JP4683049B2 - Printed wiring board with built-in resistor - Google Patents

Description

  The present invention relates to a printed wiring board with a built-in resistance element.

  The printed wiring board mounts and fixes semiconductor parts (active parts) such as ICs and LSIs and electronic parts (passive parts) such as inductances, resistors and capacitors, and electrically connects them. Therefore, the conventional printed wiring board is formed of an insulating resin substrate for mounting components and a conductive circuit formed on the surface and inside of the substrate for electrical interconnection.

  In recent years, as electronic devices have been increased in speed and frequency, it has been desired to incorporate passive components in a printed wiring board in advance in order to improve the quality characteristics (property) of propagation signals. The present application relates to a printed wiring board in which a resistance element, which is one of such passive components, is built in advance.

Patent Document 1 exists as a printed wiring board incorporating a resistance element.
Japanese Patent Application Laid-Open No. 2006-24740 “Resistance element and multilayer printed wiring board incorporating the resistance element” (publication date: Jan. 26, 2006) FIG. A resistive element is described.

  The resistance value R of a rectangular resistance element formed on a printed wiring board as described in Patent Document 1 is proportional to the length L between both electrodes and inversely proportional to the cross-sectional area S of the resistance material. The cross-sectional area S is determined by the width W and height (thickness) t of the resistance material. R = ρ · L / S = ρ · L / (W · t). Where ρ is a resistivity determined by a resistance material.

  Here, when the resistance material is formed by printing, the printing accuracy of the resistance material becomes a problem. That is, in general, when a resistance material is screen-printed on a printed wiring board and further thermally dried or thermally cured (hereinafter simply referred to as “thermal drying”), the width W and height (thickness) t of the resistance material are increased. It is difficult to control with precision. As a result, the resistance tolerance (variation) of the resistance elements inevitably tends to increase.

  In view of the above problems, an object of the present invention is to provide a novel printed wiring board with a built-in resistance element that can reduce resistance value tolerance (variation) of the resistive element and an electronic device using the same.

  The resistance element built-in printed wiring board according to the present invention includes a first electrode formed on a surface of an insulating member, a second electrode provided to face the first electrode, the first electrode, A resistor filling portion formed between the resistor filling portion formed between the second electrode and the resistor filling portion; and the resistor filling portion includes the first electrode and the first electrode. It is substantially closed by two electrodes.

  Furthermore, the manufacturing method of the resistance element built-in printed wiring board according to the present invention includes forming a first electrode and a second electrode on the surface of the insulating member, and forming a substantially closed space between these electrodes, Filling the closed space with a resistor.

  ADVANTAGE OF THE INVENTION According to this invention, the novel resistance element built-in printed wiring board which can reduce the resistance value tolerance (variation) of a resistance element, and an electronic device using the same can be provided.

  Hereinafter, embodiments of a printed wiring board with a built-in resistive element and an electronic apparatus using the same according to the present invention will be described in detail with reference to the accompanying drawings. Note that the same reference numerals are given to the same elements in the drawings, and redundant description is omitted.

[Resistance element for built-in printed wiring board]
1A to 1C are diagrams illustrating a configuration and a manufacturing method of a typical resistance element 10-1. As shown in FIG. 1A, the resistance element 10-1 has two electrodes. For example, these electrodes are a circular center electrode 14-1 and an annular peripheral electrode 12-1 surrounding the periphery. The lead conductor from the center electrode 14-1 may be a through-hole conductor (not shown) or a via conductor (not shown). The lead conductor from the peripheral electrode 12-1 is a through-hole conductor (not shown) or a via conductor (not shown) formed in the annular peripheral electrode 12-1 or the lead conductor pattern 12-1a from the peripheral electrode. .)

  In the present embodiment, the space between the center electrode 14-1 and the surrounding electrode 12-1 is closed. And the said space has the length of the same radial direction over the circumferential direction.

  As shown in FIG. 1B, the resistance material 18 is screen-printed over the entire space formed between both electrodes. The resistance material 18 is typically a resistance paste (in many cases, referred to as “carbon paste” rather than the material). As this resistance paste 18, it is preferable that it is a thing which has a thermosetting resin and an electroconductive filler as a main component, for example. As the thermosetting resin, a thermosetting resin such as an epoxy resin, a phenol resin, a melamine resin, or a polyimide resin, a resin obtained by modifying these resins, a mixture of these resins and a thermoplastic resin, or the like can be used. Among these, it is preferable to use an epoxy resin or a phenol resin from the viewpoints of adhesion to the substrate, chemical resistance, and cost. As the conductive filler, it is preferable to use inexpensive carbon such as ketchelen black, acetylene black, graphite, activated carbon. In addition to the conductive filler, an inorganic filler such as silica may be added. Commercially available carbon paste can be used as it is.

  Examples of the commercially available carbon paste include a resistance paste manufactured by Shoei Chemical Industry Co., Ltd., a Ru-based resistance paste manufactured by Sumitomo Metal Mining Co., Ltd., a resistor manufactured by Tanaka Kikinzoku Group, and a polymer type manufactured by Asahi Chemical Research Laboratory. Examples include resistor pastes, which are commercially available on the market. The resistance material 18 is heat-dried after printing. Thereby, the resistance element 10-1 is completed. In this application document, the two electrodes and the resistance material formed between them are referred to as a resistance element.

  As shown in FIG. 1C, the printing of the resistance material 18 may protrude outside the peripheral electrode 12-1. The resistance value of the resistance element 10-1 shown in FIG. 1C is the same as that shown in FIG. 1B. In addition, if the resistive material 18 is printed on the entire space between both electrodes, the resistive material 18 may not be printed on a part of the surfaces of the peripheral electrode 12-1 and the center electrode 14-1.

  The shapes of the center electrode 14-1 and the peripheral electrode 12-1 are patterned and shaped by a subtractive method, a semi-additive method (SAP), a full additive method, or the like. Among them, the semi-additive method (SAP) is preferable from the viewpoint that the electrodes can be formed with extremely high accuracy and the space (space) between both electrodes can be formed with extremely high accuracy.

  As shown in FIG. 1A, the resistance value of the resistance element 10-1 is formed with a resistivity ρ, a length (that is, a distance between both electrodes) L, and a width (that is, formed between both electrodes). This is determined by the circular line length (W) passing through the center of the annular space and the thickness t of the printing resistance. Among these, since the distance L and the width W are determined by the shapes of both electrodes, they are formed with extremely high accuracy. As a result, it is inevitably possible to further reduce the resistance tolerance of the resistance element 10.

  In other words, by forming the center electrode 14-1 and the peripheral electrode 12-1 with high accuracy by the semi-additive method (SAP), a space (space) between both electrodes can be ensured with high accuracy. If the resistance material is printed in the entire closed space between both electrodes, as in the case of forming a conventional rectangular resistance element, in the width direction of the resistance material during printing for the purpose of reducing resistance tolerance. There is no need to strictly manage the application status. That is, even if the resistance material is printed somewhat complicated, it is possible to reduce the resistance tolerance.

  FIG. 1D is a cross-sectional view in the thickness direction of a typical resistance element built-in printed wiring board 26 using such a resistance element 10. This printed wiring board has a core layer 20 and buildup layers 38u and 38d formed thereon. Resistive element 10 is formed on the upper surface of core layer 20.

  The circular resistor 10-1 shown in FIG. 1B or 1C will be described from the design aspect. The calculation of the resistance value R is the same as that of the rectangular resistance material. The resistance value R of the resistance material is represented by R = ρ · (L / S). Here, the cross-sectional area S of the resistance material is represented by the product of the width W and the height (thickness) t of the resistance material.

  Considering the resistivity ρ including the thickness t, the resistance value R is R = ρ {L / (W · t)} = (ρ / t) · (L / W) = Rs · (L / W) It becomes. Here, Rs is referred to as sheet resistance. The sheet resistance Rs is one method for expressing the resistance of a film having a uniform thickness, and its unit is (Ω / □) (ohm / square). In other words, it is the resistance value of a square (L = W) resistive film.

  The resistance value R of the circular resistance shown in FIGS. 1B and 1C is as shown in Table 1 in the case of a printing resistance with a sheet resistance of 100 (Ω / □). See FIG. 1A for the symbols in Table 1. Here, the peripheral electrode length El and the through-hole diameter Dpth formed on the back surface of the center electrode are constant. Thus, the resistance element 10 can be designed by setting a target resistance value in advance.

（変形例）
図２Ａ〜２Ｃは、図１Ａの円形電極形状に対する変形例である。以下、抵抗材は図示していないが、図２Ａ(1)は、中心電極１４−２を三角形とし、周囲電極１２−２を三角形の枠状にしている。図２Ｂ(1)は、中心電極１４−３を四角形とし、周囲電極１２−３を四角形の枠状にしている。図には示していないが、その他の多角形に関しても、中心電極をｎ角形とし、周囲電極をｎ角形の枠状にすることができる（ここで、ｎ＝3，4，5，…）。図２Ｃ(1)は、図１Ａに示す電極形状と同じである。

(Modification)
2A to 2C are modifications to the circular electrode shape of FIG. 1A. In the following, although the resistance material is not shown, in FIG. 2A (1), the center electrode 14-2 has a triangular shape and the surrounding electrode 12-2 has a triangular frame shape. In FIG. 2B (1), the center electrode 14-3 has a quadrangular shape and the surrounding electrode 12-3 has a quadrangular frame shape. Although not shown in the figure, with respect to other polygons, the center electrode can be an n-gon and the surrounding electrode can be an n-gon frame (where n = 3, 4, 5,...). FIG. 2C (1) is the same as the electrode shape shown in FIG. 1A.

  However, when generalizing with respect to the shape of the electrode, the center electrode may have any shape. Further, the surrounding electrode may have any shape as long as it completely surrounds the center electrode. Further, the center electrode does not need to be formed at the center of the surrounding electrode, and may be eccentric. In other words, the space between both electrodes should just be a closed area. Both electrodes are shaped by patterning and are formed with extremely high accuracy.

  Therefore, if a closed space can be formed between both electrodes, it is not necessary to strictly manage the width of the resistance material when printing the resistance material. That is, even if the resistance material is printed somewhat complicated, the width of the resistance material depends on the accuracy of formation between both electrodes. If it is printed, the length and width of the resistance material that inevitably has the optimum resistance tolerance can be obtained. Specifically, the length and width of the resistance material printed in the space between both electrodes can be formed with extremely high accuracy. As a result, the resistance tolerance of the resistance element can be further reduced.

  Moreover, the space between these two electrodes does not necessarily need to be completely closed. That is, as shown in FIG. 3A, the positive and negative electrodes 12-4 and 14-4 forming the resistance element may be respectively formed in a spiral shape, and the resistance element is formed as shown in FIG. 3B. The positive and negative electrodes 12-5 and 14-5 may be formed in a key bracket shape. As for the structure in which the space between the two electrodes is not closed and the space between the two electrodes is opened, the space between the two electrodes is substantially within the range that does not affect the resistance tolerance. Can be considered closed.

  2A (1), the triangular electrode resistance element 10-2, the square electrode resistance element 10-3 shown in FIG. 2B (1), and the circular electrode resistance element 10 shown in FIG. 2C (1). In -1, the resistance value can be calculated relatively easily in advance.

  However, with regard to other electrode shapes, a plurality of samples having electrodes (ie, similar electrodes) with slightly different dimensions are formed in advance on a single-layer substrate, and the resistance material 18 is printed and thermally dried. Through an experiment in which the resistance values of the samples are sequentially measured, an electrode size having a desired resistance value can be determined.

Eventually, the required electrode shape is one of the following.
(1) Electrode that forms a closed space between both electrodes
(2) Center electrode and surrounding electrodes surrounding it
(3) The center electrode is circular and the surrounding electrodes are annular electrodes
(4) A frame-shaped electrode in which the center electrode is n-gonal and the surrounding electrode is n-gonal (where n = 3, 4, 5,...)

  In these electrode shapes, a closed space can be formed between both electrodes, and the resistance element 10 having a high resistance value accuracy is formed by printing a resistance material on the entire surface of the space and thermally drying the space. I can do it.

(Problem of lead conductor from electrode)
The lead conductor from the surrounding electrode 12 does not affect the space between both electrodes, and no problem occurs. When the lead conductor from the center electrode 14 is a through-hole conductor or a via conductor (VIA conductor), the space between both electrodes is not affected and no problem occurs.

  However, a through-hole conductor or a via conductor may not be formed on the center electrode 14 due to design reasons. In this case, the conductor pattern is drawn from the center electrode 14. FIG. 2A (2) shows a case where a part of the peripheral electrode 12-2b is deleted from the triangular electrode resistance element 10-2 shown in FIG. This is an example in which 2a is formed. FIG. 2B (2) shows a case where a part of the peripheral electrode 12-3b is deleted from the square electrode resistance element 10-3 shown in FIG. This is an example in which 3a is formed. FIG. 2C (2) shows a lead electrode pattern 14 from the center electrode 14-1 by removing a part of the peripheral electrode 12-1b with respect to the round electrode resistance element 10-1 shown in FIG. 2C (1). This is an example in which -1a is formed. Although not shown in the drawing, the lead conductor pattern from the center electrode can be similarly formed for other polygons.

  In these electrode shapes, the space between the two electrodes is not completely closed. However, the space between the two electrodes is substantially closed (that is, substantially closed), and both electrodes are formed with high accuracy by, for example, a semi-additive method. The length and width can be formed almost accurately. As a result, the resistance material 18 is printed in the entire space between these electrodes, and is thermally dried, so that the resistance tolerance of the resistance element 10 is smaller than that of the conventional rectangular resistance. That is, even if the printing accuracy is somewhat poor (for example, even if the resistance material protrudes from the surrounding electrode as shown in FIG. 1C), the resistance tolerance is not affected at all.

  Care should be taken not to print the resistance material on the portion where the lead conductor pattern 14-2a or the like passes through the deleted portion such as the peripheral electrode 12-2b (that is, the gap between the lead conductor pattern and the peripheral electrode). is important. In this gap, the distance between the electrodes is very narrow and the space between the electrodes is an open space, so that a resistance material is printed in the gap portion so that no current flows therethrough.

[Printed wiring board with built-in resistance element]
The above-described resistance element 10 can be formed on various printed wiring boards. The applicant often adopts a build-up method using a core layer as a printed wiring board manufacturing method. Therefore, here, a resistance element built-in printed wiring board manufactured by a build-up method using a core layer will be described.

(Configuration of printed wiring board with built-in resistance element)
In the build-up method using the core layer, generally, an insulating layer is formed one by one on the core layer manufactured by the plated through hole (PTH) method, a conductor pattern is formed, and interlayer connection is performed. Thus, the manufacturing method is to make a multilayer by stacking conductor layers. In the core layer, a through-hole conductor and a pattern conductor are formed on an insulating substrate. In the buildup layer stacked on the core layer, via conductors (VIA conductors) and pattern conductors are formed in the insulating layer.

  Table 2 categorizes and summarizes the resistance element built-in printed wiring boards from the viewpoint of the position where the resistance element 10 is formed and the type of conductor connected to both electrodes.

図４Ａに示す抵抗素子内蔵プリント配線板２６−１における抵抗素子１０は、一方の電極（中心電極）がＰＴＨ蓋メッキ導体２８ｃであり、他方の電極（周囲電極）がコア基板２０表面の導体パターン２０ｐである。ＰＴＨ２８の内部には充填材２５が詰められ、例えば、セミアディティブ法又はテンティング法で高精度に形成されたＰＴＨ蓋メッキ導体２８ｃが形成され、その上面に抵抗材１８が形成されている。そして、導体パターン２０ｐは、ＰＴＨ蓋メッキ導体２８ｃを囲むように環状を呈している。

4A, one electrode (center electrode) is a PTH lid plating conductor 28c, and the other electrode (surrounding electrode) is a conductor pattern on the core substrate 20 surface. 20p. The PTH 28 is filled with a filler 25. For example, a PTH lid plating conductor 28c formed with high accuracy by a semi-additive method or a tenting method is formed, and a resistance material 18 is formed on the upper surface thereof. The conductor pattern 20p has an annular shape so as to surround the PTH lid plating conductor 28c.

  4B, one electrode (center electrode) is a via conductor 23, and the other electrode (surrounding electrode) is a TH (through hole) land 28l. . The PTH is filled with a filler 25, and a resistance material 18 is formed on the upper surface of the filler and the PTH pad. In this case, the lid plating conductor covering the filler inside the PTH is not formed.

  4C, one electrode (center electrode) is a via conductor 23 on TH lid plating, and the other electrode (surrounding electrode) is TH lid plating 28c. The outer edge portion 28e. In this case, the PTH is filled with a filler 25, and a groove 29 is formed in the TH lid plating 28c around the via conductor 22v, whereby the central portion 28d and the outer edge portion 28e are formed. It is separated. A via conductor 23 is formed on the central portion 28d. In such a configuration, the via conductor 23 on the TH lid plating 28c is not essential. In this case, the groove 29 provided in the TH lid plating 28c is positioned as a boundary and the inner portion thereof is used as a central electrode, and the groove is used as a boundary and the outer portion thereof is positioned as a peripheral electrode.

  In the resistance element 10 in the resistance element built-in printed wiring board 26-4 shown in FIG. 4D, one electrode (peripheral electrode) is the center portion 28d of the TH lid plating 28c, and the other electrode (center electrode) is the TH lid plating 28c. The outer edge portion 28e. The PTH is filled with a filler 25, a PTH lid plating conductor 28c is partially formed on the filler, and a via conductor 23 is formed on the upper surface thereof.

  In the resistive element built-in printed wiring board 26-5 shown in FIG. 5A, the first conductive circuit 20p formed on the surface of the first insulating member 20 and the surface of the second insulating member 22u on the first insulating member are formed. A resistive element 10 having a second conductor circuit 23t, 23p and a via conductor 23 connecting the first conductor circuit and the second conductor circuit, and the second conductor circuit 23t, 23p serving as both electrodes. Yes. That is, the resistance material 18 is formed in the buildup layer (first interlayer insulating resin layer 22u). In this case, one electrode (center electrode) is the top land 23t of the via conductor 23, and the other electrode (peripheral electrode) is the conductor pattern 23p formed around the top land 23t of the via conductor 23. The conductor pattern 23 p has an annular shape so as to surround the top land 23 t of the via conductor 23.

  In the resistive element built-in printed wiring board 26-6 shown in FIG. 5B, the first conductor circuits 23p and 23b formed on the surface of the first insulating member 22u and the surface of the second insulating member 24u on the first insulating member. The resistor element 10 includes the formed second conductor circuit 24p, the via conductor 23 that connects the first conductor circuit and the second conductor circuit, and uses the first conductor circuit as both electrodes. That is, the resistance material 18 is formed in the buildup layer (first interlayer insulating resin layer 22u). One electrode (center electrode) is a bottom land 23 b of the via conductor 23, and the other electrode (peripheral electrode) is a conductor pattern 23 p formed around the bottom land 23 b of the via conductor 23. The conductor pattern 23p has an annular shape so as to surround the bottom land 23b of the via conductor 23.

  Although not shown in the figure, when the via conductor is not filled, if the resistance material 18 is printed in the hollow via conductor, a void may be generated. Therefore, the resistance material 18 is avoided so as to avoid such a hollow portion as much as possible. Is preferably formed.

  The above is an example, and it should be understood that the resistance member 18 can be formed at other locations as desired.

(Production method)
Next, a typical method for manufacturing a resistance element built-in printed wiring board using a build-up method using a core layer will be briefly described.

  As shown in FIG. 6A, a core substrate 20 is prepared. The core substrate 20 is manufactured by a plated through hole method. An inner layer conductor pattern is formed on a glass cloth epoxy resin copper clad laminate or a glass cloth high heat resistant resin copper clad laminate, and a required number of them are prepared and laminated and adhered with an adhesive sheet called a prepreg to form one sheet. Holes are drilled in this, and plating is performed on the wall surfaces and surfaces in the holes by the plated through hole method to connect the inner and outer conductor layers. Then, the core conductor 20 is manufactured by creating a surface conductor pattern and an electrode conductor (not shown) of a resistance element. The plating may be a subtractive method in which the entire surface is plated and then a necessary range is etched, and a semi-additive method, a full additive method, or the like can also be used.

  When the resistance element 10 is formed on the core layer 20 described with reference to FIGS. 4A to 4D, both electrode conductors are formed at this stage. And the resistance paste 18 is printed in the closed space between these both electrodes, and it heat-drys to form the resistance element 10.

  As shown in FIG. 6B, insulating layers 22u and 22d are formed on the core substrate 20 and a resistance element (not shown). This insulating layer is formed by a laminating method in which a liquid material is coated or a film-like material is heated and pressure-bonded in a vacuum.

  As shown in FIG. 6C, the insulating layers 22u and 22d are drilled 23h with a laser.

  As shown in FIG. 6D, an electroless copper plating layer is deposited on the inner surface of the hole and the insulating layer surface to make it conductive. At this time, in order to improve the adhesion of the plating, the inner surface of the hole and the surface of the insulating layer are roughened.

  As shown in FIG. 6E, the conductor pattern 22uc on the surface side and the electrode conductor (not shown) of the resistance element are formed. The conductor pattern and the electrode conductor are formed by panel plating that performs electrolytic copper plating on the entire surface, forming an etching resist on the upper surface of the copper plating, and then forming a conductor pattern by etching (subtractive method). Other methods such as a semi-additive method and a full additive method can also be used.

  When the resistive element 18 is formed in the build-up layer described with reference to FIGS. 5A to 5B, the electrode conductor is formed at this stage. Then, the resistance paste 18 is printed in the closed space between these two electrodes and thermally dried to form the resistance element 10.

  As shown in FIG. 6F, the back side conductor pattern 22dc and electrode conductors (not shown) are similarly formed. Similarly, when the resistance element 10 is formed on the build-up layer, the electrode conductor is formed at this stage, and the resistance paste 18 is printed on the electrode conductor and thermally dried to form the resistance element 10.

  At this stage, one conductor pattern on each of the upper surface and the lower surface is formed on the core layer 20, so that the steps of FIGS. 6B to 6F are repeated a desired number of times. At this time, the resistance element 10 can be formed in a desired layer.

  As shown to FIG. 6G, the multilayer printed wiring board is manufactured by repeating the process of FIG. 6B-FIG. 6F once more here. If desired, a solder resist layer (not shown) may be formed on the outermost layer.

(Thickness of resistance material)
As shown in FIGS. 1D, 4A, 4C, 5A, and 5B, the thickness of the resistive material 18 has been described as being greater than the thickness of the center electrode and the surrounding electrodes. However, it should be understood that the present invention is not limited to this.

  7A shows a printed wiring board 26 with a built-in resistance element shown in FIG. 1D. A central electrode 14-1 and a peripheral electrode 12-1 are formed on the core layer 20, and a resistive material 18 is printed in a space between both electrodes. It is sectional drawing of the step formed in this way. Here, the thickness of the resistance material 18 is larger than any thickness of the center electrode 14-1 and the surrounding electrode 12-1.

  Here, as shown in FIG. 7B, the resistance material 18 is scraped off by a squeegee or other suitable means before the heat drying step, and the thickness of the resistance material 18 is determined by the center electrode 14-1 and the peripheral electrode 12-1. The thickness may be substantially the same. As described above, the resistive element 18 is sufficiently filled in the space between both electrodes, but the resistive element not covered on the central electrode 14-1 and the peripheral electrode 12-1N is shown in FIG. 7A. The resistance tolerance can be further reduced as compared with the resistance element.

  Such a resistance element in which the thickness of the resistance material is substantially the same as the thickness of the center electrode and the surrounding electrode is, for example, a resistance element built-in of another embodiment shown in FIGS. 4A, 4C, 5A, and 5B. It can also be used in printed wiring boards.

[Electronics]
An electronic device configured using the above-described resistance element built-in printed wiring board 26 will be described in comparison with a current electronic device. Here, a printed circuit board on which electronic / electrical components are mounted is called a printed circuit board or a package (PK).

  FIG. 8A is a diagram illustrating a configuration of the current electronic device 50. Two packages (PK) 30 and 31 are mounted on the motherboard (MB) 32, one PK 30 is mounted with a microprocessing unit (MPU) 34, and the other PK 31 is mounted with CS 36. The MB 32 and the PKs 30 and 31 are connected to each other by, for example, a pin junction 33, and the PK 30 and the MPU 34 or PK 31 and the chip set (CS) 36 are connected to each other by pin bonding or reflow soldering 35 using solder bumps.

  As the frequency of the electronic device 50 increases, a large number of resistance elements are required. Therefore, in the electronic device 50, the resistive elements are distributed and mounted on the resistive element 40 in the MPU, the chip resistive element 41 mounted on the PK 30, the chip resistive element 42 mounted on the MB 32, and the like.

  Since the resistance element is formed in the MPU 34, the chip size of the MPU is inevitably increased. Since the resistance element is mounted on the PK 30, the PK size is inevitably increased. Since the resistance element is mounted on the MB 32, the MB size is inevitably increased. Furthermore, the chip resistance element 41 mounted on the PK 30 and the chip resistance element 42 mounted on the MB 32 are relatively far from the MPU 34 and may deteriorate the quality characteristics of the propagation signal.

  FIG. 8B is a diagram showing an electronic device 60 configured using the resistance element built-in printed wiring board according to the present embodiment. Two packages (PK) 30 and 31 are mounted on the mother board (MB) 32, MPU 34 is mounted on one PK 30, and CS 36 is mounted on the other PK 31. As described above, a large number of resistance elements 10 can be incorporated in the printed wiring board constituting the PK 30.

  Accordingly, the resistance element 40 in the MPU of the electronic device 50 shown in FIG. 8A, the chip resistance element 41 mounted on the PK 30 and the chip resistance element 42 mounted on the MB 32 are collectively replaced with the resistance element 10 built in the printed wiring board. I can do it.

  Since the electronic device 60 shown in FIG. 8B can arrange the resistance element in the vicinity of the MPU 34, the quality characteristic of the propagation signal can be improved as compared with the electronic device shown in FIG. 8A.

[Advantages and effects of the embodiment]
According to the present embodiment, in the printed wiring board with a built-in resistive element, the resistive element forms a closed space between the two electrodes, and by forming the printing resistance in this space, the resistive material has the length L and The width W can be formed with high accuracy. For this reason, the variation in resistance value can be kept small.

  According to the present embodiment, in the printed wiring board with a built-in resistance element, the resistance element has the center electrode and the surrounding electrode, and the surrounding electrode completely surrounds the center electrode. For this reason, since the space between both electrodes is formed with high precision, the resistance material formed here can form the length L and the width W with high precision.

  According to this embodiment, in the printed wiring board with a built-in resistance element, the resistance element can be formed on either the core layer or the buildup layer. Therefore, a large number of resistance elements can be formed on one printed wiring board.

  According to the present embodiment, by employing the resistance element built-in printed wiring board, a plurality of resistance elements can be collectively incorporated in the package. In an electronic device composed of a package having a semiconductor device and a mother board having a plurality of packages, the resistance elements can be arranged in the vicinity of the semiconductor device, so that the electronic device has good quality characteristics of the propagation signal. Can be configured.

[Alternative examples]
The embodiments of the resistance element built-in printed wiring board and the electronic device using the same have been described above, but these are exemplifications, and the present invention is not limited thereto. Additions, deletions, changes, improvements, and the like that can be easily made by those skilled in the art to these embodiments are included in the present invention.

  The technical scope of the present invention is defined by the description of the appended claims.

FIG. 1A is a diagram for explaining the configuration and manufacturing method of a typical resistance element together with FIGS. 1B and 1C. FIG. 1B is a diagram for explaining a configuration and a manufacturing method of a typical resistance element together with FIGS. 1A and 1C. FIG. 1C is a diagram for explaining a configuration and a manufacturing method of a typical resistance element together with FIGS. 1A and 1B. FIG. 1D is a cross-sectional view in the thickness direction of a typical printed wiring board with a built-in resistance element in which the resistance elements of FIGS. 1A to 1C are formed. FIG. 2A is a modification of the electrode shape of FIG. 1A. FIG. 2B is still another modified example of the electrode shape of FIG. 1A. FIG. 2C is another modified example of the electrode shape of FIG. 1A. FIG. 3A shows another modification of the electrode shape of FIG. 1A. FIG. 3B is still another modified example of the electrode shape of FIG. 1A. FIG. 4A is a diagram showing another resistive element built-in printed wiring board in which a resistive element is formed in the core layer. FIG. 4B is a diagram showing another resistive element built-in printed wiring board in which a resistive element is formed in the core layer. FIG. 4C is a diagram showing another resistive element built-in printed wiring board in which a resistive element is formed in the core layer. FIG. 4D is a diagram showing another resistive element built-in printed wiring board in which a resistive element is formed in the core layer. FIG. 5A is a diagram showing a resistance element built-in printed wiring board in which a resistance element is formed in an interlayer insulating resin layer of a buildup layer. FIG. 5B is a diagram showing another resistive element built-in printed wiring board in which another resistive element is formed in the interlayer insulating resin layer of the buildup layer. FIG. 6A is a diagram for explaining a typical method for manufacturing a resistance element built-in printed wiring board using a build-up method using a core layer together with the other drawings of FIG. 6. FIG. 6B is a diagram for explaining a typical method of manufacturing a resistance element built-in printed wiring board using a build-up method using a core layer together with the other drawings of FIG. 6. FIG. 6C is a diagram for explaining a typical method for manufacturing a printed wiring board with a built-in resistance element using a build-up method using a core layer together with the other drawings of FIG. 6. FIG. 6D is a diagram for explaining a typical method for manufacturing a resistance element built-in printed wiring board using a build-up method using a core layer together with the other drawings of FIG. 6. FIG. 6E is a diagram for explaining a typical method for manufacturing a resistance element built-in printed wiring board using a build-up method using a core layer together with the other drawings of FIG. 6. FIG. 6F is a diagram for explaining a typical method of manufacturing a resistance element built-in printed wiring board using a build-up method using a core layer together with the other drawings of FIG. 6. FIG. 6G is a diagram for explaining a typical method for manufacturing a printed wiring board with a built-in resistance element using a build-up method using a core layer together with the other drawings of FIG. 6. FIG. 7A is a diagram illustrating an example of a resistance element in which the thickness of the resistance material is larger than the thickness of the center electrode and the surrounding electrodes. FIG. 7B is a diagram illustrating an example of a resistance element in which the thickness of the resistance material is substantially the same as the thicknesses of the center electrode and the surrounding electrodes. FIG. 8A is a diagram illustrating a configuration of the current electronic device 50. FIG. 8B is a diagram illustrating an electronic apparatus configured using the resistance element built-in printed wiring board according to the present embodiment.

Explanation of symbols

  10, 10-1, 10-2, 10-3: resistance element, 12, 12-1, 12-2, 12-2b, 12-3, 12-3b: surrounding electrode, 12-1a: lead conductor pattern, 14, 14-1, 14-2, 14-2b: center electrode, 14-1a, 14-2a, 14-3a: lead conductor pattern, 18: resistor material, resistor paste, 20: core layer, core substrate, 22u , 22d: insulating layer, interlayer insulating resin layer, 22uc: conductor pattern on the front side, 22dc: conductor pattern on the back side, 22p, 22p-2: conductor pattern, 23: via conductor, 23b: bottom land, 23h: laser hole Dawn, 23p: Conductor pattern, 23t: Top land, 24p: Conductor pattern, 25: Filler, 26, 26-1, 26-2, 26-3, 26-4, 26-5 6-6, 26-7: Resistive element built-in printed wiring board, 28: PTH, plated through hole, 28l: plated land, 29: through hole land, 28c: PTH lid plated conductor, 29: groove, 30: PK, package , 31: PK, package, 32: MB, motherboard, 33: pin junction, 34: MPU, 35: reflow soldering, 36: CS, 38u, 38d: build-up layer, 40: resistance element, 41: chip resistance element 42: Chip resistance element, 50: Electronic equipment, 60: Electronic equipment,

Claims (17)

A first electrode formed on the surface of the insulating member of the printed wiring board, a second electrode formed so as to surround the first electrode, and a resistor filling portion between the first electrode and the second electrode Having a resistance element composed of a resistance material filled in
The resistor filling portion is a closed space surrounded by the first electrode and the second electrode, the resistor material is filled in the entire closed space, and the resistance value of the resistor element is determined by the thickness of the resistor material. A printed wiring board with a built- in resistance element. The resistor fill portion has a constant width throughout, claim 1 resistive element embedded printed wiring board according. The first electrode及beauty second electrode is formed by a semi-additive method, according to claim 1 resistive element embedded printed wiring board according. The thickness of the resistive material is any of the first electrode及beauty second electrode is also substantially the same for all thicknesses, claim 1 resistive element embedded printed wiring board according. The thickness of the resistance material is greater than both the thickness of the first electrode及beauty second electrode, according to claim 1 resistive element embedded printed wiring board according. The first electrode is circular,
The second electrode is a circular ring surrounding the first electrode, according to claim 1 resistive element embedded printed wiring board according. The first electrode is an n-angle shape,
The second electrode surrounding takes enclose n angle shape (here, n = 3, 4, 5, ...) the first electrode is, according to claim 1 resistive element embedded printed wiring board according. In the insulating member, a through hole filled with a filler is formed,
Electrode of said resistive element, a scan Ruhoru cap plating provided so as to cover the filler as a first electrode, a ring-shaped pattern which is provided so as to surround the through-hole plated cover and a second electrode to,請 Motomeko first resistive element embedded printed wiring board according. The insulating member is formed with a through hole filled with a filler inside,
The electrode of the resistive element, the via conductors formed by formed immediately above the through-hole and the first electrode, the land portion of the through-hole and the second electrode, the resistance element embedded printed wiring 請 Motomeko 1, wherein Board. The insulating member is formed with a through-hole filled with a filler inside, and provided with a through-hole lid plating so as to cover the filler,
Electrode of said resistive element, wherein the inner portion of the groove provided in the through-hole plated cover as the boundary to the first electrode, you the outer portion and the second electrode of the groove as the boundary, according to claim 1, wherein Printed wiring board with built-in resistance element. The insulating member is formed with a through-hole filled with a filler inside, and provided with a through-hole lid plating so as to cover the filler,
Electrode of said resistive element, the via conductors formed by forming the through-hole plated cover on the first electrode, you its outer peripheral portion and the second electrode a groove formed in the through-hole plated cover as a boundary, The printed wiring board with a built-in resistance element according to claim 1. A first conductive circuit formed on the surface of the first insulating member,
A second conductive circuit formed on the surface of the second insulating member on the first insulating member,
A via conductor connecting the first conductor circuit and the second conductor circuit;
The resistance element built-in printed wiring board according to claim 1 , wherein the first electrode and the second electrode of the resistance element are formed in a second conductor circuit . A first conductive circuit formed on the surface of the first insulating member,
A second conductive circuit formed on the surface of the second insulating member on the first insulating member,
And a via conductor which connects the first conductor circuits and the second conductor circuits,
The resistance element built-in printed wiring board according to claim 1 , wherein the first electrode and the second electrode of the resistance element are formed in a first conductor circuit . The resistance element built-in printed wiring board according to claim 1, wherein the first electrode is formed from lid plating that closes a through hole of the printed wiring board. The resistance element built-in printed wiring board according to claim 1, wherein the first electrode is formed from a land connected to a via hole of the printed wiring board. Forming a first electrode on the surface of the insulating member of the printed wiring board ;
Forming a second electrode so as to surround the first electrode;
A resistance element-embedded printed wiring board manufacturing method for forming a resistance element by filling a resistor filling portion between a first electrode and a second electrode with a resistance material,
The resistor filling portion is a closed space surrounded by the first electrode and the second electrode, the resistor material is filled in the entire closed space, and the resistance value of the resistor element is determined by the thickness of the resistor material. Manufacturing method. The first electrode and the second electrode is formed by a semi-additive method, a manufacturing method of the resistance element embedded printed circuit board according to claim 16, wherein.

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