JP4708217B2 - 基板処理装置および昇降装置 - Google Patents
基板処理装置および昇降装置 Download PDFInfo
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- JP4708217B2 JP4708217B2 JP2006052683A JP2006052683A JP4708217B2 JP 4708217 B2 JP4708217 B2 JP 4708217B2 JP 2006052683 A JP2006052683 A JP 2006052683A JP 2006052683 A JP2006052683 A JP 2006052683A JP 4708217 B2 JP4708217 B2 JP 4708217B2
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- Japan
- Prior art keywords
- substrate
- processing apparatus
- chamber
- substrate processing
- support member
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Description
図1は、本発明に係る基板処理装置1を示す正面図である。図1では、第1チャンバ2が上昇した状態を示している。また、図2は、基板処理装置1を示すの側面図である。図2では、第1チャンバ2が下降した状態を示している。なお、図1および図2では、一部構成を断面で示すとともに、筐体フレーム等の一部構成を略している。また、後の説明のために、図1において、ベベルギヤボックス420については筐体を破線で示し、内部構造を示す。
以上、本発明の実施の形態について説明してきたが、本発明は上記実施の形態に限定されるものではなく様々な変形が可能である。
2 第1チャンバ
21 処理室
3 第2チャンバ
30 貫通孔
4 昇降装置
401,402,404,405 保持部
41 駆動モータ
42 動力伝達機構
420,421,422,423,424,425 ベベルギヤボックス
426,427 回転シャフト
428 カップリング
43 ピン
44 リフトプレート
45 駆動軸
46 支持部材
47 ナット部材
48 ボールネジ
49 ベローズ
6 排気機構
7 制御部
90 基板
Claims (7)
- 処理室内で基板を処理する基板処理装置であって、
前記処理室の蓋部を形成する第1チャンバと、
前記第1チャンバと迎合することにより前記処理室を形成する第2チャンバと、
前記第2チャンバに対して基板を昇降させる昇降装置と、
を備え、
前記昇降装置は、
基板を保持する複数の保持手段と、
前記複数の保持手段により保持された基板を昇降させるための駆動力を生成する単一の駆動源と、
前記駆動源により生成された駆動力を前記複数の保持手段のそれぞれに伝達する動力伝達機構と、
を備え、
前記複数の保持手段のそれぞれが、
昇降可能な少なくとも1つの駆動軸と、
前記少なくとも1つの駆動軸が立設される支持部材と、
前記支持部材に固設されるナット部材と、
前記ナット部材に螺入され、前記動力伝達機構により回転駆動力が伝達されるボールネジと、
を備え、
前記支持部材は、それぞれ他の保持手段の支持部材と互いに別体となっていることを特徴とする基板処理装置。 - 請求項1に記載の基板処理装置であって、
前記第2チャンバには複数の貫通孔が設けられており、
前記少なくとも1つの駆動軸は、前記複数の貫通孔のいずれかに挿入され、
前記少なくとも1つの駆動軸が挿入された貫通孔をそれぞれシールするベローズをさらに備えることを特徴とする基板処理装置。 - 請求項2に記載の基板処理装置であって、
前記処理室内を減圧する排気機構をさらに備え、
前記処理は、減圧乾燥処理であることを特徴とする基板処理装置。 - 請求項1ないし3のいずれかに記載の基板処理装置であって、
前記動力伝達機構が、
水平軸回りに回転駆動されるシャフトと、
前記シャフトの回転駆動力を前記ボールネジに伝達する伝達手段と、
を備えることを特徴とする基板処理装置。 - 請求項1ないし4のいずれかに記載の基板処理装置であって、
前記支持部材は、パイプ状部材であることを特徴とする基板処理装置。 - 請求項1ないし5のいずれかに記載の基板処理装置であって、
前記複数の保持手段のそれぞれが、
基板に当接する複数のピンと、
前記複数のピンが立設されるリフトプレートと、
をさらに備え、
前記少なくとも1つの駆動軸は、前記リフトプレートの下方に垂設されることを特徴とする基板処理装置。 - 基板を昇降させる昇降装置であって、
基板を保持する複数の保持手段と、
基板を昇降させるための駆動力を生成する単一の駆動源と、
前記駆動源により生成された駆動力を前記複数の保持手段のそれぞれに伝達する動力伝達機構と、
を備え、
前記複数の保持手段のそれぞれが、
昇降可能な少なくとも1つの駆動軸と、
前記少なくとも1つの駆動軸が立設される支持部材と、
前記支持部材に固設されるナット部材と、
前記ナット部材に螺入され、前記動力伝達機構により回転駆動力が伝達されるボールネジと、
を備え、
前記支持部材は、それぞれ他の保持手段の支持部材と互いに別体となっていることを特徴とする昇降装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006052683A JP4708217B2 (ja) | 2006-02-28 | 2006-02-28 | 基板処理装置および昇降装置 |
KR1020060138182A KR100807035B1 (ko) | 2006-02-28 | 2006-12-29 | 기판 처리 장치 및 승강 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006052683A JP4708217B2 (ja) | 2006-02-28 | 2006-02-28 | 基板処理装置および昇降装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007234758A JP2007234758A (ja) | 2007-09-13 |
JP4708217B2 true JP4708217B2 (ja) | 2011-06-22 |
Family
ID=38555058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006052683A Expired - Fee Related JP4708217B2 (ja) | 2006-02-28 | 2006-02-28 | 基板処理装置および昇降装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4708217B2 (ja) |
KR (1) | KR100807035B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101987577B1 (ko) * | 2018-01-24 | 2019-06-10 | 주식회사 기가레인 | 승강하는 유도부와 연동하는 배기조절부를 포함하는 기판 처리 장치 |
CN108501000A (zh) * | 2018-06-20 | 2018-09-07 | 江苏大成航空科技有限公司 | 一种无人机用电池更换机械手 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3040630B2 (ja) * | 1993-02-16 | 2000-05-15 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理方法 |
KR100291109B1 (ko) | 1993-05-31 | 2001-06-01 | 히가시 데쓰로 | 반도체 웨이퍼의 버언 인 검사기능을 구비한 프로우브 검사 및 리페어장치, 및 반도체 웨이퍼의 버언 인 검사장치 |
JPH08288368A (ja) | 1995-04-14 | 1996-11-01 | Tokyo Electron Ltd | 基板の整列装置および方法 |
JPH1116979A (ja) * | 1997-06-19 | 1999-01-22 | Tokyo Electron Ltd | 半導体処理用真空チャンバ及び載置台装置 |
JP2001274100A (ja) * | 2000-03-27 | 2001-10-05 | Hitachi Kokusai Electric Inc | 基板処理方法 |
JP4152087B2 (ja) * | 2001-03-23 | 2008-09-17 | 大日本スクリーン製造株式会社 | 基板冷却装置および基板冷却方法 |
JP2003031512A (ja) * | 2001-07-18 | 2003-01-31 | Rohm Co Ltd | 入出制御装置を備える拡散炉 |
JP4228634B2 (ja) * | 2002-09-03 | 2009-02-25 | 東京エレクトロン株式会社 | 回転駆動機構及び被処理体の搬送装置 |
JP4476133B2 (ja) * | 2005-02-24 | 2010-06-09 | 東京エレクトロン株式会社 | 処理システム |
-
2006
- 2006-02-28 JP JP2006052683A patent/JP4708217B2/ja not_active Expired - Fee Related
- 2006-12-29 KR KR1020060138182A patent/KR100807035B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2007234758A (ja) | 2007-09-13 |
KR20070089592A (ko) | 2007-08-31 |
KR100807035B1 (ko) | 2008-02-25 |
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