust so as to obtain a predetermined luminance. In this example, each of the three light emitting elements 12 connected in series by appropriately processing the resistance adjusting portion 17 provided on the back surface 11b side of the enamel substrate 11 while energizing the light emitting elements 12 and measuring the luminance thereof. The brightness of the light emitting element 12 is adjusted to be uniform by adjusting the resistance of the electric circuit for each stage.

本例示において抵抗調整部１７を加工するには、発光素子実装面１１ａ側から発光素子１２の輝度を測定可能であり、かつ裏面１１ｂ側の抵抗調整部１７にレーザ光１８を照射可能な加工装置（図示せず）に各部材を形成・実装済みのホーロー基板１１をセットし、図１に示すように、発光素子１２を発光させてその輝度を測定し、該輝度が目標値と異なる場合には、裏面１１ｂ側の抵抗調整部１７にレーザ光１８を照射して前記輝度が目標値に合致するように抵抗調整部１７を溶断加工することによって行う。   In order to process the resistance adjusting unit 17 in this example, the processing apparatus can measure the luminance of the light emitting element 12 from the light emitting element mounting surface 11a side and can irradiate the resistance adjusting unit 17 on the back surface 11b side with the laser beam 18. When a hollow substrate 11 on which each member has been formed and mounted is set (not shown), and as shown in FIG. 1, the light emitting element 12 is caused to emit light and its luminance is measured, and when the luminance is different from the target value Is performed by irradiating the resistance adjusting unit 17 on the back surface 11b side with a laser beam 18 and fusing the resistance adjusting unit 17 so that the luminance matches a target value.

具体的には、発光素子実装面１１ａ側から発光素子１２の輝度をモニタしながら、抵抗調整部１７の薄膜にＹＡＧレーザ等のレーザ光源から発したレーザ光１８を照射し、抵抗調整部１７を溶断加工し、適正な発光強度となったときにレーザ照射を停止する。これによって図４に示す回路構成を持った発光素子ユニット１０が製造される。   Specifically, while monitoring the luminance of the light emitting element 12 from the light emitting element mounting surface 11a side, the thin film of the resistance adjusting unit 17 is irradiated with laser light 18 emitted from a laser light source such as a YAG laser, and the resistance adjusting unit 17 is When the fusing process is performed and the light emission intensity is appropriate, the laser irradiation is stopped. Thus, the light emitting element unit 10 having the circuit configuration shown in FIG. 4 is manufactured.

この発光素子ユニット１０の製造方法は、ホーロー基板１１の一方の面側に発光素子１２を実装し、かつ裏面１１ｂ側に前記発光素子と電気的に接続された抵抗調整部１７を設け、発光素子１２を発光させてその輝度を測定し、該輝度が目標値と異なる場合には、前記輝度が目標値に合致するように抵抗調整部１７をレーザ加工等によって加工し、これによって抵抗調整を行うことにより、調整の度毎に測定機械上から基板を外すことなく抵抗調整することができるので、簡単にかつ正確に輝度の調整を行うことができる。また、電気抵抗体の加工時に発光素子実装面１１ａ側の発光素子１２や配線を損傷したり、性能低下を生じることなく抵抗調整部１７を加工することができる。   The light emitting element unit 10 is manufactured by mounting the light emitting element 12 on one surface side of the hollow substrate 11 and providing the resistance adjusting portion 17 electrically connected to the light emitting element on the back surface 11b side. When the luminance is different from the target value, the resistance adjusting unit 17 is processed by laser processing or the like so that the luminance matches the target value, and the resistance is adjusted thereby. As a result, the resistance can be adjusted without removing the substrate from the measuring machine at every adjustment, so that the brightness can be adjusted easily and accurately. In addition, the resistance adjusting unit 17 can be processed without damaging the light emitting element 12 and the wiring on the light emitting element mounting surface 11a side or causing a performance degradation when the electric resistor is processed.

なお、前述した例示は、本発明の一例を示したに過ぎず、本発明は前述した例示にのみ限定されるものではなく種々の変更や修正が可能である。
例えば、前述の例では、３個の発光素子を直列に接続した構造を例示したが、全部の発光素子を並列に接続して構成しても良い。
また、前述の例では、基板裏側にスルーホールを介して電子回路が構成されているが、その二つのスルーホール間を電気抵抗器で接続、さらに基板裏面に配置することもできる。この場合、前記と同様に、発光素子の発光強度を測定しながら、必要な電気抵抗を選択することができる。 The above-described examples are merely examples of the present invention, and the present invention is not limited to the above-described examples, and various changes and modifications can be made.
For example, in the above-described example, a structure in which three light emitting elements are connected in series is illustrated, but all light emitting elements may be connected in parallel.
In the above-described example, an electronic circuit is configured on the back side of the substrate through a through hole. However, the two through holes can be connected by an electrical resistor and further disposed on the back side of the substrate. In this case, as described above, a necessary electrical resistance can be selected while measuring the light emission intensity of the light emitting element.

本発明の発光素子ユニットの一実施形態を示す断面図である。It is sectional drawing which shows one Embodiment of the light emitting element unit of this invention. 同じ発光素子ユニットの平面図である。It is a top view of the same light emitting element unit. 同じ発光素子ユニットの底面図である。It is a bottom view of the same light emitting element unit. 発光素子ユニットの回路図である。It is a circuit diagram of a light emitting element unit.

符号の説明Explanation of symbols

１０…発光素子ユニット、１１…ホーロー基板、１１ａ…発光素子実装面、１１ｂ…裏面、１２…発光素子、１３…電極、１４…ボンディングワイヤ、１５ａ，１５ｂスルーホール、１６…導電部材、１７…抵抗調整部（電気抵抗体）、１８…レーザ光。
DESCRIPTION OF SYMBOLS 10 ... Light emitting element unit, 11 ... Hollow substrate, 11a ... Light emitting element mounting surface, 11b ... Back surface, 12 ... Light emitting element, 13 ... Electrode, 14 ... Bonding wire, 15a, 15b through hole, 16 ... Conductive member, 17 ... Resistance Adjustment unit (electric resistor), 18... Laser beam.

Claims (1)

ホーロー基板である基板の一方の面側に複数の発光素子を直列につないでなる段を複数並列に設け、各段を構成する前記複数の発光素子の一端を通電用の電極に接続し、他端を前記基板に設けられたスルーホール内に充填された導電部材に接続し、前記基板の裏面側に、前記導電部材に接続するように、抵抗調整部を含む電気抵抗体を設けて、前記導電部材を介して、前記複数の発光素子と前記電気抵抗体を電気的に接続し、
前記基板の一方の面側から前記複数の発光素子の輝度を測定可能であり、かつ、前記基板の裏面側の前記抵抗調整部にレーザ光を照射可能な加工装置に前記基板をセットし、
前記複数の発光素子を発光させてその輝度を測定し、該輝度が目標値と異なる場合には、裏面側の前記抵抗調整部にレーザ光を照射して前記輝度が目標値に合致するように前記抵抗調整部を溶断し、これによって輝度調整がなされた発光素子ユニットを得ることを特徴とする発光素子ユニットの製造方法。 A plurality of stages in which a plurality of light emitting elements are connected in series are provided in parallel on one surface side of a substrate which is a hollow substrate, and one end of the plurality of light emitting elements constituting each stage is connected to a current-carrying electrode, and the other An end is connected to a conductive member filled in a through-hole provided in the substrate, and an electric resistor including a resistance adjusting portion is provided on the back side of the substrate so as to be connected to the conductive member, Electrically connecting the plurality of light emitting elements and the electric resistor via a conductive member;
It is possible to measure the luminance of the plurality of light emitting elements from one surface side of the substrate, and set the substrate in a processing apparatus capable of irradiating the resistance adjustment unit on the back surface side of the substrate with laser light,
When the luminance is measured by causing the plurality of light emitting elements to emit light and the luminance is different from a target value, the resistance adjustment unit on the back side is irradiated with laser light so that the luminance matches the target value. A method of manufacturing a light emitting element unit, wherein the resistance adjusting portion is melted to obtain a light emitting element unit in which brightness is adjusted.
JP2005085884A 2005-03-24 2005-03-24 Manufacturing method of light emitting element unit Expired - Fee Related JP4754245B2 (en)

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TWI499347B (en) * 2009-12-31 2015-09-01 Epistar Corp Light-emitting device
WO2012086517A1 (en) * 2010-12-20 2012-06-28 ローム株式会社 Light-emitting element unit, and light-emitting element package
DE102012110397A1 (en) * 2012-10-30 2014-04-30 Epcos Ag Light-emitting diode arrangement, module and method for producing a light-emitting diode arrangement
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