JP4715226B2 - ORGANIC ELECTROLUMINESCENT DEVICE, METHOD FOR PRODUCING ORGANIC ELECTROLUMINESCENT DEVICE, ELECTRONIC DEVICE - Google Patents

Description

  The present invention relates to an organic electroluminescence device, a method for manufacturing an organic electroluminescence device, and an electronic apparatus.

In recent years, organic EL devices using organic EL (electroluminescence) elements, which are self-luminous elements, as pixels have been developed. An organic EL element has a configuration in which an organic functional layer such as a light emitting layer is sandwiched between an anode and a cathode. Recently, a method of patterning a liquid material in which an organic material is dissolved on a substrate by an inkjet method Development of an organic EL device adopting the above has been performed (for example, see Patent Document 1).
JP 2003-264068 A

Patent Document 1 discloses a technique for applying a liquid material to each pixel divided into banks (partitions) by an ink jet method. According to this method, the spread of the ink can be prevented by the bank, and the ink can be surely arranged in the bank by using the ink jet method. However, even when the ink-jet method is applied, the liquid material does not necessarily land at a certain position in the pixel, and a partial ink droplet (ink mist generated by a flying curve or the like) around the effective pixel is a satellite. May be drawn as. In order to avoid ink mist, attempts have been made to optimize the waveform for ejection and to reduce the viscosity of the ink itself, but it has not yet completely prevented the occurrence of ink mist. If ink mist is generated in an inkjet manufacturing process of a full-color display, and this ink mist travels through a bank and is mistakenly mixed into an adjacent pixel, color mixing occurs and a necessary element function may be impaired.
The present invention has been made in view of such circumstances, and an object thereof is to provide an organic electroluminescence device capable of preventing ink from being mixed into adjacent pixels and obtaining stable light emission characteristics, and a method for manufacturing the same. And It is another object of the present invention to provide an electronic device with high display quality provided with such an organic electroluminescence device.

In order to solve the above problems, an organic electroluminescence device according to the present invention includes a plurality of pixels, a partition partitioning the pixels, a light emitting element formed in a region partitioned by the partition, and disposed on the partition It has the mist absorption structure made.
According to this configuration, the functional liquid (ink mist) drawn as a satellite is fixed on the partition wall by the mist absorbing structure, so that it is not mistakenly mixed into adjacent pixels. For this reason, the organic electroluminescent apparatus which has the stable light emission characteristic can be provided.

In the present invention, the mist absorbing structure may be a recess.
According to this configuration, since the functional liquid drawn as the satellite is absorbed in the concave portion, the surface of the partition is flattened, and the film quality of the cathode formed thereon is also improved. That is, if functional liquid accumulates on the upper surface of the partition wall and forms a film with a non-uniform shape, local stress is generated during cathode deposition, which affects the film quality of the cathode and becomes a starting point for device deterioration. Although there is a possibility, in the present configuration, since the generation of such stress is prevented, a high-quality and highly reliable cathode film can be formed.

In the present invention, an aggregate of beads may be embedded in the recess.
According to this configuration, the aggregate of beads forms a kind of receiving layer and can promote absorption of the functional liquid.

In the present invention, the mist absorbing structure may be a lyophilic film made of an inorganic insulating material.
According to this configuration, similarly to the case where the concave portion is formed, the functional liquid drawn as the satellite can be reliably fixed on the partition wall.

In the present invention, the mist absorbing structure may be disposed at least in the center between the pixels.
According to this configuration, it is possible to more effectively prevent the mixing of functional liquid between adjacent pixels.

The method for manufacturing an organic electroluminescence device of the present invention includes a step of forming a partition wall that partitions a plurality of pixels on a substrate, and a step of disposing a functional liquid containing a light emitting element forming material in a region partitioned by the partition wall. And the step of forming the partition includes a step of forming a mist absorbing structure on an upper surface of the partition.
According to this method, the functional liquid (ink mist) drawn as a satellite is fixed on the partition wall by the mist absorbing structure, so that it is not mistakenly mixed into adjacent pixels. For this reason, the organic electroluminescent apparatus which has the stable light emission characteristic can be provided.

In the present invention, the step of forming the mist absorbing structure may include a step of forming a recess on the upper surface of the partition wall.
According to this method, the functional liquid drawn as the satellite is absorbed into the recess, so that the surface of the partition is flattened, and the film quality of the cathode formed thereon is also improved.

In the present invention, the step of forming the mist absorbing structure may include a step of embedding a bead aggregate in the recess.
According to this method, the aggregate of beads forms a kind of receiving layer and can promote the absorption of the functional liquid.

In the present invention, the step of forming the mist absorbing structure may include a step of forming a lyophilic film made of an inorganic insulating material on the upper surface of the partition wall.
According to this method, similarly to the case where the concave portion is formed, the functional liquid drawn as the satellite can be reliably fixed on the partition wall.

In the present invention, the mist absorbing structure may be formed in a central portion between pixels.
According to this method, it is possible to more effectively prevent the mixing of functional liquid between adjacent pixels.

The electronic apparatus of the present invention includes the above-described organic electroluminescence device of the present invention or the organic electroluminescence device manufactured by the above-described method of the present invention.
According to this configuration, an electronic device with high display quality can be provided.

Embodiments of the present invention will be described below with reference to the drawings. Hereinafter, as an embodiment of the organic EL device (organic electroluminescence device) of the present invention, an organic EL display device in which organic EL elements are arranged on a substrate as pixels will be described as an example.
FIG. 1 is an explanatory diagram showing a wiring structure of the organic EL device of the present embodiment, FIG. 2 is a schematic plan view of the organic EL device, and FIG. 3 is a schematic sectional view of a display region of the organic EL device.

(Organic EL device)
As shown in FIG. 1, the organic EL device of the present embodiment includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction intersecting the scanning lines 101, and a direction parallel to the signal lines 102. A plurality of power supply lines 103 extending in a line are respectively arranged, and a pixel region P is provided in the vicinity of each intersection of the scanning line 101 and the signal line 102.

Connected to the signal line 102 is a data side driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. Further, a scanning side driving circuit 105 including a shift register and a level shifter is connected to the scanning line 101.
Further, in each pixel region P, a switching thin film transistor 122 to which a scanning signal is supplied to the gate electrode via the scanning line 101, and a pixel signal supplied from the signal line 102 via this switching thin film transistor 122. A storage capacitor cap that holds the pixel signal, a driving thin film transistor 123 to which a pixel signal held by the storage capacitor cap is supplied to the gate electrode, and the power supply line 103 via the driving thin film transistor 123 A pixel electrode (electrode) 111 into which a driving current flows from the power line 103 and an organic EL layer 110 sandwiched between the pixel electrode 111 and the cathode (counter electrode) 12 are provided. The electrode 111, the counter electrode 12, and the organic EL layer 110 constitute a light emitting element.

  When the scanning line 101 is driven and the switching thin film transistor 122 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap, and the driving thin film transistor 123 is turned on / off according to the state of the holding capacitor cap. The off state is determined. Then, current flows from the power supply line 103 to the pixel electrode 111 through the channel of the driving thin film transistor 123, and further current flows to the cathode 12 through the organic EL layer 110. In the organic EL layer 110, light emission occurs according to the amount of current flowing.

As shown in FIG. 3, the organic EL device of the present embodiment includes a transparent substrate 2 made of glass or the like, and a light emitting element unit 11 formed on the substrate 2 including light emitting elements arranged in a matrix. And a cathode 12 formed on the light emitting element portion 11. Here, the display element 10 is configured by the light emitting element portion 11 and the cathode 12.
The substrate 2 is a transparent substrate such as glass, for example, and includes a display region 2a located at the center of the substrate 2 as shown in FIG. The display area 2a is an area formed by light emitting elements arranged in a matrix.

  Further, the aforementioned power supply lines 103 (103R, 103G, 103B) are wired around the outside of the display area 2a. On the both sides of the display area 2a, the above-described scanning side drive circuits 105 and 105 are arranged. Further, on both sides of the scanning side driving circuits 105 and 105, a driving circuit control signal wiring 105a and a driving circuit power wiring 105b connected to the scanning side driving circuits 105 and 105 are provided. On the upper side of the display area 2a in the figure, an inspection circuit 106 for inspecting the quality and defects of the display device during manufacturing or at the time of shipment is arranged.

In the cross-sectional configuration diagram of FIG. 3, three pixel regions P are illustrated. In the organic EL device of this embodiment, a circuit element unit 14 in which circuits such as TFTs are formed, a light emitting element unit 11 in which an organic EL layer 110 is formed, and a cathode 12 are sequentially stacked on a substrate 2. The light emitted from the organic EL layer 110 to the substrate 2 side passes through the circuit element unit 14 and the substrate 2 and is emitted to the lower side (observer side) of the substrate 2 and from the organic EL layer 110. Light emitted to the opposite side of the substrate 2 is reflected by the cathode 12, passes through the circuit element unit 14 and the substrate 2, and is emitted to the lower side (observer side) of the substrate 2.
If a transparent material is used as the cathode 12, light emitted from the cathode side can be emitted. Examples of the transparent cathode material include ITO (indium tin oxide), Pt, Ir, Ni, or Pd.

  In the circuit element portion 14, a base protective film 2c made of a silicon oxide film is formed on the substrate 2, and an island-shaped semiconductor film 141 made of polycrystalline silicon is formed on the base protective film 2c. In the semiconductor film 141, a source region 141a and a drain region 141b are formed by high concentration phosphorus ion implantation. A portion where the phosphorus ions are not introduced is a channel region 141c.

  Further, a transparent gate insulating film 142 covering the base protective film 2c and the semiconductor film 141 is formed, and a gate electrode 143 (scanning line 101) made of Al, Mo, Ta, Ti, W or the like is formed on the gate insulating film 142. A transparent first interlayer insulating film 144a and a second interlayer insulating film 144b are formed on the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. In addition, contact holes 145 and 146 are formed through the first and second interlayer insulating films 144a and 144b and connected to the source and drain regions 141a and 141b of the semiconductor film 141, respectively.

  On the second interlayer insulating film 144b, a transparent pixel electrode 111 made of ITO or the like is formed by patterning into a predetermined shape, and one contact hole 145 is connected to the pixel electrode 111. The other contact hole 146 is connected to the power supply line 103. In this way, the driving thin film transistor 123 connected to each pixel electrode 111 is formed in the circuit element unit 14.

  The light emitting element unit 11 includes an organic EL layer 110 stacked on each of the plurality of pixel electrodes 111... And a bank unit that is provided between each pixel electrode 111 and the organic EL layer 110 to partition each organic EL layer 110. (Partition wall) 112 is the main component. A cathode 12 is disposed on the organic EL layer 110. The pixel electrode 111, the organic EL layer 110, and the cathode 12 constitute a light emitting element. Here, the pixel electrode 111 is made of, for example, ITO, and is patterned in a substantially rectangular shape in plan view. A bank part 112 is provided so as to partition each pixel including the pixel electrodes 111.

As shown in FIG. 3, the bank 112 includes an inorganic bank layer (first bank layer) 112a as a first partition located on the substrate 2 side, and an organic substance as a second partition located away from the substrate 2. A bank layer (second bank layer) 112b is stacked. The inorganic bank layer 112a is formed of, for example, TiO ₂ or SiO ₂ , and the organic bank layer 112b is formed of, for example, an acrylic resin or a polyimide resin.

  The inorganic and organic bank layers 112 a and 112 b are formed on the peripheral edge of the pixel electrode 111. In plan view, the periphery of the pixel electrode 111 and the inorganic bank layer 112a are arranged so as to partially overlap. The same applies to the organic bank layer 112b, and the organic bank layer 112b is disposed so as to overlap a part of the pixel electrode 111 in a planar manner. The inorganic bank layer 112a is formed so as to protrude further toward the center of the pixel electrode 111 than the edge of the organic bank layer 112b. In this manner, each first stacked portion (projecting portion) 112e of the inorganic bank layer 112a is formed inside the pixel electrode 111, so that a lower opening 112c corresponding to the formation position of the pixel electrode 111 is provided. Yes.

  An upper opening 112d is formed in the organic bank layer 112b. The upper opening 112d is provided so as to correspond to the formation position of the pixel electrode 111 and the lower opening 112c. As shown in FIG. 3, the upper opening 112 d has a wider opening than the lower opening 112 c and is narrower than the pixel electrode 111. In some cases, the upper position of the upper opening 112d and the end of the pixel electrode 111 are substantially the same position. In this case, as shown in FIG. 3, the upper opening 112d of the organic bank layer 112b has an inclined cross section. In this way, the bank 112 has an opening 112g in which the lower opening 112c and the upper opening 112d communicate with each other.

  In the bank portion 112, a region showing lyophilicity and a region showing liquid repellency are formed. The regions showing lyophilicity are the first stacked portion 112e of the inorganic bank layer 112a and the electrode surface 111a of the pixel electrode 111. These regions are surface-treated lyophilically by plasma treatment using oxygen as a processing gas. ing. The regions exhibiting liquid repellency are the wall surface of the upper opening 112d and the upper surface 112f of the organic bank layer 112. These regions are formed by using tetrafluoromethane, tetrafluoromethane, or carbon tetrafluoride as a processing gas. The surface is fluorinated (treated to be liquid repellent) by the plasma treatment.

  Further, a mist absorbing structure 150 for absorbing ink droplets (ink mist) generated by a flight curve or the like is formed on the upper surface of the bank portion 112, that is, the upper surface of the organic bank layer 112b. As will be described later, in the organic EL device of this embodiment, the organic EL layer 110 is formed by a droplet discharge method. In this case, the ejected ink droplet does not necessarily land only on the bank opening, and may be drawn as a satellite around the effective pixel, for example. Normally, the surface of the bank is lyophobic, so such ink droplets flow through the bank surface and flow into the opening, but if they accidentally flow into other pixels, they cause color mixing and hinder the necessary device functions. There is a risk of doing. Therefore, in the present embodiment, a mist absorbing structure 150 is formed on the upper surface of the bank unit 112, and ink droplets drawn as satellites are fixed on the bank unit.

  The mist absorbing structure 150 can be formed, for example, as a mist absorbing recess as shown in FIG. By forming the recesses, the ink droplets can be reliably absorbed, and no convex strip is formed on the upper surface of the bank by the absorbed ink droplets. That is, not all ink droplets drawn as satellites flow into the opening of the bank, but a part of the ink droplet remains on the bank upper surface, and a protrusion may be formed on the bank upper surface by a drying process. Such protrusions generate local stress when forming the cathode, affect the film quality, and may be a starting point of element deterioration.In this embodiment, ink droplets remaining on the upper surface of the bank Since all of them are absorbed in the recesses, such a problem does not occur.

  The recess 150 may be filled with aggregates of beads used for the spacer. By doing so, the aggregate of beads forms a kind of receiving layer and can promote the absorption of ink droplets. As an arrangement method of the beads, an inkjet method or the like is preferable because the arrangement accuracy can be improved. Refer to JP-A-11-24083, JP-A-2001-83524, etc. for the method of arranging beads using the inkjet method. Moreover, the method of apply | coating and hardening | curing resin which exists in Unexamined-Japanese-Patent No. 2003-91010 etc. may be used.

FIG. 4 is a schematic diagram showing a planar configuration of the mist absorbing structure (recess 150).
FIG. 4A shows an example in which the recess 150 is formed as a striped groove. The groove is formed so as to extend in the long side direction of the pixel (that is, the direction parallel to the signal line 102) in the central portion between the pixels. In FIG. 4A, such grooves are formed one by one between the pixels, but the number of grooves is not limited to this. For example, a plurality of grooves can be formed between the pixels.
FIG. 4B shows an example in which the recess 150 is formed in a dot shape. The dots are densely formed in the longitudinal direction of the pixels at the center between the pixels. In this example, the arrangement of dots is arbitrary. For example, instead of arranging each dot in a straight line as shown in FIG. 4B, it is also possible to arrange each dot in a checkered pattern. In FIG. 4B, dots are not formed between pixels adjacent to each other on the short side of the pixel, but this is because the interval between adjacent pixels on the short side is adjacent on the long side. This is because the ink droplet drawn as a satellite is less likely to flow into an adjacent pixel that is wider than the pixel interval. However, it is of course possible to form dots in such areas.
FIG. 4C shows an example in which the recess 150 is formed in a lattice shape so as to surround each pixel. By doing so, the influence of color mixing due to ink mist can be more reliably prevented. Note that the recess 150 does not necessarily have to be configured to completely surround the periphery of the pixel, and may be formed in a state where a part thereof is opened. That is, it is sufficient that the periphery of each pixel is substantially surrounded by the recess 150.

On the other hand, the organic EL layer 110 includes a hole injection / transport layer 110a stacked on the pixel electrode 111 and a light emitting layer 110b formed adjacent to the hole injection / transport layer 110a.
The hole injection / transport layer 110a has a function of injecting holes into the light emitting layer 110b and a function of transporting holes inside the hole injection / transport layer 110a. By providing such a hole injecting / transporting layer 110a between the pixel electrode 111 and the light emitting layer 110b, device characteristics such as light emitting efficiency and life of the light emitting layer 110b are improved. In the light emitting layer 110b, the holes injected from the hole injection / transport layer 110a and the electrons injected from the cathode 12 are recombined in the light emitting layer to emit light.

  The hole injection / transport layer 110a is located in the lower opening 112c and formed on the pixel electrode surface 111a, and the flat portion 110a1 is formed in the upper opening 112d. The first stacked portion 112e of the inorganic bank layer is located in the upper opening 112d. It is comprised from the peripheral part 110a2 formed on top. Further, depending on the structure, the hole injection / transport layer 110a is formed only on the pixel electrode 111 and between the inorganic bank layers 112a (lower opening 112c) (on the flat portion described above). Some forms are only formed).

  The light emitting layer 110b is formed over the flat portion 110a1 and the peripheral portion 110a2 of the hole injection / transport layer 110a, and the thickness on the flat portion 112a1 is in the range of 50 nm to 80 nm. The light emitting layer 110b has three types, a red light emitting layer 110b1 that emits red (R), a green light emitting layer 110b2 that emits green (G), and a blue light emitting layer 110b3 that emits blue (B). As shown in FIG. 5, the light emitting layers 110b1 to 110b3 are arranged in stripes.

Since the peripheral portion 110a2 having a non-uniform thickness is formed on the first stacked portion 112e of the inorganic bank layer, the peripheral portion 110a2 is insulated from the pixel electrode 111 by the first stacked portion 112e, and the peripheral portion 110a2 is formed. Thus, holes are not injected into the light emitting layer 110b.
Thereby, current from the pixel electrode 111 flows only in the flat portion 112a1, holes can be transported uniformly from the flat portion 112a1 to the light emitting layer 110b, and only the central portion of the light emitting layer 110b can emit light. The light emission amount in the light emitting layer 110b can be made constant.
Further, since the inorganic bank layer 112a extends further to the center side of the pixel electrode 111 than the organic bank layer 112b, the shape of the joint portion between the pixel electrode 111 and the flat portion 110a1 is trimmed by the inorganic bank layer 112a. Thus, variation in the emission intensity between the light emitting layers 110b can be suppressed.

  Furthermore, since the electrode surface 111a of the pixel electrode 111 and the first stacked portion 112e of the inorganic bank layer 112a are lyophilic, the organic EL layer 110 is uniformly adhered to the pixel electrode 111 and the inorganic bank layer 112a, and the inorganic bank layer The organic EL layer 110 does not become extremely thin on 112a, and a short circuit between the pixel electrode 111 and the cathode 12 can be prevented. In addition, since the upper surface 112f of the organic bank layer 112b and the wall surface of the upper opening 112d exhibit liquid repellency, the organic EL layer 110 does not overflow from the opening 112g.

  As the hole injection / transport layer forming material, for example, a mixture of a polythiophene derivative such as polyethylenedioxythiophene and polystyrenesulfonic acid can be used. Examples of the material of the light emitting layer 110b include (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyfluorene derivatives, polyvinyl carbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, or polymers thereof. The material can be used by doping with rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like.

  The cathode 12 is formed on the entire surface of the light emitting element portion 11 and plays a role of flowing a current through the organic EL layer 110 in a pair with the pixel electrode 111. For example, the cathode 12 is formed by laminating a calcium layer and an aluminum layer. At this time, it is preferable to provide a cathode having a low work function on the cathode near the light emitting layer, and in this embodiment, in particular, it plays a role of injecting electrons into the light emitting layer 110b in direct contact with the light emitting layer 110b.

  In some cases, LiF for increasing the light emission efficiency is formed between the light emitting layer 110 b and the cathode 12. The red and green light emitting layers 110b1 and 110b2 are not limited to lithium fluoride, and other materials may be used. Therefore, in this case, a layer made of lithium fluoride may be formed only on the blue (B) light emitting layer 110b3, and layers other than lithium fluoride may be laminated on the other red and green light emitting layers 110b1 and 110b2. Alternatively, only calcium may be formed on the red and green light emitting layers 110b1 and 110b2 without forming lithium fluoride.

The aluminum forming the cathode 12 reflects light emitted from the light emitting layer 110b toward the substrate 2, and is preferably made of an Ag film, an Al / Ag laminated film, or the like in addition to the Al film. Furthermore, an antioxidant protective layer made of SiO, SiO ₂ , SiN or the like may be provided on aluminum.

  In the actual organic EL device, a sealing portion is provided on the light emitting element portion 11 shown in FIG. The sealing portion can be formed by, for example, applying a sealing resin in a ring shape around the substrate 2 and further sealing with a sealing can. The sealing resin is made of a thermosetting resin, an ultraviolet curable resin, or the like, and is particularly preferably made of an epoxy resin that is a kind of thermosetting resin. This sealing portion is provided for the purpose of preventing oxidation of the light emitting layer formed in the cathode 12 or the light emitting element portion 11. Further, a getter agent that absorbs water, oxygen, or the like may be provided inside the sealing can so that water or oxygen that has entered the sealing can can be absorbed.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device will be described with reference to the drawings.
The manufacturing method of this embodiment includes (1) a bank portion forming step, (2) a hole injection / transport layer forming step, (3) a light emitting layer forming step, (4) a cathode forming step, and (5) a sealing step. Have In addition, the manufacturing method demonstrated here is an example, Comprising: Another process is added as needed, A part of said process is removed.
The (2) hole injection / transport layer forming step and (3) light emitting layer forming step are performed using a liquid discharge method (inkjet method) using a droplet discharge device.

(1) Bank Part Formation Step In the bank part formation step, the bank part 112 is formed at a predetermined position on the substrate 2. The bank part 112 has a structure in which an inorganic bank layer 112a is formed as a first bank layer, and an organic bank layer 112b is formed as a second bank layer.

(1) -1 Formation of Inorganic Bank Layer 112a First, as shown in FIG. 5, the inorganic bank layer 112a is formed at a predetermined position on the substrate. The position where the inorganic bank layer 112 a is formed is on the second interlayer insulating film 144 b and the pixel electrode 111. The second interlayer insulating film 144b is formed on the circuit element portion 14 in which a thin film transistor, a scanning line, a signal line, and the like are arranged. The inorganic bank layer 112a can be made of an inorganic material such as SiO ₂ or TiO ₂ , for example. These materials are formed by, for example, a CVD method, a coating method, a sputtering method, a vapor deposition method, or the like. Furthermore, the film thickness of the inorganic bank layer 112a is preferably in the range of 50 nm to 200 nm, particularly 150 nm.

  The inorganic bank layer 112a is formed in a form having an opening by forming an inorganic film on the entire surface of the interlayer insulating layer 144 and the pixel electrode 111 and then patterning the inorganic film by a photolithography method or the like. This opening corresponds to the formation position of the electrode surface 111a of the pixel electrode 111, and is provided as a lower opening 112c as shown in FIG. At this time, the inorganic bank layer 112a is formed so as to partially overlap with the peripheral edge of the pixel electrode 111, whereby the planar light emitting region of the light emitting layer 110 is controlled.

(1) -2 Formation of Organic Bank Layer 112b Next, an organic bank layer 112b as a second bank layer is formed.
Specifically, as shown in FIG. 5, an organic bank layer 112b is formed on the inorganic bank layer 112a. As the material constituting the organic bank layer 112b, a material having heat resistance and solvent resistance such as acrylic resin and polyimide resin is used. Using these materials, the organic bank layer 112b is formed by patterning using a photolithography technique or the like. When patterning, an upper opening 112d is formed in the organic bank layer 112b. The upper opening 112d is provided at a position corresponding to the electrode surface 111a and the lower opening 112c, and is formed with a pattern common to all pixels. Further, when patterning the organic bank layer 112b, the exposure condition is changed and exposure is performed twice to form a mist absorbing recess 150 on the bank upper surface 112f. The recess 150 is provided at a position corresponding to the center between the pixels, and the depth thereof is shallower than the upper opening 112d (that is, a depth not reaching the inorganic bank layer 112a). .

As shown in FIG. 5, the upper opening 112d is preferably formed wider than the lower opening 112c formed in the inorganic bank layer 112a. Furthermore, the organic bank layer 112b preferably has a tapered cross-sectional shape. The bottom surface of the organic bank layer 112b is narrower than the width of the pixel electrode 111, and the top surface of the organic bank layer 112b is substantially the same as the width of the pixel electrode 111. It is preferable to form in the width.
As a result, the first stacked portion 112e surrounding the lower opening 112c of the inorganic bank layer 112a protrudes toward the center of the pixel electrode 111 from the organic bank layer 112b. In this manner, the upper opening 112d formed in the organic bank layer 112b and the lower opening 112c formed in the inorganic bank layer 112a are connected to each other, thereby opening the inorganic bank layer 112a and the organic bank layer 112b. 112g is formed.

The thickness of the organic bank layer 112b is preferably in the range of 0.1 μm to 3.5 μm, and particularly preferably about 2 μm. The reason for this range is as follows.
That is, when the thickness is less than 0.1 μm, the organic bank layer 112b becomes thinner than the total thickness of the hole injection / transport layer and the light emitting layer, which will be described later, and the light emitting layer 110b may overflow from the upper opening 112d. It is not preferable. On the other hand, if the thickness exceeds 3.5 μm, the step due to the upper opening 112d becomes large, and step coverage of the cathode 12 in the upper opening 112d cannot be secured, which is not preferable. Further, if the thickness of the organic bank layer 112b is 2 μm or more, it is preferable in that the insulation between the cathode 12 and the driving thin film transistor 123 can be enhanced.

Further, the surface of the formed bank portion 112 and the pixel electrode 111 is preferably subjected to an appropriate surface treatment by plasma treatment. Specifically, the surface of the bank portion 112 is made lyophobic and the pixel electrode 111 is made lyophilic. Process.
First, the surface treatment of the pixel electrode 111 can be performed by O ₂ plasma treatment using oxygen gas, for example, plasma power 100 kW to 800 kW, oxygen gas flow rate 50 ml / min to 100 ml / min, plate conveyance speed 0.5 mm / min. By processing under conditions of sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the region including the surface of the pixel electrode 111 can be made lyophilic. Moreover, the cleaning of the surface of the pixel electrode 111 and the adjustment of the work function are simultaneously performed by this O ₂ plasma treatment.
Next, the surface treatment of the bank portion 112 can be performed by CF ₄ plasma treatment using tetrafluoromethane. For example, the plasma power is 100 kW to 800 kW, the tetrafluoromethane gas flow rate is 50 ml / min to 100 ml / min, the substrate transport speed is 0. By performing the treatment under conditions of 5 mm / sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the upper opening 112d and the upper surface 112f of the bank 112 can be made liquid repellent.

(2) Hole Injection / Transport Layer Formation Step Next, in the light emitting element formation step, a hole injection / transport layer is first formed on the pixel electrode 111.
In the hole injection / transport layer forming step, a liquid composition containing a hole injection / transport layer forming material is discharged onto the electrode surface 111a by using, for example, an ink jet device as a droplet discharge device. Thereafter, a drying process and a heat treatment are performed to form a hole injection / transport layer 110a on the pixel electrode 111 and the inorganic bank layer 112a. Here, the hole injection / transport layer 110a may not be formed on the first stacked portion 112e, that is, the hole injection / transport layer may be formed only on the pixel electrode 111.

  The manufacturing method by inkjet is as follows. That is, as shown in FIG. 6, a liquid composition containing a hole injection / transport layer forming material is discharged from a plurality of nozzles formed in the inkjet head H1. Here, the composition is filled for each pixel by scanning the ink jet head, but it is also possible to scan the substrate 2. Further, the composition can be filled by moving the inkjet head and the substrate 2 relatively. In addition, in the process performed using the inkjet head after this, said point is the same.

  The ejection by the inkjet head is as follows. That is, the discharge nozzle H2 formed on the ink jet head H1 is disposed to face the electrode surface 111a, and the liquid composition is discharged from the nozzle H2. A bank 112 that defines a lower opening 112c is formed around the pixel electrode 111, and the inkjet head H1 is opposed to the pixel electrode surface 111a located in the lower opening 112c. , The liquid composition droplet 110c of which liquid amount per droplet is controlled is discharged from the discharge nozzle H2 onto the electrode surface 111a.

  As the liquid composition used in this step, for example, a composition obtained by dissolving a mixture of a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) and polystyrenesulfonic acid (PSS) in a polar solvent can be used. Examples of polar solvents include isopropyl alcohol (IPA), normal butanol, γ-butyrolactone, N-methylpyrrolidone (NMP), 1,3-dimethyl-2-imidazolidinone (DMI) and its derivatives, carbitol acetate. And glycol ethers such as butyl carbitol acetate.

  As a more specific composition, a PEDOT / PSS mixture (PEDOT / PSS = 1: 20): 12.52% by weight, IPA: 10% by weight, NMP: 27.48% by weight, DMI: 50% by weight It can be illustrated. The viscosity of the liquid composition is preferably about 1 mPa · s to 20 mPa · s, particularly about 4 mPa · s to 15 mPa · s.

  By using the above liquid composition, the discharge nozzle H2 can be stably discharged without clogging. The hole injection / transport layer forming material may be the same for the red (R), green (G), and blue (B) light emitting layers 110b1 to 110b3, and may be changed for each light emitting layer. Also good.

  The discharged droplets 110c of the composition spread on the lyophilic electrode surface 111a and the first stacked portion 112e, and are filled in the lower and upper openings 112c and 112d. Even if the first composition droplet 110c deviates from the predetermined ejection position and is ejected onto the upper surface 112f (ink mist 110 cm), the upper surface 112f is not wetted by the first composition droplet 110c and is repelled. One composition droplet 110c rolls into the lower and upper openings 112c and 112d. However, not all the droplets 110 cm are necessarily repelled, and some of them may remain on the bank upper surface as they are. However, in this embodiment, even if a droplet 110 cm remains on the upper surface of the bank, all of it is absorbed by the recess 150 for absorbing mist, so that this forms a ridge as a dry film, and the subsequent formation of the cathode There is no adverse effect.

  The amount of the composition discharged onto the electrode surface 111a is the size of the lower and upper openings 112c and 112d, the thickness of the hole injection / transport layer to be formed, and the hole injection / transport layer in the liquid composition. It is determined by the concentration of the forming material. Further, the liquid composition droplets 110c may be discharged not only once but also several times onto the same electrode surface 111a. In this case, the amount of the liquid composition at each time may be the same, and the liquid composition may be changed every time. Furthermore, you may discharge the said liquid composition not only to the same location of the electrode surface 111a but to the different location in the electrode surface 111a every time.

For the structure of the inkjet head, a head H as shown in FIG. 12 can be used. Further, the arrangement of the substrate and the ink jet head is preferably arranged as shown in FIG.
In FIG. 12, reference numeral H7 denotes a support substrate that supports the inkjet head H1, and a plurality of inkjet heads H1 are provided on the support substrate H7.
A plurality of ejection nozzles (for example, 1) are arranged on the ink ejection surface (surface facing the substrate) of the inkjet head H1 in rows along the length direction of the head and in two rows at intervals in the width direction of the head. 180 nozzles in a total of 360 nozzles). In addition, the inkjet head H1 has the discharge nozzle directed toward the substrate side, is inclined in a predetermined angle with respect to the X axis (or Y axis), is arranged in a row along the X axis direction, and at a predetermined interval in the Y direction. A plurality (6 in one row, 12 in total in FIG. 12) are positioned and supported on a support plate 20 having a substantially rectangular shape in a plan view in a state of being arranged in two rows.

  In the inkjet apparatus shown in FIG. 13, reference numeral 1115 denotes a stage on which the substrate 2 is placed, and reference numeral 1116 denotes a guide rail that guides the stage 1115 in the x-axis direction (main scanning direction) in the drawing. The head H can be moved in the y-axis direction (sub-main scanning direction) in the figure by the guide rail 1113 via the support member 1111. Further, the head H can be rotated in the θ-axis direction in the figure. The inkjet head H1 can be inclined at a predetermined angle with respect to the main scanning direction. As described above, the nozzle pitch can be made to correspond to the pixel pitch by arranging the inkjet head to be inclined with respect to the scanning direction.

  A substrate 2 shown in FIG. 13 has a structure in which a plurality of chips are arranged on a mother substrate. That is, one chip area corresponds to one display device. Here, three display areas 2a are formed, but the present invention is not limited to this. For example, when the composition is applied to the left display area 2 a on the substrate 2, the head H is moved to the left side in the drawing via the guide rail 1113 and the substrate 2 is shown in the drawing via the guide rail 1116. Application is performed while moving the substrate 2 and scanning the substrate 2. Next, the head H is moved to the right side in the drawing to apply the composition to the display area 2a at the center of the substrate. The same applies to the display area 2a at the right end. The head H shown in FIG. 12 and the ink jet apparatus shown in FIG. 13 are used not only for the hole injection / transport layer forming step but also for the light emitting layer forming step.

Next, a drying process as shown in FIG. 7 is performed. That is, the first composition after discharge is dried, the solvent contained in the first composition is evaporated, and the hole injection / transport layer 110a is formed. When the drying process is performed, the evaporation of the solvent contained in the liquid composition mainly occurs near the inorganic bank layer 112a and the organic bank layer 112b, and the hole injection / transport layer forming material is concentrated along with the evaporation of the solvent. To precipitate. As a result, as shown in FIG. 7, a peripheral portion 110a2 made of a hole injection / transport layer forming material is formed on the first stacked portion 112e. The peripheral edge 110a2 is in close contact with the wall surface (organic bank layer 112b) of the upper opening 112d. It is thicker on the side closer to.
Further, a film made of droplets absorbed by the mist absorbing structure (concave portion 150) is formed on the bank upper surface 112f. However, since this film is formed in the concave portion, no convex stripe is formed on the bank upper surface 112f, and therefore, the quality of the cathode film formed thereon is not affected.

  At the same time, the evaporation of the solvent also occurs on the electrode surface 111a by the drying process, thereby forming the flat portion 110a1 made of the hole injection / transport layer forming material on the electrode surface 111a. Since the evaporation rate of the solvent is almost uniform on the electrode surface 111a, the material for forming the hole injection / transport layer is uniformly concentrated on the electrode surface 111a, thereby forming a flat portion 110a1 having a uniform thickness. . In this way, the hole injection / transport layer 110a composed of the peripheral portion 110a2 and the flat portion 110a1 is formed. Note that the hole injection / transport layer may be formed only on the electrode surface 111a without being formed on the peripheral edge portion 110a2.

  The drying process is performed by reducing the pressure from, for example, atmospheric pressure to about 133.3 Pa (1 Torr) at room temperature in, for example, a nitrogen atmosphere. The time required for decompression is about several minutes to 10 minutes. If the pressure is rapidly reduced, the composition droplet 110c will suddenly boil, which is not preferable. On the other hand, if the temperature is higher than room temperature, the evaporation rate of the polar solvent increases and a flat film cannot be formed. After the drying treatment, it is preferable to remove the polar solvent and water remaining in the hole injecting / transporting layer 110a by performing a heat treatment in nitrogen, preferably in vacuum, at about 200 ° C. for about 10 minutes.

(3) Light emitting layer forming step The light emitting layer forming step includes a light emitting layer forming material discharging step and a drying step.
Similar to the hole injection / transport layer forming step described above, the liquid composition for forming the light emitting layer is discharged onto the hole injection / transport layer 110a by the ink jet method. Thereafter, the discharged liquid composition is dried (and heat-treated) to form the light emitting layer 110b on the hole injection / transport layer 110a.

FIG. 8 shows a discharging process of a liquid composition containing a light emitting layer forming material by inkjet.
As illustrated, the inkjet head H5 and the substrate 2 are relatively moved, and a liquid composition containing a light emitting layer forming material for each color (for example, blue (B) in this case) is ejected from an ejection nozzle H6 formed on the inkjet head. Is done.
At the time of discharge, the liquid composition is discharged while the discharge nozzle is opposed to the hole injection / transport layer 110a located in the lower and upper openings 112c and 112d and the inkjet head H5 and the substrate 2 are relatively moved. The The amount of liquid discharged from the discharge nozzle H6 is controlled per drop. Thus, the liquid (liquid composition droplet 110e) whose liquid amount is controlled is discharged from the discharge nozzle, and the liquid composition droplet 110e is discharged onto the hole injection / transport layer 110a.

  In the present embodiment, following the arrangement of the liquid composition droplets 110e, another liquid composition for the light emitting layer is discharged. In other words, as shown in FIG. 9, the liquid composition droplets 110f and 110g are discharged and arranged without drying the liquid composition droplets 110e dropped on the substrate 2. When the liquid composition droplets 110e to 110g for forming the light emitting layers 110b1 to 110b3 for the respective colors are dropped as described above, a plurality of ejection heads respectively filled with the liquid compositions for the respective colors are independently scanned. The liquid composition droplets 110e to 110g may be arranged on the substrate 2 and the liquid compositions 110e to 110f can be arranged almost simultaneously by scanning the plurality of ejection heads integrally. Also good.

  As shown in FIGS. 8 and 9, each discharged liquid composition 110e to 110g spreads on the hole injection / transport layer 110a and fills the lower and upper openings 112c and 112d. On the other hand, even if each of the liquid composition droplets 110e to 110g deviates from a predetermined discharge position and is ejected onto the upper surface 112f (ink mist 110em), the upper surface 112f is a liquid composition droplet. The liquid composition drops 110e to 110g roll into the lower and upper openings 112c and 112d without getting wet by 110e to 110g. However, not all of the droplets 110em necessarily flow into an appropriate opening, and a part of the droplet 110em may flow into the opening of an adjacent pixel by mistake. However, in this embodiment, since the mist absorbing structure 150 is formed at the center between the pixels, such a flow into the adjacent pixels is reliably prevented. Further, since the mist absorbing structure 150 is formed as a concave portion, the absorbed droplet 110em is not formed as a convex portion. That is, the dry film of the droplet 110em does not adversely affect the cathode formation.

  The amount of the liquid composition discharged onto each hole injection / transport layer 110a is the size of the lower and upper openings 112c and 112d, the thickness of the light emitting layer 110b to be formed, and the concentration of the light emitting layer material in the liquid composition. Etc. are determined. Further, the liquid compositions 110e to 110g may be discharged not only once but also several times on the same hole injection / transport layer 110a. In this case, the amount of the liquid composition at each time may be the same, and the amount of the liquid composition may be changed every time. Furthermore, the liquid composition may be discharged and arranged not only at the same location of the hole injection / transport layer 110a but also at different locations within the hole injection / transport layer 110a each time.

  The above-mentioned materials can be used as the light emitting layer forming material. As the solvent for dissolving or dispersing the light emitting layer forming material, the same type of solvent can be used for each color light emitting layer.

Next, after the liquid compositions 110e to 110g for the respective colors have been disposed at predetermined positions, the light emitting layers 110b1 to 110b3 are formed by collectively drying. That is, the solvent contained in the liquid composition droplets 110e to 110g evaporates by drying to form a red (R) light emitting layer 110b1, a green (G) light emitting layer 110b2, and a blue (B) light emitting layer 110b3 as shown in FIG. Is done. In FIG. 10, the light emitting layers emitting red, green, and blue are illustrated one by one. However, as apparent from FIG. 1 and other drawings, the light emitting elements are originally formed in a matrix. There are a large number of light-emitting layers (corresponding to each color) not shown.
Further, a film made of droplets absorbed by the mist absorbing structure (concave portion 150) is formed on the bank upper surface 112f. However, since this film is formed in the concave portion, no convex stripe is formed on the bank upper surface 112f, and therefore, the quality of the cathode film formed thereon is not affected.

  The liquid composition of the light emitting layer can be dried by the same method as in the hole injection / transport layer drying step. At this time, if the temperature is higher than room temperature, the evaporation rate of the solvent is increased, and a large amount of the light emitting layer forming material adheres to the wall surface of the upper opening 112d. In addition, in the drying treatment of the liquid composition forming the light emitting layer 110b, even when film thickness unevenness occurs in the outer peripheral portion of the substrate as in the case of the hole injecting / transporting layer 110a, a display defect is caused by the action of the protrusion 112h1. Occurrence is prevented or suppressed.

Next, when the vacuum drying is completed, it is preferable to anneal the light emitting layer 110b using a heating means such as a hot plate. This annealing process is performed at a common temperature and time that can maximize the light emission characteristics of each organic EL layer.
In this manner, the hole injection / transport layer 110a and the light emitting layer 110b are formed on the pixel electrode 111.

In addition, prior to the light emitting layer forming material discharge step, a surface modification step may be performed in order to modify the surface of the hole injection / transport layer 110a.
In the light emitting layer forming step, in order to prevent re-dissolution of the hole injection / transport layer 110a, a solvent insoluble in the hole injection / transport layer 110a is used as a solvent for the liquid composition used in forming the light emitting layer. It is preferable to use it. However, since the hole injection / transport layer 110a has low affinity for the solvent, the hole injection / transport layer 110a can be used even when a liquid composition containing a solvent is discharged onto the hole injection / transport layer 110a. And the light emitting layer 110b cannot be brought into close contact with each other, or the light emitting layer 110b may not be uniformly applied. Therefore, in order to increase the affinity of the surface of the hole injection / transport layer 110a with respect to the solvent and the light emitting layer forming material, it is preferable to perform a surface modification step before forming the light emitting layer.

  In the surface modification step, a surface modifying material that is the same solvent as the solvent of the liquid composition used for forming the light emitting layer or a similar solvent is applied by an inkjet method (droplet discharge method), a spin coating method, or a dip method. It can be performed by drying after coating on the hole injection / transport layer 110a. Examples of the surface modifier used here include cyclohexylbenzene, isopropylbiphenyl, trimethylbenzene and the like as the same solvent as the liquid composition, and examples of the surface modifier include tetramethyl. Examples thereof include benzenetoluene, toluene, xylene and the like.

(4) Cathode Formation Step Next, as shown in FIG. 11, the cathode 12 that forms a pair with the pixel electrode (anode) 111 is formed.
That is, the cathode 12 having a structure in which, for example, a calcium layer and an aluminum layer are sequentially stacked is formed on the entire surface of the substrate 2 including the light emitting layers 110b and the organic bank layers 112b. Thereby, the cathode 12 is laminated | stacked on the whole formation area of each color light emitting layer 110b, and the organic EL element corresponding to each color of red, green, and blue is each formed.

The cathode 12 is preferably formed by, for example, an evaporation method, a sputtering method, a CVD method, or the like, and particularly preferably formed by an evaporation method in terms of preventing damage to the light emitting layer 110b due to heat. Further, a protective layer such as SiO ₂ or SiN may be provided on the cathode 12 to prevent oxidation.

(5) Sealing process Finally, the board | substrate 2 with which the organic EL element was formed, and the sealing substrate prepared separately are sealed via sealing resin. For example, a sealing resin made of a thermosetting resin or an ultraviolet curable resin is applied to the peripheral portion of the substrate 2 and the sealing substrate is disposed on the sealing resin. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon, or helium. If it is carried out in the air, when a defect such as a pinhole has occurred in the cathode 12, water or oxygen may enter the cathode 12 from the defective portion and the cathode 12 may be oxidized, which is not preferable.

  Thereafter, the cathode 12 is connected to the wiring of the substrate 2, and the wiring of the circuit element unit 14 is connected to a driving IC (driving circuit) provided on or outside the substrate 2, whereby the organic EL device of the present embodiment. Complete.

  As described above, in the present embodiment, the concave portion 150 for absorbing mist is formed on the upper surface 112f of the bank portion 112 to absorb ink mist generated in the process of forming the organic EL layer. For this reason, ink mist mistakenly mixes with adjacent pixels to cause color mixing, or ink mist remaining on the bank is formed as a convex strip, and problems such as adversely affecting the cathode film quality do not occur. An organic EL device with higher quality and higher reliability than conventional devices can be provided.

  In addition, although this embodiment demonstrated the case where the mist absorption structure was made into the recessed part, this invention is not limited to this. For example, it is possible to form a lyophilic film (mist absorption structure) made of an inorganic insulating film such as silicon oxide or titanium oxide on the upper surface of the bank, and to absorb the ink mist in the lyophilic film. In this case, first, a first material film made of acrylic or the like and a second material film made of silicon oxide or the like are formed on the surface of the substrate on which the inorganic bank layer 112a is formed, and the second material film is used as a parent. After patterning into the shape of the liquid film, the first material film is patterned into the shape of the organic bank layer 112b. By doing so, a three-layer structure of the inorganic bank layer 112a, the organic bank layer 112b, and the lyophilic film can be easily formed.

(Electronics)
FIG. 14 shows an embodiment of an electronic apparatus according to the invention. The electronic apparatus of this embodiment includes the above-described organic EL device as a display unit. Here, an example of a mobile phone is shown in a perspective view, reference numeral 1000 indicates a mobile phone main body, and reference numeral 1001 indicates a display unit using the organic EL device 1 described above. As described above, in an electronic apparatus including the organic EL device according to this embodiment as a display unit, good light emission characteristics can be obtained.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but it goes without saying that the present invention is not limited to such examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

1 is a circuit diagram of an organic EL device according to an embodiment. FIG. The cross-sectional block diagram of a display area same as the above. The top view which shows typically the positional relationship of a lower opening part and an upper opening part. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. FIG. 3 is a plan configuration diagram of a head according to the embodiment. 1 is a plan configuration diagram of an ink jet apparatus according to an embodiment. FIG. 11 is a perspective configuration diagram illustrating an example of an electronic device.

Explanation of symbols

2 ... Substrate, 110c, 110e ... Ink (functional liquid), 110cm, 110em ... Ink mist (functional liquid mist), 112 ... Bank part (partition), 112f ... Bank upper surface, 112g ... Opening (partitioned by partition) Area), 150 ... mist absorption structure, 1000 ... electronic equipment, P ... pixel area (pixel)

Claims (3)

On a substrate, a plurality of pixels, a partition partitioning the pixel, and a light emitting element formed in a region partitioned by the partition,
The partition wall is positioned on the substrate side, and a second partition wall portion made of an organic material is stacked on a first partition wall portion made of an inorganic material, and the first partition wall portion is located at the center of the pixel rather than the edge of the second partition wall portion. It is formed so as to protrude on the part side,
A portion protruding from the edge of the second partition wall portion of the first partition wall portion is a region showing lyophilicity, and a wall surface and an upper surface of the second partition wall portion are a region showing liquid repellency,
On the upper surface of the second partition wall and the central portion between the pixels, a mist absorption recess in which a bead aggregate is embedded is formed,
The planar shape of the concave portion is a stripe shape extending in the long side direction of the pixel at the central portion between the pixels, a dot shape densely formed in the longitudinal direction of the pixel at the central portion between the pixels, An organic electroluminescence device having a lattice shape formed so as to surround each of the pixels. Forming a partition wall for partitioning a plurality of pixels on the substrate;
A step of disposing a functional liquid containing a material for forming a light emitting element in a region partitioned by the partition;
The partition forming step includes a step of forming a first partition wall made of an inorganic material at a predetermined position on the substrate, a step of forming a second partition wall made of an organic material on the first partition wall, and the second On the upper surface of the partition wall, a stripe shape extending in the long side direction of the pixel at the central portion between the pixels, a dot shape densely formed in the longitudinal direction of the pixel at the central portion between the pixels, Forming a mist-absorbing recess having a planar shape of any one of a lattice shape formed so as to surround each pixel, and embedding an aggregate of beads in the recess. A method for manufacturing an electroluminescence device. An electronic device comprising the organic electroluminescence device according to claim 1 or the organic electroluminescence device manufactured by the method for manufacturing an organic electroluminescence device according to claim 2 .

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