JP4639846B2 - Housing cooling structure - Google Patents

Housing cooling structure Download PDF

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JP4639846B2
JP4639846B2 JP2005052196A JP2005052196A JP4639846B2 JP 4639846 B2 JP4639846 B2 JP 4639846B2 JP 2005052196 A JP2005052196 A JP 2005052196A JP 2005052196 A JP2005052196 A JP 2005052196A JP 4639846 B2 JP4639846 B2 JP 4639846B2
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front panel
housing
cooling
cooling structure
air
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JP2006237414A (en
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孝幸 長嶋
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Meidensha Corp
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Meidensha Corp
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Description

この発明は、筐体冷却構造、特に自然空冷の筐体冷却構造に関するものである。 The present invention relates to a cooling structure for cooling structure, in particular natural cooling of the housing of the housing.

図3(a),(b)は従来の筐体の冷却構造の斜視図及びそのA−A線縦断側面図を示し、1は筐体であり、筐体1の前面にはフロントパネル2が設けられるとともに、筐体1の両側部には側板3が設けられ、側板3の前端にはフロントパネル2の両側において取付ブラケット4が設けられ、筐体1の上部には天井板5が設けられる。筐体1内にはプリント板6,7が水平に上下二段に設けられるとともに、後部に電子機器8が設けられ、プリント板6,7の前端上には高発熱コネクタ9,10が設けられ、高発熱コネクタ9,10はフロントパネル2に設けられた吸気口11,12から突出して設けられる。又、側板3にも吸気口13が設けられ、天井板5には排気口14が設けられ、フロントパネル2には表示機器15も設けられる。   FIGS. 3A and 3B are a perspective view and a vertical sectional side view of the conventional cooling structure of the housing, wherein 1 is a housing, and a front panel 2 is provided on the front surface of the housing 1. A side plate 3 is provided on both sides of the housing 1, mounting brackets 4 are provided on both sides of the front panel 2 at the front end of the side plate 3, and a ceiling plate 5 is provided on the top of the housing 1. . In the housing 1, printed boards 6 and 7 are horizontally provided in two upper and lower stages, an electronic device 8 is provided at the rear, and high heat generating connectors 9 and 10 are provided on the front ends of the printed boards 6 and 7. The high heat generating connectors 9 and 10 are provided so as to protrude from the intake ports 11 and 12 provided in the front panel 2. The side plate 3 is also provided with an air inlet 13, the ceiling plate 5 is provided with an exhaust port 14, and the front panel 2 is also provided with a display device 15.

上記構成において、高発熱コネクタ9,10及び筐体1の内部は、図3(b)に矢印に示すように、吸気口11〜13から吸入され、排気口14から排出される空気により冷却される。冷却効率を上げるためには、吸気口11〜13及び排気口14の面積を増大し、冷却空気の流通量を増大させる必要がある。   In the above-described configuration, the high heat generating connectors 9 and 10 and the inside of the housing 1 are cooled by the air sucked from the intake ports 11 to 13 and discharged from the exhaust port 14 as shown by arrows in FIG. The In order to increase the cooling efficiency, it is necessary to increase the areas of the intake ports 11 to 13 and the exhaust port 14 to increase the circulation amount of the cooling air.

なお、この出願の発明に関連する先行技術文献情報としては、他に次のようなものがある。
特開平5−335765号公報 特開平11−63547号公報 特開2001−257495号公報
Other prior art document information related to the invention of this application includes the following.
JP-A-5-335765 Japanese Patent Laid-Open No. 11-63547 JP 2001-257495 A

上記した従来の筐体の冷却構造においては、冷却空気は図3(b)の矢印に示すように流れるが、筐体1の内部に流れ込まない空気も多く、またフロントパネル2には高発熱コネクタ9,10や表示機器15等が設けられているので、吸気口11,12の面積を増大させることも限度があり、吸気口11〜13や排気口14の面積を多少増大させても冷却効果はあまり上がらず、冷却効果を上げることは困難であった。   In the conventional casing cooling structure described above, the cooling air flows as shown by the arrow in FIG. 3B, but there is much air that does not flow into the casing 1, and the front panel 2 has a high heat generating connector. 9, 10 and the display device 15 are provided, so there is a limit to increasing the area of the intake ports 11 and 12, and the cooling effect can be achieved even if the areas of the intake ports 11 to 13 and the exhaust port 14 are increased somewhat. It was difficult to increase the cooling effect.

この発明は上記のような課題を解決するために成されたものであり、冷却効率を向上するとともに、小型化が可能な筐体冷却構造を得ることを目的とする。 The present invention has been made to solve the above-described problems, and an object of the present invention is to obtain a cooling structure for a casing that can be reduced in size while improving cooling efficiency.

この発明の請求項1に係る筐体の冷却構造は、フロントパネルに、複数の吸気口を上下に並べ、かつ上側の吸気口の真下から水平方向にずらした位置に下側の吸気口を設けるとともに、天井板に排気口を設け、前記各吸気口に臨んでプリント板を収納した筐体において、前記プリント板の前端側には発熱コネクタを設け、該発熱コネクタを前記吸気口の下側から前記フロントパネルの前面に突出させるとともに、前記フロントパネルの上端に、フロントパネルの前方に突出して冷却風を前記吸気口に導くひさしを設けたものである。 According to a first aspect of the present invention, a cooling structure for a housing is provided with a plurality of intake ports arranged vertically on the front panel , and provided with a lower intake port at a position shifted horizontally from directly below the upper intake port. under with the exhaust port is provided on the top plate, the housing accommodating the printed circuit board facing the respective intake ports, provided fever connector on the front side of the printed circuit board, the heat generating connector of the intake port In addition to projecting from the side to the front surface of the front panel, an eaves projecting forward of the front panel and guiding cooling air to the intake port is provided at the upper end of the front panel.

以上のようにこの発明の請求項1によれば、フロントパネルの上端に前方に突出したひさしを設けており、従来上方に流れていた冷却風がひさしに遮られてフロントパネルの吸気口から筐体内に流入するようになり、冷却効率が向上する。又、吸気口や排気口をあまり大きくしなくても良いので、小型化が可能となる。   As described above, according to the first aspect of the present invention, the eaves projecting forward are provided at the upper end of the front panel, and the cooling air that has been flowing upward is blocked by the eaves so that it can be opened from the intake port of the front panel. It begins to flow into the body, improving the cooling efficiency. Further, since it is not necessary to make the intake port and the exhaust port so large, the size can be reduced.

実施最良形態1
以下、この発明を実施するための最良の形態を図面とともに説明する。図1(a),(b)はこの発明の実施最良形態1による筐体の冷却構造の斜視図及びそのB−B線縦断側面図を示し、筐体1のフロントパネル2の上端には前方に突出してひさし16を設ける。その他の構成は従来と同様である。
Best Embodiment 1
The best mode for carrying out the present invention will be described below with reference to the drawings. FIGS. 1A and 1B are a perspective view of a cooling structure for a housing according to the first embodiment of the present invention and a vertical side view taken along line B-B. The eaves 16 are provided so as to protrude from the surface. Other configurations are the same as those of the prior art.

上記構成において、図1(b)に矢印で示すように、フロントパネル2の吸気口11,12においては、上昇した空気はひさし16により遮られ、吸気口11,12から筐体1内に流入する。このため、冷却空気の流通量が増大し、冷却効率が向上する。又、吸気口11及び排気口12をあまり大きくしなくても、冷却空気の流通量が得られるので、筐体1の小型化が可能となる。   In the above configuration, as shown by arrows in FIG. 1B, the air that has risen is blocked by the eaves 16 at the intake ports 11 and 12 of the front panel 2 and flows into the housing 1 from the intake ports 11 and 12. To do. For this reason, the circulation amount of the cooling air is increased, and the cooling efficiency is improved. Further, since the amount of cooling air can be obtained without enlarging the intake port 11 and the exhaust port 12, the housing 1 can be downsized.

実施最良形態2
図2(a),(b)は実施最良形態2による多段筐体の冷却構造の正面図及び側面図を示し、1は従来同様の筐体であり、フロントパネル2に吸気口11,12を有するとともに、側板3に吸気口13を有する。又、天井板5に排気口14を有し、内部にはプリント板6,7等の電子機器を有する。二つの筐体1の取付ブラケット4を取付枠17にボルト18により取り付けるが、二つの筐体1は上下に間隔をあけて取り付ける。この結果、多段筐体が構成される。又、各筐体1のフロントパネル2の上端位置において前方に突出するようにしてひさし兼用のケーブルダクト19を取付枠17にボルト20により取り付ける。ケーブルダクト19には筐体1毎にケーブル21を支持する。
Embodiment 2
FIGS. 2A and 2B are a front view and a side view of a cooling structure for a multistage housing according to the second embodiment. In addition, the side plate 3 has an intake port 13. Further, the ceiling plate 5 has an exhaust port 14, and electronic devices such as printed boards 6 and 7 are provided inside. The mounting brackets 4 of the two housings 1 are attached to the mounting frame 17 with bolts 18, and the two housings 1 are attached at intervals in the vertical direction. As a result, a multistage housing is configured. Further, a cable duct 19 serving as an eaves is attached to the attachment frame 17 with a bolt 20 so as to protrude forward at the upper end position of the front panel 2 of each housing 1. The cable duct 19 supports a cable 21 for each housing 1.

上記構成において、冷却風は吸口11〜13から吸入され、排気口14から排出されるが、ひさし兼用のケーブルダクト19を設けたことにより吸気口11,12の外側を上方に流れていた冷却風がケーブルダクト19に遮られて吸気口11,12から筐体1内に流入するようになり、冷却空気の流通量が増大して冷却効果が向上する。又、吸口11〜13や排気口14をあまり大きくする必要がなく、筐体1を小型化することができる。 In the above structure, cooling air is sucked from the air suction port 11 to 13, is discharged from the exhaust port 14, it has been flowing in the outer air inlet 11 and 12 upward by providing the cable duct 19 of the eaves combined The cooling air is blocked by the cable duct 19 and flows into the housing 1 from the air inlets 11 and 12, and the amount of cooling air flowing is increased, thereby improving the cooling effect. In addition, the air intake ports 11 to 13 and the exhaust port 14 so there is no need to increase, the housing 1 can be reduced in size.

この発明の実施最良形態1による筐体の冷却構造の斜視図及びそのB−B線縦断側面図である。It is the perspective view of the cooling structure of the housing | casing by Embodiment 1 of this invention, and its BB line vertical side view. 実施最良形態2による多段筐体の冷却構造の正面図及び側面図である。It is the front view and side view of the cooling structure of the multistage housing | casing by Embodiment 2. FIG. 従来の筐体の冷却構造の斜視図及びそのA−A線縦断側面図である。It is the perspective view of the cooling structure of the conventional housing | casing, and its AA line vertical side view.

符号の説明Explanation of symbols

1…筐体
2…フロントパネル
3…側板
5…天井板
6,7…プリント板
8…電子機器
9,10…高発熱コネクタ
11〜13…吸気口
14…排気口
16…ひさし
17…取付枠
19…ひさし兼用ケーブルダクト
21…ケーブル
DESCRIPTION OF SYMBOLS 1 ... Housing 2 ... Front panel 3 ... Side plate 5 ... Ceiling board 6, 7 ... Printed board 8 ... Electronic device 9, 10 ... High heat-generation connector 11-13 ... Intake port 14 ... Exhaust port 16 ... Eaves 17 ... Mounting frame 19 ... eaves and cable duct 21 ... cable

Claims (1)

フロントパネルに、複数の吸気口を上下に並べ、かつ上側の吸気口の真下から水平方向にずらした位置に下側の吸気口を設けるとともに、天井板に排気口を設け、前記各吸気口に臨んでプリント板を収納した筐体において、
前記プリント板の前端側には発熱コネクタを設け、該発熱コネクタを前記吸気口の下側から前記フロントパネルの前面に突出させるとともに、前記フロントパネルの上端に、フロントパネルの前方に突出して冷却風を前記吸気口に導くひさしを設けたことを特徴とする筐体の冷却構造。
On the front panel, a plurality of air intakes are arranged one above the other, and a lower air intake is provided at a position shifted in a horizontal direction from directly below the upper air intake, and an exhaust port is provided on the ceiling plate. In the case where the printed board is stored,
The provided heat generation connector on the front side of the printed circuit board, are made to protrude from the heat generating connector from the lower side of the respective inlet on a front surface of the front panel, the upper end of the front panel, protrudes forward of the front panel And a cooling structure for the casing, wherein a eaves for guiding the cooling air to the intake port is provided.
JP2005052196A 2005-02-28 2005-02-28 Housing cooling structure Expired - Fee Related JP4639846B2 (en)

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JP2005052196A JP4639846B2 (en) 2005-02-28 2005-02-28 Housing cooling structure

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Application Number Priority Date Filing Date Title
JP2005052196A JP4639846B2 (en) 2005-02-28 2005-02-28 Housing cooling structure

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JP2006237414A JP2006237414A (en) 2006-09-07
JP4639846B2 true JP4639846B2 (en) 2011-02-23

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5041548B2 (en) * 2008-11-13 2012-10-03 オムロンオートモーティブエレクトロニクス株式会社 Power control device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182995U (en) * 1983-05-23 1984-12-06 日本電気株式会社 Cold air prevention cover
JPS60240195A (en) * 1984-05-15 1985-11-29 富士通株式会社 Cable duct
JPH03110884U (en) * 1990-02-28 1991-11-13
JPH11145662A (en) * 1997-11-13 1999-05-28 Fujitsu Ltd Cooling structure for printed board
JP2001085880A (en) * 1999-09-14 2001-03-30 Toshiba Corp Electronic device
JP2001339188A (en) * 2000-05-26 2001-12-07 Oki Comtec Ltd Cabinet for electronic apparatus
JP2003298269A (en) * 2002-04-02 2003-10-17 Meidensha Corp Cooling structure of electronic unit

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182995U (en) * 1983-05-23 1984-12-06 日本電気株式会社 Cold air prevention cover
JPS60240195A (en) * 1984-05-15 1985-11-29 富士通株式会社 Cable duct
JPH03110884U (en) * 1990-02-28 1991-11-13
JPH11145662A (en) * 1997-11-13 1999-05-28 Fujitsu Ltd Cooling structure for printed board
JP2001085880A (en) * 1999-09-14 2001-03-30 Toshiba Corp Electronic device
JP2001339188A (en) * 2000-05-26 2001-12-07 Oki Comtec Ltd Cabinet for electronic apparatus
JP2003298269A (en) * 2002-04-02 2003-10-17 Meidensha Corp Cooling structure of electronic unit

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