JP4708755B2 - Regulatory structure of heat dissipation material - Google Patents

Regulatory structure of heat dissipation material Download PDF

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JP4708755B2
JP4708755B2 JP2004291834A JP2004291834A JP4708755B2 JP 4708755 B2 JP4708755 B2 JP 4708755B2 JP 2004291834 A JP2004291834 A JP 2004291834A JP 2004291834 A JP2004291834 A JP 2004291834A JP 4708755 B2 JP4708755 B2 JP 4708755B2
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heat dissipation
heat
printed wiring
wiring board
substrate
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JP2006108326A (en
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卓也 渡部
宜司 米本
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Denso Ten Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Description

本発明は、放熱材の規制構造に関し、たとえばプリント配線板に実装された部品から、前記プリント配線板および放熱材を介して筐体、放熱板などに放熱させる技術に関する。
本発明において、「領域付近」は「領域」を含む。 The present invention relates to a regulating structure of the heat-release material, for example from components mounted on the printed wiring board, the housing through the printed circuit board and the heat dissipating material, a technique to dissipate the heat dissipation plate.
In the present invention, “near a region” includes “a region”.

たとえばプリント配線板に実装された発熱部品を、このプリント配線板から筐体に向けて放熱させるのに、放熱材を用いる技術が実用に供されている（たとえば特許文献１参照）。これらプリント配線板と筐体との間の間隙に、放熱材としての放熱シート、放熱ゲル（以後、放熱シート等と称す）などを介在させ、発熱部品からプリント配線板、放熱シート等から筐体に向けて放熱させている。   For example, a technique using a heat radiating material has been put to practical use for radiating heat generated from a printed wiring board toward a housing from the printed wiring board (see, for example, Patent Document 1). A heat dissipation sheet, a heat dissipation gel (hereinafter referred to as a heat dissipation sheet, etc.) as a heat dissipation material is interposed in the gap between the printed wiring board and the casing, and the casing from the printed wiring board, the heat dissipation sheet, etc. Dissipate heat toward

図５は、従来の部品の放熱構造１を概略示す断面図である。前記従来の放熱構造１では、プリント配線板２にかかる応力を緩和させるために、放熱材として、たとえば流動性のあるコンパウンド３などを適用している。   FIG. 5 is a cross-sectional view schematically showing a conventional component heat dissipation structure 1. In the conventional heat dissipation structure 1, for example, a fluid compound 3 is applied as a heat dissipation material in order to relieve stress applied to the printed wiring board 2.

特開２００１−２３７５７８号公報JP 2001-237578 A

前述の放熱材としての放熱シート等などを介在させる技術では、次のような問題がある。放熱シート等は非流動性の固体であるので、放熱材自身が不所望に流動してしまうことはないが、前述のプリント配線板、筐体間の間隙に比べて放熱シート等の厚みが厚いと、プリント配線板を撓ませてしまう。これによって実装部品またははんだ付け部に応力を発生させる問題がある。   The above-described technology that interposes a heat dissipation sheet or the like as a heat dissipation material has the following problems. Since the heat radiating sheet is a non-flowable solid, the heat radiating material itself does not flow undesirably, but the thickness of the heat radiating sheet etc. is thicker than the above-mentioned printed wiring board and the gap between the casings. Then, the printed wiring board is bent. As a result, there is a problem in that stress is generated in the mounted component or the soldered portion.

放熱材として流動性のあるコンパウンド３などを適用する技術では、次のような問題がある。つまり放熱材３は、プリント配線板２、筐体４間に挟み込まれているだけなので、たとえば周囲環境の変化に起因する熱膨張、熱収縮、あるいは振動によって、放熱材３が不所望に流動するという問題がある。車両等において、このプリント配線板を地面に対し平行ではなく、略垂直に配設した状態で適用する場合には、振動時の加速度または放熱材の自重などで、前記放熱材が不所望に流動するおそれがある。   The technology that applies the fluid compound 3 or the like as a heat radiating material has the following problems. That is, since the heat dissipation material 3 is only sandwiched between the printed wiring board 2 and the housing 4, the heat dissipation material 3 flows undesirably due to, for example, thermal expansion, thermal contraction, or vibration caused by changes in the surrounding environment. There is a problem. In a vehicle or the like, when the printed wiring board is applied in a state of being arranged substantially vertically rather than parallel to the ground, the heat dissipation material flows undesirably due to acceleration during vibration or the weight of the heat dissipation material. There is a risk.

本発明の目的は、部品等および基板に応力が発生することを防止し得るとともに、部品から基板および放熱材を介して確実に放熱することができる放熱材の規制構造を提供することである。 An object of the present invention is to provide with stress components and the like and the substrate can be prevented from occurring, the control structure of the substrate and heat dissipating material that can be reliably dissipated via the discharge heat material from the component is there.

本発明は、発熱する部品が表面に実装される基板と、前記基板の裏面から間隙を空けて設けられる筐体との間に介在される放熱材の流動を規制する構造であって、
前記基板に、流動可能な放熱材の流動を規制する規制手段を備え、
前記規制手段は、前記基板のうち、放熱材を規制すべき領域付近に形成され、互いに平行に延びる一対の長孔状の貫通孔であり、前記貫通孔に前記放熱材が流入することによって前記放熱材の動き止めアンカーとなることを特徴とする放熱材の規制構造である。 The present invention is a structure that regulates the flow of a heat radiating material interposed between a substrate on which heat-generating components are mounted on the surface and a housing provided with a gap from the back surface of the substrate ,
The substrate is provided with a regulating means for regulating the flow of the heat radiating material that can flow,
The regulating means, out of the substrate, is formed in the vicinity of the region should regulate the heat dissipation member, Ri pair of long hole-shaped through hole der extending parallel to one another, by the heat radiating member flows into the through hole The heat- dissipating material restricting structure is a heat-dissipating anchor for the heat-dissipating material.

本発明に従えば、基板には部品が実装され、この基板に規制手段が設けられ、この規制手段によって、流動可能な放熱材であって基板と筐体との間に介在される放熱材の流動を規制する。   According to the present invention, a component is mounted on the board, and a restriction means is provided on the board. By this restriction means, a heat dissipation material that is flowable and interposed between the board and the housing is provided. Regulate flow.

本発明によれば、基板には部品が実装され、この基板に規制手段が設けられ、この規制手段によって、流動可能な放熱材であって基板と筐体との間に介在される放熱材の流動を規制することができる。したがって周囲環境の変化に起因して放熱材が流動してしまうことを防止することができるので、部品から基板、放熱材および筐体を介して確実に放熱することができる。しかも前記流動可能な放熱材を用いることで、非流動性の放熱シート、放熱ゲルを用いる構造に比べて、基板が不所望に撓むことを防止し、部品等（はんだ付け部を含む）に応力が発生することを防止し得る。このように部品等および基板に応力が発生することを防止し得るとともに、部品から基板、放熱材および筐体を介して確実に放熱することができる。 According to the present invention, a component is mounted on the substrate, and a restriction means is provided on the substrate. By this restriction means, a heat dissipation material that is flowable and is interposed between the substrate and the housing. Flow can be regulated. Therefore, it is possible to prevent the heat dissipation material from flowing due to a change in the surrounding environment, so that heat can be reliably radiated from the component through the substrate, the heat dissipation material, and the housing. In addition, the use of the flowable heat dissipation material prevents the substrate from bending undesirably compared to a structure using a non-flowable heat dissipation sheet or heat dissipation gel, and can be used for components and the like (including soldered portions). Generation of stress can be prevented. As described above, it is possible to prevent stress from being generated on the components and the board and to reliably radiate heat from the components via the board, the heat dissipation material, and the housing.

以下、図面を参照しながら本発明を実施するための形態を説明する。なお各形態で先行する形態で説明している事項に対応している部分には同一の参照符を付し、重複する説明を略する場合がある。また構成の一部のみを説明している場合、構成の他の部分は、先行して説明している形態と同様とする。また実施の各形態で具体的に説明している部分の組合せばかりではなく、特に組合せに支障が生じなければ、実施の形態同士を部分的に組合せることも可能である。 Hereinafter, description of the embodiments of the present invention with reference to the drawings. In addition, the same reference mark is attached | subjected to the part corresponding to the matter demonstrated with the form preceded by each form, and the overlapping description may be abbreviate | omitted. In addition, when only a part of the configuration is described, the other parts of the configuration are the same as those described above. In addition to the combination of parts specifically described in each embodiment, the embodiments may be partially combined as long as the combination is not particularly troublesome.

図１は、本発明の参考となる第１の実施形態に係る部品の放熱構造を示し、図１（ａ）はその断面図、図１（ｂ）は要部を拡大して示す断面図、図１（ｃ）は要部の平面図である。以下の実施形態においては、放熱材の規制構造をも含む。基板であるプリント配線板１０の表面部１０ａに、たとえばトランジスタなどの部品１１が実装されている。ただし実装される部品１１は、トランジスタだけに限定されるものではない。このプリント配線板１０の裏面部１０ｂ（一表面部に相当）に間隙δをあけて筐体１２が設けられている。 FIG. 1 shows a heat dissipation structure for a component according to a first embodiment which is a reference of the present invention, FIG. 1 (a) is a sectional view thereof, and FIG. 1 (b) is a sectional view showing an enlarged main part. FIG.1 (c) is a top view of the principal part. In the following embodiment, the regulation structure of a heat radiating material is also included. A component 11 such as a transistor is mounted on the surface portion 10a of the printed wiring board 10 which is a substrate. However, the component 11 to be mounted is not limited to the transistor. A housing 12 is provided on the back surface portion 10b (corresponding to one surface portion) of the printed wiring board 10 with a gap δ.

プリント配線板１０の一表面部１０ｂにおいて、部品１１が設けられる領域の裏面側の領域でかつ、部品１１が設けられる領域よりやや大きい領域に、規制手段としての突起部１３が付設されている。突起部１３は塗布される放熱コンパウンド１４を外囲する平面視矩形枠状のものである。なお、例として外囲する短形枠状の突起部１３を説明するが、形状はこの限りではなく、たとえば完全に外囲せず一部が開いた形状であってもよい。突起部１３は、筐体１２まで到達することなく、前記一表面部１０ｂから所定小距離突出するように形成されている。平面視とは、プリント配線板１０をその厚み方向に見ることと同義である。また突起部１３は、たとえばレジスト、銅箔、シルク、チップ用ボンドおよびはんだの少なくともいずれか一つによって実現することが可能である。なお突起部１３をプリント配線板１０に一体形成することも可能である。前記放熱コンパウンド１４は、流動性のある放熱材であり、たとえばオイルコンパウンドなどによって実現される。ただし必ずしもオイルコンパウンドだけに限定されるものではない。このような突起部１３によって流動可能な放熱コンパウンド１４の流動を規制するようになっている。   On one surface portion 10 b of the printed wiring board 10, a protrusion 13 as a restricting means is attached to a region on the back side of a region where the component 11 is provided and a region slightly larger than a region where the component 11 is provided. The protrusion 13 has a rectangular frame shape in plan view that surrounds the applied heat dissipation compound 14. In addition, although the short frame-shaped projection part 13 which encloses is demonstrated as an example, a shape is not this limitation, For example, the shape which was not enclosed completely but opened partially may be sufficient. The protruding portion 13 is formed so as to protrude from the one surface portion 10 b by a predetermined small distance without reaching the housing 12. The plan view is synonymous with viewing the printed wiring board 10 in the thickness direction. The protrusion 13 can be realized by at least one of resist, copper foil, silk, chip bond, and solder, for example. Note that the protrusion 13 can be formed integrally with the printed wiring board 10. The heat dissipating compound 14 is a fluid heat dissipating material, and is realized by, for example, an oil compound. However, it is not necessarily limited to only oil compounds. The flow of the heat dissipating compound 14 that can flow by the protrusion 13 is regulated.

以上説明した第１の実施形態に係る部品の放熱構造によれば、プリント配線板１０に突起部１３が付設され、この突起部１３によって、流動可能な放熱コンパウンド１４の流動を規制することができる。したがって周囲環境の変化に起因して放熱コンパウンド１４が流動してしまうことを防止することができるので、部品１１からプリント配線板１０および放熱コンパウンド１４を介して確実に放熱することができる。しかも前記流動可能な放熱コンパウンド１４を用いることで、非流動性の放熱シート等を用いる構造に比べて、プリント配線板１０が不所望に撓むことを防止し、部品１１等（はんだ付け部を含む）に応力が発生することを防止し得る。このように部品１１等およびプリント配線板１０に応力が発生することを防止し得るとともに、部品１１からプリント配線板１０および放熱コンパウンド１４を介して確実に放熱することができる。   According to the heat dissipation structure for a component according to the first embodiment described above, the protrusion 13 is attached to the printed wiring board 10, and the flow of the heat dissipation compound 14 that can flow can be regulated by the protrusion 13. . Therefore, it is possible to prevent the heat dissipation compound 14 from flowing due to a change in the surrounding environment, so that heat can be reliably radiated from the component 11 via the printed wiring board 10 and the heat dissipation compound 14. Moreover, by using the flowable heat dissipation compound 14, it is possible to prevent the printed wiring board 10 from being bent undesirably as compared with a structure using a non-flowable heat dissipation sheet or the like. It is possible to prevent stress from being generated. Thus, it is possible to prevent stress from being generated in the component 11 and the printed wiring board 10 and to reliably radiate heat from the component 11 through the printed wiring board 10 and the heat dissipation compound 14.

突起部１３はプリント配線板１０の一表面部１０ｂに付設されるので、筐体１２にこのような規制手段を設けるのに比べて規制手段を簡単に実現でき、汎用性を高めることができる。これによって製作コストの低減を図ることができる。またこの突起部１３を、放熱コンパウンド１４を塗布すべき領域（塗布範囲）の目印とすることができ、作業能率を高めることが可能となる。   Since the protruding portion 13 is attached to the one surface portion 10b of the printed wiring board 10, the restricting means can be easily realized and the versatility can be improved as compared with the case where such a restricting means is provided in the housing 12. This can reduce the manufacturing cost. Moreover, this protrusion part 13 can be used as a mark of the area | region (application | coating range) which should apply | coat the thermal radiation compound 14, and it becomes possible to improve work efficiency.

図２は、本発明の参考となる第２の実施形態に係る部品の放熱構造を示し、図２（ａ）はその要部の平面図、図２（ｂ）は凹部１０ｃを示す断面図、図２（ｃ）は凸部１０ｄを示す断面図である。図１も参照しつつ説明する。第２の実施形態に係る部品１１の放熱構造においては、筐体１２に臨むプリント配線板１０の一表面部１０ｂにおいて、放熱コンパウンド１４を規制すべき領域付近に凹部１０ｃまたは凸部１０ｄが形成されている。これら凹部１０ｃまたは凸部１０ｄは、スルーホール、非スルーホール、はんだおよびチップ用ボンドの少なくともいずれか一つよって実現することが可能である。なお凸部１０ｄをプリント配線板１０に一体形成することも可能である。 2 shows a heat dissipation structure for a component according to a second embodiment which is a reference of the present invention, FIG. 2 (a) is a plan view of the main part, FIG. 2 (b) is a sectional view showing a recess 10c, FIG.2 (c) is sectional drawing which shows the convex part 10d. This will be described with reference to FIG. In the heat dissipation structure of the component 11 according to the second embodiment, the concave portion 10c or the convex portion 10d is formed in the vicinity of the region where the heat dissipation compound 14 is to be regulated on the one surface portion 10b of the printed wiring board 10 facing the housing 12. ing. The concave portion 10c or the convex portion 10d can be realized by at least one of a through hole, a non-through hole, solder, and a chip bond. Note that the convex portion 10d can be integrally formed with the printed wiring board 10.

第２の実施形態に係る部品１１の放熱構造によれば、これら凹部１０ｃおよび凸部１０ｄの少なくともいずれか一方によって規制手段を実現し得る。プリント配線板１０に凹部１０ｃまたは凸部１０ｄが形成されるので、規制手段を簡単に実現でき、汎用性を高めることができる。凹部１０ｃまたは凸部１０ｄを放熱コンパウンド１４の塗布範囲の目印とすることもできる。その他第１の実施形態と同様の効果を奏する。   According to the heat dissipation structure for the component 11 according to the second embodiment, the restricting means can be realized by at least one of the concave portion 10c and the convex portion 10d. Since the concave portion 10c or the convex portion 10d is formed on the printed wiring board 10, the regulating means can be easily realized and versatility can be improved. The concave portion 10 c or the convex portion 10 d can be used as a mark of the application range of the heat dissipation compound 14. Other effects similar to those of the first embodiment are obtained.

図３は、本発明の参考となる第３の実施形態に係る部品１１の放熱構造を示し、図３（ａ）はその要部の平面図、図３（ｂ）は、複数の突起部１０ｅによって形成される格子の断面図、図３（ｃ）は、複数の凹所１０ｆによって形成される格子の断面図である。図１も参照しつつ説明する。第３の実施形態に係る部品１１の放熱構造においては、筐体１２に臨むプリント配線板１０の一表面部１０ｂにおいて、放熱コンパウンド１４を規制すべき領域付近に格子１５が形成されている。この格子１５は、図３（ｂ）に示すように複数の突起部１０ｅによって実現することが可能である。また格子１５は、図３（ｃ）に示すように、複数の凹所１０ｆによって実現することが可能である。突起部１０ｅまたは凹所１０ｆは、銅箔、レジストおよびシルクの少なくともいずれか一つによって実現することが可能である。本放熱構造によれば、第２の実施形態に係る部品の放熱構造と同様の効果を奏する。 3A and 3B show a heat dissipation structure of a component 11 according to a third embodiment which is a reference of the present invention, FIG. 3A is a plan view of the main part, and FIG. 3B is a plurality of protrusions 10e. FIG. 3C is a cross-sectional view of the lattice formed by the plurality of recesses 10f. This will be described with reference to FIG. In the heat dissipation structure for the component 11 according to the third embodiment, a lattice 15 is formed in the vicinity of a region where the heat dissipation compound 14 is to be regulated on one surface portion 10 b of the printed wiring board 10 facing the housing 12. The lattice 15 can be realized by a plurality of protrusions 10e as shown in FIG. Moreover, the grating | lattice 15 can be implement | achieved by several recessed part 10f, as shown in FIG.3 (c). The protrusion 10e or the recess 10f can be realized by at least one of copper foil, resist, and silk. According to the heat dissipation structure, the same effects as those of the component heat dissipation structure according to the second embodiment can be obtained.

図４は、本発明の実施形態に関する部品の放熱構造を示し、図４（ａ）はその要部の平面図、図４（ｂ）は基板１０と筐体１２と放熱材１４との関係を示す断面図である。本実施形態に係る部品１１の放熱構造においては、部品１１から所定小距離離隔した基板位置に、一対の貫通孔１０ｇが形成されている。これら貫通孔１０ｇが互いに平行に延びる長孔状の貫通孔１０ｇであり、このような一対の貫通孔１０ｇによって流動可能な放熱コンパウンド１４の流動を規制するようになっている。ただし貫通孔１０ｇは一対に限定されるものではなく、長孔状に限定されるものでもない。本放熱構造によれば、これら貫通孔１０ｇによって放熱コンパウンド１４の動き止めアンカーとすることができる。その他第１〜第３の実施形態と同様の効果を奏する。 Figure 4 shows a heat dissipation structure of a part related to the embodiment of the present invention, FIG. 4 (a) is a plan view of the main portion, FIG. 4 (b) the relationship between the substrate 10 and the housing 12 and the heat radiating member 14 FIG. In the heat dissipation structure for the component 11 according to the present embodiment, a pair of through-holes 10g are formed at a board position spaced apart from the component 11 by a predetermined small distance. These through-holes 10g are elongated through-holes 10g extending in parallel with each other, and the flow of the heat radiation compound 14 that can flow is regulated by the pair of through-holes 10g. However, the through holes 10g are not limited to a pair, and are not limited to a long hole shape. According to the present heat dissipation structure, the through holes 10g can be used as a detent anchor for the heat dissipation compound 14. In addition, the same effects as those of the first to third embodiments are obtained.

前述の第１〜第３の実施形態、および本発明の実施形態のいずれか１つに加えて、プリント配線板のうち放熱コンパウンドを規制すべき領域付近に、銅箔が設けられる構成としてもよい。この構成によれば、銅箔によってプリント配線板の吸湿の影響をなくすことができる。つまり銅箔によってプリント配線板からの水蒸気を阻止し、この水蒸気に起因する熱伝導の悪化を未然に防止することができる。したがって部品からプリント配線板および放熱コンパウンドを介して、一層確実に放熱することができる。 In addition to any one of the first to third embodiments described above and the embodiment of the present invention , a copper foil may be provided in the vicinity of the region where the heat dissipation compound is to be regulated in the printed wiring board. . According to this configuration, the influence of moisture absorption of the printed wiring board can be eliminated by the copper foil. That is, water vapor from the printed wiring board can be blocked by the copper foil, and deterioration of heat conduction caused by the water vapor can be prevented in advance. Therefore, it is possible to radiate heat more reliably from the components via the printed wiring board and the heat dissipation compound.

本発明の参考となる第１の実施形態に係る部品の放熱構造を示し、図１（ａ）はその断面図、図１（ｂ）は要部を拡大して示す断面図、図１（ｃ）は要部の平面図である。1 shows a heat dissipation structure for a component according to a first embodiment which is a reference of the present invention, FIG. 1A is a cross-sectional view thereof, FIG. 1B is a cross-sectional view showing an enlarged main part, and FIG. ) Is a plan view of the main part. 本発明の参考となる第２の実施形態に係る部品の放熱構造を示し、図２（ａ）はその要部の平面図、図２（ｂ）は凹部１０ｃを示す断面図、図２（ｃ）は凸部１０ｄを示す断面図である。FIG. 2 (a) is a plan view of the main part, FIG. 2 (b) is a sectional view showing a recess 10c, and FIG. 2 (c) shows a heat dissipation structure for a component according to a second embodiment which is a reference of the present invention. ) Is a cross-sectional view showing the convex portion 10d. 本発明の参考となる第３の実施形態に係る部品の放熱構造を示し、図３（ａ）はその要部の平面図、図３（ｂ）は、複数の突起部１０ｅによって形成される格子の断面図、図３（ｃ）は、複数の凹所１０ｆによって形成される格子の断面図である。FIG. 3A shows a heat dissipation structure for a component according to a third embodiment which is a reference of the present invention, FIG. 3A is a plan view of the main part, and FIG. 3B is a lattice formed by a plurality of protrusions 10e. FIG. 3C is a cross-sectional view of a lattice formed by a plurality of recesses 10f. 本発明の実施形態に関する部品の放熱構造を示し、図４（ａ）はその要部の平面図、図４（ｂ）は基板１０と筐体１２と放熱材１４との関係を示す断面図である。Shows a heat radiation structure of the part related to an embodiment of the present invention, FIG. 4 (a) is a plan view of the main part, cross-sectional view of FIG. 4 (b) shows the relationship between the substrate 10 and the housing 12 and the heat radiating member 14 It is. 従来の部品の放熱構造１を概略示す断面図である。It is sectional drawing which shows schematically the conventional heat dissipation structure 1 of components.

符号の説明Explanation of symbols

１０ プリント配線板
１０ｃ，１０ｄ 凹部，凸部
１０ｅ，１０ｆ 突起部，凹所
１１ 部品
１３ 突起部
１４ 放熱コンパウンド
１５ 格子 DESCRIPTION OF SYMBOLS 10 Printed wiring board 10c, 10d Concave part, convex part 10e, 10f Protrusion part, concave part 11 Parts 13 Protrusion part 14 Radiation compound 15 Grid

Claims (1)

発熱する部品が表面に実装される基板と、前記基板の裏面から間隙を空けて設けられる筐体との間に介在される放熱材の流動を規制する構造であって、
前記基板に、流動可能な放熱材の流動を規制する規制手段を備え、
前記規制手段は、前記基板のうち、放熱材を規制すべき領域付近に形成され、互いに平行に延びる一対の長孔状の貫通孔であり、前記貫通孔に前記放熱材が流入することによって前記放熱材の動き止めアンカーとなることを特徴とする放熱材の規制構造。 A structure that regulates the flow of a heat dissipation material interposed between a substrate on which a component that generates heat is mounted on the surface and a housing provided with a gap from the back surface of the substrate ,
The substrate is provided with a regulating means for regulating the flow of the heat radiating material that can flow,
The regulating means, out of the substrate, is formed in the vicinity of the region should regulate the heat dissipation member, Ri pair of long hole-shaped through hole der extending parallel to one another, by the heat radiating member flows into the through hole A heat-dissipating material restricting structure, wherein the heat-dissipating material serves as a detent anchor .
JP2004291834A 2004-10-04 2004-10-04 Regulatory structure of heat dissipation material Expired - Fee Related JP4708755B2 (en)

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