JP2006278127A - Manufacturing method of device, manufacturing method of el device, el device and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a device arbitrarily controlling the shape of a film in forming a film material on a substrate. <P>SOLUTION: This manufacturing method of a device is characterized by including: a first application process for applying, to a surface of a substrate, a liquid composition prepared by dissolving or dispersing a functional material in a solvent; a first drying process for forming an interim coating by drying the applied liquid composition; a second application process for applying, to the formed interim coating, a solvent capable of dissolving the interim coating; and a second drying process for forming a functional film 110b by drying the applied solvent. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a device manufacturing method, an EL device (electroluminescence device) manufacturing method, an EL device obtained by the manufacturing method, and an electronic apparatus including the EL device.

In recent years, a technique for manufacturing an EL device by an ink jet method in which an organic or inorganic EL material (electroluminescence material) is converted into an ink and the ink is discharged onto a substrate has been developed (for example, see Patent Document 1). Using such an ink jet method to arrange micro-order droplets in the pixel region, manufacturing an EL device is more effective than methods such as spin coating in view of material utilization efficiency. .
Japanese Patent No. 3328297

  When an EL device is manufactured using a technique such as Patent Document 1, it is common to form a plurality of light emitting color materials such as red light emission, green light emission, and blue light emission in a predetermined arrangement. Here, when drying the droplets distributed by the ink jet method, each color material is arranged by the ink jet method and then individually dried, and all color materials are arranged by the ink jet method and then dried collectively. It can be thought of as a way to do this. In particular, when batch drying is adopted, it is considered preferable to use a common solvent for the light emitting materials of the respective colors and to dry under similar drying conditions.

  However, since each color light-emitting material has different solubility in solvents, when a common solvent is used for each color, the viscosity of one color increases and the viscosity of the other colors decreases, so that the coating properties of the droplets are reduced. It may also occur when the value decreases. In addition, the viscosity of the solution of each color differs due to the common use of the solvent, which may cause a problem that the shape of the inner film of the pixel after drying is different for each color.

  The present invention has been made to solve the above-described problem, and is a manufacturing method capable of arbitrarily controlling the film shape when a film material is formed on a substrate, not only in an EL apparatus, but in all electronic devices in general. The purpose is to provide. In particular, when patterning different film materials on the same substrate, it is possible to arbitrarily control all the film shapes of the film of each material to be formed, and it is possible to obtain a flat film for each material. The purpose is to provide a method.

  Another object of the present invention is to provide a manufacturing method that can arbitrarily control the film shape when a light emitting material is formed on a substrate, particularly for a manufacturing method of an EL device. In particular, when patterning different light emitting materials on the same substrate, all film shapes can be arbitrarily controlled for each light emitting material film to be formed, and as a result, a flat film can be obtained for each light emitting material. An object of the present invention is to provide a possible technique, and an object of the present invention is to provide an EL device having excellent light emission characteristics by adopting such a method. Another object of the present invention is to provide an electronic apparatus including such an EL device.

  In order to solve the above-mentioned problems, a device manufacturing method of the present invention includes a first application step of applying a liquid composition in which an active material is dissolved or dispersed in a solvent on a substrate, and drying the applied liquid composition. A first drying step for forming a temporary coating film, a second coating step for applying a solvent capable of dissolving or dispersing the temporary coating film to the formed temporary coating film, and drying the applied solvent. And a second drying step of forming a functional film.

According to such a manufacturing method, it becomes possible to adjust the surface shape of the temporary coating film with the solvent applied in the second application step, and as a result, the shape of the functional film obtained after the second drying step can be arbitrarily set. Can be controlled. In particular, since the film shape varies depending on the solubility of the solvent used in the second coating step, the film shape can be controlled depending on the type of the solvent, and thus a device having desired characteristics can be manufactured. Become.
In addition, the temporary coating film formed in the first coating process and the first drying process may have irregularities or uneven thickness at this stage. It is because it is restored by the solvent applied in the second application step. Due to such a background, it is not necessary to pay attention to the shape of the temporary coating film in the first coating process and the first drying process, and the process can be performed quickly and easily. In the case of using the liquid composition, a liquid composition can be adopted so that the liquid can be easily discharged from the inkjet head, and the degree of freedom in designing the liquid composition is widened, and the discharge stability can be secured. It becomes like this. As a result, the manufacturing efficiency of the device can be improved, which in turn can contribute to yield improvement and cost reduction.

  Note that different solvents can be used in the first application step and the second application step, respectively. That is, by making the solvent constituting the liquid composition containing the functional material different from the solvent for controlling the film shape that does not contain the functional material, the handling in each coating step can be facilitated. Specifically, in the first application step, the solvent can be selected so that the liquid composition has a low viscosity in consideration of the applicability of the liquid composition, and in the second application step, the film shape is changed. From the viewpoint of control, the solvent can be selected according to the solubility in the functional material. Here, the different solvents to be used mean that the composition ratio of the solvents is different in the case of a mixed solvent in addition to different types of solvents.

  In the device manufacturing method, in the first application step, the liquid composition includes a first liquid composition containing a first functional material having a first function, and a second function different from the first function. A second liquid composition containing a second functional material having the above function, wherein the first liquid composition and the second liquid composition are applied to different regions, respectively, while the second application step Can dissolve or disperse the film in either one of the first temporary coating film made of the first functional material and the second temporary coating film made of the second functional material. A solvent can be applied. Thus, when including the 1st temporary coating film and the 2nd temporary coating film, it is not necessary to give 2nd application | coating with respect to all the temporary coating films, but with respect to the desired temporary coating film which wants to control film | membrane shape If it is applied only to the manufacturing process, manufacturing efficiency can be improved. In this case, the temporary coating film to which the solvent is not applied substantially has a film formed after the first drying step as a functional film.

  In the device manufacturing method, in the first application step, the liquid composition is different from the first liquid composition including a first functional material having a first function, and the first function. A second liquid composition containing a second functional material having a second function, wherein the first liquid composition and the second liquid composition are applied to different regions, respectively, In the application step, different solvents can be applied to the first temporary coating film made of the first functional material and the second temporary coating film made of the second functional material. Thus, when performing 2nd application | coating to both a 1st temporary coating film and a 2nd temporary coating film, it is preferable to use a respectively different solvent. By using different solvents, the film shapes of both the first temporary coating film and the second temporary coating film can be suitably controlled.

  Next, in order to solve the above-described problems, the method for manufacturing an EL device according to the present invention includes a first coating step in which a liquid composition in which a light emitting material is dissolved or dispersed in a solvent is coated on a substrate, and a coated liquid composition. A first drying step of drying a product to form a temporary coating film; a second coating step of applying a solvent capable of dissolving or dispersing the temporary coating film to the formed temporary coating film; And a second drying step of forming a light emitting layer by drying the solvent.

According to such a manufacturing method, it becomes possible to adjust the surface shape of the temporary coating film with the solvent applied in the second coating step, and as a result, the layer shape (film) of the light emitting layer obtained after the second drying step. (Shape) can be controlled arbitrarily. In particular, since the layer shape (film shape) differs depending on the solubility of the solvent used in the second coating step, the layer shape can be controlled depending on the type of the solvent, and as a result, an EL device with little uneven emission. Thus, an EL device having desired light emission characteristics determined by the layer shape can be manufactured.
In addition, the temporary coating film formed in the first coating process and the first drying process may have irregularities or uneven thickness at this stage. It is because it is restored by the solvent applied in the second application step. With such a background, it is not necessary to pay attention to the film shape of the temporary coating film in the first coating process and the first drying process, and the process can be performed quickly and easily. For example, the first coating process is performed by an inkjet method. In the case of using a liquid composition, a liquid composition can be adopted so that it can be easily discharged from an inkjet head, and the degree of freedom in designing the liquid composition can be widened and the stability of discharge can be secured. become able to. As a result, the manufacturing efficiency of the EL device can be improved, which in turn can contribute to yield improvement and cost reduction.

  Note that different solvents can be used in the first application step and the second application step, respectively. That is, by making the solvent constituting the liquid composition containing the light emitting material different from the solvent for controlling the layer shape not containing the light emitting material, the handling in each coating step can be facilitated. Specifically, in the first application step, the solvent can be selected so that the liquid composition has a low viscosity in consideration of the applicability of the liquid composition. In the second application step, the layer shape From the viewpoint of control, the solvent can be selected according to the solubility in the luminescent material. Here, the different solvents to be used mean that the composition ratio of the solvents is different in the case of a mixed solvent in addition to different types of solvents.

  In the first coating step, the liquid composition includes a first liquid composition containing a first light emitting material and a second liquid composition containing a second light emitting material that emits light of a color different from that of the first light emitting material. And the first liquid composition and the second liquid composition are applied to different regions, respectively, while in the second application step, the first temporary coating film made of the first light emitting material. A solvent capable of dissolving or dispersing the temporary coating film may be applied to any one of the temporary coating film and the second temporary coating film made of the second light emitting material. Thus, when including the 1st temporary coating film and the 2nd temporary coating film, it is not necessary to give 2nd application | coating with respect to all the temporary coating films, but with respect to the desired temporary coating film which wants to control film | membrane shape If it is applied only to the manufacturing process, manufacturing efficiency can be improved. In this case, in the temporary coating film to which the solvent is not applied, the film formed after the first drying step is substantially constituted as the light emitting layer.

  In the first application step, the liquid composition includes a first liquid composition containing a first light emitting material and a second liquid containing a second light emitting material that emits light of a color different from that of the first light emitting material. The first liquid composition and the second liquid composition are applied to different regions, respectively, while the second application step includes a first temporary material made of the first light emitting material. Different solvents may be applied to the coating film and the second temporary coating film made of the second light emitting material. Thus, when performing 2nd application | coating to both a 1st temporary coating film and a 2nd temporary coating film, it is preferable to use a respectively different solvent. By using different solvents, the film shapes of both the first temporary coating film and the second temporary coating film can be suitably controlled.

  In the first application step, the liquid composition includes a red liquid composition containing a red light emitting material, a green liquid composition containing a green light emitting material, and a blue liquid composition containing a blue light emitting material. The red, green, and blue liquid compositions are applied to different areas, respectively, and in the second application step, the red temporary coating film made of the red light emitting material and the green light emitting material are used. A solvent capable of dissolving the temporary coating film is applied to any one of the green temporary coating film and the blue temporary coating film made of the blue light emitting material. it can. Thus, when a red temporary coating film, a green temporary coating film and a blue temporary coating film are included, it is not necessary to apply the second coating to all the temporary coating films, and a desired temporary coating whose film shape is to be controlled is desired. If it is applied only to the film, it is possible to improve the production efficiency. In this case, in the temporary coating film of the color to which the solvent is not applied, the film formed after the first drying step is configured as the light emitting layer of that color.

  Further, in the first coating step, the liquid composition includes a red liquid composition containing a red light emitting material, a green liquid composition containing a green light emitting material, and a blue liquid composition containing a blue light emitting material. The red, green, and blue liquid compositions are applied to different areas, respectively, and in the second application step, the red temporary coating film made of the red light emitting material and the green light emitting material are used. Different solvents may be applied to the green temporary coating film and the blue temporary coating film made of the blue light emitting material. By using a different solvent for each color, the layer shape of each color light emitting layer can be suitably controlled.

  Next, in order to solve the above-described problem, an EL device of the present invention is manufactured using the above-described method. Such an EL device is less likely to cause uneven light emission and has excellent light emission characteristics. According to another aspect of the present invention, there is provided an electronic apparatus including the above-described EL device. For example, an electronic device including such an EL device in a display unit has excellent display characteristics.

  Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the structure of an organic EL device is described as an example of an EL device manufactured by the manufacturing method according to the present invention, and then the manufacturing method is described. Further, in the present embodiment, in each drawing, the scale is different for each layer and each member so that each layer and each member has a size that can be recognized on the drawing.

(EL device)
FIG. 1 is an explanatory view showing the wiring structure of an organic EL device manufactured by the manufacturing method according to the present invention, FIG. 2 is a schematic plan view of the organic EL device, and FIG. 3 is the organic EL device. It is a cross-sectional schematic diagram of the display area of an apparatus.

  As shown in FIG. 1, the organic EL device of the present embodiment includes a plurality of scanning lines 101, a plurality of signal lines 102 extending in a direction intersecting the scanning lines 101, and a direction parallel to the signal lines 102. A plurality of power supply lines 103 extending in a line are respectively wired, and a pixel region P is provided in the vicinity of each intersection of the scanning line 101 and the signal line 102.

Connected to the signal line 102 is a data side driving circuit 104 including a shift register, a level shifter, a video line, and an analog switch. Further, a scanning side driving circuit 105 including a shift register and a level shifter is connected to the scanning line 101.
Further, in each pixel region P, a switching thin film transistor 122 to which a scanning signal is supplied to the gate electrode via the scanning line 101, and a pixel signal supplied from the signal line 102 via this switching thin film transistor 122. A storage capacitor cap that holds the pixel signal, a driving thin film transistor 123 to which a pixel signal held by the storage capacitor cap is supplied to the gate electrode, and the power supply line 103 via the driving thin film transistor 123 In addition, a pixel electrode (anode) 111 into which a driving current flows from the power line 103 and an organic EL layer 110 sandwiched between the pixel electrode 111 and the counter electrode (cathode) 12 are provided. The pixel electrode 111, the counter electrode 12, and the organic EL layer 110 constitute a light emitting element.

  When the scanning line 101 is driven and the switching thin film transistor 122 is turned on, the potential of the signal line 102 at that time is held in the holding capacitor cap, and the driving thin film transistor 123 is turned on / off according to the state of the holding capacitor cap. The off state is determined. Then, current flows from the power supply line 103 to the pixel electrode 111 through the channel of the driving thin film transistor 123, and further current flows to the cathode 12 through the organic EL layer 110. In the organic EL layer 110, light emission occurs according to the amount of current flowing.

As shown in FIG. 3, the organic EL device of the present embodiment includes a transparent substrate 2 made of glass or the like, and a light emitting element unit 11 formed on the substrate 2 including light emitting elements arranged in a matrix. And a cathode 12 formed on the light emitting element portion 11. Here, the display element 10 is configured by the light emitting element portion 11 and the cathode 12.
The substrate 2 is a transparent substrate such as glass, for example, and as shown in FIG. 2, a display region 2a located at the center of the substrate 2 and a non-display region 2c that is located at the periphery of the substrate 2 and surrounds the display region 2a. It is divided into. The display area 2a is an area formed by light emitting elements arranged in a matrix.

  Further, the aforementioned power supply lines 103 (103R, 103G, 103B) are wired in the non-display area 2c. On the both sides of the display area 2a, the above-described scanning side drive circuits 105 and 105 are arranged. Further, on both sides of the scanning side driving circuits 105 and 105, a driving circuit control signal wiring 105a and a driving circuit power wiring 105b connected to the scanning side driving circuits 105 and 105 are provided. On the upper side of the display area 2a in the figure, an inspection circuit 106 for inspecting the quality and defects of the display device during manufacturing or at the time of shipment is arranged.

  In the cross-sectional configuration diagram of FIG. 3, three pixel regions A are illustrated. In the organic EL device of this embodiment, a circuit element unit 14 in which circuits such as TFTs are formed, a light emitting element unit 11 in which an organic EL layer 110 is formed, and a cathode 12 are sequentially stacked on a substrate 2. The light emitted from the organic EL layer 110 to the substrate 2 side passes through the circuit element unit 14 and the substrate 2 and is emitted to the lower side (observer side) of the substrate 2 and from the organic EL layer 110. Light emitted to the opposite side of the substrate 2 is reflected by the cathode 12, passes through the circuit element unit 14 and the substrate 2, and is emitted to the lower side (observer side) of the substrate 2. If a transparent material is used as the cathode 12, light emitted from the cathode side can be emitted. Examples of the transparent cathode material include ITO (indium tin oxide), Pt, Ir, Ni, or Pd.

  In the circuit element portion 14, a base protective film 2c made of a silicon oxide film is formed on the substrate 2, and an island-shaped semiconductor film 141 made of polycrystalline silicon is formed on the base protective film 2c. In the semiconductor film 141, a source region 141a and a drain region 141b are formed by high concentration phosphorus ion implantation. A portion where the phosphorus ions are not introduced is a channel region 141c.

  Further, a transparent gate insulating film 142 covering the base protective film 2c and the semiconductor film 141 is formed, and a gate electrode 143 (scanning line 101) made of Al, Mo, Ta, Ti, W or the like is formed on the gate insulating film 142. A transparent first interlayer insulating film 144a and a second interlayer insulating film 144b are formed on the gate electrode 143 and the gate insulating film 142. The gate electrode 143 is provided at a position corresponding to the channel region 141c of the semiconductor film 141. In addition, contact holes 145 and 146 are formed through the first and second interlayer insulating films 144a and 144b and connected to the source and drain regions 141a and 141b of the semiconductor film 141, respectively.

  On the second interlayer insulating film 144b, a transparent pixel electrode 111 made of ITO or the like is formed by patterning into a predetermined shape, and one contact hole 145 is connected to the pixel electrode 111. The other contact hole 146 is connected to the power supply line 103. In this way, the driving thin film transistor 123 connected to each pixel electrode 111 is formed in the circuit element unit 14.

  The light emitting element unit 11 includes an organic EL layer 110 stacked on each of the plurality of pixel electrodes 111... And a bank (dividing each organic EL layer 110 provided between each pixel electrode 111 and the organic EL layer 110. The partition wall 112 is a main component. A cathode 12 is disposed on the organic EL layer 110. The pixel electrode 111, the organic EL layer 110, and the cathode 12 constitute a light emitting element. Here, the pixel electrode 111 is made of, for example, ITO, and is patterned in a substantially rectangular shape in plan view. Bank sections 112 are provided so as to partition the pixel electrodes 111.

As shown in FIG. 3, the bank 112 includes an inorganic bank layer (first bank layer) 112a as a first partition located on the substrate 2 side, and an organic substance as a second partition located away from the substrate 2. A bank layer (second bank layer) 112b is stacked. The inorganic bank layer 112a is formed of, for example, TiO ₂ or SiO ₂ , and the organic bank layer 112b is formed of, for example, an acrylic resin or a polyimide resin.

  The inorganic bank layer 112 a and the organic bank layer 112 b are formed so as to run on the peripheral edge of the pixel electrode 111. In plan view, the periphery of the pixel electrode 111 and the inorganic bank layer 112a are arranged so as to partially overlap. The same applies to the organic bank layer 112b, and the organic bank layer 112b is disposed so as to overlap a part of the pixel electrode 111 in a planar manner. The inorganic bank layer 112a is formed so as to protrude further toward the center of the pixel electrode 111 than the edge of the organic bank layer 112b. In this manner, each first stacked portion (projecting portion) 112e of the inorganic bank layer 112a is formed inside the pixel electrode 111, so that a lower opening 112c corresponding to the formation position of the pixel electrode 111 is provided. Yes.

  An upper opening 112d is formed in the organic bank layer 112b. The upper opening 112d is provided so as to correspond to the formation position of the pixel electrode 111 and the lower opening 112c. As shown in FIG. 3, the upper opening 112 d has a wider opening than the lower opening 112 c and is narrower than the pixel electrode 111. In some cases, the upper position of the upper opening 112d and the end of the pixel electrode 111 are substantially the same position. In this case, as shown in FIG. 3, the upper opening 112d of the organic bank layer 112b has an inclined cross section. In this way, the bank 112 has an opening 112g in which the lower opening 112c and the upper opening 112d communicate with each other.

  In the bank portion 112, a region showing lyophilicity and a region showing liquid repellency are formed. The region showing lyophilicity is the first stacked portion 112e of the inorganic bank layer 112a and the electrode surface of the pixel electrode 111, and these regions are surface-treated lyophilically by plasma treatment using oxygen as a processing gas. Yes. The regions exhibiting liquid repellency are the wall surface of the upper opening 112d and the upper surface 112f of the organic bank layer 112. The surface of these regions is fluorinated (plasma repellent) by plasma treatment using tetrafluoromethane as a processing gas. Processed liquid).

The organic EL layer 110 includes a hole injection / transport layer 110a laminated on the pixel electrode 111 and a light emitting layer 110b formed adjacent to the hole injection / transport layer 110a.
The hole injection / transport layer 110a has a function of injecting holes into the light emitting layer 110b and a function of transporting holes inside the hole injection / transport layer 110a. By providing such a hole injecting / transporting layer 110a between the pixel electrode 111 and the light emitting layer 110b, device characteristics such as light emitting efficiency and life of the light emitting layer 110b are improved. Further, in the light emitting layer 110b, the holes injected from the hole injection / transport layer 110a and the electrons injected from the cathode 12 are recombined to emit light.

  The hole injection / transport layer 110a is formed on the pixel electrode 111 in the lower opening 112c. The light emitting layer 110b is formed on the hole injection / transport layer 110a and has a thickness in the range of 50 nm to 80 nm. The light emitting layer 110b has three types, a red light emitting layer 110b1 that emits red (R), a green light emitting layer 110b2 that emits green (G), and a blue light emitting layer 110b3 that emits blue (B). As shown in FIG. 5, the light emitting layers 110b1 to 110b3 are arranged in stripes. As shown in FIG. 3, the red light emitting layer 110b1 forms a red pixel AR, the green light emitting layer 110b2 forms a green pixel AG, and the blue light emitting layer 110b3 forms a blue pixel AB.

  As a material for forming the hole injection / transport layer 110a, for example, a mixture of a polythiophene derivative such as polyethylenedioxythiophene and polystyrene sulfonic acid can be used. Examples of the material for forming the light emitting layer 110b include (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyfluorene derivatives, polyvinyl carbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, or these. The polymer material can be doped with rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone, and the like. By adopting such a material, the hole injection / transport layer 110a exhibits water solubility (hydrophilicity), while the light emitting layer 110b exhibits oil solubility (hydrophobicity).

  The cathode 12 is formed on the entire surface of the light emitting element portion 11 and plays a role of flowing a current through the organic EL layer 110 in a pair with the pixel electrode 111. For example, the cathode 12 is formed by laminating a calcium layer and an aluminum layer. At this time, it is preferable to provide a cathode having a low work function on the cathode near the light emitting layer, and in this embodiment, in particular, it plays a role of injecting electrons into the light emitting layer 110b in direct contact with the light emitting layer 110b.

  In some cases, LiF for increasing the light emission efficiency is formed between the light emitting layer 110 b and the cathode 12. The red and green light emitting layers 110b1 and 1110b2 are not limited to lithium fluoride, and other materials may be used. Therefore, in this case, a layer made of lithium fluoride may be formed only on the blue (B) light emitting layer 110b3, and layers other than lithium fluoride may be laminated on the other red and green light emitting layers 110b1 and 110b2. Alternatively, only calcium may be formed on the red and green light emitting layers 110b1 and 110b2 without forming lithium fluoride.

The aluminum forming the cathode 12 reflects light emitted from the light emitting layer 110b toward the substrate 2, and is preferably made of an Ag film, an Al / Ag laminated film, or the like in addition to the Al film. Furthermore, an antioxidant protective layer made of SiO, SiO ₂ , SiN or the like may be provided on aluminum.

  In the actual organic EL device, a sealing portion is provided on the light emitting element portion 11 shown in FIG. The sealing portion can be formed by, for example, applying a sealing resin in a ring shape around the substrate 2 and further sealing with a sealing can. The sealing resin is made of a thermosetting resin, an ultraviolet curable resin, or the like, and is particularly preferably made of an epoxy resin that is a kind of thermosetting resin. This sealing portion is provided for the purpose of preventing oxidation of the light emitting layer formed in the cathode 12 or the light emitting element portion 11. Further, a getter agent that absorbs water, oxygen, or the like may be provided inside the sealing can so that water or oxygen that has entered the sealing can can be absorbed.

(Method for manufacturing organic EL device)
Next, a method for manufacturing the organic EL device will be described with reference to the drawings.
The manufacturing method of the present embodiment includes (1) a bank portion forming step, (2) a bank portion surface treatment step (liquid repellency step), (3) a hole injection / transport layer forming step, (4) a light emitting layer forming step, (5) It has a cathode forming step and (6) a sealing step.
In addition, the manufacturing method demonstrated here is an example, Comprising: Another process is added as needed, A part of said process is removed. The (3) hole injection / transport layer forming step and (4) light emitting layer forming step are performed using a liquid discharge method (inkjet method) using a droplet discharge device.

(1) Bank Portion Forming Step In the bank portion forming step, a bank portion 112 as shown in FIG. The bank part 112 has a structure in which an inorganic bank layer 112a is formed as a first bank layer, and an organic bank layer 112b is formed as a second bank layer. Note that a thin film transistor (TFT) 123 and a pixel electrode 111 connected thereto are formed in advance on the substrate 2.

(1) -1 Formation of Inorganic Bank Layer 112a First, as shown in FIG. 4, the inorganic bank layer 112a is formed at a predetermined position on the substrate. The position where the inorganic bank layer 112 a is formed is on the second interlayer insulating film 144 b and the pixel electrode 111. The second interlayer insulating film 144b is formed on the circuit element portion 14 in which a thin film transistor, a scanning line, a signal line, and the like are arranged. The inorganic bank layer 112a can be made of an inorganic material such as SiO ₂ or TiO ₂ , for example. These materials are formed by, for example, a CVD method, a coating method, a sputtering method, a vapor deposition method, or the like. Furthermore, the film thickness of the inorganic bank layer 112a is preferably in the range of 50 nm to 200 nm, particularly 150 nm.

  The inorganic bank layer 112a has an opening (lower opening 112c) by forming an inorganic film on the entire surface of the interlayer insulating layer 144 and the pixel electrode 111 and then patterning the inorganic film by a photolithography method or the like. It is formed. At this time, the inorganic bank layer 112 a is formed so as to partially overlap with the peripheral edge of the pixel electrode 111, thereby controlling the planar light emitting region of the organic EL layer 110.

(1) -2 Formation of Organic Bank Layer 112b Next, an organic bank layer 112b as a second bank layer is formed.
Specifically, as shown in FIG. 4, the organic bank layer 112b is formed on the inorganic bank layer 112a. As the material constituting the organic bank layer 112b, a material having heat resistance and solvent resistance such as acrylic resin and polyimide resin is used. Using these materials, the organic bank layer 112b is formed by patterning using a photolithography technique or the like. When patterning, an upper opening 112d is formed in the organic bank layer 112b.

  As shown in FIG. 4, the upper opening 112d is preferably formed wider than the lower opening 112c formed in the inorganic bank layer 112a. Furthermore, the organic bank layer 112b preferably has a tapered cross-sectional shape. The bottom surface of the organic bank layer 112b is narrower than the width of the pixel electrode 111, and the top surface of the organic bank layer 112b is substantially the same as the width of the pixel electrode 111. It is preferable to form in the width. As a result, the first stacked portion 112e surrounding the lower opening 112c of the inorganic bank layer 112a protrudes toward the center of the pixel electrode 111 from the organic bank layer 112b. In this manner, the upper opening 112d formed in the organic bank layer 112b and the lower opening 112c formed in the inorganic bank layer 112a are connected to each other, thereby opening the inorganic bank layer 112a and the organic bank layer 112b. 112g is formed.

The thickness of the organic bank layer 112b is preferably in the range of 0.1 μm to 3.5 μm, and particularly preferably about 2 μm. The reason for this range is as follows.
That is, when the thickness is less than 0.1 μm, the organic bank layer 112b becomes thinner than the total thickness of the hole injection / transport layer 110a and the light emitting layer 110b described later, and the light emitting layer 110b may overflow from the upper opening 112d. This is not preferable. On the other hand, if the thickness exceeds 3.5 μm, the step due to the upper opening 112d becomes large, and step coverage of the cathode 12 in the upper opening 112d cannot be secured, which is not preferable. Further, if the thickness of the organic bank layer 112b is 2 μm or more, it is preferable in that the insulation between the cathode 12 and the driving thin film transistor 123 can be enhanced.

(2) Bank part surface treatment process Furthermore, the surface of the formed bank part 112 and the pixel electrode 111 is subjected to an appropriate surface treatment by plasma treatment. Specifically, a lyophobic process on the surface of the bank unit 112 and a lyophilic process for the pixel electrode 111 are performed.

First, the surface treatment of the pixel electrode 111 can be performed by O ₂ plasma treatment using oxygen gas, for example, plasma power 100 kW to 800 kW, oxygen gas flow rate 50 ml / min to 100 ml / min, plate conveyance speed 0.5 mm / min. By processing under conditions of sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the region including the surface of the pixel electrode 111 can be made lyophilic. Moreover, the cleaning of the surface of the pixel electrode 111 and the adjustment of the work function are simultaneously performed by this O ₂ plasma treatment.

Next, the surface treatment of the bank portion 112 can be performed by CF ₄ plasma treatment using tetrafluoromethane. For example, the plasma power is 100 kW to 800 kW, the tetrafluoromethane gas flow rate is 50 ml / min to 100 ml / min, the substrate transport speed is 0. By performing the treatment under conditions of 5 mm / sec to 10 mm / sec and a substrate temperature of 70 ° C. to 90 ° C., the upper opening 112d and the upper surface 112f of the bank 112 can be made liquid repellent.

(3) Hole Injection / Transport Layer Formation Step Next, a hole injection / transport layer is first formed on the pixel electrode 111 in order to form a light emitting element. In the hole injection / transport layer forming step of the present embodiment, an ink jet method is employed, but other liquid phase coating methods such as a spin coating method can be employed.

  As described above, in the hole injecting / transporting layer forming step, a liquid composition containing the hole injecting / transporting layer forming material is applied onto the pixel electrode 111 by an ink jet method, that is, by using, for example, an ink jet device as a droplet discharge device. Discharge. Thereafter, a drying process and a heat treatment are performed to form the hole injection / transport layer 110 a on the pixel electrode 111. As the liquid composition used in this step, for example, a composition obtained by dissolving a mixture of a polythiophene derivative such as polyethylenedioxythiophene (PEDOT) and polystyrenesulfonic acid (PSS) in a polar solvent can be used. Examples of the polar solvent include isopropyl alcohol (IPA), normal butanol, γ-butyrolactone, N-methylpyrrolidone (NMP), 1,3-dimethyl-2-imidazolidinone (DMI) and its derivatives, carbitol acetate And glycol ethers such as butyl carbitol acetate.

  As a more specific composition, a PEDOT / PSS mixture (PEDOT / PSS = 1: 20): 12.52% by weight, IPA: 10% by weight, NMP: 27.48% by weight, DMI: 50% by weight It can be illustrated. The viscosity of the liquid composition is preferably about 1 mPa · s to 20 mPa · s, particularly about 4 mPa · s to 15 mPa · s.

  As shown in FIG. 5, the discharged droplets 110c of the composition spread on the lyophilic pixel electrode 111 and fill the lower and upper openings 112c and 112d. Even if the first composition droplet 110c deviates from the predetermined ejection position and is ejected onto the upper surface 112f, the upper surface 112f is not wetted by the first composition droplet 110c, and the repelled first composition droplet 110c. Rolls into the lower and upper openings 112c and 112d.

  The amount of the composition discharged onto the pixel electrode 111 is the size of the lower and upper openings 112c and 112d, the thickness of the hole injection / transport layer to be formed, and the hole injection / transport layer in the liquid composition. It is determined by the concentration of the forming material. Further, the liquid composition droplet 110c may be ejected on the same pixel electrode 111 not only once but also several times. In this case, the amount of the liquid composition at each time may be the same, and the liquid composition may be changed every time. Furthermore, you may discharge the said liquid composition not only to the same location of the electrode 111 but to the different location in the electrode 111 each time.

  Next, a drying process as shown in FIG. 6 is performed. That is, the first composition after discharge is dried, the solvent contained in the first composition is evaporated, and the hole injection / transport layer 110a is formed. When the drying process is performed, the evaporation of the solvent contained in the liquid composition mainly occurs near the inorganic bank layer 112a and the organic bank layer 112b, and the hole injection / transport layer forming material is concentrated along with the evaporation of the solvent. To precipitate. As a result, as shown in FIG. 6, the hole injection / transport layer 110 a is formed on the pixel electrode 111.

  The drying process is performed, for example, in a nitrogen atmosphere at room temperature and a pressure of, for example, about 133.3 Pa (1 Torr). If the pressure is too low, the composition droplets 110c will bump, which is not preferable. On the other hand, if the temperature is higher than room temperature, the evaporation rate of the polar solvent increases and a flat film cannot be formed. After the drying treatment, it is preferable to remove the polar solvent and water remaining in the hole injecting / transporting layer 110a by performing heat treatment in nitrogen, preferably in vacuum, at 200 ° C. for about 10 minutes.

  In the hole injecting / transporting layer forming step, the discharged composition droplet 110c is filled in the lower and upper openings 112c and 112d, while the liquid repellent treated organic bank layer 112b is used as a liquid composition. Objects are repelled and roll into the lower and upper openings 112c and 112d. Thus, the discharged droplets 110c of the composition can be surely filled in the lower and upper openings 112c and 112d, and the hole injection / transport layer 110a can be formed on the electrode surface 111a.

(4) Light emitting layer forming process The light emitting layer forming process includes a light emitting layer forming material coating process and a drying process.
Here, prior to the light emitting layer forming material application step, the surface of the hole injection / transport layer 110a formed as shown in FIG. 6 is made lyophilic by oxygen plasma treatment, as in the bank surface treatment step described above. On the other hand, the peripheral part 110a2 and the bank part 112 surface are made liquid repellent by CF ₄ plasma treatment.

  Then, after the surface treatment step, the liquid composition for forming the light emitting layer is ejected onto the hole injection / transport layer 110a by the ink jet method in the same manner as the hole injection / transport layer formation step described above (first coating step). Thereafter, the discharged liquid composition is dried (and heat-treated) to form a temporary coating 110d (see FIG. 9) (first drying step), while a solvent is applied to the temporary coating 110d (second). A repair process is performed in the coating step, and after drying (second drying step), the light emitting layer 110b is formed on the hole injection / transport layer 110a. Therefore, hereinafter, the temporary coating film forming step and the repair processing step will be described. In the present embodiment, the light emitting layer 110b is formed in two stages of the provisional coating 110d and the repair process. For example, after the provisional coating 110d is formed, the repair process is performed twice or more. Also good.

(4) -1 Temporary coating film forming step (first coating step and first drying step)
In FIG. 7, the application | coating process of the liquid composition (liquid composition for temporary coating film formation) containing the light emitting layer forming material by the inkjet method in a temporary coating film formation process is shown. As shown in the drawing, a liquid containing a light emitting layer forming material (light emitting material) of each color (for example, blue (B) in this case) is moved from the discharge nozzle H6 formed on the ink jet head relative to the ink jet head H5 and the substrate 2. The composition (liquid composition for forming a temporary coating film) is discharged. At the time of discharge, the discharge nozzle is opposed to the hole injection / transport layer 110a located in the lower and upper openings 112c and 112d, and the liquid for forming a temporary coating film is moved while the inkjet head H5 and the substrate 2 are moved relative to each other. The composition is discharged. The amount of liquid discharged from the discharge nozzle H6 is controlled per drop. The liquid whose amount is controlled in this way is discharged from the discharge nozzle, and droplets of the temporary coating-forming liquid composition are discharged onto the hole injection / transport layer 110a.

In this embodiment, after disposing the temporary coating film-forming liquid composition 110e1 containing the blue light-emitting layer forming material for the blue pixel AB, the temporary coating film-forming liquid compositions 110f1 and 110g1 for the other light-emitting layers. Is discharged.
That is, as shown in FIG. 8, the liquid composition 110f1 for the green pixel AG and the red pixel AR are used without drying the temporary coating-forming liquid composition 110e1 for the blue pixel AB dropped on the substrate 2. The liquid composition 110g1 is discharged and arranged. As described above, when the liquid compositions 110e1 to 110g1 for forming a temporary coating film are dropped on the color pixels AR, AG, and AB, a plurality of ejection heads respectively filled with the liquid compositions for the respective colors are used. The liquid compositions 110e1 to 110g1 may be arranged on the substrate 2 by scanning each independently, and the liquid compositions 110e1 to 110g1 are arranged almost simultaneously by scanning the plurality of ejection heads integrally. You may make it perform.

  As shown in FIG. 8, the discharged liquid compositions 110e1 to 110g1 spread over the entire surface of the hole injection / transport layer 110a and fill the lower and upper openings 112c and 112d. On the other hand, even if the liquid compositions 110e1 to 110g1 are discharged from the predetermined discharge position on the upper surface 112f on the upper surface 112f subjected to the liquid repellent treatment, the upper surface 112f may get wet with the liquid compositions 110e1 to 110g1. The liquid compositions 110e1 to 110g1 roll into the lower and upper openings 112c and 112d.

  The amount of the liquid composition discharged onto each hole injection / transport layer 110a is the size of the lower and upper openings 112c and 112d, the thickness of the light emitting layer 110b to be formed, and the concentration of the light emitting layer material in the liquid composition. Etc. Here, a sufficient amount of the liquid composition necessary for forming the light emitting layer is discharged, that is, the light emitting layer 110b is formed only from the light emitting layer forming material (light emitting material) for forming the temporary coating film. Will be. Further, the liquid compositions 110e1 to 110g1 may be discharged not only once but also several times onto the same hole injection / transport layer 110a. In this case, the amount of the liquid composition at each time may be the same, and the amount of the liquid composition may be changed every time. Furthermore, the liquid composition may be discharged and arranged not only at the same location of the hole injection / transport layer 110a but also at different locations within the hole injection / transport layer 110a each time.

  Examples of the light emitting layer forming material include polyfluorene polymer derivatives, (poly) paraphenylene vinylene derivatives, polyphenylene derivatives, polyvinyl carbazole, polythiophene derivatives, perylene dyes, coumarin dyes, rhodamine dyes, and organic polymers mentioned above. An EL material can be used after being doped. For example, it can be used by doping rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like. The solvent for dissolving or dispersing these light emitting layer forming materials is the same type for each color, specifically, a mixed solvent of trimethylbenzene and xylene (trimethylbenzene: xylene = 5: 5 (volume ratio)). ) Was used.

  Next, after the liquid compositions 110e1 to 110g1 for forming the temporary coating film of the respective color pixels AR, AG, and AB have been arranged at predetermined positions, the temporary coating films 110d1 to 110d3 are formed into holes by performing a drying process at once. It is formed on the entire surface of the injection / transport layer 110a. That is, the solvent contained in the liquid compositions 110e1 to 110g1 is evaporated by drying, and the red (R) temporary coating 110d1, the green (G) temporary coating 110d2, and the blue (B) temporary coating 110d3 as shown in FIG. Is formed.

  Moreover, it is preferable to dry each liquid composition 110e1-110g1 for temporary coating film formation by vacuum drying, and if a specific example is given, the pressure shall be about 133.3Pa (1 Torr) at room temperature in nitrogen atmosphere. It can be performed depending on conditions. If the pressure is too low, the liquid compositions 110e1 to 110g1 are bumped, which is not preferable. Further, when the temperature is set to room temperature or higher, the evaporation rate of the solvent is increased, and a large amount of the temporary coating film forming material (that is, the light emitting layer forming material) adheres to the wall surface of the upper opening 112d.

  In addition, in this temporary coating film formation process, in order to improve applicability | paintability, the temporary coating film is formed using the same kind of solvent (common solvent) for every color temporary coating film, As a result, in FIG. As shown, the temporary coating films 110d1 to 110d3 of the respective colors have different film shapes. That is, the light-emitting layer forming materials of the respective colors have different solubility in the common solvent, so that the film shapes differ in the temporary coating films 110d1 to 110d3 to be formed. Specifically, as shown in FIG. 9, the red temporary coating film 110d1 has a concave shape, the green temporary coating film 110d2 has a flat shape, and the blue temporary coating film 110d3 has a convex shape.

(4) -2 Repair processing step (second coating step and second drying step)
Next, a repair process is performed by applying a solvent on the formed temporary coating film 110d. FIG. 10 shows a solvent application process by an ink jet method in the repair process. As shown in the drawing, the inkjet head H5 and the substrate 2 are moved relative to each other, and a solvent for each color (for example, a mixed solvent of trimethylbenzene and xylene with respect to the blue pixel AB in FIG. 10) from the discharge nozzle H6 formed in the inkjet head. 110e2) is discharged. When discharging, the solvent 110e2 is discharged while the discharge nozzle is opposed to the temporary coating film 110d located in the lower and upper openings 112c and 112d and the inkjet head H5 and the substrate 2 are moved relative to each other. The amount of liquid discharged from the discharge nozzle H6 is controlled per drop. The liquid whose amount is controlled in this way is discharged from the discharge nozzle onto the temporary coating film 110d.

  After the solvent 110e2 is ejected to the blue pixel AB, ejection is sequentially performed for other colors. That is, as shown in FIG. 11, the discharge arrangement of the solvent 110f2 for the green pixel AG and the solvent 110g2 for the red pixel AR is not performed without drying the solvent 110e2 for the blue pixel AB dropped on the temporary coating film 110d3. To do.

  Here, in the present embodiment, the solvent to be ejected is different for each color pixel AR, AG, AB. Specifically, as shown in FIG. 11, the blue solvent 110e2 discharged to the blue pixel AB is a liquid containing trimethylbenzene and xylene at a volume ratio of 7: 3 and discharged to the green pixel AG. The green solvent 110f2 contains trimethylbenzene and xylene at a volume ratio of 5: 5, and the red solvent 110g2 discharged to the red pixel AR contains trimethylbenzene and xylene at a volume ratio of 3: 7. Something is used. Note that it is not always necessary to apply a solvent to the green pixel AG, but it is preferable to discharge the solvent to the green pixel AG because the effect of re-dissolution may be caused by a saturated solvent atmosphere. .

  As described above, when the repairing solvents 110e2 to 110g2 are dropped onto the respective color pixels AR, AG, and AB, the plurality of ejection heads filled with the respective color solvents are independently scanned to scan the substrate 2. The solvents 110e2 to 110g2 may be arranged on the top, and the solvents 110e2 to 110g2 may be arranged almost simultaneously by scanning the plurality of ejection heads integrally.

  As shown in FIG. 11, each of the discharged solvents 110e2 to 110g2 spreads on the temporary coating film 110d and fills the lower and upper openings 112c and 112d. On the other hand, even if each of the solvents 110e2 to 110g2 is discharged from the predetermined discharge position and discharged onto the upper surface 112f on the liquid repellent upper surface 112f, the upper surface 112f does not get wet with the solvents 110e2 to 110g2, and the solvent 110e2 ˜110 g2 rolls into the lower and upper openings 112c and 112d. In addition, the amount of solvent discharged on each temporary coating film 110d and the solvent ratio are determined by the shape of the light emitting layer 110b to be formed.

  Next, after disposing the solvents 110e2 to 110g2 of the color pixels AR, AG, and AB at predetermined positions, the light emitting layer 110b is formed as shown in FIG. That is, the solvents 110e2 to 110g2 are evaporated by drying, and the respective color light emitting layers 110b1, 110b2, and 110b3 as shown in FIG. 12 are formed. In this case, the uneven shape generated in the temporary coating film 110d is repaired by the repair process, and the light emitting layers 110b1, 110b2, and 110b3 have a flat surface, and light emission unevenness is unlikely to occur. .

  The solvents 110e2 to 110g2 are preferably dried by vacuum drying. To give a specific example, the solvent 110e2 to 110g2 can be dried under a nitrogen atmosphere at room temperature and under a pressure of about 133.3 Pa (1 Torr). If the pressure is too low, the solvents 110e2 to 110g2 will be bumped, which is not preferable.

  Next, when the vacuum drying is completed, it is preferable to anneal the light emitting layer 110b using a heating means such as a hot plate. This annealing process is performed at a common temperature and time that can maximize the light emission characteristics of each organic EL layer. In this manner, the hole injection / transport layer 110a and the light emitting layer 110b are formed on the pixel electrode 111.

  Here, in the light emitting layer forming step of the present embodiment, the liquid composition 110e1 for forming a temporary coating film in which the light emitting layer constituting material (functional material, light emitting material) constituting the light emitting layer 110b is dissolved or dispersed in a solvent. 110 g1 is applied onto the hole injecting / transporting layer 110a, and the applied liquid compositions 110e1 to 110g1 are dried to form the temporary coatings 110d1 to 110d3. Then, the temporary coatings 110d1 to 110d3 are formed on the temporary coatings 110d1 to 110d3. A solvent (repair processing solvent) 110e2 to 110g2 capable of dissolving or dispersing the light emitting layer 110b is applied onto the temporary coating film 110d (110d3 to 110d1) and dried to form the light emitting layer 110b. Yes. By adopting such a method, an organic EL device having good light emission characteristics in which unevenness in film thickness in the light emitting layer 110b or defects such as a film not being partially formed does not easily occur, and in other words, unevenness in light emission hardly occurs. It becomes possible to provide.

In particular, in the present embodiment, since a different repair processing solvent is used for each color, an optimal repair processing can be performed for each color.
In addition, by adopting the method of the present embodiment, in the temporary coating film forming step, the solvent can be selected so that it can be easily ejected from the inkjet head regardless of the shape of the film to be formed, and the design of the liquid composition to be used is free. As the degree increases, the stability of ejection can be ensured. As a result, the manufacturing efficiency of the EL device can be improved, and as a result, it is possible to contribute to yield improvement and cost reduction.

(5) Cathode Formation Step Next, as shown in FIG. 13, the cathode 12 that forms a pair with the pixel electrode (anode) 111 is formed. That is, the cathode 12 having a structure in which, for example, a calcium layer and an aluminum layer are sequentially stacked is formed on the entire surface of the substrate 2 including the light emitting layers 110b and the organic bank layers 112b. Thereby, the cathode 12 is laminated | stacked on the whole formation area of each color light emitting layer 110b, and the organic EL element corresponding to each color of red, green, and blue is each formed.

The cathode 12 is preferably formed by, for example, an evaporation method, a sputtering method, a CVD method, or the like, and particularly preferably formed by an evaporation method in terms of preventing damage to the light emitting layer 110b due to heat. Further, a protective layer such as SiO ₂ or SiN may be provided on the cathode 12 to prevent oxidation.

(6) Sealing process Finally, the board | substrate 2 with which the organic EL element was formed, and the sealing substrate prepared separately are sealed via sealing resin. For example, a sealing resin made of a thermosetting resin or an ultraviolet curable resin is applied to the peripheral portion of the substrate 2 and the sealing substrate is disposed on the sealing resin. The sealing step is preferably performed in an inert gas atmosphere such as nitrogen, argon, or helium. If it is carried out in the air, when a defect such as a pinhole has occurred in the cathode 12, water or oxygen may enter the cathode 12 from the defective portion and the cathode 12 may be oxidized, which is not preferable.

  Thereafter, the cathode 12 is connected to the wiring of the substrate 2, and the wiring of the circuit element unit 14 is connected to a driving IC (driving circuit) provided on or outside the substrate 2, whereby the organic EL device of the present embodiment. Complete.

  According to the manufacturing method as described above, an organic EL device can be provided in which the light emitting layer 110b to be formed has less unevenness in film thickness and less inconveniences such as part of the film missing, and as a result, the light emission characteristics of the organic EL device are improved. It becomes possible.

  The selection of the solvents 110e2 to 110g2 is appropriately determined depending on the shape of the formed temporary coating film 110d. For example, as shown in FIG. 15A, when the temporary coating film 110d has a deep concave shape, a solvent in which xylene and trimethylbenzene are mixed in 7; 3 can be used. As shown in FIG. 15 (b), when the concave shape of the temporary coating film 110d is slightly shallower than in the case of FIG. 15 (a), a solvent in which xylene and trimethylbenzene are mixed in 6; 4. Can be adopted.

  On the other hand, for example, as shown in FIG. 15 (e), when the temporary coating film 110d has a high convex shape, a solvent in which xylene and trimethylbenzene are mixed in 3; 7 can be employed. And as shown in FIG.15 (d), when the convex shape of the temporary coating film 110d is a little lower than the case of FIG.15 (e), the solvent which mixed xylene and trimethylbenzene by 4; 6. Can be adopted. Then, the flat temporary coating film 110d as shown in FIG. 15C is not repaired or the solvent used in the temporary coating film forming step (xylene and trimethylbenzene is mixed in 5; 5). Solvent).

  In addition, as a solvent used in the repair process, a mixed solvent of xylene and trimethylbenzene, a mixed solvent of anisole and xylene, etc. can also be adopted. Even in such a mixed solvent, the volume of the solvent for each color for each repair process. By using different ratios, it is possible to perform a suitable repair process for each color.

  In this embodiment, the same type of solvent is applied in the temporary coating film forming step and the repair processing step, but it goes without saying that the solvent can be different in each step. Specifically, in the temporary coating film forming step, the liquid composition 110e1 to 110g1 is selected so that the liquid composition 110e1 to 110g1 has low viscosity in consideration of the applicability of the liquid composition 110e1 to 110g1, while in the repair processing step. From the viewpoint of controlling the film shape, the solvents 110e2 to 110g2 can be selected according to the solubility in the light emitting layer forming material.

  Further, in this embodiment, the repair process is performed using a mixed solvent composed of the same two solvents with different volume ratios for pixels of all colors, but the solvent type may be different for each color. Furthermore, in the present embodiment, repair processing is performed on all color pixels. For example, a pixel having a defect in the film shape or a pixel having a color that easily causes a defect is selectively used. A repair process may be performed. Furthermore, in the present embodiment, the repair process is performed in the light emitting layer forming process. However, such a repair process can be performed in the hole injection / transport layer forming process, for example.

  Further, as shown in FIG. 14, the method according to the present invention similar to the above can also be adopted when the electron block layer 113 is formed on the hole injection / transport layer 110a. By adopting such a method, the thickness of the light emitting layer 110b formed on the electron blocking layer 113 becomes uniform, and the film defects in the light emitting layer 11b hardly occur.

  Furthermore, although the organic EL device has been described as an example in the present embodiment, it is needless to say that the above-described manufacturing method can be adopted when manufacturing the inorganic EL device. Alternatively, in the case of forming a functional film such as a wiring in a semiconductor device having wiring or the like on a substrate or other device having a functional film, a repair film should be repaired after a temporary coating film is simply formed. Thus, it is possible to achieve uniform thickness of the functional film and flattening of the film surface.

(Electronics)
FIG. 16 shows an embodiment of an electronic apparatus equipped with an organic EL device manufactured by the method of the present invention. The electronic apparatus of this embodiment includes an organic EL device manufactured by the above-described method as a display unit. Here, an example of a mobile phone is shown in a perspective view, reference numeral 1000 indicates a mobile phone body, and reference numeral 1001 indicates a display unit using the organic EL device. Thus, in an electronic apparatus provided with an organic EL device as a display means, good display characteristics can be obtained.

1 is a circuit diagram of an organic EL device manufactured by a method according to the present invention. FIG. The cross-sectional block diagram of a display area same as the above. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. Process drawing explaining the manufacturing method which concerns on embodiment. The cross-sectional block diagram which shows typically the modification of an organic electroluminescent apparatus. The cross-sectional schematic diagram which shows some temporary coating films of a different shape. FIG. 11 is a perspective configuration diagram illustrating an example of an electronic device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Substrate, 110 ... Organic EL layer, 110a ... Hole injection / transport layer, 110b ... Light emitting layer (functional film), 111 ... Pixel electrode, 112 ... Bank part (partition wall part)

Claims (12)

A first coating step in which a liquid composition in which a functional material is dissolved or dispersed in a solvent is coated on a substrate;
A first drying step of drying the applied liquid composition to form a temporary coating film;
A second application step of applying a solvent capable of dissolving or dispersing the temporary coating film to the formed temporary coating film;
A second drying step of drying the applied solvent to form a functional film;
A device manufacturing method comprising:   The device manufacturing method according to claim 1, wherein different solvents are used in the first application step and the second application step. In the first coating step, the liquid composition includes a first liquid composition containing a first functional material having a first function, and a second functional material having a second function different from the first function. A second liquid composition containing the first liquid composition and the second liquid composition applied to different regions, respectively,
In the second coating step, the film is dissolved or dispersed in any one of the first temporary coating film made of the first functional material and the second temporary coating film made of the second functional material. The device manufacturing method according to claim 1, wherein a solvent capable of being applied is applied. In the first coating step, the liquid composition includes a first liquid composition containing a first functional material having a first function, and a second functional material having a second function different from the first function. A second liquid composition containing the first liquid composition and the second liquid composition applied to different regions, respectively,
In the second application step, different solvents are applied to the first temporary coating film made of the first functional material and the second temporary coating film made of the second functional material, respectively. Item 3. A device manufacturing method according to Item 1 or 2. A first coating step in which a liquid composition in which a light emitting material is dissolved or dispersed in a solvent is coated on a substrate;
A first drying step of drying the applied liquid composition to form a temporary coating film;
A second application step of applying a solvent capable of dissolving or dispersing the temporary coating film to the formed temporary coating film;
A second drying step of drying the applied solvent to form a light emitting layer;
A method for manufacturing an EL device, comprising:   6. The method of manufacturing an EL device according to claim 5, wherein a solvent used in each of the first application step and the second application step is different. In the first coating step, the liquid composition includes a first liquid composition containing a first light emitting material and a second liquid composition containing a second light emitting material that emits light of a color different from that of the first light emitting material. And applying the first liquid composition and the second liquid composition to different regions,
In the second coating step, the temporary coating film is applied to any one of the first temporary coating film made of the first luminescent material and the second temporary coating film made of the second luminescent material. 7. The method for producing an EL device according to claim 5, wherein a solvent capable of dissolving or dispersing the material is applied. In the first coating step, the liquid composition includes a first liquid composition containing a first light emitting material and a second liquid composition containing a second light emitting material that emits light of a color different from that of the first light emitting material. And applying the first liquid composition and the second liquid composition to different regions,
In the second application step, different solvents are applied to the first temporary coating film made of the first luminescent material and the second temporary coating film made of the second luminescent material, respectively. Item 7. A method for manufacturing an EL device according to Item 5 or 6. In the first application step, the liquid composition includes a red liquid composition containing a red light emitting material, a green liquid composition containing a green light emitting material, and a blue liquid composition containing a blue light emitting material. While applying these red, green and blue liquid compositions to different areas,
In the second coating step, any one of a temporary red coating film made of the red light emitting material, a green temporary coating film made of the green light emitting material, and a blue temporary coating film made of the blue light emitting material. The method for producing an EL device according to claim 5, wherein a solvent capable of dissolving the temporary coating film is applied to the coating film. In the first coating step, the liquid composition includes a red liquid composition containing a red light emitting material, a green liquid composition containing a green light emitting material, and a blue liquid composition containing a blue light emitting material. While applying these red, green and blue liquid compositions to different areas,
In the second coating step, different solvents are used for the red temporary coating film made of the red light emitting material, the green temporary coating film made of the green light emitting material, and the blue temporary coating film made of the blue light emitting material. The method for manufacturing an EL device according to claim 5, wherein the EL device is applied.   An EL device manufactured using the method according to claim 5.   An electronic apparatus comprising the EL device according to claim 11.

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