JP4685077B2 - 携帯電話装置 - Google Patents

携帯電話装置 Download PDF

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Publication number
JP4685077B2
JP4685077B2 JP2007277331A JP2007277331A JP4685077B2 JP 4685077 B2 JP4685077 B2 JP 4685077B2 JP 2007277331 A JP2007277331 A JP 2007277331A JP 2007277331 A JP2007277331 A JP 2007277331A JP 4685077 B2 JP4685077 B2 JP 4685077B2
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JP
Japan
Prior art keywords
nameplate
resist
circuit board
printed circuit
groove
Prior art date
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Expired - Fee Related
Application number
JP2007277331A
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English (en)
Japanese (ja)
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JP2009105303A5 (https=
JP2009105303A (ja
Inventor
賢一 望月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2007277331A priority Critical patent/JP4685077B2/ja
Publication of JP2009105303A publication Critical patent/JP2009105303A/ja
Publication of JP2009105303A5 publication Critical patent/JP2009105303A5/ja
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Publication of JP4685077B2 publication Critical patent/JP4685077B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2007277331A 2007-10-25 2007-10-25 携帯電話装置 Expired - Fee Related JP4685077B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007277331A JP4685077B2 (ja) 2007-10-25 2007-10-25 携帯電話装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007277331A JP4685077B2 (ja) 2007-10-25 2007-10-25 携帯電話装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2009254678A Division JP4631988B2 (ja) 2009-11-06 2009-11-06 回路基板
JP2009255771A Division JP2010034587A (ja) 2009-11-09 2009-11-09 回路基板及び電子機器

Publications (3)

Publication Number Publication Date
JP2009105303A JP2009105303A (ja) 2009-05-14
JP2009105303A5 JP2009105303A5 (https=) 2009-08-06
JP4685077B2 true JP4685077B2 (ja) 2011-05-18

Family

ID=40706686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007277331A Expired - Fee Related JP4685077B2 (ja) 2007-10-25 2007-10-25 携帯電話装置

Country Status (1)

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JP (1) JP4685077B2 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4631988B2 (ja) * 2009-11-06 2011-02-16 パナソニック株式会社 回路基板
JP5692999B2 (ja) * 2009-12-24 2015-04-01 矢崎総業株式会社 ヒートシンク取付構造
CN113038698B (zh) * 2021-03-08 2022-09-09 京东方科技集团股份有限公司 柔性电路板、显示面板、制备方法和显示装置
CN114554725B (zh) * 2022-04-25 2022-07-05 绵阳新能智造科技有限公司 一种复合pcb板的粘贴装置及方法
JP7759116B2 (ja) * 2023-07-03 2025-10-23 株式会社オプトラン 気泡除去方法及び気泡除去装置

Also Published As

Publication number Publication date
JP2009105303A (ja) 2009-05-14

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