KR100888669B1 - High-luminance power led light - Google Patents

High-luminance power led light Download PDF

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Publication number
KR100888669B1
KR100888669B1 KR1020080021701A KR20080021701A KR100888669B1 KR 100888669 B1 KR100888669 B1 KR 100888669B1 KR 1020080021701 A KR1020080021701 A KR 1020080021701A KR 20080021701 A KR20080021701 A KR 20080021701A KR 100888669 B1 KR100888669 B1 KR 100888669B1
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South Korea
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led
cover
upper cover
led light
delete delete
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KR1020080021701A
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Korean (ko)
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박수용
박종철
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주식회사 아이룩스
주식회사 월드조명
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/27Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00Protecting lighting devices from damage
    • F21V15/01Housings, e.g. material or assembling of housing parts
    • F21V15/015Devices for covering joints between adjacent lighting devices; End coverings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/104Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening using feather joints, e.g. tongues and grooves, with or without friction
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements

Abstract

A high-luminance power led light is provided to apply external power to emitting par of a LED by covering a cap having an electrode terminal on the top cover and open bottom cover. An LED lighting-emitting area(10) radiates when an external power is supplied to the device. The LED lighting-emitting area is mounted on a mounting groove of the top cover(20). The LED lighting-emitting area induces heat generated from the LED lighting-emitting area. The LED lighting-emitting area has a semi-cylindrical, and the bottom cover(30) is combined with the top cover so that it is separated. The bottom cover has the cross section of semicircular arc, and the bottom cover disperses the light emitted from the LED lighting-emitting area.

Description

고휘도 파워 엘이디등{high-luminance power LED light} High-brightness LED, such as power {high-luminance LED light power}

본 발명은 고휘도 파워 엘이디등에 관한 것으로서, 더욱 상세하게는 고휘도용 엘이디발광부를 장착한 상부커버의 둘레면에 히트싱크와 같은 방열부재를 형성함으로써 엘이디발광부에서 발생하는 열기를 상부커버를 통해 발산시 방열부재로 인해 방열시간을 단축시킴에 따라 엘이디발광부의 과부하를 방지할 수 있도록 하고, 상부커버에 하부커버를 슬라이드 결합함에 따라 조립성을 향상시킴과 아울러 상부커버와 하부커버의 개방된 측면에 전극단자를 갖는 캡을 씌움으로써 엘이디발광부를 외부로부터 보호하면서 전극단자를 통해 외부 전원을 엘이디발광부에 인가할 수 있도록 하는 간단한 구조의 고휘도 파워 엘이디등에 관한 것이다. The present invention when the heat generated from the LED light emission unit by forming the heat radiating member, such as, more particularly, to a heat sink on the circumferential surface of the upper cover is mounted unit LED light emission for high brightness as regarding the high-intensity power LEDs dissipate through the top cover the open side of so as to prevent the LED light-emitting portion overload and, as well as a top cover and improve the assemblability Sikkim as a slide coupled to the lower cover to the top cover and the bottom cover according to Sikkim shorten the heat radiation time due to the heat radiation member electrode ssuium by a cap having a terminal or the like the LED light-emitting section relates to the simple structure, high brightness LED power through the electrode terminal while being protected from the outside so as to apply the external power supply unit to the LED light emission.

조명을 위해 사용되는 일반적인 전구는 형광등, 백열등 또는 산업용으로 사용하는 메탈 네온등으로 대별되며, 이들 전구들은 대부분이 유리관 안에 가스를 주입하여 사용하는 가스 방전관 구성이다. Typical bulb used for the light is divided into metal, such as by using neon in a fluorescent lamp, incandescent lamp or industrial use, these bulbs have a gas discharge tube configuration that is most used in the gas injected into the glass tube.

상기한 일반적인 전구의 경우 유리관의 소손으로 인한 가스 유출시 대기 오 염의 원인이 될 수 있으며, 휘도를 밝게 하고자 할 시에는 그에 따른 소비 전력이 상승하게 되고, 그에 알맞은 전력선 공사 등을 행해야 하므로 시설비용과 유지 관리비용이 과도하게 소요되는 등의 문제점이 있었다. Since the case of the typical light bulb it can be a gas atmosphere o salt causes of leakage due to damage of the glass tube, and it is raised in power consumption hence when you wish to lighten the brightness, subjected to the like thereto suitable power line, Ltd. facility cost and there are problems such as maintenance costs are excessively spent.

한편 상기한 전구의 문제점을 해소할 대안으로 근자에는 소비전력이 낮은 LED를 이용한 조명등 개발이 제안되고 있다. On the other hand as an alternative to solve the problems of the above-described near-ultraviolet bulb it has been proposed lighting development with low power consumption LED.

기존 제안된 바 있는 LED를 이용한 조명등들은 LDE가 전기적으로 연결된 기판과, 기판이 고정되는 방열수단으로 구성되어 있으나, 이러한 구성의 경우 기판과 방열판이 별개의 부품으로 구성되어 있어 방열 효과가 저하되므로 충분한 방열효과를 득할 수 없는 어려움이 있었다. Luminaire using an LED in the existing proposed are the so LDE is however composed of heat-dissipating means which is electrically the substrate and the substrate is fixed is connected, in the case of such a structure there is a substrate and the heat sink is composed of discrete components decreases the heat radiation effect sufficient there was a difficulty that can not deukhal the cooling effect.

본 발명은 상기한 종래 기술의 문제점을 개선하기 위하여 안출된 것으로서, 고휘도용 엘이디발광부를 상부커버에 장착함과 더불어 이 상부커버의 둘레면에 외부 공기와의 접촉면적을 늘리도록 방열부재를 형성함으로써 방열시간을 단축시키게 되고, 이에 따라 엘이디발광부의 과부하를 방지할 수 있으며, 상부커버의 하측에 조사되는 빛의 분산용 하부커버를 슬라이드 삽입하면서 조립 작업을 용이하게 할 수 있을 뿐만 아니라, 상부커버와 하부커버의 개방된 측에 전극단자를 갖는 캡을 씌움으로써 간단한 구조로 외부 전원을 엘이디발광부에 인가하도록 한 고휘도 파워 엘이디등을 제공하는데 그 목적이 있다. The present invention, by forming the radiation member so as to increase the contact area with the outside air on the circumferential surface of the well as also attached as been made, the light-emitting parts of high-intensity LED for a top cover in order to improve the problems of the related art top cover and thereby reduce the heat dissipation time, so that it is possible to prevent the LED light-emitting portion overload, as well as the slide insert dispersion lower covers for a light to be irradiated to the upper cover the lower side can be achieved which is capable of facilitating the assembly operation, the upper cover and the to provide an external power source to a cap having an electrode terminal on the open side with a simple structure by ssuium a high brightness to be applied to the LED light-emitting unit such as a power LED of the lower cover it is an object.

상기한 과제를 해결하기 위한 본 발명은 외부 전원의 공급시 발광하는 엘이디발광부, 상기 엘이디발광부를 장착하여 상기 엘이디발광부의 발열시 열기를 방출 유도하도록 금속재질로 형성된 상부커버, 상기 상부커버에 형성되어 상기 엘이디발광부에서 조사되는 빛을 통과시키며 분산하는 하부커버 및 상기 상부커버의 외측 둘레면에 형성되어 방열면적을 증가시키는 방열부재를 포함하여 이루어져, 상기 방열부재는 상기 상부커버의 둘레면에서 외부 공기와의 접촉 면적을 증가시킴으로써 상기 엘이디발광부의 발열 방출 시간을 단축시키는 고휘도 파워 엘이디등을 특징으로 한다. The present invention for solving the above problem is a light emitting LED which emits light when supplied with the external power supply unit, the upper cover is formed of a metallic material to the mounting parts of the LED light emission stimulated emission of the LED light-emitting portion to open during heating to form the top cover It is made, including the heat radiation member, the heat radiation member that is formed on the outer peripheral surface of the lower cover and the upper cover balancing sikimyeo pass the light emitted from the LED light-emitting unit increases the heat radiation area is along the circumferential surface of the upper cover by increasing the contact area with the external air characterized by a high luminance such as a power LED wherein the LED light-emitting portion to shorten the heating time released.

상기와 같이 구성되는 본 발명에 의한 고휘도 파워 엘이디등은 고휘도용 엘이디발광부를 상부커버에 장착함과 더불어 이 상부커버의 둘레면에 외부 공기와의 접촉면적을 늘리도록 방열부재를 형성함으로써 방열시간을 단축시키게 되고, 이에 따라 엘이디발광부의 과부하를 방지할 수 있는 효과가 있다. High-intensity power LED, such as according to the present invention constituted as described above is a heat dissipation time, by forming the radiation member so as to increase the contact area with the outside air on the circumferential surface of the upper cover with the box mounted parts of the light emitting LED for high-luminance in the upper cover it is thereby reduced, the effect of this to avoid the LED light-emitting portion in accordance with the overload.

그리고, 본 발명에 의한 고휘도 파워 엘이디등은 상부커버의 하측에 조사되는 빛의 분산용 하부커버를 슬라이드 삽입하면서 조립 작업을 용이하게 할 수 있는 효과가 있다. Then, the high-brightness LED, such as a power according to the present invention there is an effect that it is possible to facilitate the assembling operation and the slide insert lower cover for dispersion of light to be irradiated to the lower side of the upper cover.

또한, 본 발명에 의한 고휘도 파워 엘이디등은 상부커버와 하부커버의 개방 된 측에 전극단자를 갖는 캡을 씌움으로써 간단한 구조로 외부 전원을 엘이디발광부에 인가할 수 있는 효과가 있다. Moreover, high-brightness LED, such as a power according to the present invention has an effect that can be applied to the light emitting unit to an external power source with a simple structure by ssuium the cap having an electrode terminal on the open side of the upper cover and the lower cover the LED.

이하, 본 발명의 실시예들을 첨부된 도면을 참조하여 상세히 설명한다. With reference to the accompanying drawings, embodiments of the present invention will be described in detail.

도 1은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 사시도이고, 도 2는 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 내부도이며, 도 3은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 단면도이다. 1 is a perspective view of such high-intensity power LED according to one embodiment of the invention, Figure 2 is an interior view of one such high-intensity power LED according to an embodiment of the present invention, Figure 3 according to one embodiment of the present invention High brightness is a cross-sectional view of the power LED and the like.

그리고, 도 4는 본 발명의 다른 실시예에 따른 고휘도 파워 엘이디등의 조립 상태도이다. And, Figure 4 is a state diagram of the assembly such as high-intensity power LED according to another embodiment of the present invention.

도 1 내지 도 3에 도시된 바와 같이, 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등은 엘이디발광부(10), 상부커버(20), 하부커버(30), 방열부재(40)로 크게 형성된다. As shown in Figure 1 to Figure 3, the high-intensity power LED, etc. in accordance with one embodiment of the present invention is largely to the LED light-emitting part 10, the top cover 20, bottom cover 30, heat-radiating member 40 It is formed.

상기 엘이디발광부(10)는 외부 전원 공급시 고휘도 발광하여 빛을 조사하는 역할을 한다. The LED light emission unit 10 is responsible for irradiating light to the light-emitting high luminance when an external power supply.

특히, 상기 엘이디발광부(10)는 상부커버(20)에 장착 고정되어 외부 전원을 공급받게 된다. In particular, the LED light emission unit 10 is fixed mounted to the top cover 20 receive external power.

이때, 상기 엘이디발광부(10)는 보드(11), 절연층(12), 회로패턴(13), 엘이디(LED,14)로 이루어진다. At this time, the LED light emission unit 10 is comprised of board 11, the insulating layer 12, a circuit pattern 13, an LED (LED, 14).

여기서, 상기 엘이디(14)는 고휘도용 파워 엘이디로써 발광시 많은 열을 발 생시키게 된다. Here, the LED 14 is thereby occurs a large amount of heat during light emission by the LED power for a high luminance.

그래서, 상기 보드(11)는 금속재질로 이루어져 엘이디(14)의 열기를 외부로 전달하는 역할을 한다. So, the board 11 is made of a metal material and serves to transfer the heat of the LED 14 to the outside.

특히, 상기 보드(11)는 상부커버(20)의 내측에 고정 장착된다. In particular, the board 11 is fixed to the inside of the upper cover 20.

이때, 상기 보드(11)는 하나 구비되어 모든 엘이디(14)를 형성할 수도 있고, 조각으로 형성되어 각각에 엘이디(14)를 형성할 수도 있다. In this case, the board 11 may be equipped with one form of all the LED 14, is formed in a piece can be formed to the LED 14, respectively.

그리고, 상기 절연층(12)은 보드(11)의 외측 둘레면에 도포된다. In addition, the insulating layer 12 is applied to the outer circumferential surface of the board 11.

상기 절연층(12)은 엘이디(14)에 외부 전원을 공급하는 회로패턴(13)을 프린팅 등의 방식으로 형성하기 위해 보드(11)에 도포된다. The insulating layer 12 is applied on the board 11 to form a circuit pattern 13 for supplying external power to the LED 14 in a manner such as printing.

또한, 상기 절연층(12)은 엘이디(14)나 회로패턴(13)이 금속재질의 보드(11)에 직접적으로 접하는 것을 방지하는 절연 기능을 행한다. In addition, the insulating layer 12 is carried out the isolation feature to prevent the LED 14 and the circuit pattern 13 directly in contact with the board 11 made of a metal.

이때, 상기 상부커버(20)와 직접적으로 접하는 보드(11)의 하측면에는 절연층(12)이 도포되지 않도록 한다. At this time, the lower surface of the upper cover 20 and the board 11 is directly in contact with the coating is to prevent the insulating layer 12.

이는, 절연층(12)의 하측면에 절연층(12)이 도포되면 절연층(12)과 상부커버(20)의 직접적 접촉을 막아 방열을 위한 열전달성능을 저하시키기 때문이다. This is because lowering the heat transfer for the heat radiation makes a direct contact with the insulating layer 12 and the upper cover 20, when the insulating layer 12 is applied to the bottom surface of insulating layer 12.

특히, 상기 회로패턴(13)은 절연층(12)에 인쇄되어 외부 전원의 공급시 전류의 흐름을 안내하는 역할을 한다. In particular, the circuit pattern 13 is printed on the insulating layer 12 serves to guide the flow of current for supply of the external power supply.

그리고, 상기 엘이디(14)는 회로패턴(13) 상에 해당되는 절연층(12)에 형성된다. In addition, the LED 14 is formed on the insulating layer 12 corresponding to the circuit pattern 13.

한편, 상기 상부커버(20)는 엘이디발광부(10)를 고정 장착하여 엘이디발광 부(10)의 발열시 열기를 방출 유도하도록 금속재질로 형성된다. On the other hand, the upper cover 20 is formed to open during heating of the LED light emission unit 10 is fixedly mounted to the LED light-emitting part 10 to a metal material so as to induce discharge.

특히, 상기 상부커버(20)는 엘이디발광부(10)에 포함되는 엘이디(14)의 발열량이 많이 빛을 조사시 뜨겁기 때문에 이 열기를 외부로 방출시킬 수 있도록 전열성을 갖는 금속재질로 이루어짐이 바람직하다. In particular, made of an metallic material having a pre recessive so as to radiate the heat to the outside because the upper cover 20 has an LED light emitting part 10, a lot of heat generation of the LED 14 is hot when irradiated with light that is included in the desirable.

이때, 상기 보드(11)와 상부커버(20)는 엘이디(14)의 열기를 외부로 배출하도록 유도하는 역할을 함에 따라 모두 전열성을 갖는 재질로 형성됨이 바람직하다. In this case, the board 11 and the upper cover 20 is preferably formed of a material having a thermosensitive both before as a role to drive to discharge the heat of the LED 14 to the outside.

또한, 상기 상부커버(20)는 내측면에 안착홈(22)을 형성하여 엘이디발광부(10)를 고정 장착한다. In addition, the upper cover 20 is fixedly mounted to the LED light-emitting part 10 to form the receiving groove 22 on the inside surface.

여기서, 상기 안착홈(22)은 엘이디발광부(10)를 매입하여 안착함으로써 엘이디(14)의 조사 각도를 좁혀 조사되는 빛의 밝기를 향상시키는 기능도 한다. Here, a function of the seating groove 22 improves the brightness of the light to be irradiated to narrow the irradiation angle of the LED 14 by mounting pieces to the LED light emission unit 10.

그리고, 상기 엘이디발광부(10)는 상부커버(20)의 안착홈(22)에 분리 가능하게 장착됨으로써 교체를 용이하게 할 수 있도록 함이 바람직하다. And, the LED light emission unit 10 is preferably also to facilitate replacement by being detachably mounted in the mounting groove 22 of the upper cover 20.

더욱 상세히, 상기 상부커버(20)는 체결구(24) 특히, 상기 안착홈(22)은 바닥면에 체결구(24)를 함몰 형성된다. The upper cover 20 is more particularly fastener 24, in particular, the mounting groove 22 is formed a recessed fasteners 24 to the bottom surface.

그리고, 상기 엘이디발광부(10)의 보드(11)에는 체결부재(17)가 삽입되고, 이 체결부재(17)는 체결구(24)와 체결된다. Then, the board 11 of the LED light emission unit 10 has been inserted into the fastening member 17, the fastening member 17 is fastened with fasteners (24).

이때, 상기 체결부재(17)는 볼트나 스크류와 같은 체결요소로 한다. At this time, the fastening member 17 is a fastener such as a bolt or screw.

아울러, 상기 체결부재(17)는 보드(11)에만 삽입될 수도 있고, 보드(11) 및 절연층(12)에 함께 삽입되어 체결구(24)에 결속된다. In addition, the fastening member 17 is inserted with the board may be inserted (11) only, the board 11 and the insulating layer 12 is bound to the fastener (24).

이 경우, 상기 체결구(24)는, 도시하지 않았지만, 내측면에 탭을 형성함이 바람직하다. In this case, the fastener 24, although not shown, it is preferable to form a tab on the inner surface.

그리고, 상기 체결부재(17)는 보드(11)에 인쇄된 회로패턴(13)에 손상을 주지 않도록 보드(11)에 구비된다. And, the fastening member 17 is provided in the board 11 so as not to damage the circuit pattern 13 printed on the board 11.

또한, 상기 하부커버(30)는 상부커버(20)의 하측에 형성되어 엘이디발광부(10)를 보호하는 역할을 한다. In addition, the bottom cover 30 serves to protect the LED light emitting part is formed at the lower side 10 of the upper cover 20.

이때, 상기 하부커버(30)는 엘이디발광부(10)의 엘이디(14)가 발광시 빛이 투과되도록 투명한 재질 또는 반투명한 재질로 형성된다. In this case, the lower cover 30 is formed of a transparent material or a translucent material so that light is transmitted when the LED 14 of the LED light emission unit 10 emits light.

한편, 상기 하부커버(30)는 엘이디발광부(10)의 유지 보수를 위해 상부커버(20)에 분리 가능하게 결합됨이 바람직하다. On the other hand, the lower cover 30 is coupled detachably to the upper cover 20 is preferred for maintenance of the LED light emission unit 10.

더욱 상세히, 상기 하부커버(30)와 상부커버(20)는 적어도 서로 대칭되는 일측면을 개방한다. More specifically, the lower cover 30 and upper cover 20 is opened to at least one side that is symmetric with each other.

편의상, 상기 하부커버(30)와 상부커버(20)는 양측을 개방한 호 형상 또는 타원호 형상으로 도시한다. For convenience, the lower cover 30 and upper cover 20 are shown in one arc-shaped or oval-arc shape opened to both sides.

그리고, 상기 하부커버(30)는 서로 마주하는 테두리에 슬라이드리브(52)를 내측 방향으로 연장 형성한다. In addition, the lower cover 30 provided along the slide rib 52, the edge facing each other inwardly.

아울러, 상기 상부커버(20)는 슬라이드리브(52)를 슬라이드 안내하도록 슬라이드홈(56)을 갖는 돌부(54)를 돌출 형성한다. In addition, the upper cover 20 is protruded to form a protrusion 54 having a slide groove 56 so as to slide the slide guide rib (52).

그래서, 상기 슬라이드리브(52)가 돌부(54)의 슬라이드홈(56)을 따라 슬라이드 됨으로써 하부커버(30)는 상부커버(20)에 슬라이드 결합 또는 분리 가능하게 된다. Thus, by being the slide rib 52 slides along the slide groove 56 of the protrusion 54, the lower cover 30 is slidably coupled or separated to the upper cover 20.

따라서, 상기 하부커버(30)와 상부커버(20)는 테두리의 접촉면적을 증가시키면서 슬라이드 조립되어 외부 물기나 이물질로부터 엘이디발광부(10)를 보호하게 된다. Thus, the lower cover 30 and upper cover 20 is slide assembly while increasing the contact area between the border is protected from external moisture or foreign matter LED light emission unit 10.

물론, 상기 상부커버(20)는 양쪽 외측면에 슬라이드홈(56)을 형성할 수도 있다. Of course, the upper cover 20 may be formed in the slide groove 56 in the outside face of each side.

또한, 상기 방열부재(40)는 상부커버(20)의 외측 둘레면에 형성되어 방열면적을 증가시키는 역할을 한다. In addition, the heat dissipation member 40 serves to be formed on the outer peripheral surface of the upper cover 20 increase the heat radiating area.

이때, 상기 방열부재(40)는 상부커버(20)의 둘레면에 연속되는 산과 골 형상이거나 또는 돌출되는 핀 형상으로 형성되어 외부 공기와의 접촉 면적을 증가시킴으로써 방열시간을 단축시킴에 따라 엘이디(14)를 포함한 엘이디발광부(10)의 과열을 방지하게 된다. In this case, the heat radiation member 40 according to Sikkim reduce the heat dissipation time, by increasing the contact area with the external air is formed in a pin shape that is continuous with the peripheral surface ridge and valley shape, or or the protrusion of the upper cover 20, an LED ( overheating of the LED light emission unit 10 including 14) is prevented.

한편, 상기 하부커버(30)와 상부커버(20)는 개방된 양측면을 캡(60a)으로 막음 처리함으로써 엘이디발광부(10)를 보호함이 바람직하다. On the other hand, the lower cover 30 and upper cover 20 by treatment with blocking the open opposite side by a cap (60a), it is preferable to protect the LED light emission unit 10.

이때, 상기 캡(60a)은 외부 전원을 인가받아 엘이디발광부(10)에 공급하도록 전극단자(72)를 형성함이 바람직하다. In this case, the cap (60a) is preferable to form the electrode terminal 72 is supplied to the receiving external power the LED light emitting part 10.

물론, 상기 전극단자(72)는 하부커버(30)와 상부커버(20)의 어느 일측을 막는 하나의 캡(60a)에만 한 쌍 형성되면 된다. Of course, the electrode terminals 72 is When a pairing with only one cap (60a) to prevent either side of the bottom cover 30 and top cover 20.

여기서, 상기 전극단자(72)는 캡(60a)의 내·외측으로 돌출되고, 상기 엘이디발광부(10)는 전극단자(72)를 삽입하도록 커넥터(74)를 구비한다. Here, the electrode terminal 72 is protruded to the inside and the outside of the cap (60a), the LED light emission unit 10 is provided with a connector 74 to insert the electrode terminal 72.

더욱 상세히, 상기 커넥터(74)는 엘이디발광부(10)의 회로패턴(13) 상에 형 성되어 각각의 엘이디(14)와 전기적으로 연결된다. More specifically, the connector 74 is an LED type on the circuit pattern 13 of the light-emitting section 10 resistance are electrically connected to the respective LED (14).

그리고, 상기 캡(60a)이 상부커버(20)와 하부커버(30)를 막음과 동시에 전극단자(72)는 해당되는 커넥터(74)에 삽입되어 전기적으로 접속된다. In addition, the cap (60a) at the same time, the electrode terminal 72 and preventing the upper cover 20 and lower cover 30 is inserted into the connector 74 which are electrically connected to each other.

그래서, 상기 전극단자(72)가 외부 전원을 공급받게 되면, 상기 엘이디(14)는 커넥터(74)와 회로패턴(13)을 통해 전기를 인가받아 빛을 조사하게 된다. Thus, when the receive the electrode terminal 72 is supplied to an external power source, the LED 14 is irradiated to the light receiving applying electricity through the connector 74 and the circuit pattern 13.

한편, 상기 캡(60a)은 상부커버(20)와 하부커버(30)에서 임의적으로 분리되지 않도록 함이 바람직하다. On the other hand, the cap (60a) is preferable to prevent the optionally separated from the upper cover 20 and lower cover 30.

따라서, 상기 캡(60a)과 상부커버(20)는 결속부재(84)에 의해 서로 결속됨이 바람직하다. Thus, the cap (60a) and the upper cover 20 is preferably being bound to each other by the coupling member 84.

더욱 상세히, 상기 캡(60a)과 상부커버(20)는 홀 형상의 결속구(82)를 일직선상에 되는 위치에 형성하고, 상기 결속부재(84)는 이 결속구(82)에 끼워짐으로써 캡(60a)과 상부커버(20)를 결속하게 된다. In more detail, by being fitted in said cap (60a) and the upper cover 20 is formed at a position on the straight line the coupling opening (82) of the hole shape, the coupling member 84 has a coupling opening (82) thereby coupling the cap (60a) and the upper cover 20.

이때, 상기 하부커버(30)는 상부커버(20)와 결속된 캡(60a)에 의해 막혀있기 때문에 슬라이드 이탈되지 않게 된다. In this case, the lower cover 30 can no longer be blocked by the slide exit, since the upper cover 20 and a coupling cap (60a).

또한, 상기 결속부재(84)는 핀 등의 체결요소로 이루어진다. In addition, the coupling member 84 comprises a fastening element such as a pin.

한편, 도 4에 도시된 바와 같이, 본 발명의 다른 실시예에 따른 고휘도 파워 엘이디등은 캡(60b)을 상부커버(20)의 일측에 일체로 형성함과 동시에 상부커버(20)의 일측에 대칭되는 하부커버(30)의 하측에 일체로 형성한다. On the other hand, as shown in Figure 4, on one side of the high-intensity power LED, such as a cap at the same time the top cover and forming a (60b) integral with the one side of the upper cover 20, 20 in accordance with another embodiment of the present invention It is formed integrally on the lower side of the symmetric lower cover 30, which is.

즉, 상기 상부커버(20)와 하부커버(30)는 서로 반대되는 측면만을 개방하도록 형성된다. That is, the upper cover 20 and lower cover 30 is formed so as to open only a side surface opposite to each other.

그래서, 상기 상부커버(20)와 하부커버(30)가 슬라이드 결합됨과 동시에 캡(60b)에 의해 해당 측면에 막히게 된다. So soon as the upper cover 20 and lower cover 30 is coupled at the same time the slide is blocked on that side by the cap (60b).

물론, 상기 상부커버(20)와 하부커버(30)가 슬라이드 결합됨과 동시에 전극단자(72)가 커넥터(74)에 접속된다. Of course, as soon the upper cover 20 and lower cover 30, the slide at the same time bonding the electrode terminal 72 is connected to the connector 74.

이 경우, 상기 캡(60b)이 상부커버(20) 및 하부커버(30)에 일체로 형성되기 때문에 상기의 결속구(82) 및 결속부재(84)는 불필요하게 된다. In this case, the cap (60b), said coupling opening (82) and the engagement member 84 of the are formed integrally with the upper cover 20 and lower cover 30 is not necessary.

미설명된 도면부호는 상술한 것으로 대체한다. The reference numerals described US replaces that previously described.

본 발명은 도면에 도시된 실시예를 참고로 하여 설명되었으나, 이는 예시적인 것에 불과하며, 당해 기술이 속하는 분야에서 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시예가 가능하다는 점을 이해할 것이다. While the invention has been described with reference to the embodiments shown in the drawings by reference, which is a point that only, and the art that various modifications and equivalents which other embodiments are possible by those skilled in the art from which belong to the exemplary it will be appreciated.

따라서, 본 발명의 진정한 기술적 보호범위는 아래의 특허청구범위에 의해서 정하여져야 할 것이다. Therefore, the true technical protection scope of the present invention will be appointed by the claims.

도 1은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 사시도. 1 is a perspective view of a power such as high-intensity LED according to one embodiment of the present invention.

도 2는 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 내부도. 2 is an internal power such as high-intensity LED according to one embodiment of the present invention.

도 3은 본 발명의 일 실시예에 따른 고휘도 파워 엘이디등의 단면도. Figure 3 is a cross-sectional view of such high-intensity power LED according to one embodiment of the present invention.

도 4는 본 발명의 다른 실시예에 따른 고휘도 파워 엘이디등의 조립 상태도. Figure 4 is assembled, such as high-intensity power LED according to another embodiment of the present invention.

<도면의 주요 부분에 관한 부호의 설명> <Description of symbols on key parts of the drawings>

10: 엘이디발광부 11: 보드 10: LED light-emitting unit 11: Board

12: 절연체 13: 회로패턴 12: insulator 13: circuit pattern

14: 엘이디 17: 체결부재 14: LED 17: fastening member

20: 상부커버 30: 하부커버 20: upper cover 30: lower cover

40: 방열부재 52: 슬라이드리브 40: heat radiation member 52: sliding ribs

54: 돌부 56: 슬라이드홈 54: protrusion 56: slide groove

60a,60b: 캡 72: 전극단자 60a, 60b: cap 72: electrode terminal

74: 커넥터 82: 결속구 74: connector 82: Binding obtain

84: 결속부재 84: engagement member

Claims (11)

  1. 외부 전원의 공급시 발광하는 엘이디발광부; Which emits light upon the supply of external power the LED light emitting part;
    상기 엘이디발광부를 장착하여 상기 엘이디발광부의 발열시 열기를 방출 유도하도록 금속재질의 반원통 형상으로 형성되며, 상기 엘이디발광부를 안착하기 위해 안착홈을 구비하는 상부커버; A top cover that is mounted to the LED light-emitting part formed of a semi-cylindrical shape of the metal material so as to induce the discharge opening when the LED light-emitting portion heating, provided with a mounting groove for mounting the light emitting parts of the LED;
    상기 상부커버에 분리가능하게 결합되고, 반원호의 단면을 가지며, 상기 엘이디발광부에서 조사되는 빛을 통과시키며 분산하는 하부커버; The upper is joined detachably to the cover, it has a semicircular arc cross-section, the bottom of dispersion sikimyeo pass the light emitted from the LED light emission unit cover; And
    상기 상부커버의 외측 둘레면에 연속되는 산과 골 형상이거나 또는 돌출되는 핀 형상으로 형성되어 방열면적을 증가시킴으로써 상기 엘이디발광부의 발열 방출 시간을 단축시키는 방열부재를 포함하며, Or by increasing the ridge and valley shape are continuous with the outer peripheral surface of the upper cover or protruding dissipation area is formed in a pin shape, and includes a heat radiation member to shorten the heat-emitting parts of the LED light emission time,
    상기 엘이디발광부는 상기 상부커버 내측에 접하며 체결부재에 의해 상기 상부커버에 분리가능하게 체결되는 금속재질 보드와, 상기 보드의 상기 상부커버에 접하는 면을 제외한 외측에 도포되는 절연층과, 상기 절연층에 인쇄되어 외부 전원의 공급시 전류의 흐름을 안내하는 회로패턴과, 상기 회로패턴에 연결되어 외부 전원의 공급시 발광하는 엘이디로 이루어지고, The LED light emission portion of the insulating isolation is applied to the outer side than the side in contact with the top cover of the the metal boards with fastening tangent to the upper cover inner member removably fastened to said top cover, the board layer and the layer is printed on the circuit for guiding the flow of current for supply of the external power supply pattern, and connected to the circuit pattern formed of a LED that emits light when supplied with the external power supply,
    상기 하부커버와 상기 상부커버는 적어도 서로 대칭되는 일측면을 개방하고, 상기 하부커버와 상기 상부커버는 개방된 측면을 캡으로 막음 처리하며, 상기 하부커버는 서로 마주하는 테두리에 슬라이드리브를 형성하며, 상기 상부커버는 상기 슬라이드리브를 슬라이드 안내하도록 슬라이드홈을 갖는 돌부를 구비하여, 상기 하부커버와 상기 상부커버의 테두리 접촉면적을 증가시켜 상기 엘이디발광부를 외부로부터 보호하고, The lower cover and the upper cover and at least another opening to a side that is symmetric, and the lower cover and the upper cover is treated blocking the open side by a cap, the lower cover forms a slide rib on the rim facing each other the upper cover is provided with the parts of the stone with the slide groove to guide the slide of the slide ribs, by increasing the lower cover and the rim contact surface area of ​​the upper cover, and protected from the light emitting parts of the LED,
    상기 캡은 외부 전원을 인가받아 상기 엘이디발광부에 공급하도록 전극단자를 형성하되, 상기 전극단자는 상기 캡의 내·외측으로 돌출되고, 상기 엘이디발광부는 상기 전극단자를 삽입하도록 커넥터를 구비하며, 상기 캡과 상기 상부커버는 일직선상에 위치하는 결속구를 형성하여, 상기 결속구는 결속부재에 의해 체결됨으로써 상기 캡과 상기 상부커버의 자연적 이탈을 방지하는 것을 특징으로 하는 고휘도 파워 엘이디등. The cap is provided with a connector to insert the electrode terminal to form a electrode terminal so as to be supplied to the LED light-emitting part, the electrode terminals are projected in the inner and outer side of the cap, the LED light emission unit receives applying an external power supply, the cap and the upper cover is formed by a coupling sphere located on a straight line, by being fastened to the coupling member coupling sphere power high-brightness LED, characterized in that to prevent the natural separation of the upper cover and the cap and so on.
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KR101031546B1 (en) 2009-10-29 2011-04-27 (주) 탑엘이디 Heat dissipation structure of transversal illuminating led lamp organization
KR200454637Y1 (en) * 2009-05-06 2011-07-19 (주)엠이씨 LED fluorescent lamps
KR101140162B1 (en) 2011-10-27 2012-05-02 (주) 파루 Tube type led lamp assembly
KR101164066B1 (en) * 2009-07-28 2012-07-12 주식회사 에피디어 Illumination housing of LED bar heat sink with radiant heat, moisture-proofing and waterproof
US8299695B2 (en) 2009-06-02 2012-10-30 Ilumisys, Inc. Screw-in LED bulb comprising a base having outwardly projecting nodes
US8330381B2 (en) 2009-05-14 2012-12-11 Ilumisys, Inc. Electronic circuit for DC conversion of fluorescent lighting ballast
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US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
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WO2009111098A2 (en) * 2008-03-02 2009-09-11 Altair Engineering, Inc. Lens and heatsink assembly for a led light tube
WO2009111098A3 (en) * 2008-03-02 2009-10-29 Altair Engineering, Inc. Lens and heatsink assembly for a led light tube
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US8807785B2 (en) 2008-05-23 2014-08-19 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US10342086B2 (en) 2008-10-24 2019-07-02 Ilumisys, Inc. Integration of LED lighting with building controls
US10036549B2 (en) 2008-10-24 2018-07-31 Ilumisys, Inc. Lighting including integral communication apparatus
US10176689B2 (en) 2008-10-24 2019-01-08 Ilumisys, Inc. Integration of led lighting control with emergency notification systems
US9635727B2 (en) 2008-10-24 2017-04-25 Ilumisys, Inc. Light and light sensor
US9585216B2 (en) 2008-10-24 2017-02-28 Ilumisys, Inc. Integration of LED lighting with building controls
US9353939B2 (en) 2008-10-24 2016-05-31 iLumisys, Inc Lighting including integral communication apparatus
US8946996B2 (en) 2008-10-24 2015-02-03 Ilumisys, Inc. Light and light sensor
US10182480B2 (en) 2008-10-24 2019-01-15 Ilumisys, Inc. Light and light sensor
US9101026B2 (en) 2008-10-24 2015-08-04 Ilumisys, Inc. Integration of LED lighting with building controls
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US9398661B2 (en) 2008-10-24 2016-07-19 Ilumisys, Inc. Light and light sensor
KR200454637Y1 (en) * 2009-05-06 2011-07-19 (주)엠이씨 LED fluorescent lamps
KR200447930Y1 (en) * 2009-05-07 2010-03-03 주식회사 삼원엘앤디 Led light of fluorescent lamp shape
US8330381B2 (en) 2009-05-14 2012-12-11 Ilumisys, Inc. Electronic circuit for DC conversion of fluorescent lighting ballast
US8299695B2 (en) 2009-06-02 2012-10-30 Ilumisys, Inc. Screw-in LED bulb comprising a base having outwardly projecting nodes
US8421366B2 (en) 2009-06-23 2013-04-16 Ilumisys, Inc. Illumination device including LEDs and a switching power control system
KR101164066B1 (en) * 2009-07-28 2012-07-12 주식회사 에피디어 Illumination housing of LED bar heat sink with radiant heat, moisture-proofing and waterproof
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US9395075B2 (en) 2010-03-26 2016-07-19 Ilumisys, Inc. LED bulb for incandescent bulb replacement with internal heat dissipating structures
US8840282B2 (en) 2010-03-26 2014-09-23 Ilumisys, Inc. LED bulb with internal heat dissipating structures
US9057493B2 (en) 2010-03-26 2015-06-16 Ilumisys, Inc. LED light tube with dual sided light distribution
US8541958B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED light with thermoelectric generator
US8540401B2 (en) 2010-03-26 2013-09-24 Ilumisys, Inc. LED bulb with internal heat dissipating structures
US9013119B2 (en) 2010-03-26 2015-04-21 Ilumisys, Inc. LED light with thermoelectric generator
US8454193B2 (en) 2010-07-08 2013-06-04 Ilumisys, Inc. Independent modules for LED fluorescent light tube replacement
US8596813B2 (en) 2010-07-12 2013-12-03 Ilumisys, Inc. Circuit board mount for LED light tube
KR101235130B1 (en) 2010-10-26 2013-02-20 노재문 Lighting device and system with light emitting diode for cultivating vegetables
US8894430B2 (en) 2010-10-29 2014-11-25 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
US8523394B2 (en) 2010-10-29 2013-09-03 Ilumisys, Inc. Mechanisms for reducing risk of shock during installation of light tube
US8870415B2 (en) 2010-12-09 2014-10-28 Ilumisys, Inc. LED fluorescent tube replacement light with reduced shock hazard
US9072171B2 (en) 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light
WO2013028965A3 (en) * 2011-08-24 2013-04-18 Ilumisys, Inc. Circuit board mount for led light
WO2013028965A2 (en) * 2011-08-24 2013-02-28 Ilumisys, Inc. Circuit board mount for led light
KR101140162B1 (en) 2011-10-27 2012-05-02 (주) 파루 Tube type led lamp assembly
US9184518B2 (en) 2012-03-02 2015-11-10 Ilumisys, Inc. Electrical connector header for an LED-based light
CN103216748A (en) * 2012-06-11 2013-07-24 上海隆光蜃景光电科技有限公司 LED (Light Emitting Diode) strip backlight lamp
US9163794B2 (en) 2012-07-06 2015-10-20 Ilumisys, Inc. Power supply assembly for LED-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US9807842B2 (en) 2012-07-09 2017-10-31 Ilumisys, Inc. System and method for controlling operation of an LED-based light
JP2014179332A (en) * 2012-11-01 2014-09-25 Panasonic Corp Light source for illumination and lighting device
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