JP4681343B2 - Manufacturing method of light emitting diode - Google Patents

Manufacturing method of light emitting diode Download PDF

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JP4681343B2
JP4681343B2 JP2005130664A JP2005130664A JP4681343B2 JP 4681343 B2 JP4681343 B2 JP 4681343B2 JP 2005130664 A JP2005130664 A JP 2005130664A JP 2005130664 A JP2005130664 A JP 2005130664A JP 4681343 B2 JP4681343 B2 JP 4681343B2
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printed circuit
circuit board
reflector
lens
adhesive
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JP2006310505A (en
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貞人 今井
敦 西田
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Description

本発明は、一般照明用LED、携帯電話用フラッシュLED、KYE照明用LEDなどに係わり、詳しくは、LEDの指向性を強く、リフレクターまたはレンズを用いることにより光を無駄なく有効利用する発光ダイオードに関する。   The present invention relates to general lighting LEDs, mobile phone flash LEDs, KYE lighting LEDs, and the like. More specifically, the present invention relates to a light emitting diode that has strong directivity of LEDs and effectively uses light without using a reflector or a lens. .

従来、軽薄短小を追求する電子機器向けに提供された表面実装型の発光ダイオードで、一般的に、携帯電話のカメラ用補助光源、スポットライトなどに使用される発光ダイオードにおいては、指向性をもった製品が多く使用される。その際、通常の発光ダイオードにリフレクターまたはレンズを付加することにより、用途に合わせた指向特性を持つ発光ダイオードを作っている。これらの発光ダイオードの一般的な構造は、ガラエポ基板の表面に形成された電極パターン上にLEDチップを実装すると共に、前記LEDチップを実装したプリント基板上にUV硬化型接着剤などを用いて、別体加工で成形されたリフレクターまたはレンズを接着することにより、LEDチップの光を無駄なく有効利用するものである。（例えば、特許文献１、非特許文献１参照）
特開２００２−２８０１６４号（第2頁、図５） 株式会社シチズン電子、報道機関向け発表資料「一般照明用白色パワーＬＥＤランプＣＬ−６５２Ｓシリーズの開発・量産化」、平成１６年９月２８日発表（第１頁、図参照） Conventionally, it is a surface-mounted light-emitting diode that has been provided for electronic devices that pursue lightness, smallness, and small size. Generally, light-emitting diodes used for auxiliary light sources for mobile phone cameras and spotlights have directivity. Many products are used. At that time, by adding a reflector or a lens to a normal light emitting diode, a light emitting diode having directional characteristics suitable for the application is made. The general structure of these light emitting diodes is to mount an LED chip on an electrode pattern formed on the surface of a glass epoxy substrate, and use a UV curable adhesive or the like on the printed circuit board on which the LED chip is mounted. By bonding a reflector or lens molded by separate processing, the light of the LED chip is effectively used without waste. (For example, see Patent Document 1 and Non-Patent Document 1)
JP 2002-280164 (2nd page, FIG. 5) CITIZEN ELECTRONICS CO., LTD., Press release material "Development and mass production of white power LED lamp CL-652S series for general lighting", announced on September 28, 2004 (see page 1, figure)

上記した特許文献１に開示されている発光ダイオードは、図８に示すように、発光ダイオードは、銀メッキされたリードフレーム１１、１２を白成形樹脂でインサート成形して絶縁基板（プリント基板）１３を形成し、前記リードフレーム１１、１２の上に、透明接着剤１７によってＬＥＤチップ１４を固着すると共に、前記ＬＥＤチップ１４の上面電極とリードフレーム１１、１２とを金属細線によりボンディングワイヤ１５で接続した後、前記ＬＥＤチップ１４を取り囲むようにプリント基板１３の上方に向かってパラボラ状に広がるリフレクター１６を透明接着剤１７または接着シートなどで接着する。前記ＬＥＤチップ１４を覆うように透光性樹脂１８で封止する。   As shown in FIG. 8, the light emitting diode disclosed in Patent Document 1 is formed by insert molding silver-plated lead frames 11 and 12 with a white molding resin, and an insulating substrate (printed substrate) 13. The LED chip 14 is fixed on the lead frames 11 and 12 with a transparent adhesive 17, and the upper electrode of the LED chip 14 and the lead frames 11 and 12 are connected by a bonding wire 15 with a thin metal wire. After that, a reflector 16 that spreads in a parabolic shape toward the upper side of the printed circuit board 13 so as to surround the LED chip 14 is bonded with a transparent adhesive 17 or an adhesive sheet. The LED chip 14 is sealed with a translucent resin 18 so as to cover the LED chip 14.

また、上記した非特許文献１に開示されているCL−６５２SシリーズのLEDランプは、照明用機器の問題点とされていた放熱性の問題を解消すると同時に、素子自体の輝度とその光の取り出し効率を高めたものである。該発光ダイオードは、図９に示すように、前述したリフレクターの代わりに、LEDチップ１４が実装されたプリント基板１３上に、透明接着剤１７または接着シートなどを用いて、別体加工で成形されたレンズ１９を接着することにより、発光ダイオードを構成する。   In addition, the CL-652S series LED lamp disclosed in Non-Patent Document 1 described above solves the problem of heat dissipation, which has been regarded as a problem of lighting equipment, and at the same time, brightness of the element itself and extraction of the light. Increased efficiency. As shown in FIG. 9, the light-emitting diode is formed by separate processing on the printed circuit board 13 on which the LED chip 14 is mounted, using a transparent adhesive 17 or an adhesive sheet, instead of the above-described reflector. A light emitting diode is formed by adhering the attached lens 19.

解決しようとする問題点は、上記した特許文献１および非特許文献１に開示されている発光ダイオードは、信頼性試験の項目で、落下試験、側圧強度試験などの外力が加わる試験において、プリント基板とＬＥＤチップ、リフレクターまたはレンズの接着部で接着強度が不十分なため、十分強度に耐えられず剥がれてしまう。また、プリント基板の表面のレジスト材と接着剤との相性が悪い場合、接着強度が著しく低下してしまう。などの問題があった。   The problem to be solved is that the light-emitting diodes disclosed in Patent Document 1 and Non-Patent Document 1 described above are reliability test items, and in a test in which an external force such as a drop test or a lateral pressure strength test is applied, a printed circuit board. Since the adhesive strength is insufficient at the bonding portion of the LED chip, the reflector or the lens, the strength is not sufficient and it peels off. Moreover, when the compatibility between the resist material on the surface of the printed circuit board and the adhesive is poor, the adhesive strength is significantly reduced. There were problems such as.

本発明は、上述の欠点を解消するもので、その目的は、プリント基板とＬＥＤチップ、リフレクターまたはレンズとの接着強度を増加させることにより、側圧強度を向上させ、製品の落下時における剥がれの防止が期待でき、更に、基板表面のレジスト材と接着剤の相性が悪く、濡れが起こりにくい状態であっても剥がれの防止可能な発光ダイオードを提供するものである。   The present invention eliminates the above-mentioned drawbacks, and its purpose is to increase the lateral pressure strength by increasing the adhesive strength between the printed circuit board and the LED chip, reflector or lens, and to prevent peeling when the product is dropped. Furthermore, the present invention provides a light-emitting diode capable of preventing peeling even when the resist material on the substrate surface is incompatible with the adhesive and is not easily wetted.

上記目的を達成するために、本発明における発光ダイオードの製造方法は、集合基板をダイシングして形成されたプリント基板にＬＥＤチップを実装し、該ＬＥＤチップを実装した前記プリント基板上にリフレクターまたはレンズを接着した発光ダイオードの製造方法において、前記プリント基板と前記リフレクターまたはレンズとの接着面に接着面積拡大部を形成し、前記接着面に塗布した接着剤が前記接着面積拡大部に流れ込み、前記プリント基板と前記リフレクターまたはレンズとの接着強度を増加させたものであって、前記接着面積拡大部は前記集合基板の前記プリント基板の集合状態でダイシングライン上に形成されたことを特徴とするものである。
To achieve the above object, a method of fabricating a light emitting diode of the present invention, an LED chip mounted on a printed board formed by dicing the assembled board, reflector or lens on the printed circuit board mounted with the LED chip in the method for manufacturing a light emitting diode bonded to the bonding area enlarged portion is formed in the bonding surface between the printed board and the reflector or lens, the adhesive applied to the adhesive surface flows into the bonding area expanding section, the printed be those with an increased adhesive strength between the substrate and the reflector or lens, the adhesive area enlargements characterized in that formed on the dicing line by a set state of the printed circuit board of the collective substrate is there.

また、前記プリント基板とリフレクターまたはレンズとの接着面に形成された接着面積拡大部は、前記プリント基板上の接着面の一部に形成された穴であることを特徴とするものである。   The adhesion area enlarged portion formed on the adhesion surface between the printed circuit board and the reflector or the lens is a hole formed in a part of the adhesion surface on the printed circuit board.

また、前記プリント基板とリフレクターまたはレンズとの接着面に形成された接着面積拡大部は、前記プリント基板上の接着面の一部に形成された溝であることを特徴とするものである。   The adhesion area enlarged portion formed on the adhesion surface between the printed circuit board and the reflector or the lens is a groove formed in a part of the adhesion surface on the printed circuit board.

また、前記プリント基板とリフレクターまたはレンズとの接着面に形成された接着面積拡大部は、前記プリント基板上の接着面の一部に形成された窪みであることを特徴とするものである。   The adhesion area enlarged portion formed on the adhesion surface between the printed circuit board and the reflector or the lens is a depression formed in a part of the adhesion surface on the printed circuit board.

本発明の発光ダイオードは、接着剤がプリント基板に形成された穴や、溝や、粗面に流れ込み硬化する。接着面積が拡大されることにより、プリント基板とリフレクターまたはレンズとの接着強度が向上する。製品の側圧強度が増し、製品の落下衝撃に対しても剥がれ防止に役立つ、また、基板表面のレジスト材に対しても接着強度が劣化しない、信頼性に優れた発光ダイオードを提供することが可能である。   In the light emitting diode of the present invention, the adhesive flows into a hole, groove, or rough surface formed on the printed circuit board and is cured. By expanding the bonding area, the bonding strength between the printed circuit board and the reflector or lens is improved. It is possible to provide a light-emitting diode with excellent reliability that increases the lateral pressure strength of the product, helps to prevent peeling even when the product is dropped, and does not deteriorate the adhesive strength against resist material on the substrate surface. It is.

本発明のチップ型ＬＥＤについて、図面に基づいて説明する。   The chip type LED of the present invention will be described with reference to the drawings.

図１〜図３は、本発明の実施例１に係わり、図１は、プリント基板の平面図、図2は、図１のプリント基板にリフレクターを接着した状態のＡ−Ａ線断面図、図３は、図１のプリント基板にレンズを接着した状態の断面図である。   1 to 3 relate to a first embodiment of the present invention, FIG. 1 is a plan view of a printed circuit board, FIG. 2 is a sectional view taken along line AA in a state where a reflector is bonded to the printed circuit board of FIG. 3 is a cross-sectional view of a state where a lens is bonded to the printed circuit board of FIG.

図１、図２において、１はガラスエポキシ樹脂などよりなる絶縁性を有するプリント基板で、該プリント基板１の上下面及び側面には、銅合金＋銀メッキなどよりなり、所定の配線パターンに形成された一対の電極２、３が形成されている。前記プリント基板1上にLEDチップ４を透明接着剤で接着した後、ワイヤボンディングし、前記LEDチップ４を囲むように透明封止樹脂５で封止する。該プリント基板１上のリフレクターとの接着面６の一部に、少なくとも一対の穴７（後述する図４、５参照）を形成する。   1 and 2, reference numeral 1 denotes an insulating printed board made of glass epoxy resin or the like. The upper and lower surfaces and side surfaces of the printed board 1 are made of copper alloy + silver plating or the like and formed in a predetermined wiring pattern. A pair of electrodes 2 and 3 are formed. After the LED chip 4 is bonded on the printed board 1 with a transparent adhesive, wire bonding is performed, and the LED chip 4 is sealed with a transparent sealing resin 5 so as to surround the LED chip 4. At least a pair of holes 7 (see FIGS. 4 and 5 to be described later) are formed in a part of the adhesive surface 6 with the reflector on the printed circuit board 1.

前記プリント基板１にリフレクター８を接着するのに、接着剤とした、例えば、ＵＶ硬化型の接着剤９が前記穴７に流れ込むようにプリント基板１とリフレクター８との接着面６に塗布した後、別体加工されたリフレクター８を接着・硬化させる。前記穴７の配設個数は、必要により増加させても良い。   After the reflector 8 is bonded to the printed circuit board 1, an adhesive, for example, a UV curable adhesive 9 is applied to the adhesive surface 6 between the printed circuit board 1 and the reflector 8 so as to flow into the hole 7. Then, the separately processed reflector 8 is bonded and cured. The number of holes 7 may be increased as necessary.

図３は、上記したリフレクターの代わりに、前記プリント基板１のレンズ接着面６に、別体加工されたレンズ１０を接着・硬化させる。その他の構成は図２と同様であるので説明は省略する。   In FIG. 3, instead of the above-described reflector, a separately processed lens 10 is bonded and cured to the lens bonding surface 6 of the printed circuit board 1. Other configurations are the same as those in FIG.

前記プリント基板１に穴７を形成することで、接着剤９とプリント基板１との接触面積が拡大される。前記穴７に流れ込んだ接着剤９が硬化して、アンカー効果（投錨効果）が得られることにより、プリント基板１とリフレクター８またはレンズ１０との接着強度が向上する。   By forming the holes 7 in the printed board 1, the contact area between the adhesive 9 and the printed board 1 is expanded. The adhesive 9 flowing into the hole 7 is cured and an anchor effect (throwing effect) is obtained, so that the adhesive strength between the printed circuit board 1 and the reflector 8 or the lens 10 is improved.

前記プリント基板とリフレクターまたはレンズとの接着面に、実施例１で示した穴の代わりに溝（後述する図６参照）または、窪み（後述する図７参照）を形成することにより、接着面積を拡大することができる。接着面積の拡大分に相当して接着強度が向上する。   By forming a groove (see FIG. 6 to be described later) or a depression (see FIG. 7 to be described later) instead of the hole shown in the first embodiment on the adhesive surface between the printed circuit board and the reflector or the lens, the adhesion area is increased. Can be enlarged. The adhesive strength is improved corresponding to the enlargement of the adhesive area.

また、前記プリント基板と上記したリフレクターまたはレンズとの接着面に形成された穴に加え、更に、プリント基板と接触する前記リフレクターまたはレンズおよびＬＥＤチップの少なくとも何れか一つの接着面に粗面を追加形成することにより、接着面積を更に拡大することができるので、接着強度が一段と向上する。   In addition to the hole formed in the adhesive surface between the printed circuit board and the reflector or lens, a rough surface is added to at least one of the adhesive surfaces of the reflector or lens and the LED chip in contact with the printed circuit board. By forming the adhesive area, the adhesive area can be further expanded, so that the adhesive strength is further improved.

図４〜図７は、前記プリント基板を集合状態で接着面積拡大部を形成する場合の実施形態を示すものである。図４（a）は、集合基板１Aの状態で直交する２つのダイシングラインX、Y上の交点に穴７aを形成し、図４（b）の単品基板１aの状態では穴７aは１/４に切断される。   4 to 7 show an embodiment in the case where the adhesion area enlarged portion is formed in the assembled state of the printed circuit boards. In FIG. 4A, holes 7a are formed at intersections on two dicing lines X and Y orthogonal to each other in the state of the collective substrate 1A. In the state of the single substrate 1a in FIG. 4B, the holes 7a are 1/4. Disconnected.

図５（a）は、集合基板１Bの状態で直交する２つのダイシングラインX、Yの中、Xライン上に穴７bを形成し、図５（b）の単品基板１ｂの状態では穴７bは１/２に切断される。   In FIG. 5A, a hole 7b is formed on the X line among two dicing lines X and Y orthogonal to each other in the state of the collective substrate 1B. In the state of the single substrate 1b in FIG. Cut in half.

図６(a)は、集合基板１Cの状態で直交する２つのダイシングラインX、Yの中、Xライン上に溝７cを形成し、図６（b）の単品基板１cの状態で溝は１/２に切断される。   In FIG. 6A, a groove 7c is formed on the X line among two dicing lines X and Y orthogonal to each other in the state of the collective substrate 1C, and the groove is 1 in the state of the single product substrate 1c in FIG. Disconnected to / 2.

図７（a）は、集合基板１Dの状態で直交する２つのダイシングラインX、Yの中、Xライン上に窪み７dを形成し、図７（b）の単品基板１dの状態で窪み７dは１/２に切断される。   In FIG. 7A, a recess 7d is formed on the X line among two dicing lines X and Y orthogonal to each other in the state of the collective substrate 1D, and the recess 7d in the state of the single substrate 1d in FIG. Cut in half.

上記したように、プリント基板上に接着面積拡大部を形成する場合に、集合状態で、形成された一つの穴、溝および窪みを所定のダイシングラインで切断することにより、１/４または１/２に切断されるので、トータルの穴、溝および窪みの数を減らすことができる。   As described above, when the adhesion area enlarged portion is formed on the printed circuit board, by cutting the formed hole, groove, and dent with a predetermined dicing line in the assembled state, 1/4 or 1 / Since it is cut into two, the total number of holes, grooves and depressions can be reduced.

上述したように、プリント基板とLEDチップ側、プリント基板とリフレクターまたはレンズ側との接着面積の拡大により接着強度を増すことができる。従って、側圧強度の向上、製品落下時における剥がれの防止が期待できる。また、基板表面のレジスト材と接着剤との相性が悪く、濡れが起こりにくい状態であっても剥がれの防止可能な発光ダイオードを提供することが可能である。   As described above, the bonding strength can be increased by increasing the bonding area between the printed circuit board and the LED chip, and between the printed circuit board and the reflector or the lens. Therefore, it can be expected to improve the lateral pressure strength and prevent peeling when the product is dropped. In addition, it is possible to provide a light-emitting diode capable of preventing peeling even when the resist material on the substrate surface is not compatible with the adhesive and is not easily wetted.

本発明の実施例１に係るプリント基板の平面図である。It is a top view of the printed circuit board concerning Example 1 of the present invention. 図１のプリント基板にリフレクターを接着した状態のＡ−Ａ線断面図である。It is the sectional view on the AA line of the state which adhered the reflector to the printed circuit board of FIG. 図１のプリント基板にレンズを接着した状態の断面図である。It is sectional drawing of the state which adhered the lens to the printed circuit board of FIG. 集合基板のダイシングラインの交点上に穴を形成した状態から単品基板に切断したプリント基板の斜視図である。It is a perspective view of the printed circuit board cut | disconnected to the single-piece board | substrate from the state which formed the hole in the intersection of the dicing line of an aggregate board | substrate. 集合基板の一方のダイシングライン上に穴を形成した状態から単品基板に切断したプリント基板の斜視図である。It is a perspective view of the printed circuit board cut | disconnected by the single-piece board | substrate from the state which formed the hole on one dicing line of an aggregate substrate. 集合基板の一方のダイシングライン上に溝を形成した状態から単品状態に切断したプリント基板の斜視図である。It is a perspective view of the printed circuit board cut | disconnected from the state which formed the groove | channel on one dicing line of an aggregate substrate to the single-piece | unit state. 集合基板の一方のダイシングライン上に窪みを形成した状態から単品基板に切断したプリント基板の斜視図である。It is a perspective view of the printed circuit board cut | disconnected to the single-piece board | substrate from the state which formed the hollow on one dicing line of an aggregate substrate. 従来のプリント基板の接着面にリフレクターを接着した状態の断面図である。It is sectional drawing of the state which adhere | attached the reflector on the adhesion surface of the conventional printed circuit board. 従来のプリント基板の接着面にレンズを接着した状態の断面図である。It is sectional drawing of the state which adhered the lens to the adhesive surface of the conventional printed circuit board.

符号の説明Explanation of symbols

１、(1a)、（１b）、（1c）、（1d） プリント基板
１A、１B、１C、１D 集合基板
４ ＬＥＤチップ
５ 透明封止樹脂
６ 接着面
７（7a、7b） 穴
７c 溝
７d 窪み
８ リフレクター
９ 接着剤
１０ レンズ
X、Y ダイシングライン

1, (1a), (1b), (1c), (1d) Printed circuit board 1A, 1B, 1C, 1D Assembly board 4 LED chip 5 Transparent sealing resin 6 Adhesive surface 7 (7a, 7b) Hole 7c Groove 7d Dimple 8 Reflector 9 Adhesive 10 Lens
X, Y dicing line

Claims (4)

集合基板をダイシングして形成されたプリント基板にＬＥＤチップを実装し、該ＬＥＤチップを実装した前記プリント基板上にリフレクターまたはレンズを接着した発光ダイオードの製造方法において、
前記プリント基板と前記リフレクターまたはレンズとの接着面に接着面積拡大部を形成し、前記接着面に塗布した接着剤が前記接着面積拡大部に流れ込み、前記プリント基板と前記リフレクターまたはレンズとの接着強度を増加させたものであって、前記接着面積拡大部は前記集合基板の前記プリント基板の集合状態でダイシングライン上に形成されたことを特徴とする発光ダイオードの製造方法。 The LED chip is mounted on a printed circuit board that is formed by dicing the aggregate substrate, the manufacturing method of a light emitting diode bonded to the reflector or lens on the printed circuit board mounted with the LED chip,
Adhesion strength between the printed circuit board and the bonding area enlarged portion is formed in the bonding surface between the reflector or lens, the flow into the adhesive applied to the adhesive surface is the adhesion area expansion unit, the printed circuit board and the reflector or lens be one increased, the adhesion area enlargements method of manufacturing a light-emitting diode, characterized in that formed on the dicing line on the set state of the printed circuit board of the collective substrate. 前記プリント基板と前記リフレクターまたはレンズとの接着面に形成された接着面積拡大部は、前記プリント基板上の接着面の一部に形成された穴であることを特徴とする請求項１記載の発光ダイオードの製造方法。 The adhesion area enlarged portion formed on the adhesive surface of the printed substrate and the reflector or lens, the emission of claim 1, wherein the a hole formed on a part of the adhesive surface of the printed circuit board Diode manufacturing method . 前記プリント基板と前記リフレクターまたはレンズとの接着面に形成された接着面積拡大部は、前記プリント基板上の接着面の一部に形成された溝であることを特徴とする請求項１記載の発光ダイオードの製造方法。 The printed circuit board and the bonding area enlarged portion formed on the adhesion surface of the reflector or lens, light emission of claim 1, wherein it is a part formed grooves in the adhesive surface on the printed circuit board Diode manufacturing method . 前記プリント基板と前記リフレクターまたはレンズとの接着面に形成された接着面積拡大部は、前記プリント基板上の接着面の一部に形成された窪みであることを特徴とする請求項１記載の発光ダイオードの製造方法。
The printed circuit board and the bonding area enlarged portion formed on the adhesion surface of the reflector or lens, light emission of claim 1, wherein the at recess formed in said portion of the adhesive surface of the printed circuit board Diode manufacturing method .
JP2005130664A 2005-04-28 2005-04-28 Manufacturing method of light emitting diode Expired - Fee Related JP4681343B2 (en)

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