JPH11145662A - Cooling structure for printed board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling structure for a printed board on which outer interface boards for a low-cost workstation can be mounted just the way as they are and can be cooled. SOLUTION: A printed board unit 20 having a front plate is vertically stored in a housing 23 for printed board unit. A plurality of interface boards 21 smaller than the printed board unit 20 are mounted and stacked horizontally on the printed board unit 20. A draft guide 28 for guiding a cooling air is provided under the lowest interface board 21. Louvers 30 for guiding cooling air are also provided in correspondence with each interface board 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cooling structure for a printed board. More specifically, the present invention relates to a printed board cooling structure that efficiently cools an external interface printed board when the external interface is used in a large-sized computer.

[0002]

2. Description of the Related Art In recent years, workstations such as personal computers have become popular, and external interfaces mounted on the workstations have also become diversified. Therefore, there is a demand that these external interfaces can be used for a large computer. However, in order to use these external interfaces in a large computer, it is necessary to newly manufacture a printed circuit board unit for the external interface according to the mounting form of the large computer, which is expensive. Therefore, a structure capable of mounting an inexpensive interface board for a workstation has been required.

FIG. 8 shows an example of a conventional cooling structure of a large-sized computer disclosed in Japanese Patent Application Laid-Open No. Hei 7-240589. 3A is a sectional view, and FIG. 3B is an enlarged view of a main part. That is, a cooling duct 1 through which cooling air passes, a heating element 2 disposed on one surface of the cooling duct, and an air passage in the cooling duct are divided into an air supply side and an exhaust side, and one of the air supply sides is separated. A partition 3 for partitioning the other exhaust side into a cooling chamber 1b containing the heating element, the partition plate having a cooling air outlet 3a at a position corresponding to the heating element. Each of the heat generating elements is provided with a wind shield plate 3b which is open and close to the windward side of each heat generating element. In addition, 4
Denotes a printed circuit board unit, 5 denotes an air supply fan, and 6 denotes an exhaust fan.

FIG. 9 shows an I / O package unit described in JP-A-7-44275 as another example of a conventional large-sized computer. Multiple packages 7
Is mounted horizontally by inserting the guide plate 9 of the package into the guide rail 8. The guide rail 8 has its projection inserted into a small hole on a sheet metal inside the housing 10 and fixed. The guide plate 9 is on the side of the package. After insertion, both ends of each package are screwed to the sheet metal of the housing 10. The male connector on one side of each package and the female connector 11 on the backboard are coupled to supply electrical signals. The cooling air 12 is supplied from one side of each package and discharged from the other side.

FIGS. 10A and 10B show a general computer. FIG. 10A is a perspective view and FIG. 10B is a perspective view showing a printed board mounting portion. In the figure, reference numeral 12 denotes a printed circuit board housing housing a plurality of printed circuit board units;
Is a duct, and 14 is a cooling fan. The printed board unit 15 has an external connection connector 16 and an internal connection connector 17 as shown in FIG. 3B, is housed vertically in the printed board mounting casing 12, and the cooling air 13 is indicated by a white arrow. As described above, the printed board unit 15 flows from the bottom to the top and is cooled.

[0006]

The conventional large-sized computer shown in FIGS. 8 to 10 has a mounting form in which an interface board for a workstation cannot be mounted as it is. Could not be mixed.

The present invention has been made in consideration of the above-described conventional problems, and has as its object to realize a printed board cooling structure that can be mounted on an inexpensive external interface board for a workstation and can be cooled.

[0008]

According to a first aspect of the present invention, a printed board unit having a front plate is vertically accommodated in a housing for mounting the printed board unit, and the printed board unit is mounted on the printed board unit. A plurality of interface boards smaller than the unit are horizontally mounted in a plurality of stages, a ventilation guide for guiding cooling air is provided below the lowermost interface board, and a louver for guiding cooling air corresponding to each interface board Is provided. According to a second aspect of the present invention, in the first aspect, the louver is provided behind each interface board and for each interface board.

By adopting this configuration, as shown in FIG. 2, the cooling air is guided to the rear side of the interface board 21 by the ventilation guide 29, further guided to each interface board 21 by the louver 30, and After being cooled, it is discharged upward from the side surface. Thus, each interface board 21 is efficiently cooled.

[0010] The invention of claim 3 is based on claim 1 or 2.
, Wherein a ventilation hole is provided in a front plate of the printed board unit. By adopting this configuration, as shown in FIG. 3, the cooling air is guided to the rear side of the interface board 21 by the ventilation guide 29 provided obliquely, further guided to each interface board 21 by the louver 30, and After the substrate 21 is cooled, it is discharged outside through the exhaust holes 32 of the front plate 25 of the printed board unit 20. Therefore, the cooling air cools the interface board 21 from the back to the front, and the heated air is supplied to the printed board unit mounting casing 23.
The interface board 21 is efficiently cooled because the interface board 21 is hardly released into the inside and is released to the outside.

According to a fourth aspect of the present invention, a printed board unit having a front plate is vertically accommodated in a housing for mounting the printed board unit, and the printed board unit has a plurality of interfaces smaller than the printed board unit. The board is mounted horizontally in a plurality of stages, the side plate of the printed board unit mounting casing is formed in a hollow, a cooling air intake is provided in the hollow side plate, and a ventilation port is provided on a surface facing the interface board. A wind adjustment plate is provided.

With this configuration, as shown in FIG. 7, when cooling air is supplied by a fan 39 provided at a lower portion, a part of the cooling air is supplied to a cooling wind provided on a side plate 35. From the inlet 36, through the hollow side plate 35,
The cooling air adjusting plate 38 guides the cooling air to the respective interface boards 21 through the ventilation holes 37.
After being cooled, it exits to the rear and is discharged outside by the exhaust fan 40. In this case, each interface board 21
By adjusting the respective angles of the cooling air adjusting plate 38 in accordance with the heat generation amount of each of the above, each interface board 21 can be cooled uniformly.

[0013]

FIG. 1 is a diagram showing a basic configuration of the present invention. In the figure, reference numeral 20 denotes a printed board unit having a structure capable of mounting a plurality of interface boards 21. The printed board unit 20 has a connector 22, and is housed in a printed board unit mounting housing 23, Connected to body-side connector. The plurality of interface boards 21 are fitted and electrically connected to a plurality of connectors 24 provided horizontally on the printed board unit 20, and are held horizontally. In addition, 25 is a front plate provided on the printed board unit 20, and 26 is a front plate provided on the interface board 21.

FIGS. 2A and 2B show a first embodiment of the present invention. FIG. 2A is a front view, FIG. 2B is a side sectional view, and FIG. 2C is a sectional view taken along line cc in FIG. FIG. In the figure, reference numeral 20 denotes a printed board unit, on which a plurality of interface boards 21 are horizontally mounted via connectors 24. The printed board unit 20 on which the interface board 21 is mounted is housed in the printed board unit mounting housing 23 and the connector 2
2, it is electrically connected to the back panel 27.
Reference numeral 28 denotes a lever for inserting and removing the printed board unit.

This embodiment is characterized in that a ventilation guide 29 for guiding cooling air is provided obliquely below the lowermost interface board 21 and a louver 30 is provided behind each interface board 21. It is.

In the first embodiment configured as described above, when the cooling air 31 is fed in as indicated by an arrow by a fan (not shown) provided below the printed board unit mounting housing 23, The cooling air is guided to the rear side of the interface board 21 by an oblique ventilation guide 29, and further guided to each interface board 21 by a louver 30. After cooling the interface boards 21, the cooling air escapes upward from the side surfaces and is discharged to the outside. Thus, each interface board 21
Is cooled efficiently.

FIGS. 3A and 3B show a second embodiment of the present invention. FIG. 3A is a front view, FIG. 3B is a side sectional view, and FIG. 3C is a sectional view taken along line cc in FIG. FIG. In the present embodiment, it is assumed that the plurality of interface boards 21 are horizontally mounted on the printed board unit 20 housed in the printed board unit mounting housing 23, and the ventilation guide 29 and the louver 30 are provided. This embodiment is the same as the embodiment, except that an exhaust hole 32 for discharging cooling air is provided in the front plate 25 of the printed board unit 20.

In the second embodiment constructed as described above, when the cooling air 31 is fed in as indicated by an arrow by a fan (not shown) provided below the printed board unit mounting housing 23, The cooling air is guided to the rear side of the interface board 21 by an oblique ventilation guide 29, and further guided to each interface board 21 by a louver 30. After cooling the interface boards 21, the cooling air is discharged to the outside through exhaust holes 32 provided in the front plate 25 of the printed board unit 20.
Therefore, the cooling air cools the interface board 21 from the rear to the front, and the heated air is hardly released into the printed board unit mounting housing 23 and is discharged to the outside. Cooled efficiently.

FIGS. 4A and 4B show a third embodiment of the present invention. FIG. 4A is a front view, FIG. 4B is a side sectional view, and FIG. 4C is a sectional view taken along line cc in FIG. FIG. In the present embodiment, a plurality of interface boards 21 are horizontally mounted on a printed board unit 20 housed in a printed board unit mounting housing 23, and a ventilation guide 29, a louver 30, and an exhaust hole 32 of a front board are provided. This is the same as in the previous embodiment, except that the lid 33 is provided on the side of the interface board 21 opposite to the side connected to the printed board unit 20.

In the third embodiment configured as described above, when the cooling air 31 is supplied as indicated by an arrow by a fan (not shown) provided below the housing 23 for mounting the printed board unit, The cooling air is guided to the rear side of the interface board 21 by an oblique ventilation guide 29, and further guided to each interface board 21 by a louver 30. After cooling the interface boards 21, the cooling air is discharged to the outside through exhaust holes 32 provided in the front plate 25 of the printed board unit 20.
At this time, since the cooling air closes the side portion of the interface board 21 with the lid 33, the cooling air can efficiently cool the interface board 21 from the rear to the front, and the heated air is supplied to the printed board unit. Since the interface board 21 is not emitted into the mounting housing 23 but is emitted to the outside, the interface board 21 is efficiently cooled and can cope with an interface board with high heat generation.

5A and 5B show a fourth embodiment of the present invention. FIG. 5A is a front view, FIG. 5B is a side sectional view, and FIG. 5C is a sectional view taken along line cc in FIG. FIG. 3D is an enlarged view of FIG. In the present embodiment, a plurality of interface boards 21 are horizontally mounted on a printed board unit 20 housed in a printed board unit mounting housing 23, and a ventilation guide 29, a louver 30, and a lid 33 are provided. This is the same as the previous embodiment, except for the exhaust holes 3 provided on the front plate of the printed circuit board unit.
1 is abolished, and instead, a louver 34 for exhaust is provided on the lid 33 corresponding to each interface board 21.

In the fourth embodiment constructed as described above, when the cooling air 31 is fed in as indicated by an arrow by a fan (not shown) provided below the printed board unit mounting housing 23, The cooling air is guided to the rear side of the interface board 21 by an oblique ventilation guide 29, and further guided to each interface board 21 by a louver 30. After cooling the interface boards 21, the cooling air is discharged to the outside from the louvers 34 provided on the lid. In the previous embodiment, the number of mounted interface boards 21 is limited because the exhaust gas depends on the exhaust holes provided in the front plate of the printed circuit board unit. And the number of interface boards 21 mounted increases.

FIGS. 6A and 6B show a fifth embodiment of the present invention. FIG. 6A is a front view, FIG. 6B is a side sectional view, and FIG. 6C is a sectional view taken along line cc in FIG. FIG. In the present embodiment, a plurality of interface boards 21 are horizontally mounted on a printed board unit 20 housed in a printed board unit mounting housing 23, and a ventilation guide 29, a louver 30 behind the interface board 21, and Louver 3
4 is provided in the same manner as in the previous embodiment.
That is, the louver 30 at the rear of No. 1 is extended as shown in FIG.

In this embodiment constructed as described above, when the cooling air 31 is supplied by a fan (not shown) provided below the printed board unit mounting housing 23 as shown by an arrow, the cooling air is supplied. Is an oblique ventilation guide 29
Is guided to the rear side of the interface board 21 by the louver 30, and further guided to each interface board 21 by the louver 30, and after cooling each interface board 21, it is discharged to the outside from the louver 34 provided in the lid 33.
At this time, since the louver 30 is elongated to form the cooling air introduction passage, an average cooling air can be sent to each interface board 21, and each interface board 21 is cooled uniformly.

FIGS. 7A and 7B are views showing a sixth embodiment of the present invention, wherein FIG. 7A is a perspective view, FIG. 7B is a front view, and FIG.
FIG. 3D is a cross-sectional view taken along the line cc in FIG. In the present embodiment, a plurality of interface boards 21 are horizontally mounted on a printed board unit 20 housed in a printed board unit mounting housing 23, as in the above-described embodiments. In the embodiment, the side plate 35 of the printed board unit mounting casing 22 is hollow, and the side plate 35 is provided with the cooling air intake 36, and the ventilation hole 37 and the cooling air adjustment plate 38 facing the interface board 21 are provided. It is a thing. 39 is a cooling air supply fan provided at the lower part of the housing, and 40 is an exhaust fan provided at the upper part of the housing.

In the present embodiment having the above-described structure, when the cooling air is fed by the fan 39 provided at the lower part of the printed board unit mounting housing 23 as shown by the arrow,
Part of the cooling air passes through the hollow side plate 35 from the cooling air intake port 36 provided in the side plate 35 and passes through the cooling air adjusting plate 3.
8 to the respective interface boards 21 through the ventilation holes 37.
Supplied to The cooling air supplied to each interface board 21 cools each interface board 21, then goes out to the rear, and is discharged outside by the exhaust fan 40. According to the present embodiment, each interface board 21 can be uniformly cooled by adjusting each angle of the cooling air adjusting plate 38 according to the heat generation amount of each interface board 21.

[0027]

According to the cooling structure for a printed board of the present invention, various interfaces conventionally used can be used, and the development man-hour and the development cost of the interface function can be reduced. Reduction is possible. In addition, the cooling of the interface board can be performed efficiently, so that the mounting efficiency can be improved.

[Brief description of the drawings]

FIG. 1 is a diagram showing a basic configuration of the present invention.

FIGS. 2A and 2B are diagrams showing a first embodiment of the present invention, wherein FIG.
Is a front view, (b) is a side sectional view, (c) is c in FIG.
It is sectional drawing in the -c line.

FIGS. 3A and 3B are diagrams showing a second embodiment of the present invention, wherein FIG.
Is a show view, (b) is a side sectional view, (c) is c in FIG.
It is sectional drawing in the -c line.

FIG. 4 is a diagram showing a third embodiment of the present invention, in which (a)
Is a front view, (b) is a side sectional view, (c) is c in FIG.
It is sectional drawing in the -c line.

FIG. 5 is a diagram showing a fourth embodiment of the present invention, in which (a)
Is a front view, (b) is a side sectional view, (c) is c in FIG.
FIG. 3D is a cross-sectional view taken along a line c, and FIG.

FIG. 6 is a diagram showing a fifth embodiment of the present invention, in which (a)
Is a front view, (b) is a side sectional view, (c) is c in FIG.
It is sectional drawing in the -c line.

FIGS. 7A and 7B are diagrams showing a sixth embodiment of the present invention, wherein FIG.
Is a perspective view, (b) is a front view, (c) is cc in FIG.
FIG. 3D is a cross-sectional view taken along a line, and FIG.

FIG. 8 is a diagram illustrating a cooling structure described in Japanese Patent Application Laid-Open No. Hei 7-240589 as an example of a conventional cooling structure for a large computer.

FIG. 9 is a diagram showing a cooling structure described in JP-A-7-44275 as another example of a conventional large-sized computer.

FIG. 10 is a diagram showing a conventional general computer.
(A) is a perspective view and (b) is a perspective view showing a printed board mounting portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 20 ... Printed board unit 21 ... Interface board 22, 24 ... Connector 23 ... Printed board unit mounting housing 25, 26 ... Front board 27 ... Back panel 28 ... Printed board unit insertion / extraction lever 29 ... Ventilation guide 30, 34 ... Louver DESCRIPTION OF SYMBOLS 31 ... Cooling air 32 ... Exhaust hole 33 ... Lid 35 ... Side plate 36 ... Ventilation port 37 ... Cooling air inlet 38 ... Cooling air adjusting plate

Claims (4)

[Claims] A printed board unit having a front plate is vertically accommodated in a printed board unit mounting housing, and a plurality of interface boards smaller than the printed board unit are horizontally arranged in a plurality of stages in the printed board unit. A cooling structure for a printed board, wherein a ventilation guide for guiding cooling air is provided below the lowermost interface board, and a louver for guiding cooling air is provided for each interface board. . 2. The cooling structure for a printed board according to claim 1, wherein said louvers are provided behind each interface board and for each interface board. 3. The cooling structure for a printed board according to claim 1, wherein ventilation holes are provided in a front plate of the printed board unit. 4. A printed board unit having a front plate is vertically accommodated in a printed board unit mounting housing, and a plurality of interface boards smaller than the printed board unit are horizontally arranged in a plurality of stages in the printed board unit. Mounted, the side plate of the printed board unit mounting casing is formed hollow, and the hollow side plate is provided with a cooling air intake, and a ventilation hole and a cooling air adjustment plate are provided on a surface facing the interface board. A cooling structure for a printed board characterized by the following.