JP4685077B2 - 携帯電話装置 - Google Patents
携帯電話装置 Download PDFInfo
- Publication number
- JP4685077B2 JP4685077B2 JP2007277331A JP2007277331A JP4685077B2 JP 4685077 B2 JP4685077 B2 JP 4685077B2 JP 2007277331 A JP2007277331 A JP 2007277331A JP 2007277331 A JP2007277331 A JP 2007277331A JP 4685077 B2 JP4685077 B2 JP 4685077B2
- Authority
- JP
- Japan
- Prior art keywords
- nameplate
- resist
- circuit board
- printed circuit
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007277331A JP4685077B2 (ja) | 2007-10-25 | 2007-10-25 | 携帯電話装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007277331A JP4685077B2 (ja) | 2007-10-25 | 2007-10-25 | 携帯電話装置 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009254678A Division JP4631988B2 (ja) | 2009-11-06 | 2009-11-06 | 回路基板 |
| JP2009255771A Division JP2010034587A (ja) | 2009-11-09 | 2009-11-09 | 回路基板及び電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009105303A JP2009105303A (ja) | 2009-05-14 |
| JP2009105303A5 JP2009105303A5 (https=) | 2009-08-06 |
| JP4685077B2 true JP4685077B2 (ja) | 2011-05-18 |
Family
ID=40706686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007277331A Expired - Fee Related JP4685077B2 (ja) | 2007-10-25 | 2007-10-25 | 携帯電話装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4685077B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4631988B2 (ja) * | 2009-11-06 | 2011-02-16 | パナソニック株式会社 | 回路基板 |
| JP5692999B2 (ja) * | 2009-12-24 | 2015-04-01 | 矢崎総業株式会社 | ヒートシンク取付構造 |
| CN113038698B (zh) * | 2021-03-08 | 2022-09-09 | 京东方科技集团股份有限公司 | 柔性电路板、显示面板、制备方法和显示装置 |
| CN114554725B (zh) * | 2022-04-25 | 2022-07-05 | 绵阳新能智造科技有限公司 | 一种复合pcb板的粘贴装置及方法 |
| JP7759116B2 (ja) * | 2023-07-03 | 2025-10-23 | 株式会社オプトラン | 気泡除去方法及び気泡除去装置 |
-
2007
- 2007-10-25 JP JP2007277331A patent/JP4685077B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009105303A (ja) | 2009-05-14 |
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