JP4714997B2 - 圧着装置 - Google Patents

圧着装置 Download PDF

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Publication number
JP4714997B2
JP4714997B2 JP2001034920A JP2001034920A JP4714997B2 JP 4714997 B2 JP4714997 B2 JP 4714997B2 JP 2001034920 A JP2001034920 A JP 2001034920A JP 2001034920 A JP2001034920 A JP 2001034920A JP 4714997 B2 JP4714997 B2 JP 4714997B2
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Japan
Prior art keywords
pressure
lower mold
mold
laminate
spacer
Prior art date
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Expired - Fee Related
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JP2001034920A
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English (en)
Japanese (ja)
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JP2002234017A (ja
JP2002234017A5 (enExample
Inventor
秀郎 中島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2001034920A priority Critical patent/JP4714997B2/ja
Publication of JP2002234017A publication Critical patent/JP2002234017A/ja
Publication of JP2002234017A5 publication Critical patent/JP2002234017A5/ja
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Publication of JP4714997B2 publication Critical patent/JP4714997B2/ja
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JP2001034920A 2001-02-13 2001-02-13 圧着装置 Expired - Fee Related JP4714997B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001034920A JP4714997B2 (ja) 2001-02-13 2001-02-13 圧着装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001034920A JP4714997B2 (ja) 2001-02-13 2001-02-13 圧着装置

Publications (3)

Publication Number Publication Date
JP2002234017A JP2002234017A (ja) 2002-08-20
JP2002234017A5 JP2002234017A5 (enExample) 2008-03-13
JP4714997B2 true JP4714997B2 (ja) 2011-07-06

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ID=18898436

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Application Number Title Priority Date Filing Date
JP2001034920A Expired - Fee Related JP4714997B2 (ja) 2001-02-13 2001-02-13 圧着装置

Country Status (1)

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JP (1) JP4714997B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007185677A (ja) * 2006-01-12 2007-07-26 Miyazu Seisakusho Co Ltd プレス金型装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0618686B2 (ja) * 1985-01-23 1994-03-16 松下電器産業株式会社 セラミツク積層基板の製造方法
JPH02238902A (ja) * 1989-03-13 1990-09-21 Fujitsu Ltd セラミック基板の積層方法

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Publication number Publication date
JP2002234017A (ja) 2002-08-20

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