JP4629220B2 - Exposure equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an exposure apparatus and an exposure method, and in particular, according to a photo-etching method, a substrate is continuously etched in a strip shape to obtain a product. The present invention relates to an exposure apparatus for plate making used in a plate making process for forming an etching-resistant resist image.
In particular, the present invention relates to an exposure apparatus that is excellent in handling when a large photomask for plate making is mounted in a substantially vertical direction.
[0002]
[Prior art]
In recent years, a shadow mask for a color TV (CRT) has been mass-produced with an increase in the amount of use, and depending on the purpose of use, there has been a demand for finer size and larger size.
Such shadow masks are generally produced on a production line that uses a strip-shaped metal plate as a material and performs etching by a photoetching method.
Briefly, while continuously or intermittently moving the belt-shaped metal plate material, usually, a plate-making process is performed on both sides thereof to form an etching-resistant resist image, and this is used as an etching mask to form the belt-shaped metal plate material. An etching process for etching was performed, and the outer peripheral portion of the product portion of each shadow mask was held by the strip-shaped metal plate material, and the contour mask was faced to the strip-shaped metal plate material, and the outer shape was processed.
Then, after that, a trimming process for separating each shadow mask is performed to obtain a target shadow mask.
[0003]
As mass production continues to increase, the demand for lowering the production cost of shadow masks, which are products, has recently become more intense, and even in the exposure method used in the plate making process and the exposure apparatus used in this process. Improvements are required in terms of productivity, quality, and cost.
In the shadow mask production line, as an exposure method in the plate making process, the strip-shaped metal plate on which the photosensitive resist film is formed is intermittently moved in a substantially stretched state, and at the time of stoppage, A photomask formed of a corresponding large glass dry plate is adhered to the resist films on both sides of the metal plate material, and exposed to form a latent image for developing and forming an etching-resistant resist image. An exposure method was adopted.
And, for the exposure apparatus used for this, a pair of photomasks (of the same size) for exposing the resist films on both sides of the substrate provided with photosensitive resist films on both sides are opposed to each other. Each having a pair of frame portions attached in a substantially vertical direction, arranging a base material between the pair of photomasks, evacuating the frame portions, and aligning the pair of photomasks with each other, A double-sided exposure apparatus has been used in which the pair of photomasks are brought into close contact with both surfaces of a base material and exposure is performed from both surfaces of the base material.
[0004]
Conventionally, in such an exposure apparatus, a positioning pin or a block for determining the vertical position of the photomask is provided in each frame part at the lower part of the frame part. Was directly applied to the positioning pin, and the position in the left and right (horizontal) direction was adjusted and mounted on the frame.
The positioning pin is located at a position lower than the photomask from the surface of the photomask that adheres to the base material provided with a photosensitive resist film on both sides, and does not enter the photomask region.
However, since a large-sized photomask for manufacturing a shadow mask is heavy and the positioning pins are small, it is difficult for such an exposure apparatus to accurately abut against the positioning pins.
[0005]
[Problems to be solved by the invention]
Thus, in the exposure apparatus used for exposure in the plate making process in a production line that uses a strip-shaped metal plate material as a raw material and performs etching by a photoetching method, such as a shadow mask production line, the frame portion of the photomask Therefore, there has been a demand for an exposure apparatus that can be easily mounted on the positioning pins, and can at least maintain the current status in terms of quality.
The present invention corresponds to this, and is an exposure apparatus used for exposure in a plate making process in a production line that uses a strip-shaped metal plate material as a material and performs etching processing by a photoetching method. It is an object of the present invention to provide an exposure apparatus that can be easily mounted on a positioning pin and can at least maintain the current status in terms of quality.
[0006]
[Means for Solving the Problems]
The exposure apparatus according to the present invention is a frame in which a pair of photomasks for exposing a resist film on both sides of a substrate provided with a photosensitive resist film on both sides thereof are opposed to each other and attached in a substantially vertical direction, respectively. A pair of portions, a substrate is disposed between the pair of photomasks, a vacuum is drawn between the frame portions, the pair of photomasks are aligned with each other, and the pair of photomasks A double-sided exposure apparatus that is in close contact with both sides and performs exposure from both sides of a substrate, and a positioning pin or block for determining the vertical position of the photomask and a photomask are placed on each frame part. , A delivery pin for delivery to and from the positioning pin or block is provided at the lower part of the frame, and the delivery pin is positioned below the upper surface of the positioning pin or block. The photomask can be rotated around one direction perpendicular to the frame, and after the photomask is transferred to the positioning pin by the transfer pin, the transfer pin is rotated so that the transfer pin adheres to the photomask substrate. After not hindering, the photomask is brought into close contact with both surfaces of the substrate, and exposure is performed from both surfaces of the substrate. In the above, the upper surface position of the transfer pin at the rotation position of the transfer pin before passing the photomask to the positioning pin varies depending on the position in the direction perpendicular to the frame portion of the transfer pin, and the positioning pin or block and the transfer pin The upper surface position of the transfer pin at the same position in the direction perpendicular to the frame part is lower than the upper surface position of the positioning pin or block, and the upper surface position of the transfer pin located away from the positioning pin or block in the direction perpendicular to the frame part is positioned. The top surface position of the tip of the transfer pin at the same height as the top surface position of the pin or block and further away in the direction perpendicular to the frame portion is higher than the top surface position of the positioning pin or block, and the photomask is positioned on the positioning pin. Rotation position of the delivery pin after passing to Upper surface position of the definitive transfer pins is characterized in that the whole is lower than the upper surface position of the positioning pin or block. In addition, in the above, a photomasking method is used to etch a continuous base material in a belt shape to obtain a product. In the shadow mask manufacturing process, both sides of the base material are matched to the pattern of the shadow mask, which is a product. It is an exposure apparatus for plate making used in a plate making process for developing and forming an etching resist image.
[0007]
As the photomask, a glass dry plate provided with a silver salt photosensitive material is generally used as a material, and a silver salt photosensitive material is selectively exposed to form a pattern (also referred to as patterning).
In recent years, a photomask master for a shadow mask has been formed by patterning after selective exposure with a drawing exposure machine and development.
An original plate or a photomask that has been subjected to close contact exposure based on the original plate and developed to form a pattern, or that has undergone a pattern synthesis process is used as a photomask.
Generally, low carbon steel or Ni—Fe material is used as the base material for the shadow mask.
[0008]
[Action]
The exposure apparatus of the present invention is an exposure apparatus used for exposure in a plate making process in a production line that uses a strip-shaped metal plate material as a material and performs etching processing by a photoetching method, and is a photomask. Therefore, it is possible to provide an exposure apparatus that can be easily attached to the positioning pins of the frame portion and can at least maintain the current status in terms of quality. Specifically, a frame portion for mounting a pair of photomasks for exposing a resist film on both sides of a base material provided with a photosensitive resist film on both sides thereof, facing each other in a substantially vertical direction, respectively. A pair is provided, a base material is disposed between the pair of photomasks, a vacuum is drawn between the frame portions, and the pair of photomasks are aligned with each other, and the pair of photomasks are disposed on both surfaces of the base material. It is a double-sided exposure apparatus that exposes from both sides of a base material, and each frame part is provided with positioning pins or blocks for determining the vertical position of the photomask, and a photomask placed thereon. A delivery pin for delivery to and from the pin or block is provided in the lower part of the frame, and the delivery pin is in a direction perpendicular to the frame at a position below the upper surface of the positioning pin. It can be rotated as a center.After passing the photomask to the positioning pin by the delivery pin, rotate the delivery pin so that the delivery pin does not hinder the adhesion of the photomask to the substrate, More specifically, the upper surface position of the delivery pin at the rotational position of the delivery pin before passing the photomask to the positioning pin is such that it is adhered to both sides of the substrate and exposure is performed from both sides of the substrate. , The position of the transfer pin varies depending on the position in the direction perpendicular to the frame, and the upper surface position of the transfer pin at the same position in the direction perpendicular to the frame and the positioning pin or block is lower than the position of the upper surface of the positioning pin or block, transfer pins of a position away in a direction perpendicular to the frame portion from the positioning pin or block Top position at the same height as the upper surface position of the positioning pin or block, the upper surface position of the tip portion of the transfer pins further away in the direction perpendicular to the frame portion is higher than the upper surface position of the positioning pin or block, and, photo This is achieved because the upper surface position of the transfer pin at the rotational position of the transfer pin after passing the mask to the positioning pin is lower than the upper surface position of the positioning pin or block.
[0009]
In other words, a delivery pin is provided on the frame, so that when the photomask is mounted, the mask is temporarily subjected to weighting, and the photomask is delivered between the delivery pin and the positioning pin or block. At this time, the height of each part of the delivery pin is adjusted so that the work can be performed safely and easily, and it does not interfere with the positioning of the photomask.
Further, the photomask is not easily dropped from the delivery pin.
In addition, the transfer pin can be rotated around a direction perpendicular to the frame portion at a position below the upper surface of the positioning pin. Even with transfer pins whose heights are adjusted, the photomask can be used with the transfer pins. After passing to the positioning pin, the delivery pin is rotated so that the delivery pin does not hinder the adhesion of the photomask to the substrate.
Thus, in the exposure apparatus of the present invention, similarly to the conventional exposure apparatus having a structure in which no delivery pin is provided, the photomask can be brought into close contact with both surfaces of the substrate, and exposure can be performed from both surfaces of the substrate.
In particular, a photomasking method is used to etch a substrate that is continuous in a strip shape to obtain a product. In a shadow mask manufacturing process, a resist that is resistant to etching in accordance with the shadow mask pattern that is the product on both sides of the substrate. The exposure apparatus for plate making used in the plate making process for developing and forming an image is effective because the photomask size is large, but the product is not limited to a shadow mask.
It can also be applied to lead frame fabrication.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
An example of an embodiment of the exposure apparatus of the present invention will be described with reference to the drawings.
FIG. 1A is a schematic view of the main part of an example of an embodiment of the exposure apparatus of the present invention when a photomask is set on the frame, and FIG. 1B is a view seen from the A0 side. FIG. 2 is a diagram for explaining the function of the transfer unit when the photomask is set on the frame. FIGS. 3 (a), 3 (b), and 3 (c) are diagrams of the embodiment. It is the schematic in each operation | movement of the principal part of exposure apparatus.
2 corresponds to the view from the A1-A2 side in FIG.
1-3, 110 is a base material (metal plate material), 115 and 116 are photosensitive resist films, 121 and 122 are photomasks, 131 and 132 are frame portions, 141 and 142 are positioning pins, and 142d is a fitting. , 151 and 152 are transfer pins, 152A is a projection, 152a is an end, 152b is a placement portion, 152c is a rotating shaft, and 152d is a fitting portion.
[0011]
The exposure apparatus of this example uses a photo-etching method to etch a metal plate material, which is a continuous base material in a strip shape, to obtain a shadow mask, which is a product. In a plate-making exposure apparatus used in the plate-making process to form an etching-resistant resist image according to the pattern, a strip-shaped metal plate with a photosensitive resist film formed on both sides is almost stretched While moving intermittently at the time of stopping, the resist film on both sides of the band-shaped metal plate material is in close contact with a photomask of a size larger than the band width direction of the metal plate material, respectively, and exposed. An exposure apparatus for forming a latent image for developing and forming an etching-resistant resist image serving as an etching-resistant mask.
[0012]
Hereinafter, an example of an embodiment of an exposure apparatus according to the present invention will be described with reference to FIG.
The exposure apparatus of this example exposes the resist films 115 and 116 on both sides of the substrate 110 provided with photosensitive resist films 115 and 116 on both sides thereof as shown in FIG. 1A. A pair of frame portions (131, 132) that are attached to each other in a substantially vertical direction so that a pair of photomasks 121, 122 of the same size for each other face each other, and the substrate 110 is disposed between the pair of photomasks 121, 122. A double-sided exposure apparatus that evacuates between the frame parts, aligns the pair of photomasks with each other, closely attaches the pair of photomasks to both surfaces of the substrate, and performs exposure from both surfaces of the substrate It is.
As shown in FIG. 1B, a positioning pin 142 for determining the vertical position of the photomask 122 and the photomask 122 are placed on the frame portion 132, and between the positioning pins 142. The transfer pin 152 for transferring the photomask is provided at the lower portion of the frame portion. Similarly, the frame portion 131 has a positioning pin 141 for determining the vertical position of the photomask 121 and the photomask 121. Is provided on the lower portion of the frame, and a delivery pin 151 is provided on the lower part of the frame.
The delivery pins 151 and 152 can rotate around one direction perpendicular to the frame at a position below the top surfaces of the positioning pins 141 and 142, respectively. After passing to the positioning pins 141 and 142, the delivery pins 151 and 152 are rotated so that the delivery pins 151 and 152 do not hinder the adhesion of the photomasks 121 and 122 to the substrate 110, and then the photomask 121. , 122 are brought into close contact with both surfaces of the substrate 110, and exposure is performed from both surfaces of the substrate 110.
Although not shown, the photomasks 121 and 122 are supported by the frame portions 131 and 132, respectively, and the photomasks 121 and 122 are in close contact with the resist films 115 and 116, respectively. It is equipped with control mechanisms such as vacuum, machine, electricity, and air pressure.
Although not explicitly shown in FIG. 1B, the frame portion 132 holds the outer peripheral portion of the photomask 122 by evacuating it, and has a rectangular frame shape around the outer peripheral portion of the photomask 122. .
In addition, as described above, a photomask is usually a glass dry plate provided with a silver salt photosensitive material, and a pattern is formed by selectively exposing the silver salt photosensitive material (also called patterning). Say) is used.
[0013]
In the case of this example, as shown in FIG. 2, the delivery pin 152 is fitted to the frame portion 132 and supported by the frame portion, and is rotatable about the fitting portion 152 d as a rotation axis. In this example, the positioning pin 142 is also fitted to the frame portion 132 as shown in FIG. The upper surface position of the delivery pin 152 at the rotational position of the delivery pin 152 before passing the photomask 122 to the positioning pin 142 varies depending on the position in the direction perpendicular to the frame portion of the delivery pin 152, as shown in FIGS. to the upper surface position of the transfer pins 152 in the same position perpendicular to the positioning pin 142 and the transfer pins 152 the frame 132 below the upper surface position of the positioning pin 142, in a direction perpendicular to the frame 132 from the positioning pin 142 The upper surface position (mounting portion 152b) of the transfer pin 152 at a distant position is the same height as the upper surface position of the positioning pin 142, and the distal end portion 152a of the transfer pin 152 at a further distant position in the direction perpendicular to the frame portion 132 is , Higher than the upper surface position of the positioning pin 142, and the photomask is positioned After passing, the position of the upper surface of the transfer pins 152 in the rotation position of the transfer pins you rotate the fitting portion 152d as a rotational axis, the entirety of which is lower than the upper surface position of the positioning pin or block. In addition, although the shape of the cross section in the surface parallel to the photomask surface of FIG. 2 in each part of the transfer pin 152 of this example is substantially circular, the shape is not limited to this. Further, the positioning pin 142 is not a pin shape but a block shape, and a photomask may be placed on the upper surface. Here, the frame portion 132 has been described, but the same applies to the frame portion 131.
[0014]
An operation of attaching the photomask 122 to the frame portion 132 will be briefly described.
First, the delivery pin 152 is set to the state shown in FIGS. 1 and 2, and the photomask 122 is placed on the placement portion 152b which is higher than the positioning pin 142 of the delivery pin 152 as shown in B1 of FIG.
Next, the photomask 122 is moved to B2 on the frame 132 side and attached to the frame 132. In this state, the outer periphery of the photomask 122 is usually evacuated and fixed to the frame 132.
In this way, the photomask 122 is normally manually set on the frame portion 132, but the movement of the photomask from the delivery pin 152 to the positioning pin 142 is performed at the same height, the work is easy, the quality No trouble occurs.
In addition, since the tip portion 152a has a shape that is higher than the height of the positioning pin 142, the photomask 122 placed on the placement portion 152b does not fall off.
The operation of removing the photomask 122 from the frame portion 132 may be performed by reversing the above operation.
Although the photomask attaching operation to the frame portion 132 has been described here, the same applies to the photomask attaching operation to the frame portion 131.
[0015]
Next, as shown in FIG. 1A, after the photomasks 121 and 122 are attached to the frame portions 131 and 132, the photomasks are respectively provided with photosensitive resist films 115 and 116 on both sides thereof. The operation of closely contacting 110 will be described with reference to FIG. 3 in association with the operation of the delivery pins 151 and 152.
After the state of FIG. 1A, first, the delivery pins 151 and 152 are rotated 180 degrees at the fitting portions, and the upper surfaces of the delivery pins 151 and 152 are lower than the upper surfaces of the positioning pins 141 and 142, respectively. To be. (Fig. 3 (a))
By rotating the delivery pin, each delivery pin is prevented from coming into contact with the photomask on the opposite side.
The base material 110 having the photosensitive resist film formed on both sides thereof is intermittently conveyed in the state shown in FIGS. 1 (a) to 3 (a).
And the following operation | movement is performed in the state which the base material 110 stopped.
Next, the frame parts 131 and 132 are respectively moved to the substrate 110 side (FIG. 3B), and in accordance with the photosensitive resist films 115 and 116, normally, the frame parts 131 and 132 are evacuated in this state. Then, the photomasks 121 and 122 are adhered to the photosensitive resist films 115 and 116, respectively. (Fig. 3 (c))
The delivery pins 151 and 152 are provided so that their positions are deviated from each other so that they do not hit the opposite frame portion even in close contact.
Usually, in this state, exposure is performed from behind each frame with irradiation light controlled to be substantially parallel light.
As the light source, an Xe lamp, a metal haloid lamp, or the like is usually used.
In this way, the attachment of the photomask frame to the photosensitive resist film on the substrate 110 of the photomask is performed.
When exchanging the photomask, reverse the above operation from the state of FIG. 3 (c) to the state of FIG. 1 (a), and then manually placing the photomask from the positioning pins on the transfer pins. Part (corresponding to 152b in FIG. 2) and further removed from the delivery pin. Then, the photomask is set again by the method described above.
[0016]
【The invention's effect】
As described above, the present invention is an exposure apparatus used for exposure in a plate-making process in a production line that uses a strip-shaped metal plate material as a raw material and performs etching processing by a photoetching method. It is possible to provide an exposure apparatus that can be easily mounted on the camera and can at least maintain the current status in terms of quality.
[Brief description of the drawings]
FIG. 1 (a) is a schematic diagram of a main part of an example of an embodiment of an exposure apparatus of the present invention when a photomask is set on a frame, and FIG. 1 (b) is a view from its A0 side. FIG.
FIG. 2 is a diagram for explaining the function of a delivery unit when a photomask is set on a frame part. FIG. 3 (a), FIG. 3 (b), and FIG. It is the schematic in each operation | movement of the principal part of the exposure apparatus of a form example.
[Explanation of symbols]
110 Base material (metal plate)
115, 116 Photosensitive resist film 121, 122 Photomask 131, 132 Frame portion 141, 142 Positioning pin 142d Fitting portion 151, 152 Delivery pin 152A Projection portion 152a End portion 152b Placement portion 152c Rotating shaft 152d Fitting portion

Claims (3)

  A pair of photomasks for exposing the resist films on both sides of the base material provided with a photosensitive resist film on both sides thereof are opposed to each other, and each has a pair of frame portions attached in a substantially vertical direction. A base material is disposed between the photomasks, the space between the frame portions is evacuated, the pair of photomasks are aligned with each other, and the pair of photomasks are adhered to both surfaces of the base material. A double-sided exposure apparatus that performs exposure from both sides of the photomask, wherein each frame is provided with a positioning pin or block for determining the vertical position of the photomask, and a photomask is placed on the positioning pin or block. A transfer pin is provided at the lower part of the frame part for transferring between them, and the transfer pin is located at a position below the positioning pin or the upper surface of the block and is perpendicular to the frame part. The photomask is transferred to the positioning pin by the transfer pin, and then the transfer pin is rotated so that the transfer pin does not hinder the adhesion of the photomask to the substrate. An exposure apparatus characterized in that a mask is brought into intimate contact with both surfaces of a substrate, and exposure is performed from both surfaces of the substrate. In Claim 1, the upper surface position of the delivery pin in the rotation position of the delivery pin before passing the photomask to the positioning pin varies depending on the position in the direction perpendicular to the frame portion of the delivery pin, and the positioning pin or block and the delivery pin The upper surface position of the transfer pin at the same position in the direction perpendicular to the frame part is lower than the upper surface position of the positioning pin or block, and the upper surface position of the transfer pin located away from the positioning pin or block in the direction perpendicular to the frame part is positioned. The tip of the transfer pin at the same height as the upper surface position of the pin or block and further away in the direction perpendicular to the frame is higher than the upper surface position of the positioning pin or block, and the photomask is transferred to the positioning pin. Delivery at the rotational position of the later delivery pin Upper surface position of the pin, the exposure apparatus characterized by whole is lower than the upper surface position of the positioning pin or block.   In claim 1 or 2, in accordance with the pattern of the shadow mask that is the product on both sides of the substrate in the shadow mask manufacturing process in which a substrate is etched by a photo-etching method to obtain a product to obtain a product, An exposure apparatus which is an exposure apparatus for plate making used in a plate making process for developing and forming an etching-resistant resist image.

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