JP4640514B2 - 発光モジュール - Google Patents

発光モジュール Download PDF

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Publication number
JP4640514B2
JP4640514B2 JP2009046739A JP2009046739A JP4640514B2 JP 4640514 B2 JP4640514 B2 JP 4640514B2 JP 2009046739 A JP2009046739 A JP 2009046739A JP 2009046739 A JP2009046739 A JP 2009046739A JP 4640514 B2 JP4640514 B2 JP 4640514B2
Authority
JP
Japan
Prior art keywords
light
light emitting
diffusion layer
heat
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009046739A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010205776A5 (enExample
JP2010205776A (ja
Inventor
友広 三瓶
清 大谷
昌裕 泉
淳哉 村田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2009046739A priority Critical patent/JP4640514B2/ja
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Priority to PCT/JP2010/053136 priority patent/WO2010098457A1/ja
Priority to US13/202,689 priority patent/US8773612B2/en
Priority to KR1020117019555A priority patent/KR101267545B1/ko
Priority to EP10746336.6A priority patent/EP2403017A4/en
Priority to CN201080009903.6A priority patent/CN102334202B/zh
Publication of JP2010205776A publication Critical patent/JP2010205776A/ja
Publication of JP2010205776A5 publication Critical patent/JP2010205776A5/ja
Application granted granted Critical
Publication of JP4640514B2 publication Critical patent/JP4640514B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP2009046739A 2009-02-27 2009-02-27 発光モジュール Expired - Fee Related JP4640514B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009046739A JP4640514B2 (ja) 2009-02-27 2009-02-27 発光モジュール
US13/202,689 US8773612B2 (en) 2009-02-27 2010-02-26 Light emitting module and illumination apparatus
KR1020117019555A KR101267545B1 (ko) 2009-02-27 2010-02-26 발광모듈 및 조명장치
EP10746336.6A EP2403017A4 (en) 2009-02-27 2010-02-26 LIGHT-EMITTING MODULE AND LIGHTING DEVICE
PCT/JP2010/053136 WO2010098457A1 (ja) 2009-02-27 2010-02-26 発光モジュールおよび照明装置
CN201080009903.6A CN102334202B (zh) 2009-02-27 2010-02-26 发光模块及照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009046739A JP4640514B2 (ja) 2009-02-27 2009-02-27 発光モジュール

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010255672A Division JP5126632B2 (ja) 2010-11-16 2010-11-16 発光モジュール

Publications (3)

Publication Number Publication Date
JP2010205776A JP2010205776A (ja) 2010-09-16
JP2010205776A5 JP2010205776A5 (enExample) 2010-10-28
JP4640514B2 true JP4640514B2 (ja) 2011-03-02

Family

ID=42967027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009046739A Expired - Fee Related JP4640514B2 (ja) 2009-02-27 2009-02-27 発光モジュール

Country Status (1)

Country Link
JP (1) JP4640514B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7923739B2 (en) 2009-06-05 2011-04-12 Cree, Inc. Solid state lighting device
US8598602B2 (en) 2009-01-12 2013-12-03 Cree, Inc. Light emitting device packages with improved heat transfer
US9111778B2 (en) 2009-06-05 2015-08-18 Cree, Inc. Light emitting diode (LED) devices, systems, and methods
US8686445B1 (en) 2009-06-05 2014-04-01 Cree, Inc. Solid state lighting devices and methods
US8860043B2 (en) 2009-06-05 2014-10-14 Cree, Inc. Light emitting device packages, systems and methods
US8648359B2 (en) 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
US8269244B2 (en) 2010-06-28 2012-09-18 Cree, Inc. LED package with efficient, isolated thermal path
JP5612991B2 (ja) 2010-09-30 2014-10-22 シャープ株式会社 発光装置及びこれを備えた照明装置
US11101408B2 (en) 2011-02-07 2021-08-24 Creeled, Inc. Components and methods for light emitting diode (LED) lighting
US8610140B2 (en) 2010-12-15 2013-12-17 Cree, Inc. Light emitting diode (LED) packages, systems, devices and related methods
TW201251140A (en) 2011-01-31 2012-12-16 Cree Inc High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
JP5836780B2 (ja) * 2011-12-02 2015-12-24 日立アプライアンス株式会社 発光ダイオードモジュール及びそれを利用した照明器具
JP2014187392A (ja) * 2014-06-23 2014-10-02 Sharp Corp 発光装置及びこれを備えた照明装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006054336A (ja) * 2004-08-12 2006-02-23 Sanyo Electric Co Ltd 発光素子
JP4894354B2 (ja) * 2006-05-31 2012-03-14 豊田合成株式会社 発光装置
JP4678391B2 (ja) * 2006-08-29 2011-04-27 東芝ライテック株式会社 照明装置
JP4758921B2 (ja) * 2007-01-29 2011-08-31 株式会社日立製作所 線状光源装置、及びバックライト装置
JP2008300210A (ja) * 2007-05-31 2008-12-11 Toshiba Lighting & Technology Corp 照明装置
JP5029822B2 (ja) * 2007-07-31 2012-09-19 東芝ライテック株式会社 光源および照明装置

Also Published As

Publication number Publication date
JP2010205776A (ja) 2010-09-16

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