JP4734012B2 - Fever treatment device - Google Patents

Description

  The present invention relates to a fever treatment device, and more particularly, to a fever treatment device that performs treatment by applying heat to a living tissue.

  In general, a fever treatment device includes a thermal forceps and a thermal forceps power source, and is used when performing treatment such as incision, coagulation, and hemostasis of an affected part in a surgical operation or a medical operation. The thermal forceps has a treatment part with a built-in heat generating means for heating the affected part, and applies heat generated by the heat generating means of the treatment part to the affected part to perform treatments such as incision, coagulation, and hemostasis.

  As such a thermal forceps, for example, Japanese Patent Publication No. 53-9031 discloses one having a treatment section having a plurality of heating elements (heater segments) divided as heating means. The treatment section treats the affected area by applying heat generated by a plurality of heating elements (heater segments) set at the same temperature setting to the affected area.

  The thermal forceps power supply of the exothermic treatment device controls the supply power so that the heating element (heater segment) has the set resistance value. At the start of output, the set resistance value is compared with the current resistance value to generate heat. On / off. Further, in order to monitor the resistance value of the heating element (heater segment) even when not outputting, a small monitor current is always passed through the heating element (heater segment).

  The thermal forceps are connected to a thermal forceps power source via a cable and a connector, and whether the thermal forceps are connected to the thermal forceps power source is always supplied with a current through the heating element (heater segment). Segment) potential drop is detected and judged from the detected voltage.

For example, US Pat. No. 4,545,073 discloses that a measurement current is alternately passed in order to detect a heating current and a resistance value of a heating resistor.
Japanese Patent Publication No.53-9031 U.S. Pat. No. 4,545,073

  However, if the monitor current is always applied to the heating element to grasp the state of the heating element (heater segment), unnecessary heat generation other than during treatment output occurs, or the temperature of the heating element after treatment output is difficult to cool down. There is a problem of becoming.

  Conventionally, since the monitor current is passed through the heating element even when the thermal forceps is connected to the thermal forceps power source, unnecessary heat is generated in the thermal forceps.

  On the other hand, as a countermeasure, there is a problem that failure such as disconnection or short circuit of the heating element cannot be detected unless the monitor current is allowed to flow at all except during the treatment output.

  The present invention has been made in view of the above circumstances, and provides a heat treatment device that can suppress unnecessary heat generation other than at the time of treatment output, and can perform appropriate output control and failure detection of a heat generating element with certainty. The purpose is to do.

The exothermic treatment apparatus of the present invention includes a treatment unit for treating a living tissue, and connects the treatment unit with a treatment unit provided with a heat generation unit for generating heat to be applied to the tissue. And a heat treatment apparatus comprising a power supply main body for supplying a predetermined drive current to the heat generating means,
The power supply body includes a monitor current supply unit that supplies a monitor current to the heat generation unit as a periodic on / off current having a predetermined duty ratio, a drive current supply unit that supplies a drive current to the heat generation unit, The current detection resistor for measuring the current values of the monitor current and the drive current supplied to the heat generation means, and the current value flowing through the current detection resistance, thereby obtaining the current value supplied to the heat generation means. A current detection unit that detects a current value of the monitor current and detects a current value of the drive current, an applied voltage detection unit that detects a voltage value applied to the heat generation unit, the current detection unit, and the applied voltage using each detection result of the detecting means, and calculating means for calculating a heat generation temperature of the heat generating means, the detection of the current detection means and the applied voltage detecting means With fruit, characterized in that and a failure detecting means for detecting a failure of the heating means.

  According to the present invention, there is an effect that unnecessary heat generation other than at the time of treatment output can be suppressed, and appropriate output control and failure detection of a heating element can be reliably performed.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIGS. 1 to 13 relate to the first embodiment of the present invention, FIG. 1 is an apparatus configuration diagram showing the overall configuration of the heat treatment apparatus, and FIG. 2 is a front view of the apparatus body viewed from the front panel side of the apparatus body of FIG. 3 is an external view showing the rear panel of the apparatus main body of FIG. 1, FIG. 4 is an explanatory view showing the coagulation / incision forceps of FIG. 1, and FIG. 5 is a side view of the heat treatment portion of the coagulation / incision forceps of FIG. 6 is a schematic perspective view from the top surface vertical direction of the heat treatment section of FIG. 5, FIG. 7 is a top cross-sectional view of the heat treatment section of the coagulation incision forceps of FIG. 1 is a side cross-sectional view of the treatment part of the coagulation / incision forceps shown in FIG. 1 as viewed from the horizontal side, FIG. 9 is a circuit block diagram of the heat treatment apparatus of FIG. 1, and FIG. 11 is a flowchart for explaining the processing of the heat treatment apparatus of FIG. 9, and FIG. 12 is the processing of FIG. Akira timing chart, FIG. 13 is a timing view enlarging an essential portion of the timing of Figure 12.

  As shown in FIG. 1, the exothermic treatment apparatus 1 of the present embodiment includes a coagulation / incision forceps 2 as a treatment means incorporating a heating element described later, and the coagulation / incision forceps 2 detachably connected. And an apparatus main body 3 that controls driving by outputting electric power to the two heating elements. The apparatus body 3 can be connected to a foot switch 6.

  The coagulation / incision forceps 2 is configured to removably connect a main body connection connector 5 provided at a proximal end portion of an extending connection cable 4 to the apparatus main body 3. Further, the coagulation / incision forceps 2 has a heat treatment section 7 including a plurality of heat generating elements 21 and a treatment section 9 constituted by an elastic receiving section 8 that can be separated from the heat treatment section 7. The treatment unit 9 grasps the living tissue and performs a predetermined treatment.

  The heat treatment section 7 and the elastic receiving section 8 of the treatment section 9 hold the living tissue, and when the heat generation treatment section 7 generates heat by energization from the apparatus main body 3, the heat treatment section 7 supplies heat energy to the grasped living tissue to coagulate the tissue. Incision or coagulation.

  Further, the number of the heat generating elements 21 varies depending on the type of forceps according to the purpose of treatment, and accordingly, the body connecting connector 5 has an identification unit 109 (see FIG. 9) described later. The identification unit 109 is composed of, for example, an electric resistance element.

  As shown in FIGS. 2 and 3, the apparatus main body 3 has a front panel 3a and a back panel 3b.

  As shown in FIG. 2, the front panel 3a includes a connector receiving portion 52 to which the main body connection connector 5 of the coagulation / incision forceps 2 can be detachably connected. Further, the front panel 3a includes a power switch 50 for turning on / off the power and an LED 51 that is lit when the power is turned on.

  Further, the front panel 3a has various switches and display LEDs shown below for setting control contents such as energy supply to the heat treatment section 7 of the coagulation / incision forceps 2 and switching conditions. The front panel 3a shifts to a section 1 setting switch 55 for shifting to the control content setting state for the output section 1, a section 2 setting switch 56 for shifting to the control content setting state for the output section 2, and a control content setting state for the output section 3. A section 3 setting switch 57 and a joule setting switch 58 for shifting to the joule control value setting state are provided.

  Further, the front panel 3a includes a power setting switch 59 for shifting to the power control value setting state, a power setting value display LED 60 for displaying the power setting value, a power setting value DOWN switch 61 for changing the power setting value, and a power setting value UP switch. 62, voltage setting switch 63 for shifting to the voltage control value setting state, voltage setting value display LED 64 for displaying the voltage setting value, voltage setting value DOWN switch 65 and voltage setting value UP switch 66 for changing the voltage setting value, current control Current setting switch 67 that shifts to the value setting state, current setting value display LED 68 that displays the current setting value, current setting value DOWN switch 69 and current setting value UP switch 70 that change the current setting value, transition to the temperature control value setting state Temperature setting switch 71 to perform, temperature setting value display LED 72 to display the temperature setting value, temperature Temperature setting value DOWN switch 73 and temperature setting value UP switch 74 for changing constant values, Joule setting value display LED 75 for displaying Joule setting values, and Joule setting value DOWN switch 76 and Joule setting value UP switches for changing Joule setting values 77.

  Further, the front panel 3a includes a limit temperature set value display LED 78 for displaying a set value of a limit temperature at which the section control is ended or shifted to the next section control, a limit temperature set value DOWN switch 79 for changing the limit temperature set value, and a limit temperature. A set value UP switch 80, a section control time setting display LED 81 for setting the time of each control section, that is, an output time, a section control time DOWN switch 82 and a section control time UP switch 83 for changing the section control time are provided. .

  Further, the front panel 3a instructs the first output sequence switch 84 to designate only the section 1 as the output sequence, and instructs the section 2 to be performed after the section 1 output (section 1 → section 2). Output sequence switch 85, instructing the output sequence to be performed after section 1 output, section 2 and section 3 (section 1 → section 2 → section 3), output by third output sequence switch 86, and joule control A joule control switch 87 for instructing

  Still further, the front panel 3a has a status display LED 54 for displaying the status of the apparatus main body 3, an output display LED 53 indicating that the heating element 21 of the coagulation / incision forceps 2 is energized, and an abnormality in the coagulation / incision forceps 2. There are forceps abnormality display LEDs 89 to 92 that are turned on when there is power, a power supply abnormality display LED 88 that lights up when there is an abnormality in the internal circuit, and a buzzer (not shown) that generates a warning sound.

  On the other hand, as shown in FIG. 3, the back panel 3 b includes a foot switch connector receiving portion 93 and a power inlet 94. The apparatus main body 3 can be connected to, for example, a coagulation / incision forceps 2 having a maximum of four heating elements.

  As shown in FIG. 4, the coagulation / incision forceps 2 includes the treatment section 9 having the heat treatment section 7 and the elastic receiving section 8 as described above, and an opening / closing operation is performed by the treatment section 9 in order to grasp the living tissue. It is comprised from the handle part 20 to perform. The connection cable 4 extends from the proximal end side of the handle portion 20.

  As shown in FIGS. 5 and 6, the heat treatment portion 7 of the coagulation / incision forceps 2 combines a plurality of heat generating elements 21, for example, the same three heat generating elements 21 a, 21 b, and 21 c so as to be capable of heat transfer. Arranged on the plate 22.

  Next, the detailed structure of the treatment part 9 having the heat treatment part 7 and the elastic receiving part 8 will be described.

  As shown in FIGS. 7 and 8, the heat treatment section 7 has a heat generating element 21 (21a to 21c) built in the heat treatment section body 7a. Here, the heating element 21 as a heating means is a thin plate resistor formed on a ceramic plate, for example. One end of each of the lead wires 23 (23a, 23b, 23c) for energizing these heating elements 21 (21a-21c) is connected, and the other end of these lead wires 23 is inserted through the connection cable 4. The main body connector 5 is connected to a connector terminal (not shown).

  As described above, the heat generating elements 21 (21a to 21c) are coupled to the heat transfer plate 22 so as to be able to transfer heat, and the heat generated by the heat generating elements 21 (21a to 21c) is transferred to the heat transfer plate 22. To be communicated to. In the configuration shown in FIG. 7, the heat generating element 21 (heat generating portion) and the heat transfer plate 22 (treatment portion) are separated, but the heat generating treatment portion in which these heat generating portions and the treatment portion are integrally formed. There may be. Further, the integrally formed heat treatment portion may be a heat resistant metal body (for example, nichrome wire).

  On the other hand, as shown in FIG. 8, the elastic receiving portion 8 includes an elastic member 24 having a saw blade portion 24 a capable of grasping a living tissue between the elastic transfer portion 22 and the heat transfer plate 22 of the heat treatment portion 7. 8a. The elastic receiving portion 8 is closed with respect to the heat generating treatment portion 7 by the closing operation of the handle portion 20, and is elastically formed by the heat transfer plate 22 of the heat generating treatment portion 7 and the saw blade portion 24a of the elastic receiving portion 8. A living tissue is grasped, and the living tissue sandwiched between the heat transfer plate 22 and the elastic member 24 is coagulated and incised or coagulated by the heat of the heat transfer plate 22. In addition, the shape of the heat generation treatment part 7 and the elastic receiving part 8 which comprise the treatment part 9 is not limited to the above-mentioned thing.

  As shown in FIG. 9, in the apparatus main body 3, the monitor current for calculating the resistance value of the heating element 21 (21 a to 21 c) is controlled by the monitor current control circuit 101 and is output from the monitor constant current power source 102. . The driving power for generating heat from the heating element 21 (21a to 21c) is controlled by the heating power control circuit 105 and output from the heating power supply 106. As described above, the heating element 21 (21a to 21c) is formed of a thin plate resistor formed on the ceramic plate 210.

The applied current detection resistor 103 and the resistance value detection circuit 104 of the apparatus body 3 are heating element temperature detection means,
(1) For example, when the applied voltage is Vm from the monitor constant current power supply 102, the resistance value detection circuit 104 monitors the constant current I1 from the monitor constant current power supply 102 by the constant resistance R0 of the current detection resistor 103, and the resistance The value detection circuit 104 detects the resistance value of the resistor R21 of the heating element 21 at the time of monitoring based on the potential drop Va (= Vm−I1 × R0) in the heating element 21 and the constant current I1.

(2) For example, when the applied voltage is applied from the heating power supply 106, the potential drop V0 at the constant resistance R0 of the current detection resistor 103 is detected by the resistance value detection circuit 104, so that the heating element 21 is supplied. The drive current I2 (= V / R0) is detected, and the resistance value detection circuit 104 detects the resistance of the resistor R21 of the heating element 21 during heat generation by the potential drop VT (= V-V0) in the heating element 21 and the current I2. Detect value.

  Since the resistance value of the resistor R21 of the heating element 21 has a correlation with the heating temperature of the heating element 21, the resistance value of the resistor R21 of the heating element 21 is feedback-controlled by the monitor current control circuit 101 and the heating power control circuit 105. Thus, the heat generation temperature of the heat generating element 21 can be controlled.

  Further, the CPU 100 controls the monitor current control circuit 101 and the heat generation power control circuit 105 based on the output setting data set on the front panel 3 a and the on / off signal from the foot switch 6. The CPU 100 also inputs failure information from the resistance value detection circuit 104 to detect a short circuit or disconnection of the heating element 21 and perform a notification process by the front panel 3a.

  By outputting the resistance value of the resistor R21 of the heating element 21 detected by the resistance value detection circuit 104 to the heating element failure determination circuit 107, the resistance value of the resistor R21 of the heating element 21 is predetermined by the heating element failure determination circuit 107. It is determined whether it is equal to or less than the short circuit determination value or greater than a predetermined disconnection determination value, and the failure information is output to the CPU 100.

  Further, the apparatus main body 3 is provided with a connector detection unit 108 for detecting whether or not the main body connection connector 5 is connected. When the main body connection connector 5 is connected to the apparatus main body 3, the connector detection unit 108 and the main body connection are connected. An identification unit 109 provided on the connector 5 is connected.

  For example, specifically, the connector detection unit 108 includes a resistor R1 that is pulled up to the circuit potential, and the resistor R2 of the identification unit 109 is connected in series to output a potential drop in the resistor R2 to the CPU 100. If the state of the potential drop at the resistor R2 is high impedance, the CPU 100 determines that the connection connector 5 is not connected, and identifies the type of the coagulation / incision forceps 2 (main body connector 5) based on the value of the potential drop at the resistor R2.

  For example, when there is one type of coagulation / incision forceps 2 (main body connection connector 5) connected to the apparatus main body 3, the resistance R2 of the identification unit 109 may be 0Ω (that is, the identification unit 109 is short-circuited).

  Moreover, although the identification part 109 was provided in the main body connection connector 5, as shown in FIG. 10, you may provide in the coagulation incision forceps 2. As shown in FIG.

  The operation of this embodiment configured as described above will be described with reference to the flowchart of FIG. 11 and the timing diagrams of FIGS. FIG. 13 is an enlarged timing diagram of the main part 150 of the timing in FIG.

  As shown in FIG. 11, the CPU 100 of the apparatus main body 3 waits for the connection of the main body connection connector 5 in step S1, and when the main body connection connector 5 is connected, in step S2, the CPU 100 turns on the monitor current control circuit 101. As shown in FIG. 12, based on the monitor output (control signal) M from the monitor current control circuit 101, the monitor constant current power supply 102 outputs a constant current monitor current I1 having a predetermined cycle to the heating element 21.

  As shown in FIG. 13, the monitor measurement by the monitor current I1 is repeated in a monitor measurement period of a predetermined duty ratio (= A%) in the monitor measurement cycle.

  Next, in step S3, the CPU 100 determines whether or not the heating element 21 is short-circuited or disconnected. If the heating element 21 is normal, the CPU 100 proceeds to step S4, and if the heating element 21 is short-circuited or disconnected. Performs a predetermined error process in step S5 and ends the process.

  In step S4, the constant current I1 from the monitor constant current power source 102 is monitored by the constant resistance R0 of the current detection resistor 103, and the potential drop Va (= Vm-I1 * R0) in the heating element 21 and the constant current I1 are used. The resistance value Rm of the resistor R21 of the heating element 21 at the time of monitoring is measured, and the process proceeds to step S6.

  In step S6, the CPU 100 determines whether or not the foot switch 6 is turned on. If the foot switch 6 is not turned on, the CPU 100 returns to step S2. When the foot switch 6 is turned on, the CPU 100 The heat generating power control circuit 105 is controlled, and the heat generating power supply power source 106 outputs the drive current I 2 to the heat generating element 21 based on the treatment output (control signal) P from the heat generating power control circuit 105. Then, the driving current I2 (= V / R0) supplied to the heating element 21 is detected, and the resistance value detection circuit 104 generates heat by the potential drop VT (= V−V0) and the driving current I2 in the heating element 21. The resistance value of the resistor R21 of the heating element 21 at the time is detected.

  The resistance value of the resistor R21 of the heat generating element 21 is feedback-controlled by the heat generating power control circuit 105, whereby the drive current I2 is controlled so as to control the heat generation temperature of the heat generating element 21, and the heat generating element 21 performs a treatment.

  In step S8, the CPU 100 determines whether or not the foot switch 6 is turned off. If the foot switch 6 is not turned off, the process returns to step S2. When the foot switch 6 is turned off, the treatment is terminated in step S9. The processes in steps S2 to S8 are repeated until detected.

  As described above, in this embodiment, unnecessary heat generation other than at the time of treatment output can be suppressed, and appropriate output control and failure detection of the heating element can be performed reliably.

  14 and 15 relate to the second embodiment of the present invention, FIG. 14 is a flowchart for explaining the processing of the heat treatment apparatus, and FIG. 15 is a timing chart for explaining the processing of FIG.

  Since the configuration of the second embodiment is the same as that of the first embodiment, only different points will be described.

  The effect | action of a present Example is demonstrated using the flowchart of FIG. 14, and the timing diagram of FIG.

  In the present embodiment, as shown in FIG. 14, after the processing in step S6, the processing in steps S11 and S12 is performed instead of step S7 in the first embodiment, and the process proceeds to step S8.

  Specifically, unlike step S7 of the first embodiment, when the foot switch 6 is turned on, the CPU 100 controls the monitor current control circuit 101 in step S11, and as shown in FIG. The monitor constant current power supply 102 continuously outputs a constant current monitor current I1 to the heat generating element 21 based on the monitor output (control signal) M from. Then, after the elapse of the predetermined time Δt in step S12, the heat generation power control circuit 105 is controlled, and the heat generation power supply power source 106 generates the drive current I2 based on the treatment output (control signal) P from the heat generation power control circuit 105. 21 is output. Then, the current I2 (= V / R0) supplied to the heat generating element 21 is detected, and the resistance value detection circuit 104 causes the potential drop VT (= V-V0) in the heat generating element 21 and the current I2 to generate heat. The resistance value of the resistor R21 of the heating element 21 is detected.

  The resistance value of the resistor R21 of the heating element 21 is feedback-controlled by the heating power control circuit 105, so that the drive current I2 is controlled so that the heating temperature of the heating element 21 is controlled, and the heating element 21 performs a treatment. Proceed to S8.

  Thus, also in the present embodiment, the same effect as in the first embodiment can be obtained.

  16 to 18 relate to the third embodiment of the present invention, FIG. 16 is a flowchart for explaining the processing of the heat treatment apparatus, FIG. 17 is a first timing chart for explaining the processing of FIG. 16, and FIG. It is a 2nd timing chart explaining a process.

  Since the configuration of the third embodiment is the same as that of the first embodiment, only different points will be described.

  The operation of the present embodiment will be described with reference to the flowchart of FIG. 16 and the timing diagrams of FIGS.

  In the present embodiment, as shown in FIG. 16, the processes of steps S21 and S23 are added between step S4 of the first embodiment after the process of step S3.

  Specifically, when the CPU 100 determines that the heating element 21 is not short-circuited or disconnected in step S3, the CPU 100 supplies power from the monitor constant current power source 102 with the constant resistance R0 of the current detection resistor 103 in step S21. The constant current I1 immediately after the start is monitored, and immediately after the start of energization of the resistor R21 of the heat generating element 21 at the time of monitoring based on the potential drop Va (= Vm−I1 × R0) in the heat generating element 21 and the constant current I1 immediately after the start of energization. The reference monitor resistance value Rs is measured, and the process proceeds to step S22.

  The resistor R21 of the heat generating element 21 requires a predetermined time until the resistance value (heat generation temperature) is saturated when a constant current from the monitor constant current power supply 102 is applied, so heat generation immediately after the start in step S21 is performed. The resistance value of the resistor R21 of the element 21 is a resistance value before saturation, and is measured as a reference monitor resistance value Rs.

  In step S22, the CPU 100 compares the reference monitor resistance value Rs with a predetermined threshold resistance value Rth to determine whether Rs <Rth. If Rs <Rth, the process proceeds to step S4. If Rs <Rth is not satisfied, in step S23, the CPU 100 measures the resistance value of the resistor R21 of the heating element 21 by the constant monitor current I1 from the monitor constant current power source 102. The current value is changed and the process proceeds to step S4. Other processes are the same as those in the first embodiment.

  If Rs <Rth by the processing of FIG. 16, as shown in FIG. 17, the monitor measurement with the monitor current I1 is performed at a predetermined duty ratio (= A%) is repeated in the monitor measurement period, and after measuring the reference monitor resistance value Rs immediately after the start of energization in step S21, the resistance value Rm of the resistance R2 of the saturated heating element 21 after a predetermined time in step S4 is measured. To do.

  If Rs <Rth is not satisfied, as shown in FIG. 18, the monitor measurement by the monitor current I1 is repeated in the monitor measurement period in which the duty ratio (= B%: B <A) is changed in the monitor measurement cycle. . The current value of the monitor current I1 is the current value I10 immediately after the start of energization, but if it is determined that Rs <Rth is not satisfied, the step immediately after the measurement of the reference monitor resistance value Rs immediately after the start of energization in step S21 is performed. In S23, the current value I11 (I11 <I10) is changed together with the duty ratio, and in step S4, the resistance value Rm of the resistor R21 of the saturated heating element 21 that has passed for a predetermined time with the monitor current I1 of the current value I11 is measured. .

  Thus, also in the present embodiment, the same effect as in the first embodiment can be obtained.

  19 and 20 relate to the fourth embodiment of the present invention, FIG. 19 is a flowchart for explaining the processing of the heat treatment apparatus, and FIG. 20 is a timing chart for explaining the processing of FIG.

  Since the configuration of the fourth embodiment is the same as that of the first embodiment, only different points will be described.

  The operation of this embodiment will be described with reference to the flowchart of FIG. 19 and the timing chart of FIG.

  In the present embodiment, as shown in FIG. 19, after the process of step S <b> 3, the process of step S <b> 31 is added between step S <b> 4 of the first embodiment.

  Specifically, when the CPU 100 determines in step S3 that the heating element 21 is not short-circuited or disconnected, the CPU 100 determines in step S31 a predetermined duty at a current value I10 (mA) as shown in FIG. In the monitor measurement of the ratio (= A%), the current value when the monitor current is off is changed from 0 (mA) to I11 (mA) (0 <I11 <I10).

  Thus, also in the present embodiment, the same effect as in the first embodiment can be obtained.

  21 and 22 relate to the fifth embodiment of the present invention, FIG. 21 is a flowchart for explaining the processing of the heat treatment apparatus, and FIG. 22 is a timing chart for explaining the processing of FIG.

  Since the configuration of the fifth embodiment is the same as that of the first embodiment, only different points will be described.

  The operation of this embodiment will be described with reference to the flowchart of FIG. 21 and the timing chart of FIG.

  In the present embodiment, as shown in FIG. 21, after the processing in step S6, the processing in steps S41 to S43 is performed instead of step S7 in the first embodiment, and the process proceeds to step S8. Further, after step S8, the process of step S44 is performed, and the process proceeds to step S9.

  Specifically, unlike step S7 of the first embodiment, when the foot switch 6 is turned on, the CPU 100 controls the monitor current control circuit 101 in step S41, and the current of the monitor current I1 as shown in FIG. The value is changed from I10 to I13 (I13> I10).

  In step S42, based on the monitor output (control signal) M from the monitor current control circuit 101, the monitor constant current power supply 102 continuously outputs the monitor current I1 having the current value I13 to the heating element 21. Then, after the elapse of the predetermined time Δt in step S43, the heat generation power control circuit 105 is controlled, and the heat generation power supply power source 106 generates the drive current I2 based on the treatment output (control signal) P from the heat generation power control circuit 105. 21 is output, and the process proceeds to step S8.

  If it is determined in step S8 that the foot switch 6 is turned off, the current value of the monitor current I1 is changed (returned) from I13 to I10 in step S44, and the process proceeds to step S9.

  Thus, also in the present embodiment, the same effect as in the first embodiment can be obtained.

  23 and 24 relate to the sixth embodiment of the present invention, FIG. 23 is a circuit block diagram of the heat treatment apparatus, and FIG. 24 is a timing chart of the heat treatment apparatus of FIG.

  Since the sixth embodiment is almost the same as the first embodiment, only different points will be described, and the same components are denoted by the same reference numerals and description thereof will be omitted.

  In this embodiment, as shown in FIG. 23, a monitor 180 controlled by the CPU 100 applies a monitor current I1 to each of the three heating elements 21a to 21c in a time division manner as shown in FIG.

  The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the scope of the present invention.

FIG. 1 is an apparatus configuration diagram showing the overall configuration of a heat treatment apparatus according to Embodiment 1 of the present invention. FIG. 1 is a front view of the apparatus main body viewed from the front panel side of the apparatus main body of FIG. External view showing the rear panel of the apparatus main body of FIG. Explanatory drawing which shows the coagulation incision forceps of FIG. FIG. 1 is a schematic perspective view from the horizontal side of the heat treatment section of the coagulation / incision forceps of FIG. FIG. 5 is a schematic perspective view of the heat treatment portion of FIG. 1 is a top sectional view of the heat treatment portion of the coagulation / incision forceps of FIG. Side sectional view of the treatment portion of the coagulation / incision forceps of FIG. Circuit block diagram of the heat treatment device of FIG. FIG. 9 is a circuit block diagram of a modification of the heat treatment apparatus of FIG. Flowchart for explaining processing of the heat treatment apparatus of FIG. Timing chart explaining the processing of FIG. The timing diagram which expanded the principal part of the timing of FIG. The flowchart explaining the process of the heat treatment apparatus which concerns on Example 2 of this invention. Timing chart explaining the processing of FIG. The flowchart explaining the process of the heat treatment apparatus which concerns on Example 3 of this invention. First timing chart explaining the processing of FIG. Second timing chart for explaining the processing of FIG. The flowchart explaining the process of the heat treatment apparatus which concerns on Example 4 of this invention. Timing chart explaining the processing of FIG. The flowchart explaining the process of the heat treatment apparatus which concerns on Example 5 of this invention. Timing chart explaining the processing of FIG. Circuit block diagram of a fever treatment device according to Embodiment 6 of the present invention FIG. 23 is a timing chart of the heat treatment apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Exothermic treatment apparatus 2 ... Coagulation incision forceps 9 ... Treatment part 21 ... Heating element 100 ... CPU
DESCRIPTION OF SYMBOLS 101 ... Monitor current control circuit 102 ... Monitor constant current power supply 103 ... Current detection resistor 104 ... Resistance value detection circuit 105 ... Heat generation power control circuit 106 ... Heat generation power supply power source 107 ... Heating element failure determination circuit 108 ... Connector detection part 109 ... Identification Part

Claims (6)

A treatment section having a treatment section for treating a living tissue, the treatment section provided with heating means for generating heat to be applied to the tissue, and the treatment section; In a heat treatment apparatus comprising a power supply main body for supplying a predetermined drive current,
The power supply body is
Monitor current supply means for supplying a monitor current to the heat generating means as a periodic on / off current having a predetermined duty ratio ;
Drive current supply means for supplying a drive current to the heat generating means;
A current detection resistor for measuring the current values of the monitor current and the drive current supplied to the heating means;
A current detection unit that detects a current value of the monitor current supplied to the heat generating unit and a current value of the drive current by obtaining a current value flowing through the current detection resistor ;
Applied voltage detecting means for detecting a voltage value applied to the heat generating means;
Using the detection results of the current detection means and the applied voltage detection means, calculation means for calculating the heat generation temperature in the heat generation means,
Using each detection result of the current detection means and the applied voltage detection means, a failure detection means for detecting a failure of the heat generation means,
An exothermic treatment device comprising: 2. The heat generation according to claim 1, wherein the monitor current supply unit changes a duty ratio of the on / off current of the monitor current based on the heat generation temperature when the monitor current is supplied by the calculation unit. Treatment device. The monitor current supply means changes the on-current value of the monitor current on / off current based on the heat generation temperature when the monitor current is supplied by the calculation means.
The exothermic treatment device according to claim 1 or 2, characterized in that . The monitor current supply means supplies the monitor current at a continuous constant current when supplying a drive current.
The exothermic treatment device according to any one of claims 1-3 . The heat treatment apparatus according to claim 4, wherein the current value of the constant current is larger than the maximum current value of the on / off current of the monitor current . The treatment section includes a plurality of the heat generating means, and at least the monitor current supply means supplies the monitor current on / off current to the plurality of heat generating means in a time-sharing manner.
The exothermic treatment device according to claim 1 .

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