JP4716228B2 - Light emitting diode lamp system - Google Patents

Description

The present invention relates to a light emitting diode run Pushi stem, in particular, according to the LED lamp system with a light emitting diode lamp structure with a high efficiency heat-dissipating function.

  Light-emitting diodes (LEDs) have a smaller volume, lower power consumption, better luminous efficiency, longer life, faster operation response, and no heat radiation and contamination with toxic substances such as mercury compared to conventional light sources. In recent years, light emitting diodes have been widely applied. Previously, the brightness of light emitting diodes could not be switched between traditional lighting sources, but with the improvement of the technology area, light emitting diodes (high power LEDs) with high lighting brightness have already been researched and developed. The illumination light source can be switched sufficiently.

  Since light-emitting diode lamps are relatively inferior in heat resistance, normally, the amount of heat generated by the light-emitting diodes by the heat-conducting element or the heat-dissipating element is conducted to the outside to dissipate the heat, so that the light-emitting diode lamps can be properly operated at relatively low temperatures. It becomes possible to operate. Therefore, how to improve the heat conduction or heat dissipation effect of the whole light emitting diode lamp by the design of the structure is an important issue for those skilled in the art.

  However, the heat dissipation effect of the conventional light emitting diode lamp clearly has inconveniences and disadvantages, and has been expected to be improved.

  Therefore, in view of the above-mentioned conventional drawbacks, the present inventor conducted deliberate observation and research in accordance with the experience engaged in the field for many years, and combined the operation of academic theory with a rational design and Provided is one that can efficiently improve the above-mentioned drawbacks.

An object of the present invention is to provide is to provide a light-emitting diode run Pushi stem having a high efficiency heat-dissipating function. The present invention provides a high-efficiency heat-dissipating effect for high-power light-emitting diodes by using a heat-dissipating module having radial-shaped fins. Therefore, the light emitting diode of the present invention can be used at a relatively low temperature, and the service life of the light emitting diode can be secured.

In order to solve the technical problem, an aspect of the present invention provides a light emitting diode lamp system including a light emitting diode lamp structure including a heat dissipation module, a light emitting module, and a power transfer module.

  The heat dissipating module has a plurality of heat dissipating fins, and these heat dissipating fins are combined in a radial shape so as to form an accommodation space. The light emitting module is accommodated in an accommodating space of the heat dissipation module. The power transfer module is electrically connected to the light emitting module. The light emitting module includes a substrate having positive and negative conductive traces, two internal conductive pins, and at least one electrically connected to the positive and negative conductive traces of the substrate through the two internal conductive pins. A light-emitting element; a fluorescent colloid for covering the at least one light-emitting element; and a light-shielding frame body that covers the periphery of the fluorescent colloid and exposes only the upper surface of the fluorescent colloid.

  The light emitting diode lamp structure of the present invention further includes an upper plate body, a lower plate body combined with the upper plate body, and a joint plate body provided between the upper plate body and the heat dissipation fin. The upper plate body and the joint plate body each have an opening for exposing the light emitting module. Also, the upper and lower ends of each heat dissipation fin are in contact with the joint plate main body and the lower plate main body, respectively, or the upper end of each heat dissipation fin is in contact with the joint plate main body, and the lower end is a predetermined distance from the lower plate main body. Leave.

In order to solve the above technical problem, an aspect of the present invention provides a light emitting diode lamp system including a plurality of light emitting diode lamp structures , a casing module, a plurality of heat dissipation sheets, and a power plug.

Each light emitting diode lamp structure includes a heat dissipation module, a light emitting module, and a power transfer module. The heat dissipating module has a plurality of heat dissipating fins, and these heat dissipating fins are combined in a radial shape so as to form an accommodation space. The light emitting module is accommodated in an accommodation space of the heat dissipation module so as to abut on the plurality of heat dissipation fins, and is surrounded by the plurality of heat dissipation fins. The power transfer module is electrically connected to the light emitting module and passes through a gap between two adjacent heat dissipation fins of the plurality of heat dissipation fins. The casing module includes an upper plate body and a lower plate body combined with the upper plate body. The plurality of heat dissipation sheets are provided between the upper plate body and the lower plate body. The power plug is electrically connected to a power transfer module having a light emitting diode lamp structure. The upper plate main body has a plurality of openings exposing each of the plurality of light emitting diode lamp structures. The plurality of light emitting diode lamp structures are disposed between the upper plate body and the lower plate body so as to be surrounded by the plurality of heat dissipation sheets.

  Also, according to different requirements, these heat dissipation fins of each heat dissipation module comprise several different aspects:

  Each of the heat dissipation fins includes a deposition portion and a fin portion extending forward and upward from the side of the deposition portion, and the light emitting module is installed in the deposition portion of the heat dissipation substrate. .

  Each of the heat dissipating fins includes a depositing portion and a fin portion extending forward and upward from the side of the depositing portion. In addition, the light emitting diode lamp structure of the present invention further includes a heat dissipating substrate that is accommodated in the accommodating space and is installed on the upper surface of the deposition portion, and the periphery of the heat dissipating substrate is an inner edge of these fin portions. Abut. The light emitting module is installed on the heat dissipation substrate.

  3. Each heat-dissipating fin includes a depositing portion and a fin portion extending forward, upward, and downward from the side of the depositing portion. In addition, the light-emitting diode lamp structure of the present invention further includes a heat-dissipating substrate that is in contact with the lower surface of these deposited portions and the inner edges of these fin portions. The light emitting module is installed in the deposition part.

  Fourth, each heat dissipating fin includes a fixed portion and a fin portion extending upward from the fixed portion. The light-emitting diode lamp structure of the present invention further includes a heat dissipation substrate that is in contact with the inner edges of these fixing portions, and each fixing portion of the heat dissipation fin is fixed so as to surround the periphery of the heat dissipation substrate. . The light emitting module is installed on the heat dissipation substrate.

  Each of the heat dissipating fins includes a fitting portion and a fin portion that extends forward, upward, and downward from the side of the fitting portion. In addition, the light emitting diode lamp structure of the present invention further includes a heat dissipation substrate having a plurality of concave grooves corresponding to the fitting portions formed around the periphery thereof, and the fitting portions of the heat dissipation fins are fitted into the concave grooves. As a result, the periphery of the heat dissipation substrate is brought into contact with the inner edges of these fin portions. The light emitting module is installed on the heat dissipation substrate.

Thus, light-emitting diodes run Pushi stem of the present invention can generate a high-efficiency heat-dissipating function, light emitting diodes (especially, high-power light-emitting diodes) can be improved in service life.

  DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to more specifically describe the technology, means and effects adopted by the present invention to achieve a predetermined object, a detailed and specific description will be given below with reference to the detailed description related to the present invention and the accompanying drawings. However, it is needless to say that the accompanying drawings are used only for reference and explanation and do not narrowly limit the scope of the present invention.

Figure 1A~ Figure 1D, respectively, partially exploded perspective view of a first embodiment of the engaging Ru - emitting diode lamp structure of the present invention, a perspective assembly view, top view and a side sectional view (upper body, the lower plate body and the joint The board body has been added.) As can be seen from these figures, the first embodiment of the present invention provides a heat-dissipating module 1a, a light emitting module 2, and a power transfer module 3 including light emission diode lamp structure A.

  The heat dissipation module 1a has a plurality of heat dissipation fins 10a, and these heat dissipation fins 10a are combined in a radial shape so as to form an accommodation space 11a in the middle of the heat dissipation module 1a. That is, the heat dissipation module 1a is a heat dissipation module having radial fins.

  Each heat dissipation fin 10a includes a depositing portion 100a and a fin portion 101a extending forward and upward from the side of the depositing portion 100a, and a surhole 102a is formed between each depositing portion 100a. Is done. Further, these heat dissipating fins 10a are combined by mutual deposition of these deposited portions 100a (that is, the deposited portions 100a are arranged so as to be deposited on each other). In the first embodiment, these heat dissipating fins 10a are combined by the stacking portion 100a being stacked on the left and right. Further, according to different designs, these heat dissipating fins 10a can be combined by the stacking portions 100a being stacked one above the other.

  The light emitting module 2 is accommodated in the accommodating space 11a of the heat dissipation module 1a. Further, the light emitting module 2 is connected to the substrate 20 having the positive and negative conductive traces (201, 202), the two internal conductive pins (210, 211), and the two internal conductive pins (210, 211). At least one light emitting element 21 electrically connected to the positive and negative conductive traces (201, 202) of the substrate 20, a fluorescent colloid 22 for covering the at least one light emitting element 21, and the periphery of the fluorescent colloid 22 And a light-shielding frame body 23 that exposes only the upper surface of the fluorescent colloid 22.

  The power transfer module 3 is electrically connected to the light emitting module 2 and has two lead wires 30. The two lead wires 30 can selectively pass through any two of the hole holes 102a.

  As shown in FIG. 1D, the light emitting diode lamp structure of the present invention further includes a casing module 4. The casing module 4 includes an upper plate main body 40, a lower plate main body 41, and a joint plate main body 42. The upper plate main body 40 and the joint plate main body 42 have openings (400, 420) for exposing the light emitting module 2, respectively. Have. Further, the upper plate main body 40 and the lower plate main body 41 are combined and tightened together by a plurality of screws (not shown), and the joint plate main body 42 is installed between the upper plate main body 40 and the heat dissipation fins 10a. In other words, the upper end of each heat dissipating fin 10 a contacts the joint plate main body 42, and the lower end is separated from the lower plate main body 41 by a predetermined distance H. By using the joint plate main body 42, the heat dissipating fins 10 a are easily fixed below the upper plate main body 40.

Figure 1E is a side sectional view (upper body dissipation fins of the first embodiment of the engaging Ru - emitting diode lamp structure of the present invention showing an aspect in contact with the lower plate body, the lower plate body and the joint plate body added Yes.) As can be seen from the drawing, the upper and lower ends of each heat dissipation fin 10a come into contact with the joint plate body 42 and the lower plate body 41, respectively, according to different heat dissipation requirements.

Figure 2A~-2B, respectively, are partial exploded perspective view and a side cross-sectional view of a second embodiment of the engaging Ru - emitting diode lamp structure of the present invention (upper body, the lower plate body and the joint plate body added. ). As can be seen from the drawing, the second embodiment of this invention, a heat dissipation module 1b, a light emitting module 2, provides a power transfer module 3, the including light emission diode lamp structure B the heat-dissipating substrate 5b.

  The heat dissipation module 1b has a plurality of heat dissipation fins 10b, and these heat dissipation fins 10b are combined in a radial shape so as to form an accommodation space 11b in the center of the heat dissipation module 1b. That is, the heat dissipation module 1b is a heat dissipation module having radial fins.

  Each heat dissipation fin 10b includes a depositing portion 100b and a fin portion 101b extending forward and upward from the side of the depositing portion 100b, and the power transfer module 3 is provided between the fin portions 101b. A gap 102b for allowing one lead wire 30 to pass therethrough is formed. In the second embodiment, these heat dissipating fins 10b are combined by depositing the deposition portions 100b on the left and right.

  In the second embodiment of the present invention, the most different point from the first embodiment is that a heat dissipation substrate 5b is added, and the heat dissipation substrate 5b is accommodated in the accommodation space 11b and installed on the upper surface 1000b of the deposition portion 100b. The periphery of the substrate 5b is in contact with the inner edge 1010b of the fin portion 101b. The light emitting module 2 is installed on the heat dissipation substrate 5b. Also, the heat dissipation board 5b can be designed as a hollow or solid heat dissipation board according to actual heat dissipation requirements, and the outer shape of the heat dissipation board 5b can be cylindrical or any shape (for example, square or (Side shape).

Figure 3A~-3B, respectively, are partial exploded perspective view and a side cross-sectional view of a third embodiment of engaging Ru - emitting diode lamp structure of the present invention (upper body, the lower plate body and the joint plate body added. ). As can be seen from the drawings, the third embodiment of the present invention includes a heat-dissipating module 1c, the light emitting module 2, provides a power transfer module 3, the including light emission diode lamp structure C and a heat-dissipating substrate 5c.

  The heat dissipation module 1c has a plurality of heat dissipation fins 10c, and these heat dissipation fins 10c are combined in a radial shape so as to form an accommodation space 11c in the center of the heat dissipation module 1c. That is, the heat dissipation module 1c is a heat dissipation module having radial fins.

  Each heat dissipating fin 10c includes a depositing portion 100c and a fin portion 101c extending forward and upward and downward from the side of the depositing portion 100c, and a power source is provided between the fin portions 101c. A gap 102c for passing one lead wire 30 of the transfer module 3 is formed. In the third embodiment, the heat-sink fins 10c are combined by depositing these deposited portions 100c on the left and right.

  In the third embodiment of the present invention, the most different point from the second embodiment is that the upper end of the heat dissipation substrate 5c is in contact with the lower surface 1000c of the deposition portion 100c, and the periphery of the heat dissipation substrate 5c is the fin portion 101c. This is a point that comes into contact with the inner edge 1010c. Moreover, the light emitting module 2 is installed on the deposition part 100c.

Figure 4A~-4B, respectively, are partial exploded perspective view and a side sectional view of a fourth embodiment of engaging Ru - emitting diode lamp structure of the present invention (upper body, the lower plate body and the joint plate body added. ). As can be seen from the drawings, the fourth embodiment of the present invention includes a heat-dissipating module 1d, a light emitting module 2, provides a power transfer module 3, the including light emission diode lamp structure D a heat-dissipating substrate 5d.

  The heat dissipation module 1d has a plurality of heat dissipation fins 10d, and these heat dissipation fins 10d are combined in a radial shape so as to form an accommodation space 11d in the center of the heat dissipation module 1d. That is, the heat dissipation module 1d is a heat dissipation module having radial fins.

  Each heat dissipating fin 10d includes a fixed portion 100d and a fin portion 101d extending upward from the fixed portion 100d. One lead of the power transfer module 3 is provided between the adjacent fixed portions 100d. A gap 102d for passing the wire 30 is formed.

  In the fourth embodiment of the present invention, the most different point from the first, second and third embodiments is that the periphery of the heat dissipation substrate 5d is brought into contact with the inner edge 1000d of the fixed portion 100d. In other words, each fixing portion 100d of the heat dissipation fin 10d is fixed so as to go around (enclose) the periphery of the heat dissipation substrate 5d. The light emitting module 2 is installed on the heat dissipation substrate 5d.

Figure 5A~-5B, respectively, are partial exploded perspective view and a side sectional view of a fifth embodiment of the engaging Ru - emitting diode lamp structure of the present invention (upper body, the lower plate body and the joint plate body added. ). As can be seen from the drawings, the fifth embodiment of the present invention provides a heat-dissipating module 1e, a light emitting module 2, a power transfer module 3, the including light emission diode lamp structure E the heat-dissipating substrate 5e.

  The heat dissipating module 1e has a plurality of heat dissipating fins 10e, and these heat dissipating fins 10e are combined in a radial shape so as to form an accommodation space 11e in the center of the heat dissipating module 1e. That is, the heat dissipation module 1e is a heat dissipation module having radial fins.

  Each heat dissipating fin 10e includes a fitting part 100e and a fin part 101e extending forward and upward and downward from the side of the fitting part 100e, and between each fin part 101e. A gap 102e for passing one lead wire 30 of the power transfer module 3 is formed.

  In the fifth embodiment of the present invention, the most different point from the other embodiments is that a plurality of concave grooves 40e corresponding to the fitting portions 100e are formed around the heat dissipation substrate 5e, and each heat dissipation fin is formed in the concave groove 40e. By fitting the fitting portion 100e of 10e, the periphery of the heat dissipation substrate 5e is brought into contact with the inner edge 1010e of these fin portions 101e. The light emitting module 2 is installed on the heat dissipation substrate 5e.

Figure 6 shows the engagement Ru light emission diode lamp system according to the present invention. As can be seen from the drawings, the present invention includes a plurality of light emitting diode lamp structure F, the power plug 3 'and the casing module 4' to provide including light-emitting diodes lamp system. Each light emitting diode lamp structure F includes a heat dissipation module 1 ′, a light emitting module 2 ′, and a power transfer module (not shown). These light emitting diode lamp structures F are arranged in a street lamp structure.

  The heat dissipating module 1 'has a plurality of heat dissipating fins 10', and these heat dissipating fins 10 'are combined in a radial shape so as to form an accommodation space 11'. The light emitting module 2 'is accommodated in the accommodating space 11' of the heat dissipation module 1 ', and the power transfer module is electrically connected to the light emitting module 2'.

  Further, the power plug 3 ′ is electrically connected to the power transfer module of each light emitting diode lamp structure F. In other words, each power transfer module has one positive lead wire and one negative lead wire (not shown), and the positive lead wire and the negative lead wire of each power transfer module are respectively connected to the power plug 3. 'Is electrically connected to the positive electrode end 31' and the negative electrode end 32 '.

  The casing module 4 'includes an upper plate main body 40', a lower plate main body 41 'combined with the upper plate main body 40', and a joint plate provided between the upper plate main body 40 'and each heat dissipating fin 10'. The upper plate main body 40 'and the joint plate main body 42' each have a plurality of openings (400 ', 420') for exposing the light emitting modules 2 '. The upper plate main body 40 'and the lower plate main body 41' are fastened in combination with each other by a plurality of screws S, and the joint plate main body 42 'is installed between the upper plate main body 40' and these heat dissipating fins 10 '. The Further, according to different usage requirements, the light-emitting diode lamp system further includes a plurality of heat dissipating sheets 5 'provided between the upper plate body 40' and the lower plate body 41 '. , Surrounding these light emitting diode lamp structures F.

  However, the arrangement of the light-emitting diode lamp structures F is not limited to the street lamp structure, and any combination of arrangements in any shape is within the protection scope of the present invention. For example, the light emitting diode lamp structure F may be a desk lamp arranged in a straight line.

  Also, the five light emitting diode lamp structures (A, B, C, D, E) posted in the different embodiments can be applied to the light emitting diode lamp system of the present invention. In other words, these light-emitting diode lamp structures F may be changed to other types of light-emitting diode lamp structures according to user requirements.

  As described above, the present invention provides a high-efficiency heat dissipation effect for a high-power light-emitting diode by using a heat dissipation module having a radial heat dissipation fin. Therefore, the light emitting diode of the present invention can be used at a relatively low temperature, and the service life of the light emitting diode can be secured. In other words, the light-emitting diode lamp structure and system according to the present invention have a highly efficient heat dissipation function and can improve the service life of the light-emitting diode (particularly, a high-power light-emitting diode).

  The foregoing description is merely a detailed description of the preferred specific embodiments and drawings of the present invention, and is not intended to limit the scope of the claims of the present invention. Any expert having ordinary knowledge in the relevant field can make appropriate changes and modifications within the field of the present invention, but such implementation is delivered within the scope of the present invention. Needless to say, there is nothing to do.

Figure 1A is a partially exploded perspective view of a first embodiment of the engaging Ru - emitting diode lamp structure of the present invention. Figure 1B is a perspective assembly view of a first embodiment of the engaging Ru - emitting diode lamp structure of the present invention. Figure 1C is a top view of a first embodiment of the engaging Ru - emitting diode lamp structure of the present invention. Figure 1D is a side cross-sectional view of a first embodiment of the engaging Ru - emitting diode lamp structure of the present invention (upper body, with addition of lower plate body and the joint plate body.). Figure 1E is a side sectional view (upper body dissipation fins of the first embodiment of the engaging Ru - emitting diode lamp structure of the present invention showing an aspect in contact with the lower plate body, the lower plate body and the joint plate body added Yes.) Figure 2A is a partially exploded perspective view of a second embodiment of the engaging Ru - emitting diode lamp structure of the present invention. Figure 2B is a side cross-sectional view of a second embodiment of the engaging Ru - emitting diode lamp structure of the present invention (upper body, with addition of lower plate body and the joint plate body.). Figure 3A is a partially exploded perspective view of a third embodiment of engaging Ru - emitting diode lamp structure of the present invention. Figure 3B is a side cross-sectional view of a third embodiment of engaging Ru - emitting diode lamp structure of the present invention (upper body, with addition of lower plate body and the joint plate body.). Figure 4A is a partially exploded perspective view of a fourth embodiment of engaging Ru - emitting diode lamp structure of the present invention. Figure 4B is a side cross-sectional view of a fourth embodiment of engaging Ru - emitting diode lamp structure of the present invention (upper body, with addition of lower plate body and the joint plate body.). Figure 5A is a partially exploded perspective view of a fifth embodiment of the engaging Ru - emitting diode lamp structure of the present invention. Figure 5B is a side cross-sectional view of a fifth embodiment of the engaging Ru - emitting diode lamp structure of the present invention (upper body, with addition of lower plate body and the joint plate body.). Figure 6 is a diagram showing an engaging Ru - emitting diode lamp system according to the present invention.

Explanation of symbols

A, B, C, D, E, F Light-emitting diode lamp structure 1a Heat-dissipating module 2 Light-emitting module 3 Power transfer module 10a Heat-dissipating fin 11a Housing space 100a Deposition part 101a Fin part 102a Sur hole 201 Positive conductive trace 202 Negative conductive trace 20 Substrate 210, 211 Internal conductive pin 21 Light emitting element 22 Fluorescent colloid 23 Shading frame main body 30 Lead wire 4 Casing module 40 Upper plate main body 41 Lower plate main body 42 Joint plate main body 400, 420 Opening 1b Heat dissipation module 5b Heat dissipation substrate 10b Heat dissipation fin 11b Accommodating space 100b Deposition portion 101b Fin portion 102b Gap 1000b Deposition portion upper surface 1c Heat dissipation module 5c Heat dissipation substrate 10c Heat dissipation 11c Storage space 100c Deposition portion 101c Fin portion 102 Gap 1010c Inner edge of fin portion 1d Heat dissipation module 5d Heat dissipation substrate 10d Heat dissipation fin 11d Housing space 100d Fixed portion 101d Fin portion 102d Gap 1000d Inner edge of fixing portion 1e Heat dissipation module 5e Heat dissipation substrate 10e Heat dissipation fin 11e Housing space 101e Fin part 102e Gap 40e Concave groove 1010e Inner edge of fin part 1 'Heat dissipating module 2' Light emitting module 3 'Power plug 4' Casing module 10 'Heat dissipating fin 11' Accommodating space 31 'Positive electrode end 32' Negative electrode end 40 'Upper plate body 41 'lower plate body 42' joint plate body 400 ', 420' opening 5 'heat dissipation sheet

Claims (19)

A plurality of heat dissipating fins, and a heat dissipating module combining these heat dissipating fins in a radial shape so as to form an accommodating space; and being accommodated in the accommodating space of the heat dissipating module so as to abut against the plurality of heat dissipating fins, A light emitting module surrounded by the plurality of heat dissipating fins, and a power transfer module electrically connected to the light emitting module and passing through a gap between two adjacent heat dissipating fins. A plurality of light emitting diode lamp structures;
A casing module comprising an upper plate body and a lower plate body combined with the upper plate body;
A plurality of heat dissipation sheets provided between the upper plate body and the lower plate body;
A power plug electrically connected to the power transfer module of each light emitting diode lamp structure,
The upper plate body has a plurality of openings exposing each of the plurality of light emitting diode lamp structures,
The plurality of light emitting diode lamp structures are disposed between the upper plate body and the lower plate body so as to be surrounded by the plurality of heat dissipation sheets. Each heat dissipating fin of each heat dissipating module of the plurality of light emitting diode lamp structures includes a depositing portion and a fin portion extending forward and upward from the side of the accumulating portion,
The light emitting diode lamp system according to claim 1, wherein the light emitting module is installed in a deposition portion of the heat dissipation fin. The light emitting diode lamp system of claim 1, wherein the heat dissipating fins are stacked and combined with each other. Further, the casing module, Bei example, the joint plate body joint plate body provided between the upper body and the heat-dissipating fins according to claim 1, characterized in that it comprises an opening for exposing the light emitting module A light emitting diode lamp system as described. The light emitting diode lamp system according to claim 4 , wherein an upper end and a lower end of each of the heat dissipating fins are in contact with the joint plate main body and the lower plate main body, respectively. The light emitting diode lamp system according to claim 4, wherein an upper end of each of the heat dissipating fins is in contact with the joint plate body, and a lower end thereof is separated from the lower plate body by a predetermined distance. The light emitting module includes a substrate having positive and negative conductive traces, two internal conductive pins, and at least one electrically connected to the positive and negative conductive traces of the substrate through the two internal conductive pins. The light-emitting element, a fluorescent colloid for covering the at least one light-emitting element, and a light-shielding frame body that covers the periphery of the fluorescent colloid and exposes only the upper surface of the fluorescent colloid. Light emitting diode lamp system . 8. The light emitting diode lamp system according to claim 7 , wherein the power transfer module has two lead wires electrically connected to the positive and negative conductive traces of the substrate, respectively. The light emitting diode lamp system according to claim 1, further comprising a heat dissipation substrate provided between the heat dissipation fins. The light emitting diode lamp system according to claim 9, wherein the heat dissipation substrate is a hollow heat dissipation substrate. The light emitting diode lamp system according to claim 9, wherein the heat dissipation substrate is a solid heat dissipation substrate. The light emitting diode lamp system according to claim 9, wherein the heat dissipation substrate is a cylindrical heat dissipation substrate. 3. The light emitting diode lamp system according to claim 2, wherein the heat dissipating fins are arranged side by side so that the accumulation portions are accumulated on the left and right . The power transfer module has two lead wires, and a through hole for passing one of the lead wires is formed at the upper end of each deposition portion between each of the deposition portions. The light-emitting diode lamp system according to claim 2 . The light emitting diode lamp system according to claim 2 , further comprising a heat dissipation substrate whose periphery is in contact with an inner edge of the fin portion, accommodated in the accommodation space, and installed on an upper surface of the deposition portion. . The light emitting diode lamp system according to claim 15, wherein the light emitting module is installed on the heat dissipation substrate. 16. The power supply module according to claim 15, wherein the power transfer module has two lead wires, and a gap is formed between each of the deposited portions so as to pass one of the lead wires. Light emitting diode lamp system . Each of the heat dissipating fins of each heat dissipating module of the plurality of light emitting diode lamp structures includes a deposition part, and a fin part extending forward and upward and downward from the side of the deposition part,
The light emitting diode lamp system according to claim 1, wherein the light emitting module is installed in the deposition unit. The light-emitting diode lamp system according to claim 18 , further comprising a heat-dissipating substrate in contact with a lower surface of the deposition part and an inner edge of the fin part .

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