KR101022621B1 - Structure and Assembly of LED Lamp having High-efficient Heat-dispersing Function - Google Patents

Abstract

A light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention includes a heat dissipation module, a light emitting module, a power supply module, and a casing module. The heat dissipation module has a plurality of heat dissipation fins, which are radially assembled to form a receiving space. The light emitting module is accommodated in an accommodation space of the heat dissipation module. The power supply module is electrically connected to the light emitting module. The casing module includes a top plate body, a bottom plate body coupled to the top plate body, and a joint plate body provided between the top plate body and the heat dissipation fin, wherein the top plate body and the joint plate body respectively expose the light emitting module. Has an opening. An upper end of each of the heat dissipation fins is in contact with the joint plate main body, and a lower end thereof is separated from the lower plate main body by a predetermined distance.

Description

Structure and assembly of LED lamp having high efficiency heat dissipation {Structure and Assembly of LED Lamp having High-efficient Heat-dispersing Function}

The present invention relates to light emitting diode lamp structures and assemblies, and more particularly to light emitting diode lamp structures and assemblies having a high efficiency heat dissipation function.

Light emitting diodes (LEDs) have the advantages of smaller volume, better power saving and luminous efficiency, longer lifespan, faster operation reaction speed, and no contamination of toxic substances such as heat radiation and mercury compared to conventional light sources. In recent years, it has become widely applied. Conventionally, the brightness of light emitting diodes has not been able to replace traditional lighting sources, but with the improvement of technology, high brightness light emitting diodes (high power LEDs) have already been researched and developed to replace traditional lighting sources.

In addition, since the heat resistance of the light emitting diode lamp is relatively low, it is possible to normally operate the light emitting diode lamp at a relatively low temperature by conducting the heat of the heat generated by the light emitting diode by the heat conduction element or the heat radiating element to the outside. Therefore, improving the heat conduction or heat dissipation effect of the entire LED lamp by the design of the structure is an important problem for those skilled in the art.

As described above, the heat dissipation effect of the conventional light emitting diode lamp is clearly uncomfortable and defects, and improvement was expected.

Accordingly, the present inventors have proposed the present invention which can concentrate on observation and research based on the experience accumulated in this field for many years and improve the above-mentioned defects effectively by applying academic theory in order to improve the above-mentioned defects.

The problem to be solved by the present invention is to provide a light emitting diode lamp structure and assembly having a high efficiency heat radiation function. The present invention provides a high efficiency heat dissipation effect to a high output light emitting diode by using a heat dissipation module having a radial heat-dissipating fin. Therefore, the light emitting diode of the present invention can be used at a relatively low temperature, thereby ensuring the service life of the light emitting diode.

In order to solve the above technical problem, an aspect of the present invention provides a light emitting diode lamp structure having a high efficiency heat radiation function including a heat dissipation module, a light emitting module, and a power supply module.

The heat dissipation module has a plurality of heat dissipation fins, which are assembled radially to form a receiving space. The light emitting module is accommodated in an accommodation space of the heat dissipation module. The power supply module is electrically connected to the light emitting module. The light emitting module may include a substrate having positive and negative conductive traces, two internal conductive pins, and at least one light emitting element electrically connected to the positive and negative conductive traces of the substrate through two internal conductive pins. And a fluorescent sealing material for covering the at least one light emitting element, and a light blocking frame body covering a periphery of the fluorescent sealing material and exposing only an upper surface of the fluorescent sealing material.

In addition, the light emitting diode lamp structure of the present invention includes a casing module having an upper plate body, a lower plate body coupled to the upper plate body, and a joint plate body provided between the upper plate body and the heat dissipation fin. The upper plate body and the joint plate body each have an opening that exposes the light emitting module. The upper and lower ends of each of the heat dissipation fins are in contact with the joint plate main body and the lower plate main body, respectively, or the upper end of each of the heat dissipation fins is in contact with the joint plate main body, and the lower end is spaced apart from the lower plate main body.

In order to solve the above technical problem, another aspect of the present invention provides a light emitting diode lamp assembly having a high efficiency heat radiation function comprising a plurality of light emitting diode lamp structure and a power plug.

Each light emitting diode lamp structure includes a heat dissipation module, a light emitting module, and a power supply module. The heat dissipation module has a plurality of heat dissipation fins, which are assembled radially to form a receiving space. The light emitting module is accommodated in an accommodation space of the heat dissipation module. The power supply module is electrically connected to the light emitting module. In addition, the power plug is electrically connected to a power supply module for each LED lamp structure.

Moreover, according to another request, the heat radiation fin of each heat radiation module is equipped with the following some other form.

1. Each of the heat dissipation fins includes a coupling portion and a fin portion extending upwardly and upwardly from the side edge of the coupling portion. In this case, the light emitting module is provided at these coupling portions of the heat dissipation substrate.

2. Each heat radiation fin is provided with a coupling part and the fin part extended upward and upward from the side edge of the said coupling part. The light emitting diode lamp structure of the present invention further includes a heat dissipation substrate accommodated in the accommodating space and installed on an upper surface of the coupling portion, and the periphery of the heat dissipation substrate is in contact with the inner edge of the fin portion. In this case, the light emitting module is installed on the heat dissipation substrate.

3. Each heat radiation fin is provided with a coupling part and the fin part extended from the side edge of the said coupling part to the front part upwards and downwards. In addition, the LED lamp structure of the present invention further comprises a heat dissipation substrate in contact with the lower surface of the coupling portion and the inner edge of the fin portion. In this case, the light emitting modules are provided in these coupling portions.

4. Each heat radiation fin is provided with a fixed part and the fin part extended upward from the said fixed part. The light emitting diode lamp structure of the present invention further includes a heat dissipation substrate in contact with the inner edge of the fixing portion, and the fixing portion of the heat dissipation fin is fixed to surround the heat dissipation substrate. In this case, the light emitting module is installed on the heat dissipation substrate.

5. Each heat radiation fin includes a fitting portion and a fin portion extending upwardly and downwardly from the side of the fitting portion. The light emitting diode lamp structure of the present invention further includes a heat dissipation substrate having a plurality of grooves corresponding to the fitting portion therein, and inserts fitting portions of the heat dissipation fins into the grooves to thereby surround the heat dissipation substrate. The inner edges of these pin portions are brought into contact. In this case, the light emitting module is installed on the heat dissipation substrate.

Therefore, the light emitting diode lamp structure and assembly of the present invention can exhibit a high efficiency heat dissipation function, thereby improving the service life of the light emitting diodes (especially high output light emitting diodes).

The light emitting diode lamp structure and assembly having a high efficiency heat dissipation function of the present invention provides a high efficiency heat dissipation effect to a high output light emitting diode by using a heat dissipation module having radial heat dissipation fins. Therefore, the light emitting diode of the present invention can be used at a relatively low temperature, thereby ensuring the service life of the light emitting diode.

In order to explain in more detail and specifically the techniques, means and effects employed by the present invention for achieving the desired purpose, specific understanding can be made by referring to the following detailed description of the invention and the accompanying drawings. These accompanying drawings are used only for reference and description, needless to say, they do not narrowly limit the scope of the invention.

1A to 1D show a partially exploded perspective view, an assembled perspective view, a top view, and a side sectional view of a first embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention, respectively. Added). As can be seen from such a drawing, the first embodiment of the present invention is a light emitting diode lamp having a high efficiency heat dissipation function including a heat dissipation module 1a, a light emitting module 2, and a power supply module 3. Provide structure A.

The heat dissipation module 1a has a plurality of heat dissipation fins 10a, and these heat dissipation fins 10a are radially assembled to form the accommodating space 11a in the middle of the heat dissipation module 1a. Thus, this heat dissipation module 1a is a heat dissipation module having radial fins.

Each of the heat dissipation fins 10a includes a coupling portion 100a and a fin portion 101a extending forwardly and upwardly from the side of the coupling portion 100a, and through holes 102a between the coupling portions 100a. ) Is formed. Moreover, these heat radiation fins 10a are assembled by mutual coupling of these coupling parts 100a. In the first embodiment, these heat dissipation fins 10a are assembled by coupling the coupling portions 100a from side to side. In addition, according to another design, the heat dissipation fins 10a may be assembled by coupling the coupling portions 100a up and down.

In addition, the light emitting module 2 is accommodated in the accommodation space 11a of the heat dissipation module 1a. The light emitting module 2 further includes a substrate 20 having positive and negative conductive traces 201 and 202, two internal conductive fins 210 and 211, and two internal conductive fins 210 and 211. At least one light emitting element 21 electrically connected to the positive and negative electrode conductive traces 201 and 202 of the substrate 20, a fluorescent sealant 22 for covering the at least one light emitting element 21; And a light shielding frame body 23 which covers the periphery of the fluorescent sealing material 22 and exposes only the upper surface of the fluorescent sealing material 22.

In addition, the power supply module 3 is electrically connected to the light emitting module 2, and the power supply module 3 has two lead wires 30. Thus, these two lead wires 30 can selectively pass into the two through holes 102a.

In addition, as shown in FIG. 1D, the LED lamp structure of the present invention further includes a casing module 4. The casing module 4 has an upper plate main body 40, a lower plate main body 41, and a joint plate main body 42, and the upper plate main body 40 and the joint plate main body 42 are light emitting modules, respectively. It has openings 400 and 420 exposing (2). In addition, the upper plate main body 40 and the lower plate main body 41 are fastened to each other by a plurality of screws (not shown), and the joint plate main body 42 is between the upper plate main body 40 and the heat dissipation fins 10a. To be prepared. In other words, the upper end of each heat radiation fin 10a is in contact with the joint plate main body 42, and the lower end is separated from the lower plate main body 41 by a predetermined distance H. Therefore, by using this joint plate main body 42, it becomes easy to fix the heat radiation fin 10a below the upper plate main body 40. FIG.

Fig. 1E is a side cross-sectional view showing the form in which the heat dissipation fin of the first embodiment of the LED lamp structure having the high efficiency heat dissipation function according to the present invention is in contact with the lower plate main body (the upper plate main body, the lower plate main body and the joint plate main body are added). As can be seen from the figure, according to different heat dissipation requests, the upper end and the lower end of each of the heat dissipation fins 10a are in contact with the joint plate main body 42 and the lower plate main body 41, respectively.

2A and 2B are partially exploded perspective and side cross-sectional views (top plate body, bottom plate body, and joint plate body) of a second embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention, respectively. As can be seen from the figure, the second embodiment of the present invention has a high efficiency heat radiation function including a heat radiation module 1b, a light emitting module 2, a power supply module 3, and a heat radiation board 5b. It provides a light emitting diode lamp structure B having a.

The heat dissipation module 1b has a plurality of heat dissipation fins 10b, and these heat dissipation fins 10b are radially assembled to form an accommodating space 11b in the center of the heat dissipation module 1b. Therefore, this heat dissipation module 1b is a heat dissipation module having radial fins.

Each of the heat dissipation fins 10b includes a coupling portion 100b and a fin portion 101b extending forwardly and upwardly from the side of the coupling portion 100b, and the power supply module 3 is provided between each fin portion 101b. A gap 102b is formed for passing one of the two lead wires 30 of the wire. In addition, in the second embodiment, these heat dissipation fins 10b are assembled by coupling the coupling portions 100b from side to side.

Therefore, in the second embodiment of the present invention, the most different point from the first embodiment is the addition of the heat dissipation substrate 5b, and the heat dissipation substrate 5b is accommodated in the accommodating space 11b so that the coupling portion 100b is provided. It is provided in the upper surface (1000b) of the (), the periphery of the heat radiation substrate (5b) is in contact with the inner edge (1010b) of the fin portion (101b). In addition, the light emitting module 2 is provided on the heat dissipation substrate 5b. In addition, according to the actual heat dissipation request, this heat dissipation board 5b can be designed as a hollow or solid heat dissipation board, and according to another space design, the external shape of the heat dissipation board 5b is different. It may be a circumferential shape or any shape (for example, square or polygon).

3A and 3B are partial exploded perspective and side cross-sectional views (top plate body, bottom plate body, and joint plate body) of a third embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention, respectively. As can be seen from the figure, the third embodiment of the present invention has a high-efficiency heat dissipation function including a heat dissipation module 1c, a light emitting module 2, a power supply module 3, and a heat dissipation substrate 5c. It provides a light emitting diode lamp structure C having a.

The heat dissipation module 1c has a plurality of heat dissipation fins 10c, and these heat dissipation fins 10c are radially assembled to form an accommodating space 11c in the center of the heat dissipation module 1c. Therefore, this heat dissipation module 1c is a heat dissipation module having radial fins.

Each of the heat dissipation fins 10c includes a coupling portion 100c and a fin portion 101c extending forward and upward and downward from the side of the coupling portion 100c, and the power supply is supplied between each fin portion 101c. A gap 102c is formed for passing one of the two lead wires 30 of the module 3. In addition, in the third embodiment, the heat dissipation fins 10c are assembled by coupling the coupling portions 100c from side to side.

Therefore, in the third embodiment of the present invention, the most different point from the second embodiment is that the upper end of the heat dissipation substrate 5c is in contact with the lower surface 1000c of the coupling portion 100c, and this heat dissipation substrate 5c is provided. ) Is in contact with the inner edge 1010c of the pin portion 101c. In addition, the light emitting module 2 is provided in these coupling parts 100c.

4A and 4B are partially exploded perspective and side cross-sectional views (top plate body, bottom plate body, and joint plate body) of a fourth embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention, respectively. As can be seen from the figure, the fourth embodiment of the present invention has a high-efficiency heat dissipation function including a heat dissipation module 1d, a light emitting module 2, a power supply module 3, and a heat dissipation substrate 5d. It provides a light emitting diode lamp structure D having.

The heat dissipation module 1d has a plurality of heat dissipation fins 10d, and these heat dissipation fins 10d are radially assembled to form the accommodating space 11d at the center of the heat dissipation module 1d. Therefore, this heat dissipation module 1d is a heat dissipation module having radial fins.

Each of the heat dissipation fins 10d includes a fixed portion 100d and a fin portion 101d extending upward from the fixed portion 100d, and the power supply module 3 is provided between the adjacent fixed portions 100d. A gap 102d is formed for passing one of the two lead wires 30 in the).

Therefore, in the fourth embodiment of the present invention, the most different point from the first, second and third embodiments is that the periphery of the heat radiation substrate 5d is in contact with the inner edge 1000d of the fixing portion 100d. to be. In other words, the fixing part 100d of these heat radiation fins 10d is fixed to surround the heat radiation substrate 5d. In addition, the light emitting module 2 is provided in this heat radiation board | substrate 5d.

5A and 5B are partially exploded perspective and side cross-sectional views (top plate body, bottom plate body, and joint plate body) of a fifth embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention, respectively. As can be seen from the figure, the fifth embodiment of the present invention has a high-efficiency heat dissipation function including a heat dissipation module 1e, a light emitting module 2, a power supply module 3, and a heat dissipation substrate 5e. It provides a light emitting diode lamp structure E having.

The heat dissipation module 1e has a plurality of heat dissipation fins 10e, and these heat dissipation fins 10e are radially assembled to form an accommodating space 11e at the center of the heat dissipation module 1e. Therefore, this heat dissipation module 1e is a heat dissipation module having radial fins.

Each of the heat dissipation fins 10e includes a fitting portion 100e and a fin portion 101e extending forward, upward, and downward from a side of the fitting portion 100e, and a power supply module for each fin portion 101e. A gap 102e for passing one of the two lead wires 30 in (3) is formed.

Therefore, in the fifth embodiment of the present invention, the most different point from the other embodiments is that a plurality of grooves 40e corresponding to the fitting portion 100e are formed around the heat dissipation substrate 5e. By fitting the fitting portions 100e of the heat dissipation fins 10e into the 40e, the circumference of the heat dissipation substrate 5e is brought into contact with the inner edge 1010e of the fin portion 101e. In addition, the light emitting module 2 is provided on the heat dissipation substrate 5e.

6 shows a light emitting diode lamp assembly having a high efficiency heat dissipation function according to the present invention. As can be seen from the drawings, the present invention provides a light emitting diode lamp assembly having a high efficiency heat dissipation function comprising a plurality of light emitting diode lamp structures F, a power plug 3 'and a casing module 4'. . Each light emitting diode lamp structure F further includes a heat dissipation module 1 ', a light emitting module 2', and a power supply module (not shown). In addition, these light emitting diode lamp structures F are arranged in a street lamp structure.

The heat dissipation module 1 'has a plurality of heat dissipation fins 10', and these heat dissipation fins 10 'are radially assembled to form the accommodating space 11'. The light emitting module 2 'is accommodated in the accommodation space 11' of the heat dissipation module 1 ', and the power supply module is electrically connected to the light emitting module 2'.

In addition, the power plug 3 'is electrically connected to the power supply module of each light emitting diode lamp structure F, respectively. In other words, each power supply module has one positive electrode lead wire and one negative electrode lead wire (not shown), and the positive electrode lead wire and the negative electrode lead wire of each power supply module each have this power plug (3 '). Is electrically connected to the positive electrode terminal 31 'and the negative electrode terminal 32'.

In addition, the casing module 4 'includes an upper plate main body 40', a lower plate main body 41 'which is coupled to the upper plate main body 40', and an upper plate main body 40 'and a heat dissipation fin 10'. A joint plate main body 42 'provided in the upper plate main body 40' and the joint plate main body 42 ', respectively, having openings 400' and 420 for exposing the light emitting module 2 ', respectively. ´) In addition, the upper plate main body 40 'and the lower plate main body 41' are fastened to each other by a plurality of screws S, and the joint plate main body 42 'is connected to the upper plate main body 40' and the heat dissipation fins 10 '. Installed between). In addition, according to different usage requirements, the LED lamp assembly has a plurality of heat dissipation sheets 5 'provided between the upper plate main body 40' and the lower plate main body 41 '. Surrounds the light emitting diode lamp structure (F).

However, the arrangement of the light emitting diode lamp structure F is not limited to only the street lamp structure, and any combination of shapes falls within the protection scope of the present invention. For example, the light emitting diode lamp structure F may be arranged in a straight line and may be a desk lamp.

In addition, the five LED lamp structures (A, B, C, D, E) disclosed in the above different embodiments are all applicable to the LED lamp assembly of the present invention. That is, the light emitting diode lamp structure F may be replaced with another kind of light emitting diode lamp structure according to the user's request.

As described above, the present invention provides a high efficiency heat radiation effect to a high output light emitting diode by using a heat radiation module having radial heat radiation fins. Therefore, the light emitting diode of the present invention can be used at a relatively low temperature, thereby ensuring the service life of the light emitting diode. In other words, the light emitting diode lamp structure and assembly according to the present invention can exhibit a high efficiency heat dissipation function, thereby improving the service life of the light emitting diodes (particularly, high output light emitting diodes).

The foregoing descriptions are merely details and drawings of preferred specific embodiments of the present invention, and do not limit the claims of the present invention. The scope of rights claimed by the present invention is based on the claims, and those skilled in the art can make appropriate changes, modifications, and the like within the field of the present invention, and the practice is included in the scope of the present invention.

1A is a partially exploded perspective view of a first embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention.

1B is an assembled perspective view of a first embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention.

1C is a top view of a first embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention.

1D is a side cross-sectional view (with an upper plate body, a lower plate body and a joint plate body added) of a first embodiment of a LED lamp structure having a high efficiency heat dissipation function according to the present invention.

FIG. 1E is a side cross-sectional view (with an upper plate body, a lower plate body, and a joint plate body added) showing a form in which the heat dissipation fin of the first embodiment of the LED lamp structure having the high efficiency heat dissipation function according to the present invention is in contact with the lower plate body.

2A is a partially exploded perspective view of a second embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention;

2B is a side cross-sectional view (with an upper plate body, a lower plate body and a joint plate body added) of a second embodiment of a LED lamp structure having a high efficiency heat dissipation function according to the present invention.

3A is a partially exploded perspective view of a third embodiment of a LED lamp structure having a high efficiency heat dissipation function according to the present invention;

3B is a side cross-sectional view (with an upper plate body, a lower plate body and a joint plate body added) of a third embodiment of a LED lamp structure having a high efficiency heat dissipation function according to the present invention.

4A is a partially exploded perspective view of a fourth embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention;

4B is a side cross-sectional view (with an upper plate body, a lower plate body and a joint plate body added) of a fourth embodiment of a LED lamp structure having a high efficiency heat dissipation function according to the present invention.

5A is a partially exploded perspective view of a fifth embodiment of a light emitting diode lamp structure having a high efficiency heat dissipation function according to the present invention;

5B is a side cross-sectional view (with an upper plate body, a lower plate body and a joint plate body added) of a fifth embodiment of a LED lamp structure having a high efficiency heat dissipation function according to the present invention.

6 is a view showing a light emitting diode lamp assembly having a high efficiency heat radiation function according to the present invention.

[Description of the code]

A, B, C, D, E, F... Light emitting diode lamp structure

1a... Heat dissipation module

2… Light emitting module

3 ... Power supply module

10a... Heat dissipation fins

11a... Accommodation space

100a... Joint

101a... Pin part

102a... Thru Hall

201... Positive Conductive Trace

202... Negative Challenge Trace

20 ... Board

210, 211... Internal challenge pin

21... Light emitting element

22 ... Fluorescent sealant

23 ... Shading frame body

30 ... Lead wire

4… Casing module

40... Top body

41... Lower plate

42... Joint plate body

400, 420... Opening

1b... Heat dissipation module

5b... Heat dissipation board

10b... Heat dissipation fins

11b... Accommodation space

100b... Joint

101b... Pin part

102b... gap

1000b... Joint surface

1c... Heat dissipation module

5c... Heat dissipation board

10c... radiation

11c... Accommodation space

100c... Joint

101c... Pin part

102c... gap

1010c... Inner edge of fin

1d... Heat dissipation module

5d... Heat dissipation board

10d... Heat dissipation fins

11d... Accommodation space

100d... Fixture

101d... Pin part

102d... gap

1000d... Inner edge of fixture

1e... Heat dissipation module

5e... Heat dissipation board

10e... Heat dissipation fins

11e... Accommodation space

100e... Fitting

101e... Pin part

102e... gap

40e... Groove

1010e... Inner edge of fin

One… Heat dissipation module

2… Light emitting module

3´… Power plug

4… Casing module

10´… Heat dissipation fins

11´… Accommodation space

31´ A positive electrode

32´ Negative

40´… Top body

41´… Lower plate

42´ Joint plate body

400 ', 420'. Opening

5´… Heat resistant sheet

Claims (50)

A heat dissipation module having a plurality of heat dissipation fins radially assembled to form a receiving space; A light emitting module accommodated in an accommodation space of the heat dissipation module; And, And a power supply module electrically connected to the light emitting module. A gap is formed between the heat dissipation fin and the heat dissipation fin, and the light emitting module is exposed to the outside through the gap. delete The method of claim 1, And a casing module having a top plate body, a bottom plate body coupled to the top plate body, and a joint plate body provided between the top plate body and the heat dissipation fin, wherein the top plate body and the joint plate body are each the light emitting module. A light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that it has an opening for exposing. The method of claim 3, The upper and lower ends of each of the heat dissipation fins are respectively in contact with the joint plate body and the lower plate body, the LED lamp structure having a high efficiency heat dissipation function. The method of claim 3, An upper end of each of the heat dissipation fins is in contact with the joint plate body, the lower end of the light emitting diode lamp structure having a high efficiency heat dissipation, characterized in that the predetermined distance from the lower body. The method of claim 1, The light emitting module includes: a substrate having positive and negative conductive traces, two internal conductive pins, at least one light emitting element electrically connected to the positive and negative conductive traces of the substrate via two internal conductive pins; And a light shielding frame body covering the at least one light emitting element and a light shielding frame body covering the periphery of the fluorescent sealing material and exposing only an upper surface of the fluorescent sealing material. The method of claim 6, The power supply module has two lead wires electrically connected to the positive and negative conductive traces of the substrate, respectively. The method of claim 1, The light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that it further comprises a heat dissipation substrate provided between the heat dissipation fins. The method of claim 8, The heat dissipation substrate is a light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that the hollow heat radiation substrate. The method of claim 8, The heat dissipation substrate is a light emitting diode lamp structure having a high efficiency heat dissipation, characterized in that the solid heat dissipation substrate. The method of claim 8, The heat dissipation substrate is a light emitting diode lamp structure having a high efficiency heat dissipation, characterized in that the columnar heat dissipation substrate. The method of claim 1, Each of the heat dissipation fins includes a coupling portion and a fin portion extending upwardly and forwardly from a side of the coupling portion. The method of claim 12, The light emitting module is a light emitting diode lamp structure having a high efficiency heat dissipation, characterized in that installed in the coupling portion of the heat dissipation substrate. The method of claim 12, The heat dissipation fin is a light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that assembled by mutual coupling of the coupling portion. The method of claim 12, The power supply module has two lead wires, and a through-hole for passing one of the two lead wires is formed between each coupling portion, the LED lamp structure having a high efficiency heat dissipation function. The method of claim 12, The light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that it further comprises a heat dissipation substrate in contact with the inner edge of the fin portion, received in the accommodation space and installed on the upper surface of the coupling portion. The method of claim 16, The light emitting module is a light emitting diode lamp structure having a high efficiency heat dissipation, characterized in that installed on the heat dissipation substrate. The method of claim 16, The power supply module has two lead wires, and a light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that the gap for passing one of the two lead wires is formed between each coupling portion. The method of claim 1, Each of the heat dissipation fins includes a coupling portion and a fin portion extending upwardly and downwardly forward and downward from a side of the coupling portion. The method of claim 19, The light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that further comprising a heat dissipation substrate in contact with the lower surface of the coupling portion and the inner edge of the fin portion. The method of claim 19, The light emitting module is a light emitting diode lamp structure having a high efficiency heat radiation, characterized in that installed in the coupling portion. The method of claim 19, The heat dissipation fin is a light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that assembled by mutual coupling of the coupling portion. The method of claim 19, The power supply module has two lead wires, and a light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that the gap for passing one of the two lead wires is formed between each coupling portion. The method of claim 1, Each of the heat dissipation fins includes a fixing portion and a fin portion extending upwardly from the fixing portion. The method of claim 24, The light emitting diode lamp structure having a high efficiency heat radiation function characterized in that it further comprises a heat radiation substrate in contact with the inner edge of the fixing portion. The method of claim 24, The light emitting module is a light emitting diode lamp structure having a high efficiency heat dissipation, characterized in that installed on the heat dissipation substrate. The method of claim 24, The fixing part of the heat dissipation fins, the LED lamp structure having a high efficiency heat dissipation function, characterized in that fixed to surround the heat dissipation substrate. The method of claim 24, The power supply module has two lead wires, and a light emitting diode lamp structure having a high efficiency heat dissipation function, characterized in that the gap for passing one of the two lead wires is formed between each fixing portion. The method of claim 1, Each of the heat dissipation fins includes a fitting portion and a fin portion extending upwardly and downwardly forward and downward from a side of the fitting portion. 30. The method of claim 29, A plurality of grooves corresponding to the fitting portion are formed around the plurality of recesses, and the fitting portions of the respective heat dissipation fins are inserted in the grooves, thereby further comprising a heat dissipation substrate for contacting the inner edges of the fin portions. Light emitting diode lamp structure having a heat dissipation function. 30. The method of claim 29, The light emitting module is a light emitting diode lamp structure having a high efficiency heat dissipation, characterized in that installed on the heat dissipation substrate. 30. The method of claim 29, And the power supply module has two lead wires, and the gap for passing one of the two lead wires is formed between each fitting part. A heat dissipation module having a plurality of heat dissipation fins, the heat dissipation module radially assembled such that the heat dissipation fins form an accommodating space, a light emitting module accommodated in the accommodating space of the heat dissipation module, and a power supply module electrically connected to the light emitting module. A plurality of light emitting diode lamp structures; And A power plug electrically connected to a power supply module of each light emitting diode lamp structure; A gap is formed between the heat dissipation fin and the heat dissipation fin, and the light emitting module is exposed to the outside through the gap. 34. The method of claim 33, Each power supply module has one positive electrode lead wire and one negative electrode lead wire electrically connected to the positive electrode terminal and the negative electrode terminal of the power plug, respectively. 34. The method of claim 33, And a casing module including a top plate body, a bottom plate body coupled to the top plate body, and a joint plate body provided between the top plate body and the heat dissipation fin, wherein the top plate body and the joint plate body are each the light emitting module. The light emitting diode lamp assembly having a high efficiency heat dissipation function, characterized in that it has a plurality of openings for exposing. 36. The method of claim 35 wherein The LED lamp assembly having a high efficiency heat dissipation function is provided between the upper plate main body and the lower plate main body, the plurality of heat dissipation sheet surrounding the light emitting diode lamp structure. 34. The method of claim 33, Each of the heat dissipation fins of each of the heat dissipation modules includes a coupling portion and a fin portion extending upwardly and upwardly from the side of the coupling portion. The method of claim 37, Each of the light emitting modules is a light emitting diode lamp assembly having a high efficiency heat dissipation, characterized in that installed in the coupling portion of each of the heat dissipation substrate. The method of claim 37, Each of the light emitting diode lamp structures further includes a heat dissipation substrate accommodated in the accommodating space and installed on an upper surface of the coupling part, and the periphery of the heat dissipation substrate is in contact with an inner edge of the fin part. LED lamp assembly having a. 40. The method of claim 39, The light emitting diode lamp assembly having a high efficiency heat dissipation, characterized in that each of the light emitting module is installed on the corresponding heat dissipation substrate. 34. The method of claim 33, Each of the heat dissipation fins of each of the heat dissipation modules includes a coupling part and a fin part extending forward and upward and downward from a side of the coupling part. The method of claim 41, wherein Each of the LED lamp structures further includes a heat dissipation substrate in contact with a lower surface of the coupling part and an inner edge of the fin part. The method of claim 41, wherein The light emitting diode lamp assembly having a high efficiency heat dissipation, characterized in that each light emitting module is installed in the corresponding coupling portion. 34. The method of claim 33, Each of the heat dissipation fins of each of the heat dissipation modules includes a fixing portion and a fin portion extending forward from the fixing portion. The method of claim 44, Each of the light emitting diode lamp structures further comprises a heat dissipation substrate in contact with an inner edge of the fixing part. The method of claim 44, The light emitting diode lamp assembly having a high efficiency heat dissipation, characterized in that each of the light emitting module is installed on the corresponding heat dissipation substrate. The method of claim 44, Each LED lamp structure has a heat dissipation substrate, The fixing part of the heat dissipation fin of each heat dissipation module is a light emitting diode lamp assembly having a high efficiency heat dissipation function, characterized in that fixed to surround the heat dissipation substrate. 34. The method of claim 33, Each of the heat dissipation fins of each of the heat dissipation modules includes a fitting portion and a fin portion extending upward and upward and downward from a side of the fitting portion. The method of claim 48, Each of the light emitting diode lamp structures further includes a heat dissipation substrate having a plurality of grooves corresponding to the fitting portion therein, and inserts fitting portions of the heat dissipation fins into the grooves to surround the heat dissipation substrate. Light emitting diode lamp assembly having a high efficiency heat dissipation, characterized in that the contact with the inner edge. The method of claim 49, Wherein each of the light emitting modules is mounted on the corresponding heat dissipation substrate.

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