JP4731768B2 - フローはんだ付け方法 - Google Patents
フローはんだ付け方法 Download PDFInfo
- Publication number
- JP4731768B2 JP4731768B2 JP2001289131A JP2001289131A JP4731768B2 JP 4731768 B2 JP4731768 B2 JP 4731768B2 JP 2001289131 A JP2001289131 A JP 2001289131A JP 2001289131 A JP2001289131 A JP 2001289131A JP 4731768 B2 JP4731768 B2 JP 4731768B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- solder material
- temperature
- jet
- flow soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001289131A JP4731768B2 (ja) | 2000-09-26 | 2001-09-21 | フローはんだ付け方法 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000292271 | 2000-09-26 | ||
| JP2000292271 | 2000-09-26 | ||
| JP2000-292271 | 2000-09-26 | ||
| JP2001289131A JP4731768B2 (ja) | 2000-09-26 | 2001-09-21 | フローはんだ付け方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002176250A JP2002176250A (ja) | 2002-06-21 |
| JP2002176250A5 JP2002176250A5 (https=) | 2008-10-30 |
| JP4731768B2 true JP4731768B2 (ja) | 2011-07-27 |
Family
ID=26600740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001289131A Expired - Fee Related JP4731768B2 (ja) | 2000-09-26 | 2001-09-21 | フローはんだ付け方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4731768B2 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0732978U (ja) * | 1993-11-25 | 1995-06-16 | 日本電熱計器株式会社 | 噴流式はんだ槽における酸化物除去装置 |
| JPH1093231A (ja) * | 1996-09-11 | 1998-04-10 | Matsushita Electric Ind Co Ltd | 噴流式自動半田付装置 |
| JP3761678B2 (ja) * | 1997-07-17 | 2006-03-29 | 松下電器産業株式会社 | 錫含有鉛フリーはんだ合金及びそのクリームはんだ並びにその製造方法 |
| JP3241013B2 (ja) * | 1998-02-27 | 2001-12-25 | 松下電器産業株式会社 | はんだ付け装置とはんだ回収装置と酸化物の除去方法と酸化物の分離剤 |
| JP2000244108A (ja) * | 1999-02-22 | 2000-09-08 | Senju Metal Ind Co Ltd | プリント基板のはんだ付け方法、プリント基板のはんだ付け装置およびはんだ付け装置用冷却装置 |
-
2001
- 2001-09-21 JP JP2001289131A patent/JP4731768B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002176250A (ja) | 2002-06-21 |
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