JP4744961B2 - Reinforcing film for flexible printed wiring boards - Google Patents

Reinforcing film for flexible printed wiring boards Download PDF

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JP4744961B2
JP4744961B2 JP2005206800A JP2005206800A JP4744961B2 JP 4744961 B2 JP4744961 B2 JP 4744961B2 JP 2005206800 A JP2005206800 A JP 2005206800A JP 2005206800 A JP2005206800 A JP 2005206800A JP 4744961 B2 JP4744961 B2 JP 4744961B2
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film
flexible printed
printed wiring
reinforcing film
water vapor
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JP2007027374A (en
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田 亜也子 森
根 博 行 関
田 隆 一 鶴
中 秀 明 田
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Nippon Mektron KK
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Description

本発明は、電子分野のフレキシブルプリント配線板に用いられる補強フィルムに係わり、とくにフレキシブルプリント配線板の接続端子部などの強度が必要とされる箇所に貼り付けて強度を増すために用いる補強フィルムに関する。   The present invention relates to a reinforcing film used for a flexible printed wiring board in the electronic field, and particularly relates to a reinforcing film used for increasing the strength by being attached to a location where strength is required such as a connection terminal portion of the flexible printed wiring board. .

近年、電子機器の小型化、高密度化により、フレキシブルな絶縁基板上に導体回路を形成したフレキシブルプリント配線板がよく用いられている。この場合、絶縁基板にはフレキシブルな耐熱性樹脂フィルムが用いられており、接続端子部など強度が必要とされる箇所には、補強材を張り合わせて強度を増す必要がある。   In recent years, flexible printed wiring boards in which a conductor circuit is formed on a flexible insulating substrate are often used due to downsizing and high density of electronic devices. In this case, a flexible heat-resistant resin film is used for the insulating substrate, and it is necessary to increase the strength by attaching a reinforcing material to a portion where strength is required, such as a connection terminal portion.

従来、補強材には、ガラス織布基材エポキシ樹脂積層板などの電気絶縁用積層板が用いられてきたが、打ち抜きの際に抜きカスが生じ易いなど、加工する上で問題があった。それを解決するために、ポリイミドやポリエーテルケトンなどの耐熱性樹脂フィルムを補強フィルムとして用いるケースが多くなってきている。   Conventionally, laminated sheets for electrical insulation such as glass woven fabric base material epoxy resin laminated sheets have been used as the reinforcing material, but there has been a problem in processing such as the occurrence of scraps during punching. In order to solve this problem, there are an increasing number of cases in which a heat-resistant resin film such as polyimide or polyether ketone is used as a reinforcing film.

これらの耐熱性樹脂を用いた補強フィルムは、上記のような打ち抜きの際に生じる抜きカスの発生を抑制することができる。   Reinforcing films using these heat-resistant resins can suppress the occurrence of punching residue that occurs during punching as described above.

しかしながら、耐熱性樹脂フィルムを用いた場合には、厚みを増すに連れて製造が困難となり、価格が上がることや、反りが発生するなどの問題が生じることがある。   However, when a heat-resistant resin film is used, it becomes difficult to manufacture as the thickness increases, and problems such as an increase in price and warping may occur.

この反りの抑えに関しては、「絶縁基板と同等のヤング率を有する外側材」と「曲げ中立面が厚みの中央に位置する内側材」とからなる補強材を用いることで、製品の反りを抑えることが提案されている(特許文献１)。
特開平7-321421号公報 特開平10-65320号公報 With regard to the suppression of this warpage, it is possible to reduce the warpage of the product by using a reinforcing material consisting of “an outer material having a Young's modulus equivalent to that of an insulating substrate” and “an inner material whose bending neutral surface is located at the center of the thickness”. It has been proposed to suppress (Patent Document 1).
Japanese Unexamined Patent Publication No. 7-321421 Japanese Patent Laid-Open No. 10-65320

一方、反りとは別の問題点として、耐熱性樹脂フィルムの厚さを増すと、高温下での工程、例えば表面実装時のリフロー工程などにおいて、フレキシブルプリント配線板と補強フィルムとの界面に剥離が生じるという問題がある。   On the other hand, as a problem different from warping, if the thickness of the heat-resistant resin film is increased, it peels off at the interface between the flexible printed wiring board and the reinforcing film in a process under high temperature, for example, a reflow process during surface mounting There is a problem that occurs.

この原因は、高温下においてフレキシブルプリント配線板と補強フィルムとの間に発生した水蒸気が、補強フィルムを通過せずにフレキシブルプリント配線板と補強フィルムとの間に溜まり、界面に剥がれが生じるためだと推定される。界面に剥がれが生じると、実装不良の因子となる。   This is because water vapor generated between the flexible printed wiring board and the reinforcing film at high temperatures accumulates between the flexible printed wiring board and the reinforcing film without passing through the reinforcing film, causing peeling at the interface. It is estimated to be. If peeling occurs at the interface, it becomes a factor of mounting failure.

この対策が、特許文献２に開示されており、補強板に水蒸気を通過させるための通気孔を多数開口させることで、カバーフィルムと銅箔との間にボイド（気泡）が発生することを防止している。   This measure is disclosed in Patent Document 2 and prevents the formation of voids (bubbles) between the cover film and the copper foil by opening a large number of vent holes for allowing water vapor to pass through the reinforcing plate. is doing.

しかし、この特許文献２に記載の対策は、通気孔部への異物の混入や、加工工数が掛かるといった問題があり、十分な対応策となっていない。   However, the countermeasure described in Patent Document 2 is not a sufficient countermeasure because there are problems that foreign matter is mixed into the vent hole and the number of processing steps is increased.

本発明は、上述の点を考慮してなされたもので、実装時のリフロー工程などにおいて発生するフレキシブルプリント配線板と補強フィルムとの間に生じる界面剥離を抑制し得るフレキシブルプリント配線板用補強フィルムを提供することを目的とする。   The present invention has been made in consideration of the above-mentioned points, and is a reinforcing film for a flexible printed wiring board that can suppress interfacial peeling that occurs between the flexible printed wiring board and the reinforcing film that occurs in a reflow process during mounting. The purpose is to provide.

上記目的達成のため、本発明では、
Tg（ガラス転移温度）が１５０℃以上の耐熱性樹脂を基材とし、層構造が多層構造であって少なくとも１つの気泡混入層を含むものであり、水蒸気透過係数を３０．０ｇ／２４ｈ・ｍ２より高くしたことを特徴とするフレキシブルプリント配線板用補強フィルム、
を提供する。 In order to achieve the above object, in the present invention,
The base material is a heat-resistant resin having a Tg (glass transition temperature) of 150 ° C. or higher, the layer structure is a multi-layer structure and includes at least one bubble-containing layer, and the water vapor transmission coefficient is 30.0 g / 24 h · m. A reinforcing film for a flexible printed wiring board, characterized by being higher than 2 .
I will provide a.

本発明によれば、気泡混入層を含む構造により水蒸気が抜けてフレキシブルプリント配線板と補強フィルムとの間に生じる界面剥離を抑制することができる。   ADVANTAGE OF THE INVENTION According to this invention, interfacial peeling which arises between a flexible printed wiring board and a reinforcement film when water vapor | steam escapes with the structure containing a bubble mixing layer can be suppressed.

以下、添付図面を参照して本発明の一実施例を説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

図１は、本発明の実施例１である3層構造の耐熱性フィルムの断面構造を示している。本発明に係る耐熱性樹脂フィルムの水蒸気透過係数の調整は、フィルム自体に気泡を混入させることにより行う。水蒸気透過係数の数値は、30.0g/24h・m2程度あれば充分と考えられる。 FIG. 1 shows a cross-sectional structure of a heat-resistant film having a three-layer structure that is Example 1 of the present invention. The water vapor transmission coefficient of the heat resistant resin film according to the present invention is adjusted by mixing bubbles in the film itself. A value of about 30.0 g / 24 h · m 2 is considered sufficient for the water vapor transmission coefficient.

水蒸気透過係数がかなり低い値の場合、高温工程、例えばリフロー工程などにより、水蒸気が補強フィルムを通過せずに補強フィルムとフレキシブルプリント配線板との界面に溜まり、界面剥離の原因となる。水蒸気透過係数を調整した耐熱性樹脂フィルムは、撹拌により水蒸気を混入させた耐熱性樹脂溶液を流延塗布したのち、加熱乾燥することにより得られる。作製したフィルムの厚みは、通常、12.5〜200μmである。   When the water vapor transmission coefficient is a considerably low value, water vapor does not pass through the reinforcing film but accumulates at the interface between the reinforcing film and the flexible printed wiring board due to a high temperature process, for example, a reflow process, which causes interface peeling. A heat-resistant resin film having an adjusted water vapor transmission coefficient is obtained by casting and applying a heat-resistant resin solution mixed with water vapor by stirring, followed by heating and drying. The thickness of the produced film is usually 12.5 to 200 μm.

本発明の課題解決に適用可能な耐熱性樹脂フィルムとしては、ポリイミド、ポリアミドイミド、ポリエーテルイミド、ポリサルフォン、ポリフェニレンサルファイド、ポリエーテルエーテルケトン、ポリカーボネート、ポリアリレート、ポリエーテルサルフォン、液晶ポリマー、フッ素樹脂、エポキシ樹脂などのようなTg（ガラス転移温度）が１５０℃以上のもので、キャスト、押し出し成形等の方法によりフィルム化が可能な樹脂からなるものなどが使用可能である。 Examples of the heat-resistant resin film applicable to solving the problems of the present invention include polyimide, polyamideimide, polyetherimide, polysulfone, polyphenylene sulfide, polyetheretherketone, polycarbonate, polyarylate, polyethersulfone, liquid crystal polymer, and fluororesin. It is possible to use a resin having a Tg (glass transition temperature) of 150 ° C. or higher, such as an epoxy resin, and a resin that can be formed into a film by a method such as casting or extrusion molding.

また、図１に示したように、補強フィルム１０の層構成を多層構造にすることも可能である。図１では３層構成となっており、上層１１、中央層１２、下層１３は、それぞれ耐熱性樹脂からなるフィルムであり、これらの層１１ないし１３は、接着剤を介さずにコーティングやラミネートなどの積層方法で積層される。   Moreover, as shown in FIG. 1, it is also possible to make the layer structure of the reinforcing film 10 into a multilayer structure. In FIG. 1, it has a three-layer structure, and the upper layer 11, the central layer 12, and the lower layer 13 are films made of a heat-resistant resin, and these layers 11 to 13 are coated or laminated without using an adhesive. It is laminated by the laminating method.

なお、図１には、上層、中央層および下層からなる３層構造であって、上層および下層に気泡混入層を含むフィルム構成を示したが、中央層に気泡混入層を有するフィルムなど、どの層に気泡混入層を含んでもよい。   Note that FIG. 1 shows a three-layer structure consisting of an upper layer, a central layer, and a lower layer, and a film configuration including a bubble-containing layer in the upper layer and the lower layer. The layer may include a bubble-containing layer.

上層１１、中央層１２および下層１３は、同一組成でも異なる組成でもよい。また、それらの厚みは、同一でも異なるものでもよい。好ましくは、上層１１と下層１３とを同一組成、同一厚みとすれば反りの発生が抑制されるから、なおよい。   The upper layer 11, the central layer 12, and the lower layer 13 may have the same composition or different compositions. Moreover, those thicknesses may be the same or different. Preferably, if the upper layer 11 and the lower layer 13 have the same composition and the same thickness, the occurrence of warpage is suppressed, so it is even better.

上層１１と下層１３とが異なる組成もしくは異なる厚みである場合、熱膨張係数の違いによりフィルム自体の反りが発生する可能性があるので、組み合わせに留意する必要がある。また、多層構造としても、水蒸気透過係数を高くすることが必要である。   When the upper layer 11 and the lower layer 13 have different compositions or different thicknesses, the warpage of the film itself may occur due to the difference in thermal expansion coefficient, so it is necessary to pay attention to the combination. In addition, it is necessary to increase the water vapor transmission coefficient even in a multilayer structure.

水蒸気透過係数を適当な範囲にできるのであれば、積層される耐熱性フィルムが、一般の耐熱性フィルムであっても、または水蒸気透過係数を高くした耐熱性フィルムであってもよい。一般の耐熱性フィルムとしては、水蒸気透過係数を調整していない耐熱性樹脂フィルムであり、市販品を用いてもよい。この積層操作を繰り返すことにより、さらに多層化した耐熱性樹脂フィルムを作製することも可能であり、フィルム厚みの調整が容易となる利点がある。   As long as the water vapor transmission coefficient can be adjusted to an appropriate range, the heat resistant film to be laminated may be a general heat resistant film or a heat resistant film having a high water vapor transmission coefficient. A general heat resistant film is a heat resistant resin film whose water vapor transmission coefficient is not adjusted, and a commercially available product may be used. By repeating this laminating operation, it is possible to produce a heat-resistant resin film having a further multilayered structure, which is advantageous in that the film thickness can be easily adjusted.

市販のポリイミドフィルム（鐘淵化学工業株式会社製、アピカルNPI、厚み50μm）をベース材として、その両面に、気体を混入させたポリアミック酸溶液を塗布した後に乾燥を行うことで、水蒸気透過係数の高いポリイミドフィルムである上下層１１，１３（図１）を形成した。3層補強フィルムとしての総厚みは、75μmであった。   By applying a polyamic acid solution mixed with gas on both sides of a commercially available polyimide film (Kanebuchi Chemical Industry Co., Ltd., Apical NPI, thickness 50 μm) as a base material, the water vapor transmission coefficient is reduced. Upper and lower layers 11 and 13 (FIG. 1), which are high polyimide films, were formed. The total thickness as a three-layer reinforcing film was 75 μm.

また、作製した3層補強フィルムの断面観察を行った結果、上、下各層１１，１３のポリイミドフィルムに、気泡（直径約0.38μm、70個/100μm2）が存在することを確認した。この3層補強フィルムの水蒸気透過係数を、ASTM E-96-66 Procedure E (カップ法)により測定した。 Further, as a result of cross-sectional observation of the produced three-layer reinforcing film, it was confirmed that bubbles (diameter: about 0.38 μm, 70/100 μm 2 ) were present in the polyimide films of the upper and lower layers 11 and 13. The water vapor transmission coefficient of this three-layer reinforcing film was measured by ASTM E-96-66 Procedure E (cup method).

図２は、水蒸気透過係数のある３層補強フィルム１０の効果を評価するため、フレキシブルプリント基板２０に貼付してサンプル１００を作製する様子を示している。すなわち、ポリイミド両面銅張板(銅箔厚：１８μｍ、ポリイミド厚：２５μｍ)２０の両面にポリイミドカバーフィルム(ポリイミドフィルム厚：１２．５μｍ、接着剤厚：２５μｍ)２１，２２をラミネートにより貼り付けたベース材２０Ａを用意し、このベース材２０Ａに接着剤シート(厚み：５０μｍ)３０を介して3層補強フィルム１０を貼り付ける。このようにして作製したサンプル１００を用いて、はんだ耐熱性試験および吸湿リフロー試験を行った。   FIG. 2 shows a state in which a sample 100 is manufactured by being attached to the flexible printed circuit board 20 in order to evaluate the effect of the three-layer reinforcing film 10 having a water vapor transmission coefficient. That is, polyimide cover films (polyimide film thickness: 12.5 μm, adhesive thickness: 25 μm) 21 and 22 were attached to both surfaces of a polyimide double-sided copper-clad plate (copper foil thickness: 18 μm, polyimide thickness: 25 μm) 20 by lamination. A base material 20A is prepared, and the three-layer reinforcing film 10 is attached to the base material 20A via an adhesive sheet (thickness: 50 μm) 30. A solder heat resistance test and a moisture absorption reflow test were performed using the sample 100 thus manufactured.

試験方法
＜加湿はんだ耐熱性試験＞
サンプル１００を40℃、90％RHの環境試験機に72時間保持し、その後、はんだ浴に10秒間浸漬し、剥がれや膨れなどが生じない温度を測定した。 Test method <humidified solder heat resistance test>
Sample 100 was held in an environmental tester at 40 ° C. and 90% RH for 72 hours, and then immersed in a solder bath for 10 seconds to measure the temperature at which peeling and swelling did not occur.

＜吸湿リフロー試験＞
サンプル１００を40℃、90％RHの環境試験機に72時間保持し、Max温度が260℃になるように設定した、一般的なリフロー条件のリフロープログラムに設定されたリフロー炉で加熱し、剥がれや膨れの有無を観察した。 <Hygroscopic reflow test>
Sample 100 is held in an environmental tester at 40 ° C and 90% RH for 72 hours, heated in a reflow oven set to a reflow program under general reflow conditions set to a maximum temperature of 260 ° C, and peeled off. The presence or absence of blistering was observed.

比較例Comparative example

比較例としては、次の3例のポリイミドフィルムを用いた。厚みは、何れも７５μｍである。   As comparative examples, the following three polyimide films were used. The thickness is 75 μm in all cases.

比較例１：鐘淵化学工業株式会社製アピカルNPI
比較例２：デュポン社製カプトン300H
比較例３：宇部興産株式会社製ユーピレックス
これらを用いて、実施例1と同様に3層構造補強材を作製し、実施例１と同様の加湿はんだ耐熱性試験および吸湿リフロー試験を行った。その結果は、下記表１に示す通りである。

Figure 0004744961
Comparative Example 1: Apical NPI manufactured by Kaneka Corporation
Comparative Example 2: DuPont Kapton 300H
Comparative Example 3: Upilex manufactured by Ube Industries, Ltd. Using these, a three-layer structural reinforcing material was produced in the same manner as in Example 1, and the same humidified solder heat resistance test and moisture absorption reflow test as in Example 1 were performed. The results are as shown in Table 1 below.
Figure 0004744961

上記表１に示すように、実施例1では、水蒸気透過係数が31.6 g/24h・m2であり、他のポリイミドフィルムよりも高い水蒸気透過性を有することが確認された。そして、この実施例１を用いて補強を行なったフレキシブルプリント配線板では、膨れが全く生じなかった。このことから、水蒸気透過係数が31.6 g/24h・m2であれば充分な値であることが分り、２５．０ｇ／２４ｈ・ｍ２以上の値であれば実用性があることが推定される。 As shown in Table 1 above, in Example 1, the water vapor transmission coefficient was 31.6 g / 24 h · m 2 , and it was confirmed that the water vapor permeability was higher than that of other polyimide films. The flexible printed wiring board reinforced using Example 1 did not swell at all. From this, it can be seen that a water vapor transmission coefficient of 31.6 g / 24 h · m 2 is sufficient, and a value of 25.0 g / 24 h · m 2 or more is estimated to be practical. .

また、加湿はんだ耐熱性試験では、実施例1は、比較例1〜3よりも高い耐熱性を示した。さらに、吸湿リフロー試験において、実施例1のみが膨れや剥がれがなく工程を通過することが可能になる。   In the humidified solder heat resistance test, Example 1 showed higher heat resistance than Comparative Examples 1 to 3. Further, in the moisture absorption reflow test, only Example 1 can pass through the process without swelling or peeling.

以上の結果から、本発明の気泡混入層を含む重層構造の耐熱性樹脂フィルムを用いることにより、フレキシブルプリント配線板と補強フィルムとの間に生じる界面剥離を抑制することができ、より高温下での作業が可能になる。   From the above results, by using the heat-resistant resin film having a multilayer structure including the bubble-mixed layer of the present invention, it is possible to suppress interfacial peeling that occurs between the flexible printed wiring board and the reinforcing film, and at higher temperatures. Work becomes possible.

本発明の一実施例の構造を示す断面図。Sectional drawing which shows the structure of one Example of this invention. 本発明の一実施例を試験するために作成したサンプルの構成を示す図。The figure which shows the structure of the sample produced in order to test one Example of this invention.

符号の説明Explanation of symbols

１０ 補強フィルム
１１ 補強フィルム１０の上層
１２ 補強フィルム１０の中央層
１３ 補強フィルム１０の下層
２０ 両面銅張板
２１，２２ カバーフィルム
２０Ａ ベース材
３０ 接着剤
１００ サンプル DESCRIPTION OF SYMBOLS 10 Reinforcing film 11 Upper layer of reinforcing film 10 12 Central layer of reinforcing film 10 13 Lower layer of reinforcing film 10 Double-sided copper-clad plate 21, 22 Cover film 20A Base material 30 Adhesive 100 Sample

Claims (3)

Tg（ガラス転移温度）が１５０℃以上の耐熱性樹脂を基材とし、層構造が多層構造であって少なくとも１つの気泡混入層を含むものであり、水蒸気透過係数を３０．０ｇ／２４ｈ・ｍ２より高くしたことを特徴とするフレキシブルプリント配線板用補強フィルム。 The base material is a heat-resistant resin having a Tg (glass transition temperature) of 150 ° C. or higher, the layer structure is a multi-layer structure and includes at least one bubble-containing layer, and the water vapor transmission coefficient is 30.0 g / 24 h · m. A reinforcing film for flexible printed wiring boards, characterized by being higher than 2 . 請求項１記載のフレキシブルプリント基板用補強フィルムにおいて、
ポリイミドフィルムを前記基材として、その両面に気体を混入させたポリアミック酸溶液を塗布した後に乾燥を行うことで、水蒸気透過係数の高いポリイミドフィルムである上下層を形成したことを特徴とするフレキシブルプリント配線板用補強フィルム。 In the reinforcing film for flexible printed circuit boards according to claim 1,
A flexible print characterized in that the upper and lower layers, which are polyimide films having a high water vapor transmission coefficient, are formed by applying a polyamic acid solution mixed with gas on both sides of the polyimide film as a base material and then drying. Reinforcing film for wiring boards. ポリイミド両面銅張板の両面にカバーフィルムを貼り付けた両面構成のフレキシブルプリント配線板であって、前記カバーフィルムの上に請求項１または２記載のフィルムを貼り付けたことを特徴とするフレキシブル配線板。   A flexible printed wiring board having a double-sided structure in which a cover film is pasted on both sides of a polyimide double-sided copper-clad board, wherein the film according to claim 1 or 2 is pasted on the cover film. Board.
JP2005206800A 2005-07-15 2005-07-15 Reinforcing film for flexible printed wiring boards Expired - Fee Related JP4744961B2 (en)

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JP2005206800A JP4744961B2 (en) 2005-07-15 2005-07-15 Reinforcing film for flexible printed wiring boards
TW095122996A TW200711543A (en) 2005-07-15 2006-06-26 Reinforcing film for flexible printed circuit board
CN200610105921XA CN1897788B (en) 2005-07-15 2006-07-14 Reinforced film for flexible printing circuit board

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CN101437358B (en) * 2007-11-14 2010-04-14 昆山雅森电子材料科技有限公司 Protection film for printed circuit board and procedure for processing circuit board using the protection film
CN103098561B (en) * 2010-09-13 2015-11-25 株式会社钟化 The manufacture method of stiffener integral type flexible printing substrate and stiffener integral type flexible printing substrate
CN101986772B (en) * 2010-10-27 2012-06-06 淳华科技(昆山)有限公司 Method for manufacturing flexible circuit board
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