JP4628405B2 - 半導体処理チャンバコンポーネント - Google Patents
半導体処理チャンバコンポーネント Download PDFInfo
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- JP4628405B2 JP4628405B2 JP2007199011A JP2007199011A JP4628405B2 JP 4628405 B2 JP4628405 B2 JP 4628405B2 JP 2007199011 A JP2007199011 A JP 2007199011A JP 2007199011 A JP2007199011 A JP 2007199011A JP 4628405 B2 JP4628405 B2 JP 4628405B2
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- Prior art keywords
- processing chamber
- semiconductor processing
- halogen
- bonding material
- chamber component
- Prior art date
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- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 28
- 239000000463 material Substances 0.000 claims description 78
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 32
- 229910052736 halogen Inorganic materials 0.000 claims description 29
- 150000002367 halogens Chemical class 0.000 claims description 29
- 238000009826 distribution Methods 0.000 claims description 28
- 239000000945 filler Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 16
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000007767 bonding agent Substances 0.000 claims 3
- -1 acrylic compound Chemical class 0.000 claims 1
- 239000007789 gas Substances 0.000 description 53
- 210000002381 plasma Anatomy 0.000 description 20
- 239000010410 layer Substances 0.000 description 17
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 229910052727 yttrium Inorganic materials 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 229910052749 magnesium Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910052715 tantalum Inorganic materials 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical class C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910016569 AlF 3 Inorganic materials 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000946 Y alloy Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000004715 ethylene vinyl alcohol Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- RZXDTJIXPSCHCI-UHFFFAOYSA-N hexa-1,5-diene-2,5-diol Chemical compound OC(=C)CCC(O)=C RZXDTJIXPSCHCI-UHFFFAOYSA-N 0.000 description 1
- 238000005305 interferometry Methods 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000191 poly(N-vinyl pyrrolidone) Polymers 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002338 polyhydroxyethylmethacrylate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Chemical class 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/403—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4409—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber characterised by sealing means
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C29/00—Alloys based on carbides, oxides, nitrides, borides, or silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides, sulfides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D17/00—Radial-flow pumps, e.g. centrifugal pumps; Helico-centrifugal pumps
- F04D17/08—Centrifugal pumps
- F04D17/16—Centrifugal pumps for displacing without appreciable compression
- F04D17/168—Pumps specially adapted to produce a vacuum
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- General Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Die Bonding (AREA)
Description
本発明の実施形態は概して半導体処理チャンバに係り、より詳細には半導体処理チャンバコンポーネントの結合に適した接合材に関する。
(関連技術の説明)
Claims (10)
- 第2表面に隣接して配置された第1表面と、
前記第1表面と第2表面とを連結する接合剤を含み、前記第1表面と第2表面の間の接合剤の一部は、プラズマプロセスの間、プラズマに露出して残留し、露出部はプラズマから供給されるハロゲン含有ガスと反応し、
前記接合剤は、
アクリル系化合物である接着材と、
前記接着材に添加された金属充填材を含み、前記金属充填材は、Mg、Ta及びZrの少なくとも1つである半導体処理チャンバコンポーネント。 - プラズマから供給されたハロゲン含有ガスと反応した露出部は、その上に形成されたハロゲン系金属層を更に含む請求項1記載の半導体処理チャンバコンポーネント。
- 前記ハロゲン系金属層の化学式がMFxであり、MがMg、Ta、及びZrから成る群から選択され、xが1〜5の整数である請求項2記載の半導体処理チャンバコンポーネント。
- 前記接着材がペースト、膠、ゲル又はパッド状である請求項1記載の半導体処理チャンバコンポーネント。
- 前記金属充填材は平均直径が0.2μm〜2.5μmの粒子、薄片又は粉末を更に含む請求項1記載の半導体処理チャンバコンポーネント。
- 前記金属充填材の接着材に対する比が重量%で1:20〜1:1である請求項1記載の半導体処理チャンバコンポーネント。
- 前記第1表面がガス分布アセンブリのベースであり、前記第2表面がガス分布プレートである請求項1記載の半導体処理チャンバコンポーネント。
- 前記第1表面が基板支持アセンブリのベースであり、前記第2表面が静電チャックである請求項1記載の半導体処理チャンバコンポーネント。
- 前記第1表面がセラミックであり、前記第2表面が金属である請求項1記載の半導体処理チャンバコンポーネント。
- 前記接合材が50μm〜500μmの厚さを有する請求項1記載の半導体処理チャンバコンポーネント。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/461,689 US7718029B2 (en) | 2006-08-01 | 2006-08-01 | Self-passivating plasma resistant material for joining chamber components |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2008103681A JP2008103681A (ja) | 2008-05-01 |
JP2008103681A5 JP2008103681A5 (ja) | 2010-07-08 |
JP4628405B2 true JP4628405B2 (ja) | 2011-02-09 |
Family
ID=38705022
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007199011A Expired - Fee Related JP4628405B2 (ja) | 2006-08-01 | 2007-07-31 | 半導体処理チャンバコンポーネント |
Country Status (6)
Country | Link |
---|---|
US (1) | US7718029B2 (ja) |
EP (1) | EP1884979A3 (ja) |
JP (1) | JP4628405B2 (ja) |
KR (1) | KR101095752B1 (ja) |
CN (1) | CN101134879B (ja) |
TW (2) | TWI350550B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005097338A1 (ja) * | 2004-04-08 | 2005-10-20 | Matsushita Electric Works, Ltd. | 静電霧化装置 |
US7838800B2 (en) * | 2006-09-25 | 2010-11-23 | Tokyo Electron Limited | Temperature controlled substrate holder having erosion resistant insulating layer for a substrate processing system |
DE112008002167B4 (de) * | 2007-04-26 | 2014-02-06 | Panasonic Corporation | Kühlschrank und elektrische Vorrichtung |
KR101259484B1 (ko) * | 2008-02-26 | 2013-05-06 | 쿄세라 코포레이션 | 웨이퍼 지지 부재와 그 제조 방법, 및 이것을 사용한 정전 척 |
US8194384B2 (en) * | 2008-07-23 | 2012-06-05 | Tokyo Electron Limited | High temperature electrostatic chuck and method of using |
US8147648B2 (en) | 2008-08-15 | 2012-04-03 | Lam Research Corporation | Composite showerhead electrode assembly for a plasma processing apparatus |
US20100140222A1 (en) * | 2008-12-10 | 2010-06-10 | Sun Jennifer Y | Filled polymer composition for etch chamber component |
US9520314B2 (en) * | 2008-12-19 | 2016-12-13 | Applied Materials, Inc. | High temperature electrostatic chuck bonding adhesive |
KR101861600B1 (ko) * | 2010-11-15 | 2018-05-28 | 어플라이드 머티어리얼스, 인코포레이티드 | 챔버 구성부품들을 연결하기 위해 이용되는 접착제 재료 |
KR20190124348A (ko) * | 2012-04-26 | 2019-11-04 | 어플라이드 머티어리얼스, 인코포레이티드 | Esc 본딩 접착제 부식을 방지하기 위한 방법들 및 장치 |
US9666466B2 (en) | 2013-05-07 | 2017-05-30 | Applied Materials, Inc. | Electrostatic chuck having thermally isolated zones with minimal crosstalk |
US9583369B2 (en) * | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
US9725799B2 (en) | 2013-12-06 | 2017-08-08 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
US10570257B2 (en) | 2015-11-16 | 2020-02-25 | Applied Materials, Inc. | Copolymerized high temperature bonding component |
Citations (5)
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JP2001226656A (ja) * | 2000-02-16 | 2001-08-21 | Tomoegawa Paper Co Ltd | 半導体製造装置またはエッチング装置用接着剤、該装置用接着シート及びそれらを用いた構造部品 |
JP2002519863A (ja) * | 1998-06-30 | 2002-07-02 | ラム リサーチ コーポレーション | プラズマ処理のためのエラストマ結合材と、その製造並びに利用方法 |
JP2004091546A (ja) * | 2002-08-29 | 2004-03-25 | Lintec Corp | 貼着体 |
JP2004513516A (ja) * | 2000-11-01 | 2004-04-30 | アプライド マテリアルズ インコーポレイテッド | 拡張されたプロセスウィンドウを有する誘電体エッチングチャンバ |
JP2005154531A (ja) * | 2003-11-25 | 2005-06-16 | Lintec Corp | 低アウトガス粘着シート |
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US5074456A (en) | 1990-09-18 | 1991-12-24 | Lam Research Corporation | Composite electrode for plasma processes |
TW399264B (en) * | 1998-11-27 | 2000-07-21 | United Microelectronics Corp | Method for reducing the fluorine content on metal pad surface |
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JP3784682B2 (ja) * | 2001-09-26 | 2006-06-14 | 富士通株式会社 | 伝送装置 |
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-
2006
- 2006-08-01 US US11/461,689 patent/US7718029B2/en not_active Expired - Fee Related
-
2007
- 2007-07-31 JP JP2007199011A patent/JP4628405B2/ja not_active Expired - Fee Related
- 2007-08-01 TW TW096128277A patent/TWI350550B/zh not_active IP Right Cessation
- 2007-08-01 CN CN2007101428789A patent/CN101134879B/zh not_active Expired - Fee Related
- 2007-08-01 KR KR1020070077371A patent/KR101095752B1/ko not_active IP Right Cessation
- 2007-08-01 EP EP07015108A patent/EP1884979A3/en not_active Withdrawn
- 2007-08-01 TW TW100111614A patent/TWI441235B/zh not_active IP Right Cessation
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JP2002519863A (ja) * | 1998-06-30 | 2002-07-02 | ラム リサーチ コーポレーション | プラズマ処理のためのエラストマ結合材と、その製造並びに利用方法 |
JP2002519862A (ja) * | 1998-06-30 | 2002-07-02 | ラム リサーチ コーポレーション | プラズマプロセス用電極およびその製造方法ならびにその用途 |
JP2003133296A (ja) * | 1998-06-30 | 2003-05-09 | Lam Res Corp | プラズマ処理のためのエラストマ結合材と、その製造並びに利用方法 |
JP2001226656A (ja) * | 2000-02-16 | 2001-08-21 | Tomoegawa Paper Co Ltd | 半導体製造装置またはエッチング装置用接着剤、該装置用接着シート及びそれらを用いた構造部品 |
JP2004513516A (ja) * | 2000-11-01 | 2004-04-30 | アプライド マテリアルズ インコーポレイテッド | 拡張されたプロセスウィンドウを有する誘電体エッチングチャンバ |
JP2004091546A (ja) * | 2002-08-29 | 2004-03-25 | Lintec Corp | 貼着体 |
JP2005154531A (ja) * | 2003-11-25 | 2005-06-16 | Lintec Corp | 低アウトガス粘着シート |
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TW200830349A (en) | 2008-07-16 |
US7718029B2 (en) | 2010-05-18 |
TWI441235B (zh) | 2014-06-11 |
JP2008103681A (ja) | 2008-05-01 |
CN101134879A (zh) | 2008-03-05 |
EP1884979A3 (en) | 2008-02-27 |
TW201140642A (en) | 2011-11-16 |
US20080029211A1 (en) | 2008-02-07 |
TWI350550B (en) | 2011-10-11 |
KR101095752B1 (ko) | 2011-12-21 |
EP1884979A2 (en) | 2008-02-06 |
CN101134879B (zh) | 2011-11-02 |
KR20080012230A (ko) | 2008-02-11 |
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